JP6994334B2 - 加工装置 - Google Patents

加工装置 Download PDF

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Publication number
JP6994334B2
JP6994334B2 JP2017181135A JP2017181135A JP6994334B2 JP 6994334 B2 JP6994334 B2 JP 6994334B2 JP 2017181135 A JP2017181135 A JP 2017181135A JP 2017181135 A JP2017181135 A JP 2017181135A JP 6994334 B2 JP6994334 B2 JP 6994334B2
Authority
JP
Japan
Prior art keywords
motor
holding
cooling
motor bracket
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017181135A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019055450A (ja
Inventor
二郎 現王園
乃力 劉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2017181135A priority Critical patent/JP6994334B2/ja
Priority to KR1020180101177A priority patent/KR102541671B1/ko
Priority to CN201811079560.5A priority patent/CN109531428B/zh
Priority to TW107132872A priority patent/TWI767058B/zh
Publication of JP2019055450A publication Critical patent/JP2019055450A/ja
Application granted granted Critical
Publication of JP6994334B2 publication Critical patent/JP6994334B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2017181135A 2017-09-21 2017-09-21 加工装置 Active JP6994334B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017181135A JP6994334B2 (ja) 2017-09-21 2017-09-21 加工装置
KR1020180101177A KR102541671B1 (ko) 2017-09-21 2018-08-28 가공 장치
CN201811079560.5A CN109531428B (zh) 2017-09-21 2018-09-17 加工装置
TW107132872A TWI767058B (zh) 2017-09-21 2018-09-18 加工裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017181135A JP6994334B2 (ja) 2017-09-21 2017-09-21 加工装置

Publications (2)

Publication Number Publication Date
JP2019055450A JP2019055450A (ja) 2019-04-11
JP6994334B2 true JP6994334B2 (ja) 2022-01-14

Family

ID=65841242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017181135A Active JP6994334B2 (ja) 2017-09-21 2017-09-21 加工装置

Country Status (4)

Country Link
JP (1) JP6994334B2 (zh)
KR (1) KR102541671B1 (zh)
CN (1) CN109531428B (zh)
TW (1) TWI767058B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111734799B (zh) * 2020-07-20 2020-12-08 上海陛通半导体能源科技股份有限公司 可去除径向力的旋转装置、加热器旋转系统及半导体设备
JP2023145215A (ja) * 2022-03-28 2023-10-11 株式会社東京精密 ウエハ加工装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003025198A (ja) 2001-07-10 2003-01-29 Sharp Corp 面取り装置および被面取り基板
JP2008006535A (ja) 2006-06-29 2008-01-17 Nidec Sankyo Corp 産業用ロボット
JP2016112635A (ja) 2014-12-12 2016-06-23 Ｔｏｗａ株式会社 切断装置及び切断方法
JP2017042875A (ja) 2015-08-27 2017-03-02 株式会社ディスコ 研削装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4657455A (en) * 1984-11-16 1987-04-14 Cemtronics Concrete machine tools
JPH05285781A (ja) * 1992-04-10 1993-11-02 Sony Corp エアスピンドルユニット
JP3449505B2 (ja) * 1995-02-23 2003-09-22 株式会社ディスコ 研磨装置におけるセットアップ方法
DE102005044832A1 (de) * 2005-09-20 2007-03-22 Siemens Ag Elektrische Maschine
TW200827086A (en) * 2006-12-28 2008-07-01 Hiwin Tech Corp Cooling device of linear module
JP5318517B2 (ja) 2008-10-10 2013-10-16 株式会社ディスコ チャックテーブル機構
JP5335448B2 (ja) * 2009-01-19 2013-11-06 株式会社ディスコ 加工装置
CN101820197A (zh) * 2009-02-27 2010-09-01 鸿富锦精密工业（深圳）有限公司 马达安装座
JP2011051027A (ja) * 2009-08-31 2011-03-17 Nagase Integrex Co Ltd 連結フランジ
TWM389601U (en) * 2010-04-01 2010-10-01 Prec Machinery Res & Dev Ct Motor fixing plate with heat dissipating features
CN101924415A (zh) * 2010-08-27 2010-12-22 湘潭市长航电机有限公司 一种水冷电机
CN202114607U (zh) * 2011-06-08 2012-01-18 云南蓝晶科技股份有限公司 晶片抛光机
JP2013123309A (ja) * 2011-12-09 2013-06-20 Fanuc Ltd 放熱性能を向上させた電動機冷却プレート
CN203574480U (zh) * 2013-10-10 2014-04-30 苏州上金数控科技有限公司 主轴电机冷却座
CN204992883U (zh) * 2015-09-02 2016-01-20 东莞市启航精密数控设备有限公司 液冷式电机座

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003025198A (ja) 2001-07-10 2003-01-29 Sharp Corp 面取り装置および被面取り基板
JP2008006535A (ja) 2006-06-29 2008-01-17 Nidec Sankyo Corp 産業用ロボット
JP2016112635A (ja) 2014-12-12 2016-06-23 Ｔｏｗａ株式会社 切断装置及び切断方法
JP2017042875A (ja) 2015-08-27 2017-03-02 株式会社ディスコ 研削装置

Also Published As

Publication number Publication date
KR102541671B1 (ko) 2023-06-08
CN109531428B (zh) 2022-06-24
TWI767058B (zh) 2022-06-11
TW201914751A (zh) 2019-04-16
KR20190033423A (ko) 2019-03-29
CN109531428A (zh) 2019-03-29
JP2019055450A (ja) 2019-04-11

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