TWI700149B - 研磨裝置 - Google Patents

研磨裝置 Download PDF

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Publication number
TWI700149B
TWI700149B TW105122231A TW105122231A TWI700149B TW I700149 B TWI700149 B TW I700149B TW 105122231 A TW105122231 A TW 105122231A TW 105122231 A TW105122231 A TW 105122231A TW I700149 B TWI700149 B TW I700149B
Authority
TW
Taiwan
Prior art keywords
turntable
motor
grinding
polishing
partition
Prior art date
Application number
TW105122231A
Other languages
English (en)
Chinese (zh)
Other versions
TW201711799A (zh
Inventor
山中聡
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201711799A publication Critical patent/TW201711799A/zh
Application granted granted Critical
Publication of TWI700149B publication Critical patent/TWI700149B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02013—Grinding, lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/02—Lapping machines or devices; Accessories designed for working surfaces of revolution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
TW105122231A 2015-08-27 2016-07-14 研磨裝置 TWI700149B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-167610 2015-08-27
JP2015167610A JP6523872B2 (ja) 2015-08-27 2015-08-27 研削装置

Publications (2)

Publication Number Publication Date
TW201711799A TW201711799A (zh) 2017-04-01
TWI700149B true TWI700149B (zh) 2020-08-01

Family

ID=58209238

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105122231A TWI700149B (zh) 2015-08-27 2016-07-14 研磨裝置

Country Status (4)

Country Link
JP (1) JP6523872B2 (ja)
KR (1) KR102343155B1 (ja)
CN (1) CN106475899B (ja)
TW (1) TWI700149B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107309725B (zh) * 2017-06-23 2023-11-21 浙江登亿自动化设备股份有限公司 双联结构卧轴圆台平面磨床
JP6994334B2 (ja) * 2017-09-21 2022-01-14 株式会社ディスコ 加工装置
JP7068098B2 (ja) * 2018-08-15 2022-05-16 株式会社ディスコ 研削装置
JP2023044257A (ja) 2021-09-17 2023-03-30 株式会社ディスコ 加工装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW467796B (en) * 1999-10-05 2001-12-11 Peter Mok Chemical-mechanical polishing apparatus with circular motion pads
JP2002283183A (ja) * 2001-03-26 2002-10-03 Nidek Co Ltd 眼鏡レンズ加工装置
TW516990B (en) * 1999-08-20 2003-01-11 Ebara Corp Polishing apparatus
TWM247332U (en) * 2003-11-13 2004-10-21 Hardinge Taiwan Prec Machinery The plate cooler machining for the vertical milling machine
TW201006604A (en) * 2008-06-23 2010-02-16 Tsudakoma Ind Co Ltd Cooling circuit of heating element for indexing device of machine tool
TWM389601U (en) * 2010-04-01 2010-10-01 Prec Machinery Res & Dev Ct Motor fixing plate with heat dissipating features
TW201330968A (zh) * 2011-10-31 2013-08-01 Komatsu Ntc Ltd 工具機之冷卻裝置
JP2013255952A (ja) * 2012-06-11 2013-12-26 Disco Corp 研削装置
TW201519992A (zh) * 2013-11-28 2015-06-01 Hipro Prec Co Ltd 旋轉工作台裝置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000254857A (ja) * 1999-01-06 2000-09-19 Tokyo Seimitsu Co Ltd 平面加工装置及び平面加工方法
JP4464113B2 (ja) * 2003-11-27 2010-05-19 株式会社ディスコ ウエーハの加工装置
JP2009094326A (ja) * 2007-10-10 2009-04-30 Disco Abrasive Syst Ltd ウェーハの研削方法
US8574028B2 (en) * 2008-06-20 2013-11-05 Illinois Tool Works Inc. Grinder/polisher
JP5335448B2 (ja) * 2009-01-19 2013-11-06 株式会社ディスコ 加工装置
EP2474978B1 (en) * 2009-08-31 2016-12-07 Elm Inc. Method and apparatus for repairing optical disc
JP5406676B2 (ja) * 2009-11-10 2014-02-05 株式会社ディスコ ウエーハの加工装置
JP5424864B2 (ja) * 2009-12-28 2014-02-26 株式会社ディスコ 加工装置
TW201323149A (zh) * 2011-10-21 2013-06-16 Strasbaugh 晶圓研磨之系統與方法
JP5822647B2 (ja) 2011-10-21 2015-11-24 株式会社ディスコ 研削装置
CN202592201U (zh) * 2012-05-17 2012-12-12 特新电子机械设备（东莞）有限公司 双盘式研磨机
JP6244206B2 (ja) * 2014-01-14 2017-12-06 株式会社ディスコ 研削装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW516990B (en) * 1999-08-20 2003-01-11 Ebara Corp Polishing apparatus
TW467796B (en) * 1999-10-05 2001-12-11 Peter Mok Chemical-mechanical polishing apparatus with circular motion pads
JP2002283183A (ja) * 2001-03-26 2002-10-03 Nidek Co Ltd 眼鏡レンズ加工装置
TWM247332U (en) * 2003-11-13 2004-10-21 Hardinge Taiwan Prec Machinery The plate cooler machining for the vertical milling machine
TW201006604A (en) * 2008-06-23 2010-02-16 Tsudakoma Ind Co Ltd Cooling circuit of heating element for indexing device of machine tool
TWM389601U (en) * 2010-04-01 2010-10-01 Prec Machinery Res & Dev Ct Motor fixing plate with heat dissipating features
TW201330968A (zh) * 2011-10-31 2013-08-01 Komatsu Ntc Ltd 工具機之冷卻裝置
JP2013255952A (ja) * 2012-06-11 2013-12-26 Disco Corp 研削装置
TW201519992A (zh) * 2013-11-28 2015-06-01 Hipro Prec Co Ltd 旋轉工作台裝置

Also Published As

Publication number Publication date
TW201711799A (zh) 2017-04-01
CN106475899B (zh) 2020-11-24
KR20170026137A (ko) 2017-03-08
KR102343155B1 (ko) 2021-12-23
JP2017042875A (ja) 2017-03-02
JP6523872B2 (ja) 2019-06-05
CN106475899A (zh) 2017-03-08

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