JP5184910B2 - Substrate surface grinding machine - Google Patents

Substrate surface grinding machine Download PDF

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Publication number
JP5184910B2
JP5184910B2 JP2008031325A JP2008031325A JP5184910B2 JP 5184910 B2 JP5184910 B2 JP 5184910B2 JP 2008031325 A JP2008031325 A JP 2008031325A JP 2008031325 A JP2008031325 A JP 2008031325A JP 5184910 B2 JP5184910 B2 JP 5184910B2
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Prior art keywords
grinding
ball screw
substrate
fixed plate
grindstone
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JP2009190102A (en
Inventor
守幸 柏
悦男 藤田
一雄 小林
富美夫 久保
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株式会社岡本工作機械製作所
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/04Headstocks; Working-spindles; Features relating thereto
    • B24B41/047Grinding heads for working on plane surfaces

Description

The present invention relates to a work chuck rotary table mechanism in which a rotary / linearly movable grindstone shaft supported by a hydrostatic bearing and a porous ceramic rotary chuck table are supported by a hollow spindle, and the hollow spindle is supported by a hydrostatic bearing. And a high-rigidity surface grinding apparatus mainly composed of a grindstone shaft tilting mechanism. This surface grinding machine is used for surface grinding of workpieces such as silicon bare wafers, semiconductor substrates, ceramic substrates, GaAs plates, sapphire substrates, etc., and improves the planarization of the workpieces and the substrate grinding speed. It is.

After placing a workpiece such as a silicon bare wafer or semiconductor substrate on a porous ceramic rotary chuck table, rotate the grindstone shaft that supports the cupwheel grindstone and lower it to place the cupwheel grindstone on the workpiece surface. A surface grinding machine that reduces the thickness of the workpiece by grinding the workpiece surface by first controlling the inclination angle and feed amount (cutting amount) of the grinding wheel shaft with respect to the workpiece and then gradually decreasing it. It has become. The reason for changing the inclination of the grindstone axis is to prevent grinding burn of the workpiece to be ground and to make the thickness distribution of the workpiece as uniform as possible.

For example, grinding is performed by placing a wafer on a porous ceramic rotary chuck table that is rotationally driven in a horizontal plane, and grinding the wafer with a cup wheel type diamond grindstone attached to a lower portion of a grinding spindle head arranged in a vertical direction. In the apparatus, driving means for relatively moving the grinding spindle head and the wafer in the vertical z-axis direction, tilting means for rotating the grinding spindle head or wafer about the x-axis and the y-axis in a horizontal plane, Surface grinding with control means for controlling the driving means and the tilting means to change the feed amount of the grinding spindle head and the relative tilt between the grinding spindle head and the workpiece stepwise or continuously according to the stage of grinding A device has been proposed. The tilting means is provided in a column that fixes the lifting means of the grinding spindle head (see, for example, Patent Document 1).

An air bearing spindle comprising a spindle body on which a grinding wheel for grinding the surface of a workpiece is mounted, a radial bearing for supporting the spindle body by air, and a housing including a thrust bearing. The blowing area is divided into at least three areas, and an air spindle inclination adjusting mechanism for adjusting the inclination of the spindle body by individually adjusting the air supply pressure to the divided air blowing area has been proposed. (For example, refer to Patent Document 2).

Furthermore, a porous ceramic rotary chuck table for holding a workpiece, a grinding head that is rotated by attaching a grindstone to a spindle, a bearing that supports the grindstone spindle, a magnetic bearing that controls tilting of the grinding head, and the grinding A sensor for detecting a relative attitude of the spindle with respect to the workpiece; and attitude control means for controlling the magnetic bearing so that the grinding wheel spindle assumes a preset attitude using detection data detected by the sensor. Using surface grinding, the workpiece and grinding wheel are moved relative to each other while the grinding wheel of the grinding head is pressed against the workpiece held on the porous ceramic rotary chuck table. Grinding methods have also been proposed (for example, patent documents) 3 reference.).

Furthermore, a rotating grindstone that holds the workpiece while being held in place by the grindstone feeding means, a workpiece support that supports the workpiece, and a workpiece support that moves the workpiece support in a direction parallel to the workpiece surface. A magnetic bearing device for controlling the position of the wheel shaft of the rotating grindstone, and a grinding wheel feeding means and a workpiece support base feed using the axial direction control current and the radial direction control current of the magnetic bearing device. And a control means for controlling the means, the feed of the work support is controlled based on the radial direction control current of the magnetic bearing device, and the rotating grindstone is controlled based on the axial direction control current of the magnetic bearing device. There has also been proposed a surface grinding apparatus in which a stop position in a direction perpendicular to the workpiece surface is controlled (see, for example, Patent Document 4).

And an inner surface provided with a spindle device for rotating the grindstone shaft, a workpiece holding means for holding the workpiece, and a feeding means for relatively moving the grindstone of the spindle device and the workpiece held by the workpiece holding means. A cylindrical grinding device, wherein the spindle device is connected to a spindle mounted with a grindstone at a tip thereof via a hydrostatic magnetic compound bearing in which a hydrostatic gas bearing and a magnetic bearing are combined so that a combined portion is generated. As a displacement measuring means that is rotatably installed in the main body and obtains the displacement of the spindle, a pressure sensor that measures the pressure of the bearing surface of the hydrostatic gas bearing is provided, and the displacement of the spindle is obtained from the measured value of the pressure sensor. An internal cylindrical grinding device provided with magnetic bearing control means for controlling the magnetic force of the magnetic bearing has also been proposed (see, for example, Patent Document 5). ).

On the other hand, although not disclosed for use in a grinding apparatus, a composite (rotation / linear motion) actuator that rotates and linearly moves a rotatable / linearly movable tool spindle has also been proposed (for example, Patent Document 6, Patent) (Ref. Literature 7, Patent Literature 8, and Patent Literature 9).

There is also known a test apparatus including a height position adjuster using a kinematic coupling in which a male member and a female member are coupled (see, for example, Patent Document 10 and Non-Patent Document 1).

Furthermore, the grinding wheel shaft that supports the rotor of the built-in motor is supported by a hydrostatic thrust bearing and a hydrostatic radial bearing, and the grinding wheel shaft is constituted by a heat pipe, and the heat generation of the rotor is caused by the heat pipe in the longitudinal direction of the grinding wheel shaft. There is also known a grinding head that is supported by a hydrostatic bearing having a cooling structure that transmits and escapes from the hydrostatic bearing to the outside (see, for example, Patent Document 11). A work-use porous ceramic rotary chuck table supported by a hydrostatic bearing has also been proposed (see, for example, Patent Document 12 and Patent Document 13).

Patent No. 3,472,784 JP 11-132232 A JP 2005-22059 A JP 2005-262431 A JP 2000-24805 A US Patent Application Publication No. 2007/0222401 JP 2006-220196 A JP 2004-364348 A JP 2006-220178 A US Pat. No. 6,104,202 Bal-tec, "Kinema coupling design for Z-axis", {on-line}, pages 430-434, {searched May 30, 2005}, Internet <URL: http://www.precisionballs.com /kinematic_repeatability.html> Japanese Patent Laid-Open No. 11-235643 US Patent Application Publication No. 2007/0286537 Japanese Patent Application Laid-Open No. 2000-240652

Back surface grinding obtained using the grinding apparatus for tilting the grindstone shaft described in Patent Literature 1, Patent Literature 2 and Patent Literature 3 as long as the semiconductor substrate (workpiece) has a diameter of 200 mm or 300 mm and a thickness of 100 to 770 μm. The processed semiconductor substrate is a ground semiconductor substrate that has a thickness distribution (thickness fluctuation is around 1 μm) that can withstand the practical use of DRAM even if the central part is thin and the edge is thick. In a semiconductor substrate for DRAM having a thickness of 20 to 50 μm, the percentage of the thickness fluctuation with respect to the target thickness of 20 to 50 μm is as large as 2 to 5%, and the thickness distribution is more excellent (the thickness fluctuation is 0). .5μ
It is desired to realize a highly rigid surface grinding apparatus that does not cause cracks or cracks in the semiconductor substrate during grinding.

In addition, the semiconductor manufacturing industry dislikes that the substrate is soiled with oil during substrate processing, and the emergence of a hydrostatic bearing substrate surface grinding apparatus is desired.

The first object of the present invention is to support the grindstone shaft that can rotate / linearly move as described in Patent Document 6, Patent Document 7, Patent Document 8, and Patent Document 9 so as to be rotatable and linearly movable by a magnetic bearing or a thrust bearing. The grinding head technology and the kinematic coupling height position adjustment technology described in Patent Literature 10 and Non-Patent Literature 1 are assembled into the surface grinding device technology described in Patent Literature 1 to Patent Literature 5 to achieve high rigidity. It is to provide a substrate surface grinding apparatus.

The second object of the present invention is to apply the hydrostatic bearing technology described in Patent Literature 12 and Patent Literature 13 to the bearings of the grinding wheel spindle and the work spindle of this high-rigidity substrate surface grinding apparatus, thereby providing environmentally friendly water. An object of the present invention is to provide a substrate surface grinding apparatus for a hydrostatic bearing.

A third object of the present invention is to provide an elevating mechanism that uses a new kinema coupling structure.

According to the first aspect of the present invention, there is provided a grinding head in which a cup wheel type grindstone supported by a grindstone shaft capable of rotation / linear movement is supported by a hydrostatic bearing and a magnetic bearing so as to be rotatable and linearly movable, and the grindstone shaft is rotated / linearly moved. A rotary / linear motion combined actuator, a fixed plate with a grinding head fixed at the center of the lower surface so that the grinding wheel axis is vertical, and a porous ceramic rotary chuck table provided below the grinding head is supported by a hollow spindle, A work chuck rotary table mechanism whose hollow spindle is supported by a hydrostatic bearing, wherein a horizontal surface of the porous ceramic rotary chuck table is parallel to a bottom surface of a cup wheel type grindstone supported by the grindstone shaft. The work chuck rotary table mechanism provided on the machine and the grinding wheel axis in the vertical direction Plane of the substrate with a fixing plate lift mechanism 3 group with a kinematic coupling and the cylinder rod the cause of the fixed plate is vertically moved to three positions of the apexes of an equilateral triangle or isosceles triangle to comprise let fixed plate lower surface of center point In the grinding apparatus , the fixed plate elevating mechanism has a cross-sectional V-shaped coupling female member having a hole through which the ball screw penetrates in the center and fixed to the surface of the machine base of the work chuck rotary table mechanism, and the ball screw penetrates in the center. A coupling male member having a hole and having a bottom cross-sectional shape that fits into the inner wall of the V recess of the coupling female member, the through hole of the coupling female member, and the through hole of the coupling female member on the vertical line A ball screw that penetrates through the bottom of the machine frame base of the work chuck rotary table mechanism with a fixture A ball screw in which a ball screw drive motor, an encoder, and a ball screw screwed body are attached to the upper end side of the ball screw; A wedge attached to the tip of a ball screw that can be moved forward and backward by driving a micro servo motor in a space formed by a V recess of the coupling female member and a bottom surface of the coupling male member, The present invention provides a surface grinding apparatus for a substrate, which is a fixed plate height position adjusting mechanism capable of determining the height position of the fixed plate by contacting the wedge with the bottom surface of the coupling male member .

According to a second aspect of the present invention, the grindstone shaft supported by the hydrostatic bearing is supported through a composite bearing in which a magnetic bearing and a hydrostatic bearing are combined so that a portion that serves as a mutual portion is generated. hollow spindle journalled chuck table, characterized in that it is supported by the water hydrostatic bearings, there is provided a surface grinding device substrate according to claim 1.

Since the inclination angle of the grinding wheel shaft with respect to the workpiece (substrate) is performed by three fixed plate lifting mechanisms provided at three locations on the lower surface of the fixed plate provided with the grinding wheel shaft in the vertical direction, the load of the fixed plate is applied during substrate grinding. In addition, a load is applied to the surface of the substrate through the grindstone, and the surface grinding device has a higher rigidity than the grinding devices of Patent Literature 1, Patent Literature 2, Patent Literature 3 and Patent Literature 4, and the substrate diameter is as large as 450 mm. Even for a workpiece, a ground substrate with an excellent flat wall thickness distribution can be obtained.

Moreover, it describes in the method of inclining the 2 axis | shaft of the x axis of the column which fixes the grindstone axis | shaft described in patent document 1 so that raising / lowering, y axis, and patent document 2, patent document 4, patent document 4, and patent document 5 are described. Compared with the method of tilting the grinding wheel shaft at three points of the air bearing and four points of the magnetic bearing, it is easy and accurate to set the tilt angle of the grinding wheel shaft with three fixed plate height position adjustment mechanisms And the rigidity is high.

When hydrostatic bearings are used for the hollow spindle and the grinding wheel spindle bearing the porous ceramic rotary chuck table, the surface grinding apparatus is environmentally friendly.

By using a grinding head structure in which a cup wheel type grindstone is supported by a grindstone shaft that is rotated and linearly moved by a composite actuator, the substrate is driven by a linear movement of 0 to 1.5 mm of the grindstone shaft during surface grinding of the substrate. Grinding is performed by moving the fixed plate up or down using a fixed plate lifting mechanism using a kinema coupling or cylinder rod to cut the surface or retract from the substrate surface and move the grindstone head to the standby position. Time can be shortened.

Hereinafter, the present invention will be described in more detail with reference to the drawings. FIG. 1 is a perspective view showing the main part of the surface grinding apparatus of the present invention, and two of the three fixed plate lifting mechanisms are shown with the ball screw housing material omitted. 2 is a front cross-sectional view of the surface grinding apparatus, FIG. 3 is a side cross-sectional view of the surface grinding apparatus, and FIG. 4 is a horizontal cross-sectional view of the surface grinding apparatus. . 5 is a plan view of the surface grinding apparatus, FIG. 6 is a front sectional view of the kinema coupling portion of the fixed plate elevating mechanism, FIG. 7 is a plan view of the kinema coupling portion of the fixed plate elevating mechanism, and FIG. 9 is a side view of the kinema coupling portion, FIG. 9 is a front view of a height position measuring displacement sensor attached to the coupling portion of the fixed plate lifting mechanism, FIG. 10 is a sectional view of the grinding head, and FIG. 11 is a work chuck rotary. It is sectional drawing of a table mechanism.

As shown in FIGS. 1, 2, and 3, the substrate surface grinding apparatus 100 according to the present invention includes a work chuck table mechanism 2 installed in a central circular cavity of a machine frame 9, a grindstone shaft that can rotate / linearly move. A grinding head 1 that supports a cup wheel type grindstone 14 supported by a shaft 13 by a hydrostatic bearing and a magnetic bearing so as to be rotatable and linearly movable, a rotary / linear motion combined actuator 18 that rotates / directly moves the grindstone shaft 13, and the grindstone Vertex of equilateral triangle or isosceles triangle with respect to the center point of the fixed plate 6 with the grinding head 1 fixed at the center position of the lower surface and the fixed plate 6 with the grindstone shaft 13 provided in the vertical direction so that the shaft 13 is vertical. Three sets of kinematic couplings for moving the fixed plate up and down at three positions and a fixed plate elevating mechanism 7 including a cylinder rod are configured as main assembly materials.

The work chuck rotary table mechanism 2 includes a porous ceramic rotary chuck table 21 supported by a hollow spindle 22, and the hollow spindle 22 is supported by a hydrostatic bearing, and the horizontal surface of the porous ceramic rotary chuck table 21. Is provided so as to be parallel to the bottom surface of the cup wheel type grindstone 14 supported by the grindstone shaft 13. The lower end of the hollow spindle 22 is connected to three supply pipes connected to a vacuum pump, a compressor, and a pure water supply pump (not shown) by a rotary joint 29. A switching valve is attached to the three supply pipes. Decompression during workpiece adsorption according to the substrate processing process, pressurization when the substrate is removed from the porous ceramic rotary chuck table, and cleaning of the porous ceramic rotary chuck table Switch when supplying pressurized water.

The machine frame 9 is made of marble, ceramic, black granite, resin concrete, cast steel, or the like.

The fixed plate elevating mechanism 7 includes a V-shaped coupling female member 73 having a hole through which the ball screw 72 passes in the center and fixed to the upper surface of the base 9a of the machine casing 9 of the work chuck rotary table mechanism 2, and a ball screw 72 in the center. A coupling male member 74 having a V-shaped bottom cross-sectional shape that fits into the inner surface of the V recess of the coupling female member 73, and a through hole and a coupling female member of the coupling female member. The ball screw 72 installed through the through hole on the vertical line and the lower end of the ball screw are fixed to the bottom of the machine base 9a of the work chuck rotary table mechanism 2 by a fixture 79a so that the upper end of the ball screw is fixed to the grinding head 1. The lower surface of the fixed plate 6 is fixed by a fixed fitting plate 79b so that it can be driven to rotate, and the upper end side of the ball screw 72 Ball screw drive motor 71 and the encoder 76 and a ball screw threadably united 77 is attached. A wedge 83 attached to the tip of a ball screw 81 is provided in the space 70 formed by the V recess of the coupling female member 73 and the bottom surface of the coupling male member 74 by driving the micro servo motor 82. 70 is provided so as to be able to move forward and backward.

A wedge attached to the tip of a ball screw 81 that can be moved forward and backward by driving the micro servo motor 82 in a space 70 formed by a V recess 73a of the coupling female member 73 and a bottom surface of the coupling male member 74. 83, and then the ball screw 72 is driven to depress the coupling male member 74 and bring the bottom surface of the male member into contact with the top surface of the wedge 83, thereby increasing the height between the bottom surface of the fixing plate 6 and the surface of the rotary chuck table 21 made of porous ceramic. The height is slightly higher. On the other hand, when the wedge 83 is retracted from the space 70 and then the ball screw 72 is driven to push down the coupling male member 74 to bring the male member bottom surface into contact with the top surface of the wedge 83, the bottom surface of the fixing plate 6 and the porous ceramic rotary chuck The height between the tables 21 is slightly reduced. The height between the bottom surface of the fixed plate 6 and the horizontal surface of the porous ceramic rotary chuck table 21 is determined by the contact between the top surface of the wedge 83 and the bottom surface of the coupling male member 74.

3 and FIG. 4, in the vicinity of the porous ceramic rotary chuck table 21 of the work chuck rotary table mechanism 2, probe pins are respectively brought into contact with the workpiece surface and the porous ceramic rotary chuck table 21 surface. A two-point process indicator 91 for measuring the thickness of the substrate is provided. The thickness of the substrate is used to determine an inclination angle of the grindstone shaft with respect to the substrate surface when the substrate is ground.

The ratio of the diameter r g of the annular grinding blade of the cup wheel type grinding wheel 14 to the diameter r c of the porous ceramic rotary chuck table 21 (r g / r c) is 1.01 to 1.25 times are preferred. The cup wheel type grindstone 14 is supported by the grindstone shaft 13 so that the annular grindstone blade of the cup wheel type grindstone 14 passes through the center point of the substrate.

Further, three linear sensors 84 for measuring the height position of the bottom surface of the fixed plate are provided on the side of the coupling female member 73 of the fixed plate lifting mechanism 7. Before grinding, the height of the three points between the surface of the porous ceramic rotary chuck table 21 and the bottom surface of the fixed plate, the kinematic coupling portion cavity 70 entry and retract distances of the three wedges 83, and the porous ceramic of the grindstone shaft 13 Correlation data of the tilt angle with respect to the surface of the made rotary chuck table 21 is preliminarily compiled in a table and stored in the memory of the numerical control device, thereby changing the tilt angle of the grindstone shaft 13 according to the thickness of the ground substrate. A machining software program can be designed. The grinding wheel shaft tilt angle changing software program is a grinding wheel shaft tilt angle software program that adopts a system in which the ball screw 72 (cylinder rod) of the fixed plate lifting mechanism 7 supports the bottom surface of the fixed plate 6 at the three vertex positions of an equilateral triangle. Easy design.

The method of grinding the substrate at three different contact point positions by changing the angle of the grindstone shaft 13 with respect to the substrate surface during the grinding of the substrate is even better than the method of grinding the substrate at one contact point position. A ground substrate having high flatness is provided.

In the coupling parts 73 and 74 of the fixed plate elevating mechanism 7 shown in FIGS. 6, 7, and 8 except for the ball screw 72, the female member 73 is on the surface of the machine base 9 a of the work chuck rotary table mechanism 2. It is fixed to. The female member 73 has a V-shaped cross section, and the bottom 73a is inclined. The female member 73 has a hole through which the ball screw 72 passes in the center.

The male member 74 includes a plate 74a having a substantially V-shaped cross section that forms two bottom portions, a plate 74b having a small width provided above the plate 74, and a side wall plate 74c that fixes the two plates. And the bottom of the plate 74a having a substantially V-shaped cross section is also inclined. A space 70 is formed by the bottom surface of the plate 74 a having a substantially V-shaped cross section and the V-shaped recess of the female member 73.

The ball screw 72 is inserted into the through hole of the female member 73 and the through hole of the male member 74 in the vertical direction.

In the space 70 formed by the female member 73 and the male member 74, a wedge 83 attached to the tip of the ball screw 81 is provided so as to move forward and backward by driving the micro servo motor 82. A ball screw 81 for moving the wedge 83 back and forth in the space 70 is also installed with an inclination of 4 to 7 degrees with respect to the upper surface of the machine frame base 9a, similar to the inclination of the bottom of the female member 73.

On the opposite side where the micro servo motor 82 is installed, three linear sensors 84 are installed as shown in FIGS. 4, 6 and 9, and the linear sensor 84 is composed of a bottom surface of the fixing plate 6 and a porous ceramic rotary. The vertical distance between the surfaces of the chuck table 21 is measured.

Further, as shown in FIG. 8, a height position measuring sensor 86 having a pair of measuring probes is attached to the side wall plate 74c of the male member 74 constituting the kinema coupling in order to measure the height of the void 70. It has been.

The fixed plate elevating mechanism 7 may be a height adjusting device including a kinema coupling and a cylinder rod that can move the height position of the fixed plate 6. For example, instead of the servo motor drive ball screw 72 described above, a fixed plate lifting mechanism using a cylinder rod that can be moved up and down by a pneumatic or hydraulic cylinder can be used. Further, the ball screw drive motor position of the above-described fixed plate lifting mechanism 7 may be installed upside down on the bottom side of the machine base 9a. Further, a structure in which the structure of the female member 73, male member 74, and wedge 83 of the kinema coupling is changed to a known kinema coupling structure may be used.

Next, the structure of the grinding head 1 will be described in detail with reference to FIGS. 2 and 3 and FIG. As shown in FIG. 10, the grinding head 1 that supports the cup wheel type grinding wheel 14 below the grinding wheel shaft 13 has a rotary bottom made of porous ceramic with the bottom surface of the blade edge 14a arranged in an annular shape of the cup wheel type grinding wheel 14. The grinding wheel shaft is set as a processing standby position so as to be parallel to the surface of the chuck table 21.

The grinding head 1 is installed so that the cup wheel type diamond grinding wheel 14 is lowered from the center point of the bottom surface of the fixed plate 6 whose plane is an equilateral triangle.

The cutting edge 14a of the cup wheel type grinding wheel 14 is annularly arranged on the lower surface of the grinding wheel flange 14b, and the grinding liquid is supplied from the grinding liquid supply nozzles 14c and 14c to the annular concave groove provided on the upper surface of the grinding wheel flange 14b. . The rotational speed of the grindstone shaft can be up to 5,000 rpm, and a rotational speed of 1,000 to 2,500 rpm is used during substrate grinding.

The grindstone shaft 13 is surrounded by a cylindrical outer housing 15, and the lower portion of the grindstone shaft 13 is hydrostatically radial bearinged. A water passage 15e is provided in the inner wall of the cylindrical outer housing 15, and water is supplied to the water passage 15e from the water supply port 15a. A water passage 15k of a radial bearing is provided on the inner wall of the cylindrical bearing housing (bush) 15m, and the water supplied by the pump from the water inlet provided on the outer wall of the cylindrical outer housing 15 is not shown in the figure. It is supplied to a water passage 15k provided on the inner wall of the cylindrical bearing housing 15m. The cylindrical outer housing 15 further includes a vacuum pressure reducing port 15b for reducing the pressure in the water passage 15k to facilitate passage of water, a drain outlet 15d for discharging the water in the water passage 15k to the outside of the cylindrical outer fusing 15, and the A pressurized air supply port 15c is provided for supplying pressurized air into the water passage 15k and sealing it so that excessive water is not supplied into the water passage. Water that has flowed through the water passage 15k between the cylindrical bearing housing 15m and the outer surface of the grindstone shaft 13 and bearing the grindstone shaft 13 is discharged from the drain outlet 15d. After the substrate grinding is finished, the operation of the surface grinding apparatus is stopped, and when the long-term operation is stopped, the vacuum pressure reducing port 15b is first depressurized, and then the compressed air is supplied into the water channel 15k from the compressed air supply port 15c. Water and water droplets remaining in 15k are discharged from the drain outlet 15d to the outside of the cylindrical outer housing 15, and the water passage is dried to prevent generation of algae.

A built-in motor 16 that rotates the grindstone shaft 13 in the horizontal direction is installed at the center of the grindstone shaft 13, and the built-in motor 16 receives coolant supplied from a coolant introduction pipe 15 f provided in the cylindrical outer housing 15. It is guided to the discharge pipe 15g through the coolant flow path 15h provided on the inner wall of the cylindrical housing 15.

The radial bearing part chamber and the coolant chamber of the built-in motor 16 are partitioned by a lip seal 15j so that fluids (water, air) supplied to the respective chambers are not mixed.

A position sensor 85, which is a position detection element of the ball target 17 provided at the upper end of the grindstone shaft 13, is mounted above the grindstone shaft 13, and the grindstone shaft 13 to which the mover (permanent magnet) 18a is fixed is vertically moved. A coil 18b for moving about 0 to 1.5 mm is installed.

The built-in motor 16 can rotate the grindstone shaft 13, and the motor 18, which is a combination of the mover 18 a and the coil 18 b, can perform a thrust linear movement of 1.5 mm or less of the grindstone shaft 13. This is called a combined rotary / linear actuator.

The structure of the rotary / linear motion line combined actuator for the grindstone shaft may be the structure of the combined rotary / linear motion line actuator for the spindle disclosed in Patent Document 6, Patent Document 7 and Patent Document 8 described above.

Next, the structure of the work chuck rotary table mechanism 2 will be described in detail with reference to FIGS. 2, 3 and 11. Workpiece chuck rotary table mechanism 2, hollow spindle 22, the water passage 23a to the inner wall, 25b is carbon nitride ceramic cylindrical bush 23 provided for journalled a porous ceramic rotary chuck table 21, the cylindrical S i C Ceramic A water supply port 24a provided to communicate with the water passages 23a and 25b of the bush made of water, a vacuum pressure reduction port 24b for reducing the pressure in the water passages 23a and 25b and facilitating passage of water, and water in the water passages 23a and 25b A cylinder provided with a drain outlet 24d for draining water out of the cylindrical outer housing 24 and a compressed air supply / supply port 24c for sending pressurized air into the water passage so as to prevent excess water from being supplied to the water passages 23a and 25b. The cooling water is supplied to the cooling water passage provided on the inner wall of the cylindrical outer housing 24 and the cylindrical outer housing 24. Water injection ports 24f and 26c, drainage ports 24g and 26c for draining the water in the cooling water passage to the outside of the cylindrical outer housing 24, a thrust bearing 25a provided above the hollow spindle 22, and a central portion of the hollow spindle 22. A radial bearing 25b provided, a built-in motor 27 which is a hollow spindle rotational drive mechanism provided at a lower portion of the hollow spindle 22, an encoder 28 and a rotary joint 29 connected at the lower end of the hollow spindle 22, and the rotary joint 29 To a vacuum pump that is a pressure reducing mechanism for reducing the pressure of the fluid in the hollow spindle 22 pipe, a compressor that is a pressurized gas supply mechanism for pressurizing the hollow spindle pipe, and a water supply pump that supplies pure water into the hollow spindle 22 pipe. Tube 22a, 22b.

The material of the hollow spindle 22 and the cylindrical bush 23 is preferably a ceramic such as silicon nitride, carbon nitride, silicon oxide, alumina, zirconia, etc., but a conventional stainless steel or chrome plated steel spindle surface is 100 to 500 μm by ceramic chemical vapor deposition. A thick coating may be used.

Wherein the water passage of the thrust bearing 25a, the pure water from the pure water supply nozzle 25a 1 provided eight supplied, draining from the discharge pipe 25a 2. Water is supplied to the water passage 23a of the radial bearing 25b from the water supply port 24c and drained from the drain outlet 24d. The cooling water of the built-in motor 27 is supplied from the water supply port 26a and drained from the discharge port 26b. Cooling water for cooling the built-in motor 27 is supplied from the water supply port 24a and discharged from the drain port 26b.

The workpiece (substrate) is placed on the porous ceramic rotary chuck table 21, the vacuum pump is operated to fix the workpiece on the porous ceramic table 21, and the built-in motor 27 then holds the hollow spindle 22. Rotate horizontally. The rotation speed of the hollow spindle 22 can be up to 500 rpm, and is used at 50 to 200 rpm during substrate grinding.

A process of flattening and grinding a substrate using the substrate surface grinding apparatus 100 shown in FIG. 1 will be described below.

1) The substrate is placed on the porous ceramic rotary chuck table 21 using a transfer robot or a transfer pad, and then the vacuum pump is operated to depressurize the decompression chamber 21a on the bottom surface of the porous ceramic rotary chuck table. It is fixed on a rotary chuck table 21 made of porous ceramic.

2) The built-in motor 27 is driven to rotate the hollow spindle 22.

3) After driving the three ball screws 72 of the fixed plate lifting mechanism 7 of the fixed plate 6 that hangs down and fixes the grinding head 1 in the standby position to raise the fixed plate 6, the coupling of the fixed plate lifting mechanism 7 While a wedge 83 attached to the tip of a ball screw 81 that can be moved forward and backward by driving by one of the micro servo motors 82 is inserted into a space 70 formed by the female member 73 and the coupling male member 74, another micro The wedge 83 attached to the tip of the ball screw 81 which can be moved forward and backward by driving with two servo motors 82 is retracted, and then the ball screw 72 is driven to push down the coupling male member 74 so that the bottom surface of the male member is wedge 83. The height between the bottom surface of the fixed plate 6 and the surface of the porous ceramic rotary chuck table 21 is set in contact with the upper surface.

4) While the grindstone shaft 13 is rotated by the built-in motor 16, the ball screw 72 of the fixed plate elevating mechanism 7 is lowered and the cup wheel type diamond grinding grindstone 14 is rubbed against the rotating substrate surface to start grinding cutting of the substrate. To do. At this time, the grinding liquid is supplied from the supply nozzle 14 c into the upper groove of the flange 14 b of the cup wheel type diamond grinding wheel 14, and the grinding liquid is supplied to the substrate surface via the through holes provided obliquely to the flange wall. The wheel blade 14a of the wheel-type diamond grinding wheel 14 and the substrate are cooled. The grinding wheel shaft lower feed for cutting the substrate is performed by grinding wheel shaft feeding by a combined rotary / linear motion actuator.

5) During grinding, the thickness of the substrate is measured by the two-point process indicator 91, and the fixed plate 6 is instructed by the grinding wheel shaft tilting program in which the tilting angle of the grinding wheel shaft 13 with respect to the substrate surface is determined based on the thickness value. In order to make it the height position, the fixing plate 6 is raised by raising the ball screw 72 of the fixing plate raising / lowering mechanism 7 described above to slightly increase the height of the space 70 of the female member 73 and the male member 74, A ball screw 8 that can be moved forward and backward by driving by one of the other micro servo motors 82 while a wedge 83 attached to the tip of a ball screw 81 that can move forward and backward by being driven by two of the micro servo motors 82 is entered.
The wedge 83 attached to the tip of 1 is retracted, and then the ball screw 72 is driven to push down the coupling male member 74 so that the bottom surface of the male member abuts on the top surface of the wedge 83 to make the bottom surface of the fixing plate 6 and porous ceramic. The height between the surfaces of the rotary chuck table 21 is set.

6) The grindstone shaft 13 whose angle has been adjusted is lowered by lowering the ball screw 72 of the fixed plate elevating mechanism 7 and brought into contact with the substrate surface of the grindstone blade 14a of the cup wheel type diamond grinding grindstone 14, and the substrate surface by the grindstone blade 14a is contacted. Resume rubbing. The grinding wheel shaft lower feed for cutting the substrate is performed by grinding wheel shaft feeding by a combined rotary / linear motion actuator.

7) The substrate thickness measurement and the grindstone axis tilt angle adjustment in the above 5) step, and the substrate rubbing in the 6) step are repeated. When the thickness of the substrate is close to the desired final thickness, or when the final thickness is reached, the inclination angle of the grindstone shaft 13 with respect to the substrate surface is 0 degree (the bottom surface of the fixed plate 6 or an annular grindstone blade 14a of a cup wheel type diamond grinding grindstone). The grinding wheel shaft inclination angle is decreased for a while so that the bottom surface of the group is parallel to the horizontal surface of the substrate or the surface of the machine base 9a.

8) After completion of the substrate grinding process, the ball screw 72 of the fixed plate elevating mechanism 7 is raised to retract the grinding head 1 upward and return to the standby position away from the grinding substrate. At the grinding head standby position, the distance to the bottom surface of the fixed plate 6 is measured using the linear sensor 84, and it is confirmed whether the inclination angle of the grindstone shaft 13 with respect to the substrate surface is 0 degree. When it is not 0 degree, the raising / lowering of the three ball screws 72 of the fixed plate raising / lowering mechanism 7 is adjusted, and the inclination angle with respect to the substrate surface of the grindstone shaft 13 is adjusted to 0 degree.

9) After the rotation of the porous ceramic rotary chuck table 21 is stopped, the vacuum pump is stopped, and then pressurized water is supplied to the bottom surface of the porous ceramic rotary chuck table 21 to provide a porous ceramic rotary chuck table for the ground substrate. 21 The substrate can be easily peeled from the surface.

10) The ground substrate is sucked by the transport robot or the transport pad, and the ground substrate is transferred from the surface of the porous ceramic rotary chuck table 21 to the next processing step.

11) After the surface of the porous ceramic rotary chuck table 21 is cleaned by a porous ceramic rotary chuck table cleaning device (not shown), pressurized water is jetted from the bottom surface 21a of the porous ceramic rotary chuck table for 0.1 to 0.5 seconds ( The ceramic ceramic rotary chuck table is cleaned.

The substrate grinding apparatus 100 of the present invention is equipped with kinematic couplings and ball screws (elevating cylinder rods) at three locations on the lower surface of the fixing plate 6 on which the grinding wheel head 1 is suspended for adjusting the inclination angle of the grinding wheel shaft 13 with respect to the substrate surface. Since the three plate raising / lowering mechanisms are arranged, the fixed plate load is applied to the substrate surface through the grindstone at the time of substrate grinding, so that a highly rigid surface grinding apparatus is obtained. Therefore, even if the workpiece has a large substrate diameter of 450 mm, a ground substrate with excellent flatness can be obtained.

It is a perspective view which shows the principal part of the surface grinding apparatus of this invention. It is sectional drawing of a surface grinding apparatus. It is a top view of a surface grinding apparatus. It is horizontal direction sectional drawing of a surface grinding apparatus. It is a top view of a surface grinding apparatus. It is front sectional drawing of the kinema coupling part of a fixed plate raising / lowering mechanism. It is a top view of the kinema coupling part of a fixed plate raising / lowering mechanism. It is a side view of the kinema coupling part of a fixed plate raising / lowering mechanism. It is a front view of the height position measurement displacement sensor attached to the kinema coupling part of the fixed plate lifting mechanism. It is sectional drawing of a grinding head. It is sectional drawing of a work chuck rotary table mechanism.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Surface grinding machine 1 Grinding head 13 Grinding wheel axis 14 Cup wheel type grinding wheel 14c Grinding liquid supply nozzle 15 Cylindrical housing 16, 18 Rotary / linear motion compound actuator 2 Work chuck rotary table mechanism 21 Porous ceramic rotary chuck table 22 Hollow spindle 23 Cylindrical bush made of carbon nitride ceramic 24 Cylindrical housing member 25a Thrust bearing 25b Radial bearing 23a, 25a 1 Water passage 27 Built-in motor 28 Encoder 29 Rotary joint 6 Grinding head fixing plate 7 Fixing plate lifting mechanism 70 Void 71 Ball screw drive motor 72 Ball screw 73 Coupling female member 74 Coupling male member 76 Encoder 79a Fixing tool 79b Fixed fitting plate 81 Ball screw 82 Microphone Servomotor 83 wedge 84 linear sensor 85 height measuring sensor 9 machine frame 9a machine frame base 91 2-point process indicator

Claims (2)

  1. A grinding head that supports a cup wheel type grindstone supported by a grindstone shaft that can rotate / directly move with a hydrostatic bearing and a magnetic bearing, and a rotary / linear motion compound actuator that rotates / directly moves the grindstone shaft. A fixed plate having a grinding head fixed at the center of the lower surface so that the grindstone axis is in a vertical direction, a porous ceramic rotary chuck table provided below the grinding head is supported by a hollow spindle, and the hollow spindle is a hydrostatic bearing. The work chuck rotary table mechanism is a work chuck rotary table mechanism provided so that a horizontal surface of the porous ceramic rotary chuck table is parallel to a bottom surface of a cup wheel type grindstone supported by the grindstone shaft. Mechanism and fixed plate provided with the grinding wheel shaft in the vertical direction A surface grinding device for the substrate provided with a fixing plate lift mechanism 3 group with a kinematic coupling and the cylinder rod the cause of the fixed plate is vertically moved to three positions of the apexes of an equilateral triangle or isosceles triangle with respect to the center point of the surface The fixed plate lifting mechanism has a cross-sectional V-shaped coupling female member having a hole through which the ball screw passes in the center and fixed to the surface of the machine base of the work chuck rotary table mechanism, and has a hole through which the ball screw passes in the center. A coupling male member having a V-shaped bottom cross-section that fits into the inner wall of the V recess of the coupling female member, a through hole of the coupling female member, and a through hole of the coupling female member are installed through the vertical line. The lower end of the ball screw can be rotated by a fixture at the bottom of the machine base of the work chuck rotary table mechanism. A ball screw having a ball screw drive motor, an encoder, and a ball screw screwed body attached to the upper end side of the ball screw, and the coupling is fixed on the lower surface of the grinding head fixing plate by a fixed fitting plate. A wedge attached to the tip of a ball screw that can be moved back and forth by driving a micro servo motor in a space formed by a V concave portion of the female member and a bottom surface of the coupling male member, and the wedge and the cup A surface grinding apparatus for a substrate, which is a fixed plate height position adjusting mechanism capable of determining a height position of a fixed plate by contact with a bottom surface of a male ring member .
  2. A hollow spindle that supports a rotary chuck table made of porous ceramic, with the grinding wheel shaft supported by the hydrostatic bearing supported through a composite bearing in which the magnetic bearing and the hydrostatic bearing are combined so that they can be combined with each other. characterized in that but is supported by the water hydrostatic bearings, surface grinding device substrate according to claim 1.
JP2008031325A 2008-02-13 2008-02-13 Substrate surface grinding machine Expired - Fee Related JP5184910B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008031325A JP5184910B2 (en) 2008-02-13 2008-02-13 Substrate surface grinding machine

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008031325A JP5184910B2 (en) 2008-02-13 2008-02-13 Substrate surface grinding machine
TW97130565A TWI436854B (en) 2008-02-13 2008-08-11 Substrate surface grinding device
KR1020080105664A KR101311135B1 (en) 2008-02-13 2008-10-28 Surface grinding machine of substrate
US12/356,793 US8047897B2 (en) 2008-02-13 2009-01-21 Substrate flat grinding device

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JP2009190102A JP2009190102A (en) 2009-08-27
JP5184910B2 true JP5184910B2 (en) 2013-04-17

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JP (1) JP5184910B2 (en)
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KR101311135B1 (en) 2013-09-25
TW200934615A (en) 2009-08-16
US20090203299A1 (en) 2009-08-13
US8047897B2 (en) 2011-11-01
KR20090087802A (en) 2009-08-18
TWI436854B (en) 2014-05-11
JP2009190102A (en) 2009-08-27

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