CN109575283B - 聚酰亚胺膜、覆金属层叠板及电路基板 - Google Patents
聚酰亚胺膜、覆金属层叠板及电路基板 Download PDFInfo
- Publication number
- CN109575283B CN109575283B CN201811133042.7A CN201811133042A CN109575283B CN 109575283 B CN109575283 B CN 109575283B CN 201811133042 A CN201811133042 A CN 201811133042A CN 109575283 B CN109575283 B CN 109575283B
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- CN
- China
- Prior art keywords
- polyimide
- layer
- polyimide film
- thermal expansion
- diamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017191992 | 2017-09-29 | ||
JP2017-191992 | 2017-09-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109575283A CN109575283A (zh) | 2019-04-05 |
CN109575283B true CN109575283B (zh) | 2022-08-09 |
Family
ID=65919938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811133042.7A Active CN109575283B (zh) | 2017-09-29 | 2018-09-27 | 聚酰亚胺膜、覆金属层叠板及电路基板 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7212480B2 (ko) |
KR (1) | KR102635402B1 (ko) |
CN (1) | CN109575283B (ko) |
TW (1) | TWI771500B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023547673A (ja) * | 2020-11-04 | 2023-11-13 | ピーアイ・アドバンスド・マテリアルズ・カンパニー・リミテッド | 高い寸法安定性を有するポリイミドフィルム及びその製造方法 |
KR102617724B1 (ko) * | 2020-11-04 | 2023-12-27 | 피아이첨단소재 주식회사 | 높은 치수 안정성을 가지는 폴리이미드 필름 및 그 제조방법 |
KR20230063057A (ko) * | 2021-11-01 | 2023-05-09 | 피아이첨단소재 주식회사 | 높은 치수 안정성을 가지는 폴리이미드 필름 및 그 제조방법 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1947476A (zh) * | 2004-03-09 | 2007-04-11 | 新日铁化学株式会社 | 软性印刷线路板及其制造方法 |
CN104070763A (zh) * | 2013-03-29 | 2014-10-01 | 新日铁住金化学株式会社 | 柔性覆铜层叠板的制造方法 |
CN106553352A (zh) * | 2015-09-30 | 2017-04-05 | 新日铁住金化学株式会社 | 具有聚酰亚胺层的层叠体的制造方法、聚酰亚胺膜的制造方法 |
CN106646714A (zh) * | 2015-10-30 | 2017-05-10 | 住友化学株式会社 | 偏振板和具备该偏振板的显示装置、以及其制造方法 |
WO2017159274A1 (ja) * | 2016-03-17 | 2017-09-21 | 新日鉄住金化学株式会社 | ポリアミド酸、熱可塑性ポリイミド、樹脂フィルム、金属張積層板及び回路基板 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4236101B2 (ja) * | 2003-09-16 | 2009-03-11 | 日東電工株式会社 | Vaモード液晶表示装置用視角補償フィルムの製造方法 |
JP4564336B2 (ja) * | 2004-11-04 | 2010-10-20 | 新日鐵化学株式会社 | Cof用銅張積層板及びcof用キャリアテープ |
KR20070058812A (ko) * | 2005-12-05 | 2007-06-11 | 주식회사 코오롱 | 폴리이미드 필름 |
JP2007165525A (ja) * | 2005-12-13 | 2007-06-28 | Toyobo Co Ltd | 表示機器 |
KR101593267B1 (ko) * | 2013-03-29 | 2016-02-11 | 코오롱인더스트리 주식회사 | 폴리이미드 수지 및 이를 이용한 폴리이미드 필름 |
JP2014201632A (ja) | 2013-04-03 | 2014-10-27 | 東レ・デュポン株式会社 | ポリイミドフィルム、および、その製造方法 |
JP6370609B2 (ja) * | 2014-05-29 | 2018-08-08 | 東レ・デュポン株式会社 | ポリイミドフィルム |
AU2014100840B4 (en) | 2014-07-24 | 2015-03-12 | Holden, Annette DR | A Bra Assembly |
JP6559027B2 (ja) * | 2014-09-30 | 2019-08-14 | 日鉄ケミカル&マテリアル株式会社 | ポリアミド酸、ポリイミド、樹脂フィルム及び金属張積層板 |
TWI735421B (zh) * | 2015-01-22 | 2021-08-11 | 日商尤尼吉可股份有限公司 | 積層體、其製造方法及使用方法、暨無鹼玻璃基板積層用聚醯亞胺前驅體溶液 |
JP2017069200A (ja) * | 2015-09-30 | 2017-04-06 | 新日鉄住金化学株式会社 | 機能層付ポリイミドフィルムの製造方法 |
CN106893121B (zh) * | 2015-12-17 | 2020-07-03 | 深圳瑞华泰薄膜科技股份有限公司 | 一种高尺寸稳定型聚酰亚胺薄膜及其制备方法 |
JP6645880B2 (ja) * | 2016-03-17 | 2020-02-14 | 日鉄ケミカル&マテリアル株式会社 | ポリイミドフィルムの製造方法 |
JP6461860B2 (ja) * | 2016-05-30 | 2019-01-30 | 日鉄ケミカル&マテリアル株式会社 | 透明導電性フィルムの製造方法 |
-
2018
- 2018-09-04 JP JP2018165307A patent/JP7212480B2/ja active Active
- 2018-09-27 CN CN201811133042.7A patent/CN109575283B/zh active Active
- 2018-09-27 KR KR1020180114714A patent/KR102635402B1/ko active IP Right Grant
- 2018-09-28 TW TW107134209A patent/TWI771500B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1947476A (zh) * | 2004-03-09 | 2007-04-11 | 新日铁化学株式会社 | 软性印刷线路板及其制造方法 |
CN104070763A (zh) * | 2013-03-29 | 2014-10-01 | 新日铁住金化学株式会社 | 柔性覆铜层叠板的制造方法 |
CN106553352A (zh) * | 2015-09-30 | 2017-04-05 | 新日铁住金化学株式会社 | 具有聚酰亚胺层的层叠体的制造方法、聚酰亚胺膜的制造方法 |
CN106646714A (zh) * | 2015-10-30 | 2017-05-10 | 住友化学株式会社 | 偏振板和具备该偏振板的显示装置、以及其制造方法 |
WO2017159274A1 (ja) * | 2016-03-17 | 2017-09-21 | 新日鉄住金化学株式会社 | ポリアミド酸、熱可塑性ポリイミド、樹脂フィルム、金属張積層板及び回路基板 |
Also Published As
Publication number | Publication date |
---|---|
KR102635402B1 (ko) | 2024-02-13 |
TWI771500B (zh) | 2022-07-21 |
JP2019065266A (ja) | 2019-04-25 |
KR20190038383A (ko) | 2019-04-08 |
CN109575283A (zh) | 2019-04-05 |
JP7212480B2 (ja) | 2023-01-25 |
TW201915069A (zh) | 2019-04-16 |
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