JP5184910B2 - 基板の平面研削装置 - Google Patents
基板の平面研削装置 Download PDFInfo
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- JP5184910B2 JP5184910B2 JP2008031325A JP2008031325A JP5184910B2 JP 5184910 B2 JP5184910 B2 JP 5184910B2 JP 2008031325 A JP2008031325 A JP 2008031325A JP 2008031325 A JP2008031325 A JP 2008031325A JP 5184910 B2 JP5184910 B2 JP 5184910B2
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- grinding
- ball screw
- grindstone
- fixed plate
- coupling
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 53
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
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- 238000012546 transfer Methods 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910001208 Crucible steel Inorganic materials 0.000 description 1
- 241000195493 Cryptophyta Species 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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- 229910052594 sapphire Inorganic materials 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
m未満)、研削中、半導体基板に割れやクラックが生じない高剛性の平面研削装置の実現が望まれている。
易とする。
1の先端に取り付けられた楔83を後退させ、次いで、ボールネジ72を駆動させてカップリング雄部材74を押し下げてその雄部材底面を楔83上面に当接させて固定板6底面とポーラスセラミック製ロータリーチャックテーブル21表面間の高さ設定を行う。
Claims (2)
- 回転/直動可能な砥石軸に軸承されたカップホイール型砥石を静圧軸受と磁気軸受で回転および直動可能に支持した研削ヘッド、前記砥石軸を回転/直動させる回転/直動複合アクチュエータ、その砥石軸が垂直方向となるよう下面中央位置に研削ヘッドを固定した固定板、前記研削ヘッドの下方に設けたポーラスセラミック製ロータリーチャックテーブルが中空スピンドルにより軸承され、その中空スピンドルが静圧軸受により軸受けされるワークチャックロータリーテーブル機構であって、前記ポーラスセラミック製ロータリーチャックテーブルの水平方向表面が前記砥石軸に軸承されたカップホイール型砥石の底面に平行となるように設けたワークチャックロータリーテーブル機構、および、前記砥石軸を垂直方向に備えさせた固定板下面の中心点に対し正三角形または二等辺三角形の頂点位置の三箇所に前記固定板を上下移動させるキネマカップリングとシリンダロッドを備える固定板昇降機構3基を備える基板の平面研削装置であって、前記固定板昇降機構が、ワークチャックロータリーテーブル機構の機枠ベース表面に固定された中央にボールネジが貫通する孔を有する断面V形状カップリング雌部材、中央にボールネジが貫通する孔を有し、前記カップリング雌部材のV凹部内面壁に嵌合する底部断面形状がV形状のカップリング雄部材、前記カップリング雌部材の貫通孔およびカップリング雌部材の貫通孔を鉛直線上に貫通して設置されるボールネジであって、下端をワークチャックロータリーテーブル機構の機枠ベースの底部で固定具により回転駆動可能により固定され、上端は研削ヘッドの固定板の下面で固定嵌合プレートにより回転駆動可能により固定され、ボールネジの上端側にボールネジ駆動モータとエンコーダとボールネジ螺合体が取り付けられたボールネジ、および、前記カップリング雌部材のV凹部と前記カップリング雄部材の底面とで構成される空所内にマイクロサーボモータの駆動により進退移動可能なボールネジの先端に取り付けられた楔、とで構成され、該楔と前記カップリング雄部材の底面の接触により固定板の高さ位置が決定可能である固定板高さ位置調整機構であることを特徴とする、基板の平面研削装置。
- 静圧軸受に支持される砥石軸が、磁気軸受と水静圧軸受とが互いに兼用部分が生じるように複合化された複合軸受を介して支持され、ポーラスセラミック製ロータリーチャックテーブルを軸承する中空スピンドルが水静圧軸受により支持されることを特徴とする、請求項1に記載の基板の平面研削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008031325A JP5184910B2 (ja) | 2008-02-13 | 2008-02-13 | 基板の平面研削装置 |
TW097130565A TWI436854B (zh) | 2008-02-13 | 2008-08-11 | Substrate surface grinding device |
KR1020080105664A KR101311135B1 (ko) | 2008-02-13 | 2008-10-28 | 기판의 평면 연삭 장치 |
US12/356,793 US8047897B2 (en) | 2008-02-13 | 2009-01-21 | Substrate flat grinding device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008031325A JP5184910B2 (ja) | 2008-02-13 | 2008-02-13 | 基板の平面研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009190102A JP2009190102A (ja) | 2009-08-27 |
JP5184910B2 true JP5184910B2 (ja) | 2013-04-17 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008031325A Expired - Fee Related JP5184910B2 (ja) | 2008-02-13 | 2008-02-13 | 基板の平面研削装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8047897B2 (ja) |
JP (1) | JP5184910B2 (ja) |
KR (1) | KR101311135B1 (ja) |
TW (1) | TWI436854B (ja) |
Families Citing this family (54)
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JP5513201B2 (ja) * | 2010-03-29 | 2014-06-04 | 株式会社ディスコ | 硬質基板の研削方法および研削装置 |
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US9393669B2 (en) | 2011-10-21 | 2016-07-19 | Strasbaugh | Systems and methods of processing substrates |
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CN116297529B (zh) * | 2023-05-10 | 2024-10-11 | 成都思越智能装备股份有限公司 | 一种柔性屏缺陷检测装置 |
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US8047897B2 (en) | 2011-11-01 |
KR101311135B1 (ko) | 2013-09-25 |
TWI436854B (zh) | 2014-05-11 |
US20090203299A1 (en) | 2009-08-13 |
JP2009190102A (ja) | 2009-08-27 |
KR20090087802A (ko) | 2009-08-18 |
TW200934615A (en) | 2009-08-16 |
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