JP6523872B2 - 研削装置 - Google Patents
研削装置 Download PDFInfo
- Publication number
- JP6523872B2 JP6523872B2 JP2015167610A JP2015167610A JP6523872B2 JP 6523872 B2 JP6523872 B2 JP 6523872B2 JP 2015167610 A JP2015167610 A JP 2015167610A JP 2015167610 A JP2015167610 A JP 2015167610A JP 6523872 B2 JP6523872 B2 JP 6523872B2
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- JP
- Japan
- Prior art keywords
- grinding
- turntable
- motor
- partition
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02013—Grinding, lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/02—Lapping machines or devices; Accessories designed for working surfaces of revolution
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
また、仕切り部は、ターンテーブルの上に配設されるモータを内側に収容する凹部を有するため、この凹部にモータを収容した状態で、研削水を仕切り部の外側に当てることにより、仕切り部とモータとを冷却してターンテーブルに熱影響を及ぼさないようにすることができる。
これにより、ウエーハの研削中にターンテーブルが熱変形するのを防ぎ、ウエーハに加工不良が発生することはない。
51:保持面 52:回転軸 53:ロータリージョイント 54:モータ
55:駆動プーリ 56:従動プーリ 57:ベルト
6:仕切り部 60:凹部 61:外側面 7:吸引源 8:エアー供給源 9:コラム
10:研削手段 100:接触部分 11:スピンドル 12:スピンドルハウジング
13:モータ 14:マウンタ 15:研削ホイール 16:研削砥石
20:研削水供給手段 21:研削水供給源 22:研削水
30:研削送り手段 31:ボールネジ 32:モータ 33:ガイドレール
34:昇降部
40:研削装置 41:ターンテーブル 42:チャックテーブル
420:回転軸 4:モータ 44:駆動プーリ 45:従動プーリ 46:ベルト
Claims (1)
- ウエーハを保持するチャックテーブルを回転させるモータを有する2以上の保持手段と、2以上の該保持手段が均等間隔に配設され回転するターンテーブルと、該ターンテーブルの上に配設され2以上のチャックテーブルの間を仕切る仕切り部と、該チャックテーブルに保持されるウエーハを研削する研削砥石を有する研削手段と、ウエーハと該研削砥石とに研削水を供給する研削水供給手段と、を備える研削装置であって、
該モータは、該ターンテーブルの上に配設され、
該仕切り部は、該ターンテーブルの上に配設される該モータを内側に収容する凹部を有し、
該仕切り部の外側に該研削水を当てることにより、該仕切り部と該仕切り部に収容される該モータとを冷却することを特徴とする研削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015167610A JP6523872B2 (ja) | 2015-08-27 | 2015-08-27 | 研削装置 |
TW105122231A TWI700149B (zh) | 2015-08-27 | 2016-07-14 | 研磨裝置 |
KR1020160103469A KR102343155B1 (ko) | 2015-08-27 | 2016-08-16 | 연삭 장치 |
CN201610729978.0A CN106475899B (zh) | 2015-08-27 | 2016-08-25 | 磨削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015167610A JP6523872B2 (ja) | 2015-08-27 | 2015-08-27 | 研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017042875A JP2017042875A (ja) | 2017-03-02 |
JP6523872B2 true JP6523872B2 (ja) | 2019-06-05 |
Family
ID=58209238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015167610A Active JP6523872B2 (ja) | 2015-08-27 | 2015-08-27 | 研削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6523872B2 (ja) |
KR (1) | KR102343155B1 (ja) |
CN (1) | CN106475899B (ja) |
TW (1) | TWI700149B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107309725B (zh) * | 2017-06-23 | 2023-11-21 | 浙江登亿自动化设备股份有限公司 | 双联结构卧轴圆台平面磨床 |
JP6994334B2 (ja) * | 2017-09-21 | 2022-01-14 | 株式会社ディスコ | 加工装置 |
JP7068098B2 (ja) * | 2018-08-15 | 2022-05-16 | 株式会社ディスコ | 研削装置 |
JP2023044257A (ja) | 2021-09-17 | 2023-03-30 | 株式会社ディスコ | 加工装置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000254857A (ja) * | 1999-01-06 | 2000-09-19 | Tokyo Seimitsu Co Ltd | 平面加工装置及び平面加工方法 |
US6354922B1 (en) * | 1999-08-20 | 2002-03-12 | Ebara Corporation | Polishing apparatus |
US6343975B1 (en) * | 1999-10-05 | 2002-02-05 | Peter Mok | Chemical-mechanical polishing apparatus with circular motion pads |
JP2002283183A (ja) * | 2001-03-26 | 2002-10-03 | Nidek Co Ltd | 眼鏡レンズ加工装置 |
TWM247332U (en) * | 2003-11-13 | 2004-10-21 | Hardinge Taiwan Prec Machinery | The plate cooler machining for the vertical milling machine |
JP4464113B2 (ja) * | 2003-11-27 | 2010-05-19 | 株式会社ディスコ | ウエーハの加工装置 |
JP2009094326A (ja) * | 2007-10-10 | 2009-04-30 | Disco Abrasive Syst Ltd | ウェーハの研削方法 |
US8574028B2 (en) * | 2008-06-20 | 2013-11-05 | Illinois Tool Works Inc. | Grinder/polisher |
JP2010000590A (ja) * | 2008-06-23 | 2010-01-07 | Tsudakoma Corp | 工作機械用の割出し装置における発熱体の冷却回路 |
JP5335448B2 (ja) * | 2009-01-19 | 2013-11-06 | 株式会社ディスコ | 加工装置 |
US8342905B2 (en) * | 2009-08-31 | 2013-01-01 | Elm Inc. | Optical disk restoration method and apparatus |
JP5406676B2 (ja) * | 2009-11-10 | 2014-02-05 | 株式会社ディスコ | ウエーハの加工装置 |
JP5424864B2 (ja) * | 2009-12-28 | 2014-02-26 | 株式会社ディスコ | 加工装置 |
TWM389601U (en) * | 2010-04-01 | 2010-10-01 | Prec Machinery Res & Dev Ct | Motor fixing plate with heat dissipating features |
JP5822647B2 (ja) | 2011-10-21 | 2015-11-24 | 株式会社ディスコ | 研削装置 |
US8968052B2 (en) * | 2011-10-21 | 2015-03-03 | Strasbaugh | Systems and methods of wafer grinding |
JP5389889B2 (ja) * | 2011-10-31 | 2014-01-15 | コマツNtc株式会社 | 工作機械の冷却装置 |
CN202592201U (zh) * | 2012-05-17 | 2012-12-12 | 特新电子机械设备(东莞)有限公司 | 双盘式研磨机 |
JP5930192B2 (ja) * | 2012-06-11 | 2016-06-08 | 株式会社ディスコ | 研削装置 |
TWI526274B (zh) * | 2013-11-28 | 2016-03-21 | Rotating table device | |
JP6244206B2 (ja) * | 2014-01-14 | 2017-12-06 | 株式会社ディスコ | 研削装置 |
-
2015
- 2015-08-27 JP JP2015167610A patent/JP6523872B2/ja active Active
-
2016
- 2016-07-14 TW TW105122231A patent/TWI700149B/zh active
- 2016-08-16 KR KR1020160103469A patent/KR102343155B1/ko active IP Right Grant
- 2016-08-25 CN CN201610729978.0A patent/CN106475899B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TW201711799A (zh) | 2017-04-01 |
KR102343155B1 (ko) | 2021-12-23 |
JP2017042875A (ja) | 2017-03-02 |
TWI700149B (zh) | 2020-08-01 |
CN106475899A (zh) | 2017-03-08 |
CN106475899B (zh) | 2020-11-24 |
KR20170026137A (ko) | 2017-03-08 |
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