TWI767058B - 加工裝置 - Google Patents

加工裝置 Download PDF

Info

Publication number
TWI767058B
TWI767058B TW107132872A TW107132872A TWI767058B TW I767058 B TWI767058 B TW I767058B TW 107132872 A TW107132872 A TW 107132872A TW 107132872 A TW107132872 A TW 107132872A TW I767058 B TWI767058 B TW I767058B
Authority
TW
Taiwan
Prior art keywords
motor
holding
motor bracket
cooling water
rotating shaft
Prior art date
Application number
TW107132872A
Other languages
English (en)
Other versions
TW201914751A (zh
Inventor
現王園二郎
劉乃力
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201914751A publication Critical patent/TW201914751A/zh
Application granted granted Critical
Publication of TWI767058B publication Critical patent/TWI767058B/zh

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/30Work carriers for single side lapping of plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • B24B41/068Table-like supports for panels, sheets or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

[課題] 在不調整皮帶張力下要能夠交換及追加冷卻機構,且要能夠縮短作業時間。[解決手段] 加工裝置1具備保持晶圓W的保持手段2,保持手段2具備保持晶圓W的保持台20、使保持台20旋轉的旋轉軸21、使旋轉軸21旋轉的馬達24、將馬達24的旋轉力傳動至旋轉軸21的傳動手段25、以及冷卻馬達托架26的冷卻套27,因為冷卻套27具備接觸到馬達托架26且在內部使冷卻水8流通的冷卻水路272,所以不用將馬達24和馬達托架26一起從例如裝置基台10卸除,而能容易地對馬達托架26進行冷卻套27的裝卸。因此,不需要調整皮帶張力,且能縮短作業時間。

Description

加工裝置
本發明係關於一種研削加工被保持在保持台上之晶圓的加工裝置。
研削晶圓的研削裝置至少具備有保持晶圓的保持台,使保持台旋轉的馬達,用於安裝馬達的馬達托架,以及環狀地配設有研削磨石的研削輪,其中研削磨石研削保持在保持台上的晶圓,一邊藉由馬達使保持台旋轉,一邊以研削磨石研削保持台所保持的晶圓(例如,參閱下列的專利文件1)。
使保持台旋轉的馬達,由於在旋轉動作時會發熱,所以馬達的熱度被傳導至保持台使得保持台的傾斜度變化,或使得保持面的形狀變化,而有晶圓的面內無法研削為均一厚度的問題。因此,有具備在馬達托架的內部設置水路使水流通,以斷開馬達的熱度之冷卻機構者。 [習知技術文獻] [專利文獻]
[專利文獻1]日本特開2010-89234號公報
[發明所欲解決的課題] 然而,根據流通在水路中的水之水質會有水路被阻塞的情況,在此情況下,有交換馬達托架的必要。例如,在藉由皮帶傳動機構使保持台旋轉時,因為在交換馬達托架時有暫時鬆開皮帶以調整皮帶張力的必要,所以會花費作業時間。此外,在上述專利文件1所示的研削裝置中,因為是以不具有水路的馬達托架安裝馬達,會有在稍後需要冷卻機構的情況。在此情況下,也有在交換馬達托架時需要調整皮帶張力,而花費作業時間的問題。
本發明係因為有鑑於上述情況,目的是在於不進行傳動機構的調整下要能夠交換及追加冷卻機構,並且要能夠縮短作業時間,其中傳動機構將馬達的旋轉力傳動至保持台。
[解決課題的技術手段] 本發明是一種加工裝置,其具備保持晶圓的保持手段,以及加工該晶圓的加工手段;其中,該保持手段具備:保持台,其保持晶圓;旋轉軸,其使該保持台的中心繞軸旋轉;保持基座,其旋轉自如地支撐該旋轉軸,並被裝置基台所支撐;馬達,其為該旋轉軸的旋轉動力源,透過板狀的馬達托架配設於該保持基座或裝置基台;傳動手段,其將該馬達的旋轉力傳動至該旋轉軸;以及冷卻套,其冷卻該馬達托架;該冷卻套具備:冷卻水路,其接觸該馬達托架且在內部使冷卻水流通。
[發明功效] 本發明的加工裝置具備保持晶圓的保持手段,保持手段具備:保持晶圓的保持台,使保持台的中心繞軸旋轉的旋轉軸,旋轉自如地支撐旋轉軸並被裝置基台所支撐的保持基座,透過板狀的馬達托架配設於保持基座或裝置基台且為旋轉軸之旋轉動力源的馬達,將馬達的旋轉力傳動至旋轉軸的傳動手段,以及冷卻馬達托架的冷卻套;因為冷卻套具備接觸馬達托架且在內部使冷卻水流通的冷卻水路,所以不用將馬達與馬達托架一起從保持基座或裝置基台卸除,而能容易地對馬達托架進行冷卻套的裝卸。從而,在傳動手段為由例如皮帶傳動機構所組成的情況下,不進行皮帶張力的調整,而能夠交換及追加冷卻套,可以縮短作業時間。此外,即使在傳動手段為由例如齒輪傳動機構所組成的情況下,也不需調整齒輪的咬合,與上述相同,可以縮短作業時間。
圖1所示加工裝置1是研削加工作為工件之晶圓W的加工裝置之一例示。加工裝置1具有在Y軸方向延伸的裝置基台10。加工裝置1具備保持晶圓W的保持手段2,研削被保持在保持手段2之晶圓W的加工手段3,以及使加工手段3在相對保持手段2接近或遠離的研削進給方向(Z軸方向)上昇降的昇降手段4。
裝置基台10的Y軸方向後部側上,立設有支柱11。加工手段3是在支柱11的前方可昇降地被昇降手段4所支撐。加工手段3具備:具有Z軸方向軸心的主軸30,圍繞主軸30之外周的主軸外殼31,安裝在主軸30之一端的馬達32,保持主軸外殼31的保持座33,透過安裝件34安裝在主軸30下端的研削輪35,以及環狀地固定在研削環35下部的多個研削磨石36。馬達32藉由使主軸30旋轉,而能夠使研削輪35以預定的旋轉速度旋轉。
昇降手段4具備:在Z軸方向延伸的滾珠螺桿40,連接至滾珠螺桿40之一端的馬達41,與滾珠螺桿40平行地延伸的一對導軌42,以及在內部具備螺帽與滾珠螺桿40螺合並且側部與導軌42滑動接觸的昇降板43。在昇降板43上固定有保持座33。而且,藉由馬達41使滾珠螺桿40旋轉,而能夠使得昇降板43與加工手段3沿著一對導軌42在Z軸方向上昇降。
保持手段2具備:保持晶圓W的保持台20,使保持台20的中心繞軸旋轉的旋轉軸21,旋轉自如地支撐旋轉軸21並被裝置基台10所支撐的圖2所示的保持基座22,透過馬達托架26配設於保持基座22或裝置基台10上且為旋轉軸21之旋轉動力源的馬達24,將馬達24的旋轉力傳動至旋轉軸21的傳動手段25,以及冷卻馬達托架26的冷卻套27。
保持台20的上表面成為吸引保持晶圓W的保持面20a。在保持台20上,連接有未圖示的吸引源,能夠使吸引源的吸引力作用在保持面20a上。保持台20的周圍由蓋子12所覆蓋。如圖2所示,保持台20構成為裝卸自如地安裝在保持基座22上。保持基座22被立設於裝置基台10的支柱23水平地支撐。
馬達24的前端上連接有軸240。本實施方式所示的裝置基台10之內部中,形成有具有固定面101的安裝洞100,其中馬達托架26固定於固定面101。在固定面101上,形成有使軸240貫穿的貫穿孔102,在軸貫穿孔102的周圍有使第1螺絲6螺合的第1內螺紋103,以及使第2螺絲7螺合的第2內螺紋104。
如圖3所示,傳動手段25是由連接至旋轉軸21的從動皮帶輪250,透過馬達托架26連接至馬達24的驅動皮帶輪251,以及纏繞在從動皮帶輪250和驅動皮帶輪251上的皮帶252所構成。馬達24的軸240的上端連接有驅動皮帶輪251。當馬達24使驅動皮帶輪251驅動時,皮帶252使從動皮帶輪250跟隨動作以將旋轉力傳動至旋轉軸21,並且能夠使保持台20和旋轉軸21一起旋轉。作為將旋轉力傳動至旋轉軸21的傳動手段25,並不限定為本實施方式所示的皮帶傳動機構的構成,也可以藉由齒輪傳動機構來構成傳動手段25。
馬達托架26是形成為例如矩形板狀,具備使馬達24的軸240貫穿的貫穿孔260,以及形成在貫穿孔260周圍的多個(例如2個)的第1插入孔261和多個(例如2個)的第2插入孔262。第1插入孔261是對應於圖2所示第1內螺紋103的位置。此外,第2插入孔262是對應第2內螺紋104的位置。
在此,當透過馬達托架26將馬達24安裝在裝置基台10之內部時,使軸240貫穿馬達托架26的貫穿孔260和軸貫穿孔102以從裝置基台10的上表面突出,並且使馬達托架26抵接固定面101。在此狀態下,藉由將第1螺絲6從第1插入孔261插入且螺合至第1內螺紋103,將馬達托架26固定在固定面101上。當將馬達24從固定面101卸除時,進行上述安裝動作的逆向動作即可。
冷卻套27是形成為例如U字形,在其內側具有開口270。冷卻套27的端部27a、27b上分別形成有使第2螺絲7插入的插入孔271。插入孔271的位置是對應於馬達托架26的第2插入孔262的位置。本實施方式所示冷卻套27,因為由U字形所組成,能夠防止馬達24接觸冷卻套27的側面。另外,冷卻套27只要是能夠圍繞馬達24的形狀即可,並不特別限定為U字形,也可以是例如ㄈ字形。
如圖4所示,在冷卻套27的內部形成有使冷卻水8流通的冷卻水路272。在冷卻套27的端部27a側的冷卻水路272連接有供給管28,其中供給管28從冷卻水循環裝置5將經調節至預定溫度的冷卻水8供給至冷卻水路272。此外,在冷卻套27的端部27b側的冷卻水路272,連接有從冷卻水路272將冷卻水8排出的排水管29。當從冷卻水循環裝置5通過供給管28使冷卻水8流入冷卻水路272內時,冷卻水8沿著冷卻水路272流去,從排水管29排出。當被排出的冷卻水8流入冷卻水循環裝置5時,再次被調節到預定溫度後被送往供給管28。這種冷卻套27是以冷卻水8不斷地在冷卻水路272內循環的方式所構成。
當冷卻套27安裝至馬達托架26時,如圖5所示,使冷卻套27的插入孔271與馬達托架26的第2插入孔262一致,並使冷卻套27接觸馬達托架26的下表面。隨後,將第2螺絲7插入至插入孔271和第2插入孔262,並藉由螺合以緊固至圖2所示裝置基台10的第2內螺紋104,以將冷卻套27固定在馬達托架26上。藉此,將馬達24定位在開口270,並使馬達24的側面成為以冷卻套27圍繞的狀態。當將冷卻套27從馬達托架26卸除時,僅藉由將第2螺絲7從插入孔271和第2插入孔262卸除,就能夠容易地將冷卻套27從馬達托架26卸除。此外,在冷卻套27,藉由U字形的內側面接觸圓柱狀馬達24的外側面,能夠將馬達托架26冷卻並且將馬達24冷卻。
接著,說明關於圖1所示加工裝置1的操作例。晶圓W為圓形板狀的工件之一例示,並不特別限定材質等。當研削加工晶圓W時,以受到未圖示之吸引源的作用之保持面20a吸引保持晶圓W,並使保持台20移動至加工手段3的下方。隨後,驅動馬達24以藉由傳動手段25將旋轉力傳動至旋轉軸21,並使保持台20在預定方向上旋轉。加工手段3藉由使主轉30旋轉,一邊使研削輪35在預定方向上旋轉,一邊藉由昇降手段4使加工手段3在接近保持台20之保持面20a的方向下降,且以邊旋轉邊下降的研削磨石36一邊推壓晶圓W一邊研削加工達到預定的厚度為止。
在晶圓W的研削中,因為持續使保持台20旋轉,馬達24會發熱。因此,如圖4所示, 藉由冷卻水循環裝置5不斷地使冷卻水8在冷卻套27的冷卻水路272上流通,以冷卻馬達24。也就是說,藉由在冷卻水路272內循環的冷卻水8的冷卻作用不斷地冷卻馬達24的周圍,移除馬達24的熱度,並且使得熱影響不會波及保持台20。另外,使用例如純水作為冷卻水8。
如此一來,本發明的加工裝置1具備保持晶圓W的保持手段2,以及加工晶圓W的加工手段3,保持手段2具備:保持晶圓W的保持台20,使保持台20的中心繞軸旋轉的旋轉軸21,旋轉自如地支撐旋轉軸21並被裝置基台10所支撐的保持基座22,透過板狀的馬達托架26配設於保持基座22或裝置基台10且為旋轉軸21之旋轉動力源的馬達24,將馬達24的旋轉力傳動至旋轉軸21的傳動手段25,以及冷卻馬達托架26的冷卻套27;因為冷卻套27具備接觸馬達托架26且在內部使冷卻水8流通的冷卻水路272,所以不用將馬達24和馬達托架26一起從例如裝置基台10卸除,而能夠容易地對馬達托架26進行冷卻套27的裝卸。藉此,不進行皮帶252之皮帶張力的調整,而能夠交換及追加冷卻套27,並能夠縮短作業時間。此外,即使在傳動手段25為由齒輪傳動機構所組成的情況下,也不需調整齒輪的咬合,並能夠縮短作業時間。
上述實施方式所示的加工裝置1,雖作為研削裝置來說明,但並不限定於此構成,也可以是具備作為保持台20之旋轉驅動源的馬達24,且有使發熱的馬達24以冷卻套27冷卻必要的加工裝置。從而,本發明也能夠適用於例如研磨裝置等。
1‧‧‧加工裝置10‧‧‧裝置基台100‧‧‧安裝洞101‧‧‧固定面102‧‧‧軸貫穿孔103‧‧‧第1內螺紋104‧‧‧第2內螺紋11‧‧‧支柱12‧‧‧蓋子2‧‧‧保持手段20‧‧‧保持台20a‧‧‧保持面21‧‧‧旋轉軸22‧‧‧保持基座23‧‧‧支柱24‧‧‧馬達25‧‧‧傳動手段250‧‧‧從動皮帶輪251‧‧‧驅動皮帶輪252‧‧‧皮帶26‧‧‧馬達托架260‧‧‧貫穿孔261‧‧‧第1插入孔262‧‧‧第2插入孔27‧‧‧冷卻套270‧‧‧開口271‧‧‧插入孔272‧‧‧冷卻水路28‧‧‧供給管29‧‧‧排水管3‧‧‧加工手段30‧‧‧主軸31‧‧‧主軸外殼32‧‧‧馬達33‧‧‧保持座34‧‧‧安裝件35‧‧‧研削輪36‧‧‧研削磨石4‧‧‧昇降手段40‧‧‧滾珠螺桿41‧‧‧馬達42‧‧‧導軌43‧‧‧昇降板5‧‧‧冷卻水循環裝置6‧‧‧第1螺絲7‧‧‧第2螺絲8‧‧‧冷卻水
圖1為表示加工裝置之構成的立體圖。 圖2為表示保持手段之構成的剖面圖。 圖3為表示冷卻套安裝至馬達托架前的狀態下之保持手段的立體圖。 圖4為表示冷卻套之構成的俯視圖。 圖5為表示冷卻套安裝在馬達托架上的狀態下之保持手段的立體圖。
1‧‧‧加工裝置
10‧‧‧裝置基台
11‧‧‧支柱
12‧‧‧蓋子
2‧‧‧保持手段
20‧‧‧保持台
20a‧‧‧保持面
21‧‧‧旋轉軸
24‧‧‧馬達
25‧‧‧傳動手段
250‧‧‧從動皮帶輪
251‧‧‧驅動皮帶輪
252‧‧‧皮帶
26‧‧‧馬達托架
27‧‧‧冷卻套
3‧‧‧加工手段
30‧‧‧主軸
31‧‧‧主軸外殼
32‧‧‧馬達
33‧‧‧保持座
34‧‧‧安裝件
35‧‧‧研削輪
36‧‧‧研削磨石
4‧‧‧昇降手段
40‧‧‧滾珠螺桿
41‧‧‧馬達
42‧‧‧導軌
43‧‧‧昇降板
W‧‧‧晶圓

Claims (1)

  1. 一種加工裝置,其具備保持晶圓的保持手段,以及加工該晶圓的加工手段;其中,該保持手段具備:保持台,其保持晶圓;旋轉軸,其使該保持台的中心繞軸旋轉;保持基座,其旋轉自如地支撐該旋轉軸,並被裝置基台所支撐;馬達,其為該旋轉軸的旋轉動力源,透過板狀的馬達托架配設於該保持基座或裝置基台;傳動手段,其將該馬達的旋轉力傳動至該旋轉軸;以及冷卻套,其冷卻該馬達托架;該裝置基台具備內螺孔;該馬達托架具備與該內螺孔對應的長孔;該冷卻套具備:冷卻水路,其圍繞該馬達的外側面,形成為接觸該馬達托架的U形,且在內部使冷卻水流通;該冷卻水路的流入口,其配設於該U形的一端;該冷卻水路的流出口,其配設於該U形的另一端;以及兩個插入孔,其等分別形成於該一端側及該另一端側,且使螺絲插入;使貫通該插入孔之螺絲貫通該長孔並與該裝置基台的內螺孔螺合,該些螺絲與該冷卻套及該馬達托架一起鎖緊固定。
TW107132872A 2017-09-21 2018-09-18 加工裝置 TWI767058B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017181135A JP6994334B2 (ja) 2017-09-21 2017-09-21 加工装置
JP2017-181135 2017-09-21

Publications (2)

Publication Number Publication Date
TW201914751A TW201914751A (zh) 2019-04-16
TWI767058B true TWI767058B (zh) 2022-06-11

Family

ID=65841242

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107132872A TWI767058B (zh) 2017-09-21 2018-09-18 加工裝置

Country Status (4)

Country Link
JP (1) JP6994334B2 (zh)
KR (1) KR102541671B1 (zh)
CN (1) CN109531428B (zh)
TW (1) TWI767058B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111734799B (zh) * 2020-07-20 2020-12-08 上海陛通半导体能源科技股份有限公司 可去除径向力的旋转装置、加热器旋转系统及半导体设备
JP2023145215A (ja) * 2022-03-28 2023-10-11 株式会社東京精密 ウエハ加工装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4657455A (en) * 1984-11-16 1987-04-14 Cemtronics Concrete machine tools
TW200827086A (en) * 2006-12-28 2008-07-01 Hiwin Tech Corp Cooling device of linear module
TWM389601U (en) * 2010-04-01 2010-10-01 Prec Machinery Res & Dev Ct Motor fixing plate with heat dissipating features
TW201711799A (zh) * 2015-08-27 2017-04-01 Disco Corp 研磨裝置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05285781A (ja) * 1992-04-10 1993-11-02 Sony Corp エアスピンドルユニット
JP3449505B2 (ja) * 1995-02-23 2003-09-22 株式会社ディスコ 研磨装置におけるセットアップ方法
JP2003025198A (ja) * 2001-07-10 2003-01-29 Sharp Corp 面取り装置および被面取り基板
DE102005044832A1 (de) * 2005-09-20 2007-03-22 Siemens Ag Elektrische Maschine
JP4617278B2 (ja) * 2006-06-29 2011-01-19 日本電産サンキョー株式会社 産業用ロボット
JP5318517B2 (ja) 2008-10-10 2013-10-16 株式会社ディスコ チャックテーブル機構
JP5335448B2 (ja) * 2009-01-19 2013-11-06 株式会社ディスコ 加工装置
CN101820197A (zh) * 2009-02-27 2010-09-01 鸿富锦精密工业(深圳)有限公司 马达安装座
JP2011051027A (ja) * 2009-08-31 2011-03-17 Nagase Integrex Co Ltd 連結フランジ
CN101924415A (zh) * 2010-08-27 2010-12-22 湘潭市长航电机有限公司 一种水冷电机
CN202114607U (zh) * 2011-06-08 2012-01-18 云南蓝晶科技股份有限公司 晶片抛光机
JP2013123309A (ja) * 2011-12-09 2013-06-20 Fanuc Ltd 放熱性能を向上させた電動機冷却プレート
CN203574480U (zh) * 2013-10-10 2014-04-30 苏州上金数控科技有限公司 主轴电机冷却座
JP6444717B2 (ja) * 2014-12-12 2018-12-26 Towa株式会社 切断装置及び切断方法
CN204992883U (zh) * 2015-09-02 2016-01-20 东莞市启航精密数控设备有限公司 液冷式电机座

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4657455A (en) * 1984-11-16 1987-04-14 Cemtronics Concrete machine tools
TW200827086A (en) * 2006-12-28 2008-07-01 Hiwin Tech Corp Cooling device of linear module
TWM389601U (en) * 2010-04-01 2010-10-01 Prec Machinery Res & Dev Ct Motor fixing plate with heat dissipating features
TW201711799A (zh) * 2015-08-27 2017-04-01 Disco Corp 研磨裝置

Also Published As

Publication number Publication date
CN109531428A (zh) 2019-03-29
TW201914751A (zh) 2019-04-16
JP2019055450A (ja) 2019-04-11
KR20190033423A (ko) 2019-03-29
JP6994334B2 (ja) 2022-01-14
CN109531428B (zh) 2022-06-24
KR102541671B1 (ko) 2023-06-08

Similar Documents

Publication Publication Date Title
TWI767058B (zh) 加工裝置
TWI710427B (zh) 磨削輪及被加工物的磨削方法
KR20190093122A (ko) 연삭 연마 장치 및 연삭 연마 방법
KR101366762B1 (ko) 볼밸브용 볼 연마장치
US10569442B2 (en) Cutting blade mounting mechanism
TWI700149B (zh) 研磨裝置
US20070123154A1 (en) Polishing apparatus
JP2009279709A (ja) コイルばねの両端研削機
TWI652140B (zh) 雙碟式表面磨床中靜壓墊的熱變形預防設備以及雙碟式表面磨床
KR102243872B1 (ko) 피가공물의 연삭 방법
KR20130053481A (ko) 웨이퍼 연마장비
KR20170142722A (ko) 반도체 웨이퍼 그라인더
JP2009141122A (ja) ウェーハ加工装置
CN210731913U (zh) 一种精密磨床的打磨机构
TWI779164B (zh) 磨削裝置
TW201811505A (zh) 磨削裝置
JP2016132070A (ja) 研削ホイール及び研削装置
JP2010010339A (ja) 研削方法
JP2020192633A (ja) 電装冷却装置
CN213615819U (zh) 一种可调节的打磨设备
KR200433107Y1 (ko) 냉각수단이 구비된 자장을 이용한 거스러미 제거장치
TW202313245A (zh) 加工裝置
JP2023178694A (ja) Cmp研磨装置
JPH10235558A (ja) 研磨装置
JP2003285255A (ja) 研削盤