JP6736404B2 - 研削装置 - Google Patents
研削装置 Download PDFInfo
- Publication number
- JP6736404B2 JP6736404B2 JP2016145924A JP2016145924A JP6736404B2 JP 6736404 B2 JP6736404 B2 JP 6736404B2 JP 2016145924 A JP2016145924 A JP 2016145924A JP 2016145924 A JP2016145924 A JP 2016145924A JP 6736404 B2 JP6736404 B2 JP 6736404B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- support
- grinding
- wafer
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000227 grinding Methods 0.000 title claims description 69
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 15
- 238000003825 pressing Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- -1 or the like Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/10—Arrangements for cooling or lubricating tools or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
24 保持テーブル
26 支持テーブル
90 回転手段
25 枠体
52 (移動)基台
71、74 支持柱
71c、74c 貫通孔
60 エア供給源
73a、74b 供給口
72a、77a 排気口
W ウエーハ
Claims (2)
- ウエーハを保持する保持手段と、該保持手段で保持したウエーハを研削砥石で研削する研削手段とを備える研削装置であって、
該保持手段は、ウエーハを保持する保持テーブルと、該保持テーブルを支持する支持テーブルと、該支持テーブルを回転させる回転手段と、該支持テーブルを回転可能に支持する枠体と、該基台から該枠体を支持する少なくとも3つの支持柱とを備え、
該支持柱は、下端を該基台に接続し上端を該枠体に接続して、内部を貫通する貫通孔と、該下端側に配設し該貫通孔とエア供給源とを連通する供給口と、該上端側に配設し該貫通孔を流れたエアを該支持テーブルに向かって排気する排気口とを備え、
該貫通孔にエアを流して該支持柱を冷却するとともに、該貫通孔を流れたエアを該支持テーブルに向かって排気し該支持テーブルを冷却して該支持柱と該支持テーブルとの熱変形を防止する研削装置。 - 該3つの支持柱のうち少なくとも1つの支持柱は、該枠体と該基台との距離を調節する調節機構を備え、
該調節機構は、該基台の上面から垂下する方向で上端から垂下する第1の雌ネジ孔を備えて該基台に配設されるベース部と、該第1の雌ネジ孔に螺入する第1の雄ネジが下端に形成されると共に、該第1の雌ネジ孔とは異なるネジピッチで該第1の雌ネジ孔の延在方向と平行に延在し該枠体を貫通する第2の雌ネジ孔に螺入する第2の雄ネジが上端に形成されて、該基台と該枠体とを連結させるネジ柱とを備え、該調節機構の延在方向に内部を貫通する貫通孔が形成され、該供給口は該調節機構の下端側で該貫通孔とエア供給源とを連通し、該排気口は該調節機構の上端側で該貫通孔を流れたエアを該支持テーブルに向かって排気し、
該貫通孔にエアを流して該ネジ柱を冷却するとともに、該貫通孔を流れたエアを該支持テーブルに向かって排気し該支持テーブルを冷却して該ネジ柱と該支持テーブルとの熱変形を防止する請求項1記載の研削装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016145924A JP6736404B2 (ja) | 2016-07-26 | 2016-07-26 | 研削装置 |
TW106119315A TWI726113B (zh) | 2016-07-26 | 2017-06-09 | 磨削裝置 |
KR1020170085823A KR102240210B1 (ko) | 2016-07-26 | 2017-07-06 | 연삭 장치 |
MYPI2017702525A MY184581A (en) | 2016-07-26 | 2017-07-10 | Grinding apparatus |
CN201710595270.5A CN107650010B (zh) | 2016-07-26 | 2017-07-20 | 磨削装置 |
US15/657,963 US10639764B2 (en) | 2016-07-26 | 2017-07-24 | Grinding apparatus |
DE102017212651.5A DE102017212651B4 (de) | 2016-07-26 | 2017-07-24 | Schleifvorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016145924A JP6736404B2 (ja) | 2016-07-26 | 2016-07-26 | 研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018015823A JP2018015823A (ja) | 2018-02-01 |
JP6736404B2 true JP6736404B2 (ja) | 2020-08-05 |
Family
ID=61012338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016145924A Active JP6736404B2 (ja) | 2016-07-26 | 2016-07-26 | 研削装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10639764B2 (ja) |
JP (1) | JP6736404B2 (ja) |
KR (1) | KR102240210B1 (ja) |
CN (1) | CN107650010B (ja) |
DE (1) | DE102017212651B4 (ja) |
MY (1) | MY184581A (ja) |
TW (1) | TWI726113B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112059884B (zh) * | 2020-09-19 | 2021-09-28 | 陶正云 | 一种玻化砖及其加工方法与加工系统 |
CN112643472A (zh) * | 2021-01-13 | 2021-04-13 | 江阴市嘉润机械配件有限公司 | 一种用于车架总成加工的成型装置 |
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-
2016
- 2016-07-26 JP JP2016145924A patent/JP6736404B2/ja active Active
-
2017
- 2017-06-09 TW TW106119315A patent/TWI726113B/zh active
- 2017-07-06 KR KR1020170085823A patent/KR102240210B1/ko active IP Right Grant
- 2017-07-10 MY MYPI2017702525A patent/MY184581A/en unknown
- 2017-07-20 CN CN201710595270.5A patent/CN107650010B/zh active Active
- 2017-07-24 US US15/657,963 patent/US10639764B2/en active Active
- 2017-07-24 DE DE102017212651.5A patent/DE102017212651B4/de active Active
Also Published As
Publication number | Publication date |
---|---|
US20180029187A1 (en) | 2018-02-01 |
US10639764B2 (en) | 2020-05-05 |
CN107650010A (zh) | 2018-02-02 |
DE102017212651B4 (de) | 2024-08-01 |
KR102240210B1 (ko) | 2021-04-13 |
CN107650010B (zh) | 2021-03-26 |
KR20180012200A (ko) | 2018-02-05 |
MY184581A (en) | 2021-04-06 |
DE102017212651A1 (de) | 2018-02-15 |
TW201811505A (zh) | 2018-04-01 |
TWI726113B (zh) | 2021-05-01 |
JP2018015823A (ja) | 2018-02-01 |
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