JP5184910B2 - Substrate surface grinding machine - Google Patents
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- JP5184910B2 JP5184910B2 JP2008031325A JP2008031325A JP5184910B2 JP 5184910 B2 JP5184910 B2 JP 5184910B2 JP 2008031325 A JP2008031325 A JP 2008031325A JP 2008031325 A JP2008031325 A JP 2008031325A JP 5184910 B2 JP5184910 B2 JP 5184910B2
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
本発明は、静圧軸受により軸受けされる回転／直動可能な砥石軸と、ポーラスセラミック製ロータリーチャックテーブルが中空スピンドルにより軸承され、その中空スピンドルが静圧軸受により軸受けされるワークチャックロータリーテーブル機構と、砥石軸傾斜機構とで主に構成される高い剛性を有する平面研削装置に関する。この平面研削装置は、シリコンベアウエハ、半導体基板、セラミック基板、ＧａＡｓ板、サファイア基板等のワークピースの平面研削加工に使用され、ワークピースの平坦化を向上するとともに基板の研削速度を向上させるものである。 The present invention relates to a work chuck rotary table mechanism in which a rotary / linearly movable grindstone shaft supported by a hydrostatic bearing and a porous ceramic rotary chuck table are supported by a hollow spindle, and the hollow spindle is supported by a hydrostatic bearing. And a high-rigidity surface grinding apparatus mainly composed of a grindstone shaft tilting mechanism. This surface grinding machine is used for surface grinding of workpieces such as silicon bare wafers, semiconductor substrates, ceramic substrates, GaAs plates, sapphire substrates, etc., and improves the planarization of the workpieces and the substrate grinding speed. It is.
シリコンベアウエハや半導体基板などのワークピースを、ポーラスセラミック製ロータリーチャックテーブル上に載置した後、カップホイール型砥石を軸承する砥石軸を回転させつつ、下降してカップホイール型砥石をワークピース表面に摺擦し、砥石軸のワークピースに対する傾斜角度および送り量（切込量）を初めに大きく、次第に小さく制御してワークピース表面を研削し、ワークピースの厚みを薄くする平面研削装置が実用化されている。砥石軸の傾斜を変更することは、研削加工されるワークピースの研削焼けを防止するとともに、ワークピースの厚み分布を可能な限り均一とするためである。 After placing a workpiece such as a silicon bare wafer or semiconductor substrate on a porous ceramic rotary chuck table, rotate the grindstone shaft that supports the cupwheel grindstone and lower it to place the cupwheel grindstone on the workpiece surface. A surface grinding machine that reduces the thickness of the workpiece by grinding the workpiece surface by first controlling the inclination angle and feed amount (cutting amount) of the grinding wheel shaft with respect to the workpiece and then gradually decreasing it. It has become. The reason for changing the inclination of the grindstone axis is to prevent grinding burn of the workpiece to be ground and to make the thickness distribution of the workpiece as uniform as possible.
例えば、水平面内で回転駆動されるポーラスセラミック製ロータリーチャックテーブル上にウエハを載置し、ウエハを、垂直方向に配置された研削スピンドルヘッドの下部に取り付けられたカップホイール型ダイヤモンド砥石により研削する研削装置において、前記研削スピンドルヘッドとウエハを垂直方向であるｚ軸方向に相対移動させる駆動手段と、前記研削スピンドルヘッドまたはウエハを水平面内のｘ軸およびｙ軸の回りに回転させる傾動手段と、前記駆動手段および傾動手段を制御して研削スピンドルヘッドの送り量および研削スピンドルヘッドとワークとの相対的な傾きを研削の段階に応じて段階的または連続的に変化させる制御手段とを備えた平面研削装置が提案されている。傾斜手段は、研削スピンドルヘッドの昇降手段を固定するコラムに備えられている（例えば、特許文献１参照。）。 For example, grinding is performed by placing a wafer on a porous ceramic rotary chuck table that is rotationally driven in a horizontal plane, and grinding the wafer with a cup wheel type diamond grindstone attached to a lower portion of a grinding spindle head arranged in a vertical direction. In the apparatus, driving means for relatively moving the grinding spindle head and the wafer in the vertical z-axis direction, tilting means for rotating the grinding spindle head or wafer about the x-axis and the y-axis in a horizontal plane, Surface grinding with control means for controlling the driving means and the tilting means to change the feed amount of the grinding spindle head and the relative tilt between the grinding spindle head and the workpiece stepwise or continuously according to the stage of grinding A device has been proposed. The tilting means is provided in a column that fixes the lifting means of the grinding spindle head (see, for example, Patent Document 1).
また、ワークピースの表面を研削する研削砥石が装着されるスピンドル本体と、該スピンドル本体をエアーによって支持するラジアルベアリング、スラストベアリングを含むハウジングとから構成される空気軸受スピンドルにおいて、前記スラストベアリングのエアー吹き出し領域は、少なくとも３つの領域に分割されており、該分割されたエアー吹き出し領域へのエアーの供給圧を個別に調整して前記スピンドル本体の傾きを調整するエアースピンドルの傾き調整機構も提案されている（例えば特許文献２参照。）。 An air bearing spindle comprising a spindle body on which a grinding wheel for grinding the surface of a workpiece is mounted, a radial bearing for supporting the spindle body by air, and a housing including a thrust bearing. The blowing area is divided into at least three areas, and an air spindle inclination adjusting mechanism for adjusting the inclination of the spindle body by individually adjusting the air supply pressure to the divided air blowing area has been proposed. (For example, refer to Patent Document 2).
さらに、ワークピースを保持するポーラスセラミック製ロータリーチャックテーブルと、砥石をスピンドルに取り付けて回転駆動する研削ヘッドと、前記砥石スピンドルを支持する軸受と、前記研削ヘッドの傾動を制御する磁気軸受、前記研削スピンドルのワークピースに対する相対的な姿勢を検出するセンサと、前記センサによって検出した検出データを用いて前記砥石スピンドルが予め設定した姿勢となるように前記磁気軸受を制御する姿勢制御手段とを具備する平面研削を用い、前記ポーラスセラミック製ロータリーチャックテーブルに保持したワークピースに研削ヘッドの砥石を押し付けた状態でワークピースと研削砥石とを相対運動させることにより被研削物の被研削面を平面状に研削する方法も提案されている（例えば、特許文献３参照。）。 Furthermore, a porous ceramic rotary chuck table for holding a workpiece, a grinding head that is rotated by attaching a grindstone to a spindle, a bearing that supports the grindstone spindle, a magnetic bearing that controls tilting of the grinding head, and the grinding A sensor for detecting a relative attitude of the spindle with respect to the workpiece; and attitude control means for controlling the magnetic bearing so that the grinding wheel spindle assumes a preset attitude using detection data detected by the sensor. Using surface grinding, the workpiece and grinding wheel are moved relative to each other while the grinding wheel of the grinding head is pressed against the workpiece held on the porous ceramic rotary chuck table. Grinding methods have also been proposed (for example, patent documents) 3 reference.).
さらにまた、砥石送り手段によって所定位置に保持されてワークを研削する回転砥石と、ワークを支持するワーク支持台と、ワーク支持台をワークの被加工面と平行な方向に移動させるワーク支持台送り手段とを備えている研削装置において、回転砥石の砥石軸の位置を制御する磁気軸受装置と、磁気軸受装置のアキシャル方向制御電流およびラジアル方向制御電流を使用して砥石送り手段とワーク支持台送り手段とを制御する制御手段とをさらに備えており、磁気軸受装置のラジアル方向制御電流に基づいてワーク支持台の送りが制御されるとともに、磁気軸受装置のアキシャル方向制御電流に基づいて回転砥石のワークの被加工面と垂直な方向の停止位置が制御される平面研削装置も提案されている（例えば、特許文献４参照。）。 Furthermore, a rotating grindstone that holds the workpiece while being held in place by the grindstone feeding means, a workpiece support that supports the workpiece, and a workpiece support that moves the workpiece support in a direction parallel to the workpiece surface. A magnetic bearing device for controlling the position of the wheel shaft of the rotating grindstone, and a grinding wheel feeding means and a workpiece support base feed using the axial direction control current and the radial direction control current of the magnetic bearing device. And a control means for controlling the means, the feed of the work support is controlled based on the radial direction control current of the magnetic bearing device, and the rotating grindstone is controlled based on the axial direction control current of the magnetic bearing device. There has also been proposed a surface grinding apparatus in which a stop position in a direction perpendicular to the workpiece surface is controlled (see, for example, Patent Document 4).
および、砥石軸を回転させるスピンドル装置と、ワークピースを保持するワーク保持手段と、これらスピンドル装置の砥石とワーク保持手段に保持されたワークピースとを相対的に移動させる送り手段とを備えた内面円筒研削装置であって、前記スピンドル装置は、砥石を先端に取付けたスピンドルを静圧気体軸受と磁気軸受とが互いに兼用部分が生じるように複合化された静圧磁気複合軸受を介してスピンドル装置本体に回転自在に設置し、前記スピンドルの変位を求める変位測定手段として、前記静圧気体軸受の軸受面の圧力を測定する圧力センサを設け、この圧力センサの測定値から前記スピンドルの変位を求めて前記磁気軸受の磁力制御を行う磁気軸受制御手段を設けた内面円筒研削装置も提案されている（例えば、特許文献５参照。）。 And an inner surface provided with a spindle device for rotating the grindstone shaft, a workpiece holding means for holding the workpiece, and a feeding means for relatively moving the grindstone of the spindle device and the workpiece held by the workpiece holding means. A cylindrical grinding device, wherein the spindle device is connected to a spindle mounted with a grindstone at a tip thereof via a hydrostatic magnetic compound bearing in which a hydrostatic gas bearing and a magnetic bearing are combined so that a combined portion is generated. As a displacement measuring means that is rotatably installed in the main body and obtains the displacement of the spindle, a pressure sensor that measures the pressure of the bearing surface of the hydrostatic gas bearing is provided, and the displacement of the spindle is obtained from the measured value of the pressure sensor. An internal cylindrical grinding device provided with magnetic bearing control means for controlling the magnetic force of the magnetic bearing has also been proposed (see, for example, Patent Document 5). ).
一方、研削装置への利用を開示するものではないが、回転／直動可能な工具主軸を回転および直動させる複合（回転／直動）アクチュエータも提案されている（例えば、特許文献６、特許文献７、特許文献８および特許文献９参照。）。 On the other hand, although not disclosed for use in a grinding apparatus, a composite (rotation / linear motion) actuator that rotates and linearly moves a rotatable / linearly movable tool spindle has also been proposed (for example, Patent Document 6, Patent) (Ref. Literature 7, Patent Literature 8, and Patent Literature 9).
また、雄部材と雌部材がカップリングするキネマカップリング（kinematic coupling）を利用した高さ位置調整具を備えるテスト装置も知られている（例えば、特許文献１０、非特許文献１参照。）。 There is also known a test apparatus including a height position adjuster using a kinematic coupling in which a male member and a female member are coupled (see, for example, Patent Document 10 and Non-Patent Document 1).
さらに、ビルトインモータのロータを支持する砥石軸を水静圧スラスト軸受および水静圧ラジアル軸受で支持するとともに前記砥石軸をヒートパイプにより構成し、ロータの発熱をヒートパイプにより砥石軸の長手方向に伝達して前記水静圧軸受から外部に逃がす冷却構造とした水静圧軸受で支持される研削ヘッドも知られている（例えば、特許文献１１参照。）。水静圧軸受で支持されるワーク用ポーラスセラミック製ロータリーチャックテーブルも提案されている（例えば、特許文献１２および特許文献１３参照。）。 Furthermore, the grinding wheel shaft that supports the rotor of the built-in motor is supported by a hydrostatic thrust bearing and a hydrostatic radial bearing, and the grinding wheel shaft is constituted by a heat pipe, and the heat generation of the rotor is caused by the heat pipe in the longitudinal direction of the grinding wheel shaft. There is also known a grinding head that is supported by a hydrostatic bearing having a cooling structure that transmits and escapes from the hydrostatic bearing to the outside (see, for example, Patent Document 11). A work-use porous ceramic rotary chuck table supported by a hydrostatic bearing has also been proposed (see, for example, Patent Document 12 and Patent Document 13).
半導体基板（ワークピース）の直径が２００ｍｍまたは３００ｍｍ、厚みが１００〜７７０μｍであるうちは特許文献１、特許文献２および特許文献３に記載の砥石軸を傾斜させる研削装置を用いて得られる裏面研削加工半導体基板は中央部が薄く、縁部が厚いものであってもＤＲＡＭ製造実用化に耐える肉厚分布（厚みの振れが１μｍ前後）を有する研削加工半導体基板であるが、次々世代の４５０ｍｍ直径、厚み２０〜５０μｍのＤＲＡＭ用半導体基板においては、目標とする厚み２０〜５０μｍに対する厚みの振れが１μｍの百分率は２〜５％と大きな数値となり、より肉厚分布の優れ（厚みの振れが０．５μ
ｍ未満）、研削中、半導体基板に割れやクラックが生じない高剛性の平面研削装置の実現が望まれている。
Back surface grinding obtained using the grinding apparatus for tilting the grindstone shaft described in Patent Literature 1, Patent Literature 2 and Patent Literature 3 as long as the semiconductor substrate (workpiece) has a diameter of 200 mm or 300 mm and a thickness of 100 to 770 μm. The processed semiconductor substrate is a ground semiconductor substrate that has a thickness distribution (thickness fluctuation is around 1 μm) that can withstand the practical use of DRAM even if the central part is thin and the edge is thick. In a semiconductor substrate for DRAM having a thickness of 20 to 50 μm, the percentage of the thickness fluctuation with respect to the target thickness of 20 to 50 μm is as large as 2 to 5%, and the thickness distribution is more excellent (the thickness fluctuation is 0). .5μ
It is desired to realize a highly rigid surface grinding apparatus that does not cause cracks or cracks in the semiconductor substrate during grinding.
また、半導体製造業界では基板加工中に基板が油で汚れるのを嫌い、水静圧軸受の基板平面研削装置の出現が望まれている。 In addition, the semiconductor manufacturing industry dislikes that the substrate is soiled with oil during substrate processing, and the emergence of a hydrostatic bearing substrate surface grinding apparatus is desired.
本発明の第一の目的は、前記特許文献６、特許文献７、特許文献８および特許文献９に記載の回転／直動可能な砥石軸を磁気軸受けやスラスト軸受で回転および直動可能に支持した研削ヘッド技術と、特許文献１０や非特許文献１記載のキネマカップリングの高さ位置調整の技術を、特許文献１乃至特許文献５に記載の表面研削装置の技術にアッセンブリして高剛性の基板平面研削装置を提供することである。 The first object of the present invention is to support the grindstone shaft that can rotate / linearly move as described in Patent Document 6, Patent Document 7, Patent Document 8, and Patent Document 9 so as to be rotatable and linearly movable by a magnetic bearing or a thrust bearing. The grinding head technology and the kinematic coupling height position adjustment technology described in Patent Literature 10 and Non-Patent Literature 1 are assembled into the surface grinding device technology described in Patent Literature 1 to Patent Literature 5 to achieve high rigidity. It is to provide a substrate surface grinding apparatus.
本発明の第二の目的は、この高剛性の基板平面研削装置の砥石スピンドルおよびワークスピンドルの軸受に、特許文献１２および特許文献１３に記載の水静圧軸受技術を応用に、環境に優しい水静圧軸受の基板平面研削装置を提供することである。 The second object of the present invention is to apply the hydrostatic bearing technology described in Patent Literature 12 and Patent Literature 13 to the bearings of the grinding wheel spindle and the work spindle of this high-rigidity substrate surface grinding apparatus, thereby providing environmentally friendly water. An object of the present invention is to provide a substrate surface grinding apparatus for a hydrostatic bearing.
本発明の第三の目的は、新しいキネマカップリング構造を利用する昇降機構を提供することにある。 A third object of the present invention is to provide an elevating mechanism that uses a new kinema coupling structure.
請求項１の発明は、回転／直動可能な砥石軸に軸承されたカップホイール型砥石を静圧軸受と磁気軸受で回転および直動可能に支持した研削ヘッド、前記砥石軸を回転／直動させる回転／直動複合アクチュエータ、その砥石軸が垂直方向となるよう下面中央位置に研削ヘッドを固定した固定板、前記研削ヘッドの下方に設けたポーラスセラミック製ロータリーチャックテーブルが中空スピンドルにより軸承され、その中空スピンドルが静圧軸受により軸受けされるワークチャックロータリーテーブル機構であって、前記ポーラスセラミック製ロータリーチャックテーブルの水平方向表面が前記砥石軸に軸承されたカップホイール型砥石の底面に平行となるように設けたワークチャックロータリーテーブル機構、および、前記砥石軸を垂直方向に備えさせた固定板下面の中心点に対し正三角形または二等辺三角形の頂点位置の三箇所に前記固定板を上下移動させるキネマカップリングとシリンダロッドを備える固定板昇降機構３基を備える基板の平面研削装置であって、前記固定板昇降機構が、ワークチャックロータリーテーブル機構の機枠ベース表面に固定された中央にボールネジが貫通する孔を有する断面Ｖ形状カップリング雌部材、中央にボールネジが貫通する孔を有し、前記カップリング雌部材のＶ凹部内面壁に嵌合する底部断面形状がＶ形状のカップリング雄部材、前記カップリング雌部材の貫通孔およびカップリング雌部材の貫通孔を鉛直線上に貫通して設置されるボールネジであって、下端をワークチャックロータリーテーブル機構の機枠ベースの底部で固定具により回転駆動可能により固定され、上端は研削ヘッドの固定板の下面で固定嵌合プレートにより回転駆動可能により固定され、ボールネジの上端側にボールネジ駆動モータとエンコーダとボールネジ螺合体が取り付けられたボールネジ、および、前記カップリング雌部材のＶ凹部と前記カップリング雄部材の底面とで構成される空所内にマイクロサーボモータの駆動により進退移動可能なボールネジの先端に取り付けられた楔、とで構成され、該楔と前記カップリング雄部材の底面の接触により固定板の高さ位置が決定可能である固定板高さ位置調整機構であることを特徴とする、基板の平面研削装置を提供するものである。 According to the first aspect of the present invention, there is provided a grinding head in which a cup wheel type grindstone supported by a grindstone shaft capable of rotation / linear movement is supported by a hydrostatic bearing and a magnetic bearing so as to be rotatable and linearly movable, and the grindstone shaft is rotated / linearly moved. A rotary / linear motion combined actuator, a fixed plate with a grinding head fixed at the center of the lower surface so that the grinding wheel axis is vertical, and a porous ceramic rotary chuck table provided below the grinding head is supported by a hollow spindle, A work chuck rotary table mechanism whose hollow spindle is supported by a hydrostatic bearing, wherein a horizontal surface of the porous ceramic rotary chuck table is parallel to a bottom surface of a cup wheel type grindstone supported by the grindstone shaft. The work chuck rotary table mechanism provided on the machine and the grinding wheel axis in the vertical direction Plane of the substrate with a fixing plate lift mechanism 3 group with a kinematic coupling and the cylinder rod the cause of the fixed plate is vertically moved to three positions of the apexes of an equilateral triangle or isosceles triangle to comprise let fixed plate lower surface of center point In the grinding apparatus , the fixed plate elevating mechanism has a cross-sectional V-shaped coupling female member having a hole through which the ball screw penetrates in the center and fixed to the surface of the machine base of the work chuck rotary table mechanism, and the ball screw penetrates in the center. A coupling male member having a hole and having a bottom cross-sectional shape that fits into the inner wall of the V recess of the coupling female member, the through hole of the coupling female member, and the through hole of the coupling female member on the vertical line A ball screw that penetrates through the bottom of the machine frame base of the work chuck rotary table mechanism with a fixture A ball screw in which a ball screw drive motor, an encoder, and a ball screw screwed body are attached to the upper end side of the ball screw; A wedge attached to the tip of a ball screw that can be moved forward and backward by driving a micro servo motor in a space formed by a V recess of the coupling female member and a bottom surface of the coupling male member, The present invention provides a surface grinding apparatus for a substrate, which is a fixed plate height position adjusting mechanism capable of determining the height position of the fixed plate by contacting the wedge with the bottom surface of the coupling male member .
請求項２の発明は、静圧軸受に支持される砥石軸が、磁気軸受と水静圧軸受とが互いに兼用部分が生じるように複合化された複合軸受を介して支持され、ポーラスセラミック製ロータリーチャックテーブルを軸承する中空スピンドルが水静圧軸受により支持されることを特徴とする、請求項１に記載の基板の平面研削装置を提供するものである。 According to a second aspect of the present invention, the grindstone shaft supported by the hydrostatic bearing is supported through a composite bearing in which a magnetic bearing and a hydrostatic bearing are combined so that a portion that serves as a mutual portion is generated. hollow spindle journalled chuck table, characterized in that it is supported by the water hydrostatic bearings, there is provided a surface grinding device substrate according to claim 1.
砥石軸のワークピース（基板）に対する傾斜角度が、砥石軸を垂直方向に備えさせた固定板下面の三箇所に備えた固定板昇降機構３基により行われるので、基板研削時、固定板の荷重も砥石を通じて基板表面に負荷が懸かり、特許文献１、特許文献２、特許文献３および特許文献４の研削装置と比較し、より剛性の高い平面研削装置となっており、基板径が４５０ｍｍと大きいワークピースであっても平坦な肉厚分布の優れた研削加工基板が得られる。 Since the inclination angle of the grinding wheel shaft with respect to the workpiece (substrate) is performed by three fixed plate lifting mechanisms provided at three locations on the lower surface of the fixed plate provided with the grinding wheel shaft in the vertical direction, the load of the fixed plate is applied during substrate grinding. In addition, a load is applied to the surface of the substrate through the grindstone, and the surface grinding device has a higher rigidity than the grinding devices of Patent Literature 1, Patent Literature 2, Patent Literature 3 and Patent Literature 4, and the substrate diameter is as large as 450 mm. Even for a workpiece, a ground substrate with an excellent flat wall thickness distribution can be obtained.
また、特許文献１に記載の砥石軸を昇降可能に固定するコラムのｘ軸、ｙ軸の二軸を傾斜させる方法、および特許文献２、特許文献３、特許文献４および特許文献５に記載される砥石軸を空気軸受の三点や磁気軸受の四点で傾斜させる方法と比較し、３基の固定板高さ位置調整機構で砥石軸の傾斜角を設定するのが容易で、かつ、正確であり、剛性が高いものとなる。 Moreover, it describes in the method of inclining the 2 axis | shaft of the x axis of the column which fixes the grindstone axis | shaft described in patent document 1 so that raising / lowering, y axis, and patent document 2, patent document 4, patent document 4, and patent document 5 are described. Compared with the method of tilting the grinding wheel shaft at three points of the air bearing and four points of the magnetic bearing, it is easy and accurate to set the tilt angle of the grinding wheel shaft with three fixed plate height position adjustment mechanisms And the rigidity is high.
ポーラスセラミック製ロータリーチャックテーブルを軸承する中空スピンドルおよび砥石軸の軸受に水静圧軸受を使用するときは、環境に優しい平面研削装置となる。 When hydrostatic bearings are used for the hollow spindle and the grinding wheel spindle bearing the porous ceramic rotary chuck table, the surface grinding apparatus is environmentally friendly.
複合アクチュエータにより回転および直動される砥石軸にカップホイール型砥石を軸承させた研削ヘッド構造としたことにより、基板の平面研削加工時は砥石軸の０〜１．５ｍｍの進退直動移動による基板表面への切り込みあるいは基板表面からの後退をさせ、砥石ヘッドの待機位置への移動にはキネマカップリング、シリンダロッドを備える固定板昇降機構を用い固定板を上昇または下降させることにより行うので研削加工時間を短くすることができる。 By using a grinding head structure in which a cup wheel type grindstone is supported by a grindstone shaft that is rotated and linearly moved by a composite actuator, the substrate is driven by a linear movement of 0 to 1.5 mm of the grindstone shaft during surface grinding of the substrate. Grinding is performed by moving the fixed plate up or down using a fixed plate lifting mechanism using a kinema coupling or cylinder rod to cut the surface or retract from the substrate surface and move the grindstone head to the standby position. Time can be shortened.
以下、図を用いて本発明をさらに詳細に説明する。図１は本発明の平面研削装置の要部を示す斜視図で、固定板昇降機構３基の内２基については、ボールネジのハウジング材を省いて示している。図２は平面研削装置の正面断面図、図３は平面研削装置の側面断面図、図４は平面研削装置の水平方向断面図で、図２におけるＩ−Ｉ線下方方向から見た図を示す。図５は平面研削装置の平面図、図６は固定板昇降機構のキネマカップリング部の正面断面図、図７は固定板昇降機構のキネマカップリング部の平面図、図８は固定板昇降機構のキネマカップリング部の側面図、図９は固定板昇降機構のカップリング部に取り付けた高さ位置測定変位センサの正面図、図１０は研削ヘッドの断面図、および、図１１はワークチャックロータリーテーブル機構の断面図である Hereinafter, the present invention will be described in more detail with reference to the drawings. FIG. 1 is a perspective view showing the main part of the surface grinding apparatus of the present invention, and two of the three fixed plate lifting mechanisms are shown with the ball screw housing material omitted. 2 is a front cross-sectional view of the surface grinding apparatus, FIG. 3 is a side cross-sectional view of the surface grinding apparatus, and FIG. 4 is a horizontal cross-sectional view of the surface grinding apparatus. . 5 is a plan view of the surface grinding apparatus, FIG. 6 is a front sectional view of the kinema coupling portion of the fixed plate elevating mechanism, FIG. 7 is a plan view of the kinema coupling portion of the fixed plate elevating mechanism, and FIG. 9 is a side view of the kinema coupling portion, FIG. 9 is a front view of a height position measuring displacement sensor attached to the coupling portion of the fixed plate lifting mechanism, FIG. 10 is a sectional view of the grinding head, and FIG. 11 is a work chuck rotary. It is sectional drawing of a table mechanism.
図１、図２および図３に示すように、本発明の基板表面研削装置１００は、機枠９の中央円形型窩内に据え付けられたワークチャックテーブル機構２、回転／直動可能な砥石軸１３に軸承されたカップホイール型砥石１４を静圧軸受と磁気軸受で回転および直動可能に支持した研削ヘッド１、前記砥石軸１３を回転／直動させる回転／直動複合アクチュエータ１８、前記砥石軸１３が垂直方向となるよう下面中央位置に研削ヘッド１を固定した固定板６および前記砥石軸１３を垂直方向に備えさせた固定板６下面の中心点に対し正三角形または二等辺三角形の頂点位置の三箇所に前記固定板を上下移動させるキネマカップリングとシリンダロッドを備える固定板昇降機構７の３基、を主なアッセンブリ材として構成される。 As shown in FIGS. 1, 2, and 3, the substrate surface grinding apparatus 100 according to the present invention includes a work chuck table mechanism 2 installed in a central circular cavity of a machine frame 9, a grindstone shaft that can rotate / linearly move. A grinding head 1 that supports a cup wheel type grindstone 14 supported by a shaft 13 by a hydrostatic bearing and a magnetic bearing so as to be rotatable and linearly movable, a rotary / linear motion combined actuator 18 that rotates / directly moves the grindstone shaft 13, and the grindstone Vertex of equilateral triangle or isosceles triangle with respect to the center point of the fixed plate 6 with the grinding head 1 fixed at the center position of the lower surface and the fixed plate 6 with the grindstone shaft 13 provided in the vertical direction so that the shaft 13 is vertical. Three sets of kinematic couplings for moving the fixed plate up and down at three positions and a fixed plate elevating mechanism 7 including a cylinder rod are configured as main assembly materials.
前記ワークチャックロータリーテーブル機構２は、ポーラスセラミック製ロータリーチャックテーブル２１が中空スピンドル２２により軸承され、その中空スピンドル２２が静圧軸受により軸受けされており、前記ポーラスセラミック製ロータリーチャックテーブル２１の水平方向表面が前記砥石軸１３に軸承されたカップホイール型砥石１４の底面に平行となるように設けられている。中空スピンドル２２の下端はロータリージョイント２９により図示されていない真空ポンプ、コンプレッサ、純水供給ポンプに接続する３本の供給管に接続されている。３本の供給管には切り替え弁が取り付けられ、基板加工プロセスに応じてワークピース吸着時の減圧、基板をポーラスセラミック製ロータリーチャックテーブルより外すときの加圧、ポーラスセラミック製ロータリーチャックテーブルの洗浄時の加圧水供給時に切り替える。 The work chuck rotary table mechanism 2 includes a porous ceramic rotary chuck table 21 supported by a hollow spindle 22, and the hollow spindle 22 is supported by a hydrostatic bearing, and the horizontal surface of the porous ceramic rotary chuck table 21. Is provided so as to be parallel to the bottom surface of the cup wheel type grindstone 14 supported by the grindstone shaft 13. The lower end of the hollow spindle 22 is connected to three supply pipes connected to a vacuum pump, a compressor, and a pure water supply pump (not shown) by a rotary joint 29. A switching valve is attached to the three supply pipes. Decompression during workpiece adsorption according to the substrate processing process, pressurization when the substrate is removed from the porous ceramic rotary chuck table, and cleaning of the porous ceramic rotary chuck table Switch when supplying pressurized water.
前記機枠９は、大理石、セラミック、黒御影石（グラナイト）、レジンコンクリート、鋳物鋼などを素材とする。 The machine frame 9 is made of marble, ceramic, black granite, resin concrete, cast steel, or the like.
固定板昇降機構７は、ワークチャックロータリーテーブル機構２の機枠９のベース９ａ上表面に固定された中央にボールネジ７２が貫通する孔を有する断面Ｖ形状カップリング雌部材７３と、中央にボールネジ７２が貫通する孔を有し、前記カップリング雌部材７３のＶ凹部内面に嵌合する底部断面形状がＶ形状のカップリング雄部材７４と、前記カップリング雌部材の貫通孔およびカップリング雌部材の貫通孔を鉛直線上に貫通して設置されるボールネジ７２とこのボールネジ下端をワークチャックロータリーテーブル機構２の機枠ベース９ａ底部で固定具７９ａにより回転駆動可能により固定され、ボールネジ上端は研削ヘッド１の固定板６の下面で固定嵌合プレート７９ｂにより回転駆動可能により固定され、ボールネジ７２の上端側にボールネジ駆動モータ７１とエンコーダ７６とボールネジ螺合体７７が取り付けられている。前記カップリング雌部材７３のＶ凹部と前記カップリング雄部材７４の底面とで構成される空所７０内には、ボールネジ８１の先端に取り付けられた楔８３がマイクロサーボモータ８２の駆動により空所７０内に進退移動可能に設けられている。 The fixed plate elevating mechanism 7 includes a V-shaped coupling female member 73 having a hole through which the ball screw 72 passes in the center and fixed to the upper surface of the base 9a of the machine casing 9 of the work chuck rotary table mechanism 2, and a ball screw 72 in the center. A coupling male member 74 having a V-shaped bottom cross-sectional shape that fits into the inner surface of the V recess of the coupling female member 73, and a through hole and a coupling female member of the coupling female member. The ball screw 72 installed through the through hole on the vertical line and the lower end of the ball screw are fixed to the bottom of the machine base 9a of the work chuck rotary table mechanism 2 by a fixture 79a so that the upper end of the ball screw is fixed to the grinding head 1. The lower surface of the fixed plate 6 is fixed by a fixed fitting plate 79b so that it can be driven to rotate, and the upper end side of the ball screw 72 Ball screw drive motor 71 and the encoder 76 and a ball screw threadably united 77 is attached. A wedge 83 attached to the tip of a ball screw 81 is provided in the space 70 formed by the V recess of the coupling female member 73 and the bottom surface of the coupling male member 74 by driving the micro servo motor 82. 70 is provided so as to be able to move forward and backward.
前記カップリング雌部材７３のＶ凹部７３ａと前記カップリング雄部材７４の底面とで構成される空所７０内に前記マイクロサーボモータ８２の駆動により進退移動可能なボールネジ８１の先端に取り付けられた楔８３を進入させ、次いで、ボールネジ７２を駆動させてカップリング雄部材７４を押し下げてその雄部材底面を楔８３上面に当接させると固定板６底面とポーラスセラミック製ロータリーチャックテーブル２１表面間の高さは僅かに高くなる。一方、楔８３を空所７０から後退させ、次いで、ボールネジ７２を駆動させてカップリング雄部材７４を押し下げて雄部材底面を楔８３上面に当接させると固定板６底面とポーラスセラミック製ロータリーチャックテーブル２１間の高さは僅かに低くなる。楔８３の上面と前記カップリング雄部材７４の底面の接触により固定板６底面とポーラスセラミック製ロータリーチャックテーブル２１の水平方向表面間の高さが決められる。 A wedge attached to the tip of a ball screw 81 that can be moved forward and backward by driving the micro servo motor 82 in a space 70 formed by a V recess 73a of the coupling female member 73 and a bottom surface of the coupling male member 74. 83, and then the ball screw 72 is driven to depress the coupling male member 74 and bring the bottom surface of the male member into contact with the top surface of the wedge 83, thereby increasing the height between the bottom surface of the fixing plate 6 and the surface of the rotary chuck table 21 made of porous ceramic. The height is slightly higher. On the other hand, when the wedge 83 is retracted from the space 70 and then the ball screw 72 is driven to push down the coupling male member 74 to bring the male member bottom surface into contact with the top surface of the wedge 83, the bottom surface of the fixing plate 6 and the porous ceramic rotary chuck The height between the tables 21 is slightly reduced. The height between the bottom surface of the fixed plate 6 and the horizontal surface of the porous ceramic rotary chuck table 21 is determined by the contact between the top surface of the wedge 83 and the bottom surface of the coupling male member 74.
図３および図４に示す基板表面研削装置１００において、ワークチャックロータリーテーブル機構２のポーラスセラミック製ロータリーチャックテーブル２１の近傍にはワークピース表面とポーラスセラミック製ロータリーチャックテーブル２１表面にそれぞれプローブピンを接触して基板の厚みを測定する２点式プロセスインジケータ９１が設けられている。基板の厚みは、基板研削加工するときの砥石軸の基板表面に対する傾斜角度を定めるに利用される。 3 and FIG. 4, in the vicinity of the porous ceramic rotary chuck table 21 of the work chuck rotary table mechanism 2, probe pins are respectively brought into contact with the workpiece surface and the porous ceramic rotary chuck table 21 surface. A two-point process indicator 91 for measuring the thickness of the substrate is provided. The thickness of the substrate is used to determine an inclination angle of the grindstone shaft with respect to the substrate surface when the substrate is ground.
ポーラスセラミック製ロータリーチャックテーブル２１の直径ｒｃに対するカップホイール型砥石１４の環状砥石刃の直径ｒｇの比（ｒｇ／ｒｃ）は、１．０１〜１．２５倍が好ましい。カップホイール型砥石１４の環状砥石刃が基板中心点を通過するよう砥石軸１３にカップホイール型砥石１４は軸承される。 The ratio of the diameter r g of the annular grinding blade of the cup wheel type grinding wheel 14 to the diameter r c of the porous ceramic rotary chuck table 21 (r g / r c) is 1.01 to 1.25 times are preferred. The cup wheel type grindstone 14 is supported by the grindstone shaft 13 so that the annular grindstone blade of the cup wheel type grindstone 14 passes through the center point of the substrate.
また、固定板昇降機構７のカップリング雌部材７３側部には固定板底面高さ位置を測定するリニアセンサ８４が３基備え付けられている。研削加工前に、ポーラスセラミック製ロータリーチャックテーブル２１表面と固定板底面間の三点の高さと、３つの楔８３のキネマカップリング部空所７０進入距離および後退距離と、砥石軸１３のポーラスセラミック製ロータリーチャックテーブル２１表面に対する傾斜角度の相関データを予め表に纏め、数値制御装置のメモリーに記憶させることにより、研削加工された基板の厚みに応じて砥石軸１３の傾斜角度を変化させる基板研削加工ソフトプログラムの設計が可能である。砥石軸の傾斜角度変更ソフトプログラムは、固定板昇降機構７のボールネジ７２（シリンダロッド）が固定板６底面を正三角形の三頂点位置で支持する方式を採用する方が砥石軸傾斜角度ソフトプログラムの設計を容
易とする。
Further, three linear sensors 84 for measuring the height position of the bottom surface of the fixed plate are provided on the side of the coupling female member 73 of the fixed plate lifting mechanism 7. Before grinding, the height of the three points between the surface of the porous ceramic rotary chuck table 21 and the bottom surface of the fixed plate, the kinematic coupling portion cavity 70 entry and retract distances of the three wedges 83, and the porous ceramic of the grindstone shaft 13 Correlation data of the tilt angle with respect to the surface of the made rotary chuck table 21 is preliminarily compiled in a table and stored in the memory of the numerical control device, thereby changing the tilt angle of the grindstone shaft 13 according to the thickness of the ground substrate. A machining software program can be designed. The grinding wheel shaft tilt angle changing software program is a grinding wheel shaft tilt angle software program that adopts a system in which the ball screw 72 (cylinder rod) of the fixed plate lifting mechanism 7 supports the bottom surface of the fixed plate 6 at the three vertex positions of an equilateral triangle. Easy design.
基板の研削加工中に砥石軸１３の基板表面に対する角度を変えて異なった三点の接触点位置で基板を研削加工する方法は、一点の接触点位置で基板を研削加工する方法より、更に優れた平坦性を有する研削加工基板を与える。 The method of grinding the substrate at three different contact point positions by changing the angle of the grindstone shaft 13 with respect to the substrate surface during the grinding of the substrate is even better than the method of grinding the substrate at one contact point position. A ground substrate having high flatness is provided.
ボールネジ７２を除いて図示した図６、図７、および図８に示す固定板昇降機構７のカップリング部品７３，７４において、雌部材７３は、ワークチャックロータリーテーブル機構２の機枠ベース９ａ表面上に固定されている。雌部材７３は、断面Ｖ形状をしており、底部７３ａは傾斜している。また、雌部材７３は中央にボールネジ７２が貫通する孔を有する。 In the coupling parts 73 and 74 of the fixed plate elevating mechanism 7 shown in FIGS. 6, 7, and 8 except for the ball screw 72, the female member 73 is on the surface of the machine base 9 a of the work chuck rotary table mechanism 2. It is fixed to. The female member 73 has a V-shaped cross section, and the bottom 73a is inclined. The female member 73 has a hole through which the ball screw 72 passes in the center.
雄部材７４は、２枚の底部を形成する断面略Ｖ状のプレート７４ａとその上方に設けた幅の小さいプレート７４ｂとこれら２枚のプレートを固定する側壁板７４ｃにより構成され、中央にボールネジ７２が貫通する孔を有し、前記断面略Ｖ状のプレート７４ａの底部も傾斜している。この断面略Ｖ状のプレート７４ａの底面と前記雌部材７３のＶ形状凹部とで空所７０が構成される。 The male member 74 includes a plate 74a having a substantially V-shaped cross section that forms two bottom portions, a plate 74b having a small width provided above the plate 74, and a side wall plate 74c that fixes the two plates. And the bottom of the plate 74a having a substantially V-shaped cross section is also inclined. A space 70 is formed by the bottom surface of the plate 74 a having a substantially V-shaped cross section and the V-shaped recess of the female member 73.
ボールネジ７２は、前記雌部材７３の貫通孔および雄部材７４の貫通孔に鉛直方向に挿入される。 The ball screw 72 is inserted into the through hole of the female member 73 and the through hole of the male member 74 in the vertical direction.
前記雌部材７３と雄部材７４で形成される空所７０内には、ボールネジ８１の先端に取り付けられた楔８３がマイクロサーボモータ８２の駆動により進退移動可能に設けられている。楔８３を空所７０内に進退移動させるボールネジ８１も雌部材７３の底部傾斜と同じく機枠ベース９ａ上表面に対して４〜７度傾斜して設置される。 In the space 70 formed by the female member 73 and the male member 74, a wedge 83 attached to the tip of the ball screw 81 is provided so as to move forward and backward by driving the micro servo motor 82. A ball screw 81 for moving the wedge 83 back and forth in the space 70 is also installed with an inclination of 4 to 7 degrees with respect to the upper surface of the machine frame base 9a, similar to the inclination of the bottom of the female member 73.
このマイクロサーボモータ８２が設置されている反対側には、図４、図６および図９に示されるようにリニアセンサ８４が３基設置され、リニアセンサ８４は固定板６底面とポーラスセラミック製ロータリーチャックテーブル２１表面間の垂直間距離を測定する。 On the opposite side where the micro servo motor 82 is installed, three linear sensors 84 are installed as shown in FIGS. 4, 6 and 9, and the linear sensor 84 is composed of a bottom surface of the fixing plate 6 and a porous ceramic rotary. The vertical distance between the surfaces of the chuck table 21 is measured.
さらに、図８に示すように、キネマカップリングを構成する雄部材７４の側壁板７４ｃには、前記空所７０高さを測定するため、一対の測定プローブを有する高さ位置測定センサ８６が取り付けられている。 Further, as shown in FIG. 8, a height position measuring sensor 86 having a pair of measuring probes is attached to the side wall plate 74c of the male member 74 constituting the kinema coupling in order to measure the height of the void 70. It has been.
固定板昇降機構７は、固定板６の高さ位置を移動させることができるキネマカップリング、シリンダロッドを備える高さ調整装置であればよい。例えば、上述のサーボモータ駆動ボールネジ７２の代わりに空気圧もしくは油圧シリンダで上下移動できるシリンダロッドを用いた固定板昇降機構も利用できる。また、上述の固定板昇降機構７のボールネジ駆動モータ位置を機枠ベース９ａ底側に上下逆にして設置してもよい。さらに、キネマカップリングの雌部材７３と雄部材７４、楔８３の構造を公知のキネマカップリング構造に変更したものを利用してもよい。 The fixed plate elevating mechanism 7 may be a height adjusting device including a kinema coupling and a cylinder rod that can move the height position of the fixed plate 6. For example, instead of the servo motor drive ball screw 72 described above, a fixed plate lifting mechanism using a cylinder rod that can be moved up and down by a pneumatic or hydraulic cylinder can be used. Further, the ball screw drive motor position of the above-described fixed plate lifting mechanism 7 may be installed upside down on the bottom side of the machine base 9a. Further, a structure in which the structure of the female member 73, male member 74, and wedge 83 of the kinema coupling is changed to a known kinema coupling structure may be used.
次に、図２と図３を参照しながら図１０を用いて研削ヘッド１の構造を詳細に説明する。図１０に示すように、カップホイール型研削砥石１４を砥石軸１３の下方に軸承する研削ヘッド１は、そのカップホイール型研削砥石１４の環状に並設された刃先１４ａの底面がポーラスセラミック製ロータリーチャックテーブル２１表面に平行となるよう砥石軸の加工待機位置として設置する。 Next, the structure of the grinding head 1 will be described in detail with reference to FIGS. 2 and 3 and FIG. As shown in FIG. 10, the grinding head 1 that supports the cup wheel type grinding wheel 14 below the grinding wheel shaft 13 has a rotary bottom made of porous ceramic with the bottom surface of the blade edge 14a arranged in an annular shape of the cup wheel type grinding wheel 14. The grinding wheel shaft is set as a processing standby position so as to be parallel to the surface of the chuck table 21.
研削ヘッド１は、平面が正三角形上の固定板６の底面中心点よりカップホイール型ダイヤモンド研削砥石１４が下端となるよう垂下して設置される。 The grinding head 1 is installed so that the cup wheel type diamond grinding wheel 14 is lowered from the center point of the bottom surface of the fixed plate 6 whose plane is an equilateral triangle.
カップホイール型研削砥石１４の刃先１４ａは砥石フランジ１４ｂの下面に環状に並設され、砥石フランジ１４ｂの上面に設けられた環状凹状溝には研削液供給ノズル１４ｃ，１４ｃより研削液が供給される。砥石軸の回転数は、最大５，０００ｒｐｍまで可能で、基板研削時は、１，０００〜２，５００ｒｐｍの回転数が利用される。 The cutting edge 14a of the cup wheel type grinding wheel 14 is annularly arranged on the lower surface of the grinding wheel flange 14b, and the grinding liquid is supplied from the grinding liquid supply nozzles 14c and 14c to the annular concave groove provided on the upper surface of the grinding wheel flange 14b. . The rotational speed of the grindstone shaft can be up to 5,000 rpm, and a rotational speed of 1,000 to 2,500 rpm is used during substrate grinding.
砥石軸１３は円筒状外ハウジング１５により囲繞され、砥石軸１３の下方部は、水静圧ラジアル軸受される。円筒状外ハウジング１５内壁には、水通路１５ｅが設けられ、給水口１５ａより水は水通路１５ｅへ供給される。円筒状軸受ハウジング（ブッシュ）１５ｍ内壁にはラジアル軸受の水通路１５ｋが設けられ、図示されていないが前記円筒状外ハウジング１５の外側壁に設けられた注水口よりポンプにより給水される水が前記円筒状軸受ハウジング１５ｍ内壁に設けられた水通路１５ｋに供給される。円筒状外ハウジング１５は、さらに前記水通路１５ｋ内を減圧して水を通り易くするバキューム減圧口１５ｂと該水通路１５ｋ内の水を円筒状外フジング１５外へ排出するドレン抜口１５ｄと該水通路１５ｋ内へ加圧空気を供給して過剰の水が水通路内に供給されないようシールする圧空供給口１５ｃが設けられる。この円筒状軸受ハウジング１５ｍと砥石軸１３外表面間の水通路１５ｋを流れて砥石軸１３を軸受した水は、ドレン抜口１５ｄより排出される。基板研削終了後、平面研削装置の稼動を停止し、長期運転休止のさいは、先ずバキューム減圧口１５ｂを減圧し、次いで、圧空を圧空供給口１５ｃより水通路１５ｋ内へ供給することにより水通路１５ｋ内に残留する水および水滴をドレン抜口１５ｄより円筒状外ハウジング１５外へ放出するとともに、水通路内を乾燥させ、藻の発生を防ぐ。 The grindstone shaft 13 is surrounded by a cylindrical outer housing 15, and the lower portion of the grindstone shaft 13 is hydrostatically radial bearinged. A water passage 15e is provided in the inner wall of the cylindrical outer housing 15, and water is supplied to the water passage 15e from the water supply port 15a. A water passage 15k of a radial bearing is provided on the inner wall of the cylindrical bearing housing (bush) 15m, and the water supplied by the pump from the water inlet provided on the outer wall of the cylindrical outer housing 15 is not shown in the figure. It is supplied to a water passage 15k provided on the inner wall of the cylindrical bearing housing 15m. The cylindrical outer housing 15 further includes a vacuum pressure reducing port 15b for reducing the pressure in the water passage 15k to facilitate passage of water, a drain outlet 15d for discharging the water in the water passage 15k to the outside of the cylindrical outer fusing 15, and the A pressurized air supply port 15c is provided for supplying pressurized air into the water passage 15k and sealing it so that excessive water is not supplied into the water passage. Water that has flowed through the water passage 15k between the cylindrical bearing housing 15m and the outer surface of the grindstone shaft 13 and bearing the grindstone shaft 13 is discharged from the drain outlet 15d. After the substrate grinding is finished, the operation of the surface grinding apparatus is stopped, and when the long-term operation is stopped, the vacuum pressure reducing port 15b is first depressurized, and then the compressed air is supplied into the water channel 15k from the compressed air supply port 15c. Water and water droplets remaining in 15k are discharged from the drain outlet 15d to the outside of the cylindrical outer housing 15, and the water passage is dried to prevent generation of algae.
砥石軸１３の中央部には、砥石軸１３を水平方向に回転させるビルトインモータ１６が設置され、ビルトインモータ１６は円筒状外ハウジング１５に設けられた冷却液導入パイプ１５ｆより供給された冷却液が円筒状ハウジング１５内壁に設けられた冷却液流路１５ｈを通って排出管１５ｇへ導かれる。 A built-in motor 16 that rotates the grindstone shaft 13 in the horizontal direction is installed at the center of the grindstone shaft 13, and the built-in motor 16 receives coolant supplied from a coolant introduction pipe 15 f provided in the cylindrical outer housing 15. It is guided to the discharge pipe 15g through the coolant flow path 15h provided on the inner wall of the cylindrical housing 15.
前記ラジアル軸受される部室とビルトインモータ１６の冷却液室とは、リップシール１５ｊによりそれぞれの室に供給される流体（水、空気）が混合しないよう区画されている。 The radial bearing part chamber and the coolant chamber of the built-in motor 16 are partitioned by a lip seal 15j so that fluids (water, air) supplied to the respective chambers are not mixed.
砥石軸１３の上方には、砥石軸１３の上端に設けられたボールターゲット１７の位置検出素子である位置センサ８５を搭載し、可動子（永久磁石）１８ａを固定した砥石軸１３を上下方向に０〜１．５ｍｍ程度移動させるためのコイル１８ｂが設置されている。 A position sensor 85, which is a position detection element of the ball target 17 provided at the upper end of the grindstone shaft 13, is mounted above the grindstone shaft 13, and the grindstone shaft 13 to which the mover (permanent magnet) 18a is fixed is vertically moved. A coil 18b for moving about 0 to 1.5 mm is installed.
前記ビルトインモータ１６で砥石軸１３の回転を、可動子１８ａとコイル１８ｂとの組み合わせのモータ１８で砥石軸１３の１．５ｍｍ以下のスラスト直動を行うことができ、これらモータ１６，１８を合わせて回転／直線複合アクチュエータと呼ぶ。 The built-in motor 16 can rotate the grindstone shaft 13, and the motor 18, which is a combination of the mover 18 a and the coil 18 b, can perform a thrust linear movement of 1.5 mm or less of the grindstone shaft 13. This is called a combined rotary / linear actuator.
砥石軸の回転／直動線複合アクチュエータの構造は、既述した特許文献６、特許文献７および特許文献８に開示されるスピンドルの回転／直動線複合アクチュエータの構造としてもよい。 The structure of the rotary / linear motion line combined actuator for the grindstone shaft may be the structure of the combined rotary / linear motion line actuator for the spindle disclosed in Patent Document 6, Patent Document 7 and Patent Document 8 described above.
次に、図２、図３および図１１を用いてワークチャックロータリーテーブル機構２の構造を詳細に説明する。ワークチャックロータリーテーブル機構２は、ポーラスセラミック製ロータリーチャックテーブル２１を軸承する中空スピンドル２２、内周壁に水通路２３ａ，２５ｂが設けられた窒化炭素セラミック製円筒状ブッシュ２３、この円筒状ＳｉＣセラミック製ブッシュの水通路２３ａ，２５ｂに連通するよう設けられた水供給口２４ａとこれら水通路２３ａ，２５ｂ内を減圧して水を通り易くするバキューム減圧口２４ｂと該水通路２３ａ，２５ｂ内の水を円筒状外ハウジング２４外へ排水するドレン抜口２４ｄと該水通路内へ加圧空気を送って過剰の水が水通路内２３ａ，２５ｂへ供給されないようシールする圧空供給供給口２４ｃを備える円筒状外ハウジング２４、円筒状外ハウジング２４の内壁に設けられた冷却水通路に冷却水を供給する注水口２４ｆ，２６ｃ、これら冷却水通路内の水を円筒状外ハウジング２４外へ排水する排水口２４ｇ，２６ｃ、前記中空スピンドル２２の上方に設けたスラスト軸受２５ａおよび中空スピンドル２２の中央部に設けたラジアル軸受２５ｂと、前記中空スピンドル２２の下方部に設けた中空スピンドル回転駆動機構であるビルトインモータ２７、エンコーダ２８および中空スピンドル２２下端で連結されるロータリージョイント２９、ならびに、このロータリージョイント２９を介して前記中空スピンドル２２管内の流体を減圧する減圧機構である真空ポンプ、中空スピンドル管内を加圧する加圧気体供給機構であるコンプレッサおよび前記中空スピンドル２２管内に純水を供給する給水ポンプに接続される管２２ａ，２２ｂを備える。 Next, the structure of the work chuck rotary table mechanism 2 will be described in detail with reference to FIGS. 2, 3 and 11. Workpiece chuck rotary table mechanism 2, hollow spindle 22, the water passage 23a to the inner wall, 25b is carbon nitride ceramic cylindrical bush 23 provided for journalled a porous ceramic rotary chuck table 21, the cylindrical S i C Ceramic A water supply port 24a provided to communicate with the water passages 23a and 25b of the bush made of water, a vacuum pressure reduction port 24b for reducing the pressure in the water passages 23a and 25b and facilitating passage of water, and water in the water passages 23a and 25b A cylinder provided with a drain outlet 24d for draining water out of the cylindrical outer housing 24 and a compressed air supply / supply port 24c for sending pressurized air into the water passage so as to prevent excess water from being supplied to the water passages 23a and 25b. The cooling water is supplied to the cooling water passage provided on the inner wall of the cylindrical outer housing 24 and the cylindrical outer housing 24. Water injection ports 24f and 26c, drainage ports 24g and 26c for draining the water in the cooling water passage to the outside of the cylindrical outer housing 24, a thrust bearing 25a provided above the hollow spindle 22, and a central portion of the hollow spindle 22. A radial bearing 25b provided, a built-in motor 27 which is a hollow spindle rotational drive mechanism provided at a lower portion of the hollow spindle 22, an encoder 28 and a rotary joint 29 connected at the lower end of the hollow spindle 22, and the rotary joint 29 To a vacuum pump that is a pressure reducing mechanism for reducing the pressure of the fluid in the hollow spindle 22 pipe, a compressor that is a pressurized gas supply mechanism for pressurizing the hollow spindle pipe, and a water supply pump that supplies pure water into the hollow spindle 22 pipe. Tube 22a, 22b.
中空スピンドル２２および円筒状ブッシュ２３の素材は、窒下珪素、窒化炭素、酸化珪素、アルミナ、ジルコニアなどのセラミックが好ましいが、従来のステンレスあるいはクロムメッキ鋼製スピンドル表面をセラミック化学蒸着で１００〜５００μｍ厚コーティングしたものでもよい。 The material of the hollow spindle 22 and the cylindrical bush 23 is preferably a ceramic such as silicon nitride, carbon nitride, silicon oxide, alumina, zirconia, etc., but a conventional stainless steel or chrome plated steel spindle surface is 100 to 500 μm by ceramic chemical vapor deposition. A thick coating may be used.
前記スラスト軸受２５ａの水通路には、８箇所設けられている純水供給ノズル２５ａ１より純水が供給され、排出管２５ａ２より排水する。ラジアル軸受２５ｂの水通路２３ａには、前記水供給口２４ｃより水が給水され、ドレン抜口２４ｄより排水される。ビルトインモータ２７の冷却水は、給水口２６ａより給水され、排出口２６ｂより排水される。ビルトインモータ２７を冷却する冷却水は、給水口２４ａより供給され、排水口２６ｂより排出される。 Wherein the water passage of the thrust bearing 25a, the pure water from the pure water supply nozzle 25a 1 provided eight supplied, draining from the discharge pipe 25a 2. Water is supplied to the water passage 23a of the radial bearing 25b from the water supply port 24c and drained from the drain outlet 24d. The cooling water of the built-in motor 27 is supplied from the water supply port 26a and drained from the discharge port 26b. Cooling water for cooling the built-in motor 27 is supplied from the water supply port 24a and discharged from the drain port 26b.
ワークピース(基板)は、ポーラスセラミック製ロータリーチャックテーブル２１上に載置され、真空ポンプを稼動させてワークピースをポーラスセラミック製テーブル２１上に位置固定し、ついで、ビルトインモータ２７で中空スピンドル２２を水平方向に回転させる。中空スピンドル２２の回転数は５００ｒｐｍまで可能で、基板研削時は、５０〜２００ｒｐｍで利用される。 The workpiece (substrate) is placed on the porous ceramic rotary chuck table 21, the vacuum pump is operated to fix the workpiece on the porous ceramic table 21, and the built-in motor 27 then holds the hollow spindle 22. Rotate horizontally. The rotation speed of the hollow spindle 22 can be up to 500 rpm, and is used at 50 to 200 rpm during substrate grinding.
図１に示す基板の平面研削装置１００を用いて基板を平坦化研削加工する工程を以下に説明する。 A process of flattening and grinding a substrate using the substrate surface grinding apparatus 100 shown in FIG. 1 will be described below.
１）搬送ロボットや搬送パッドを用いて基板をポーラスセラミック製ロータリーチャックテーブル２１上へ載置し、ついで、真空ポンプを稼動させてポーラスセラミック製ロータリーチャックテーブル底面の減圧室２１ａを減圧し、基板をポーラスセラミック製ロータリーチャックテーブル２１上に固定する。 1) The substrate is placed on the porous ceramic rotary chuck table 21 using a transfer robot or a transfer pad, and then the vacuum pump is operated to depressurize the decompression chamber 21a on the bottom surface of the porous ceramic rotary chuck table. It is fixed on a rotary chuck table 21 made of porous ceramic.
２）ビルトインモータ２７を駆動して中空スピンドル２２を回転させる。 2) The built-in motor 27 is driven to rotate the hollow spindle 22.
３）待機位置にある研削ヘッド１を垂下して固定する固定板６の固定板昇降機構７三基のボールネジ７２を駆動させて固定板６を上昇させた後、固定板昇降機構７のカップリング雌部材７３とカップリング雄部材７４とで形成された空所７０内にマイクロサーボモータ８２の一基による駆動により進退移動可能なボールネジ８１の先端に取り付けられた楔８３を進入させながら他のマイクロサーボモータ８２の二基による駆動により進退移動可能なボールネジ８１の先端に取り付けられた楔８３を後退させ、次いで、ボールネジ７２を駆動させてカップリング雄部材７４を押し下げてその雄部材底面を楔８３上面に当接させて固定板６底面とポーラスセラミック製ロータリーチャックテーブル２１表面間の高さ設定を行う。 3) After driving the three ball screws 72 of the fixed plate lifting mechanism 7 of the fixed plate 6 that hangs down and fixes the grinding head 1 in the standby position to raise the fixed plate 6, the coupling of the fixed plate lifting mechanism 7 While a wedge 83 attached to the tip of a ball screw 81 that can be moved forward and backward by driving by one of the micro servo motors 82 is inserted into a space 70 formed by the female member 73 and the coupling male member 74, another micro The wedge 83 attached to the tip of the ball screw 81 which can be moved forward and backward by driving with two servo motors 82 is retracted, and then the ball screw 72 is driven to push down the coupling male member 74 so that the bottom surface of the male member is wedge 83. The height between the bottom surface of the fixed plate 6 and the surface of the porous ceramic rotary chuck table 21 is set in contact with the upper surface.
４）砥石軸１３をビルトインモータ１６で回転させながら固定板昇降機構７のボールネジ７２を下降させてカップホイール型ダイヤモンド研削砥石１４を回転している基板面へ摺擦させ、基板の研削切り込みを開始する。この際、カップホイール型ダイヤモンド研削砥石１４のフランジ１４ｂ上方溝内へ研削液が供給ノズル１４ｃより供給され、フランジ壁斜めに設けられた貫通孔を経由して研削液は基板表面へ供給され、カップホイール型ダイヤモンド研削砥石１４の砥石刃１４ａと基板を冷却する。基板の切り込みのための砥石軸下方送り込みは回転／直動複合アクチュエータによる砥石軸送りで行う。 4) While the grindstone shaft 13 is rotated by the built-in motor 16, the ball screw 72 of the fixed plate elevating mechanism 7 is lowered and the cup wheel type diamond grinding grindstone 14 is rubbed against the rotating substrate surface to start grinding cutting of the substrate. To do. At this time, the grinding liquid is supplied from the supply nozzle 14 c into the upper groove of the flange 14 b of the cup wheel type diamond grinding wheel 14, and the grinding liquid is supplied to the substrate surface via the through holes provided obliquely to the flange wall. The wheel blade 14a of the wheel-type diamond grinding wheel 14 and the substrate are cooled. The grinding wheel shaft lower feed for cutting the substrate is performed by grinding wheel shaft feeding by a combined rotary / linear motion actuator.
５）研削途中に、２点式プロセスインジケータ９１により基板の厚みを測定し、その厚み値を基に砥石軸１３の基板表面に対する傾斜角を定めた砥石軸傾斜プログラムに指示される固定板６の高さ位置にするため、前述の固定板昇降機構７のボールネジ７２を上昇させることにより固定板６を若干上昇させて雌部材７３と雄部材７４の空所７０の高さを若干拡げ、ついで、マイクロサーボモータ８２の二基による駆動により進退移動可能なボールネジ８１の先端に取り付けられた楔８３を進入させながら他のマイクロサーボモータ８２の一基による駆動により進退移動可能なボールネジ８
１の先端に取り付けられた楔８３を後退させ、次いで、ボールネジ７２を駆動させてカップリング雄部材７４を押し下げてその雄部材底面を楔８３上面に当接させて固定板６底面とポーラスセラミック製ロータリーチャックテーブル２１表面間の高さ設定を行う。
5) During grinding, the thickness of the substrate is measured by the two-point process indicator 91, and the fixed plate 6 is instructed by the grinding wheel shaft tilting program in which the tilting angle of the grinding wheel shaft 13 with respect to the substrate surface is determined based on the thickness value. In order to make it the height position, the fixing plate 6 is raised by raising the ball screw 72 of the fixing plate raising / lowering mechanism 7 described above to slightly increase the height of the space 70 of the female member 73 and the male member 74, A ball screw 8 that can be moved forward and backward by driving by one of the other micro servo motors 82 while a wedge 83 attached to the tip of a ball screw 81 that can move forward and backward by being driven by two of the micro servo motors 82 is entered.
The wedge 83 attached to the tip of 1 is retracted, and then the ball screw 72 is driven to push down the coupling male member 74 so that the bottom surface of the male member abuts on the top surface of the wedge 83 to make the bottom surface of the fixing plate 6 and porous ceramic. The height between the surfaces of the rotary chuck table 21 is set.
６）角度調整の行われた砥石軸１３を固定板昇降機構７のボールネジ７２の下降により行い、カップホイール型ダイヤモンド研削砥石１４の砥石刃１４ａの基板表面に接触させ、砥石刃１４ａによる基板表面の摺擦を再開する。基板の切り込みのための砥石軸下方送り込みは回転／直動複合アクチュエータによる砥石軸送りで行う。 6) The grindstone shaft 13 whose angle has been adjusted is lowered by lowering the ball screw 72 of the fixed plate elevating mechanism 7 and brought into contact with the substrate surface of the grindstone blade 14a of the cup wheel type diamond grinding grindstone 14, and the substrate surface by the grindstone blade 14a is contacted. Resume rubbing. The grinding wheel shaft lower feed for cutting the substrate is performed by grinding wheel shaft feeding by a combined rotary / linear motion actuator.
７）前述の５）工程の基板厚み測定と砥石軸傾斜角度調整、および６）工程の基板摺擦を繰り返す。基板の厚みが所望の最終厚みに近い、もしくは、最終厚みとなったときは、砥石軸１３の基板表面に対する傾斜角度が０度（固定板６底面あるいはカップホイール型ダイヤモンド研削砥石の環状砥石刃１４ａ群の底面と、基板の水平方向表面あるいは機枠ベース９ａ表面とが平行）となるよう砥石軸傾斜角度を暫時減少させて行う。 7) The substrate thickness measurement and the grindstone axis tilt angle adjustment in the above 5) step, and the substrate rubbing in the 6) step are repeated. When the thickness of the substrate is close to the desired final thickness, or when the final thickness is reached, the inclination angle of the grindstone shaft 13 with respect to the substrate surface is 0 degree (the bottom surface of the fixed plate 6 or an annular grindstone blade 14a of a cup wheel type diamond grinding grindstone). The grinding wheel shaft inclination angle is decreased for a while so that the bottom surface of the group is parallel to the horizontal surface of the substrate or the surface of the machine base 9a.
８）基板の研削加工終了後は、固定板昇降機構７のボールネジ７２を上昇させることにより研削ヘッド１を上方へ後退させて研削加工基板より遠ざける待機位置戻しを行う。研削ヘッド待機位置で、リニアセンサ８４を用いて固定板６底面までの距離を測定し、砥石軸１３の基板表面に対する傾斜角度が０度であったか確認する。０度でないときは、固定板昇降機構７の３本のボールネジ７２の昇降を調整し、砥石軸１３の基板表面に対する傾斜角度が０度であるよう調整する。 8) After completion of the substrate grinding process, the ball screw 72 of the fixed plate elevating mechanism 7 is raised to retract the grinding head 1 upward and return to the standby position away from the grinding substrate. At the grinding head standby position, the distance to the bottom surface of the fixed plate 6 is measured using the linear sensor 84, and it is confirmed whether the inclination angle of the grindstone shaft 13 with respect to the substrate surface is 0 degree. When it is not 0 degree, the raising / lowering of the three ball screws 72 of the fixed plate raising / lowering mechanism 7 is adjusted, and the inclination angle with respect to the substrate surface of the grindstone shaft 13 is adjusted to 0 degree.
９）ポーラスセラミック製ロータリーチャックテーブル２１の回転を止めた後、真空ポンプの稼動を停止させ、ついで、ポーラスセラミック製ロータリーチャックテーブル２１底面に加圧水を供給して研削加工基板のポーラスセラミック製ロータリーチャックテーブル２１表面からの基板剥離を容易とする。 9) After the rotation of the porous ceramic rotary chuck table 21 is stopped, the vacuum pump is stopped, and then pressurized water is supplied to the bottom surface of the porous ceramic rotary chuck table 21 to provide a porous ceramic rotary chuck table for the ground substrate. 21 The substrate can be easily peeled from the surface.
１０）搬送ロボットまたは搬送パッドにより研削加工基板を吸着し、ポーラスセラミック製ロータリーチャックテーブル２１表面より次の加工工程へ研削加工基板を移送する。 10) The ground substrate is sucked by the transport robot or the transport pad, and the ground substrate is transferred from the surface of the porous ceramic rotary chuck table 21 to the next processing step.
１１）図示されていないポーラスセラミック製ロータリーチャックテーブル洗浄機器によりポーラスセラミック製ロータリーチャックテーブル２１表面を洗浄した後、ポーラスセラミック製ロータリーチャックテーブル底面２１ａより加圧水を０．１〜０．５秒ジェットフラッシュ（噴出）させてポーラスセラミック製ロータリーチャックテーブル洗浄を行う。 11) After the surface of the porous ceramic rotary chuck table 21 is cleaned by a porous ceramic rotary chuck table cleaning device (not shown), pressurized water is jetted from the bottom surface 21a of the porous ceramic rotary chuck table for 0.1 to 0.5 seconds ( The ceramic ceramic rotary chuck table is cleaned.
本発明の基板の研削装置１００は、砥石軸１３の基板表面に対する傾斜角度調整に砥石ヘッド１を垂下させた固定板６下面の三箇所にキネマカップリング、ボールネジ（昇降シリンダロッド）を備えた固定板昇降機構３基を配して行うので、基板研削時、固定板の荷重も砥石を通じて基板表面に負荷が懸かり、高剛性の平面研削装置となっている。それゆえ、基板径が４５０ｍｍと大きいワークピースであっても平坦性に優れた研削加工基板が得られる。 The substrate grinding apparatus 100 of the present invention is equipped with kinematic couplings and ball screws (elevating cylinder rods) at three locations on the lower surface of the fixing plate 6 on which the grinding wheel head 1 is suspended for adjusting the inclination angle of the grinding wheel shaft 13 with respect to the substrate surface. Since the three plate raising / lowering mechanisms are arranged, the fixed plate load is applied to the substrate surface through the grindstone at the time of substrate grinding, so that a highly rigid surface grinding apparatus is obtained. Therefore, even if the workpiece has a large substrate diameter of 450 mm, a ground substrate with excellent flatness can be obtained.
１００ 平面研削装置 １ 研削ヘッド １３ 砥石軸 １４ カップホイール型砥石 １４ｃ 研削液供給ノズル １５ 円筒状ハウジング １６，１８ 回転／直動複合アクチュエータ ２ ワークチャックロータリーテーブル機構 ２１ ポーラスセラミック製ロータリーチャックテーブル ２２ 中空スピンドル ２３ 窒化炭素セラミック製円筒状ブッシュ ２４ 円筒状ハウジング部材 ２５ａ スラスト軸受 ２５ｂ ラジアル軸受 ２３ａ，２５ａ１ 水通路 ２７ ビルトインモータ ２８ エンコーダ ２９ ロータリージョイント ６ 研削ヘッドの固定板 ７ 固定板昇降機構 ７０ 空所 ７１ ボールネジ駆動モータ ７２ ボールネジ ７３ カップリング雌部材 ７４ カップリング雄部材 ７６ エンコーダ ７９ａ 固定具 ７９ｂ 固定嵌合プレート ８１ ボールネジ ８２ マイクロサーボモータ ８３ 楔 ８４ リニアセンサ８５ 高さ位置測定センサ ９ 機枠 ９ａ 機枠ベース９１ ２点式プロセスインジケータ DESCRIPTION OF SYMBOLS 100 Surface grinding machine 1 Grinding head 13 Grinding wheel axis 14 Cup wheel type grinding wheel 14c Grinding liquid supply nozzle 15 Cylindrical housing 16, 18 Rotary / linear motion compound actuator 2 Work chuck rotary table mechanism 21 Porous ceramic rotary chuck table 22 Hollow spindle 23 Cylindrical bush made of carbon nitride ceramic 24 Cylindrical housing member 25a Thrust bearing 25b Radial bearing 23a, 25a 1 Water passage 27 Built-in motor 28 Encoder 29 Rotary joint 6 Grinding head fixing plate 7 Fixing plate lifting mechanism 70 Void 71 Ball screw drive motor 72 Ball screw 73 Coupling female member 74 Coupling male member 76 Encoder 79a Fixing tool 79b Fixed fitting plate 81 Ball screw 82 Microphone Servomotor 83 wedge 84 linear sensor 85 height measuring sensor 9 machine frame 9a machine frame base 91 2-point process indicator
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| TW097130565A TWI436854B (en) | 2008-02-13 | 2008-08-11 | Substrate surface grinding device |
| KR1020080105664A KR101311135B1 (en) | 2008-02-13 | 2008-10-28 | Surface grinding machine of substrate |
| US12/356,793 US8047897B2 (en) | 2008-02-13 | 2009-01-21 | Substrate flat grinding device |
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| KR20090087802A (en) | 2009-08-18 |
| US20090203299A1 (en) | 2009-08-13 |
| TW200934615A (en) | 2009-08-16 |
| US8047897B2 (en) | 2011-11-01 |
| JP2009190102A (en) | 2009-08-27 |
| TWI436854B (en) | 2014-05-11 |
| KR101311135B1 (en) | 2013-09-25 |
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