TWI761776B - 研磨裝置的控制裝置、程式及研磨方法 - Google Patents
研磨裝置的控制裝置、程式及研磨方法 Download PDFInfo
- Publication number
- TWI761776B TWI761776B TW109106871A TW109106871A TWI761776B TW I761776 B TWI761776 B TW I761776B TW 109106871 A TW109106871 A TW 109106871A TW 109106871 A TW109106871 A TW 109106871A TW I761776 B TWI761776 B TW I761776B
- Authority
- TW
- Taiwan
- Prior art keywords
- workpiece
- grinding wheel
- grinding
- control
- feeding
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/07—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a stationary work-table
- B24B7/075—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a stationary work-table using a reciprocating grinding head mounted on a movable carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/003—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019054515A JP7098257B2 (ja) | 2019-03-22 | 2019-03-22 | 研削装置の制御装置、プログラム、及び研削方法 |
JP2019-054515 | 2019-03-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202035063A TW202035063A (zh) | 2020-10-01 |
TWI761776B true TWI761776B (zh) | 2022-04-21 |
Family
ID=72557150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109106871A TWI761776B (zh) | 2019-03-22 | 2020-03-03 | 研磨裝置的控制裝置、程式及研磨方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7098257B2 (ja) |
KR (1) | KR102689707B1 (ja) |
CN (1) | CN111716171B (ja) |
TW (1) | TWI761776B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7291056B2 (ja) * | 2019-09-30 | 2023-06-14 | 株式会社ディスコ | ウェーハの研磨方法 |
WO2022075251A1 (ja) * | 2020-10-06 | 2022-04-14 | ユアサ化成株式会社 | 研磨システム |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002086354A (ja) * | 2000-09-12 | 2002-03-26 | Hitachi Via Mechanics Ltd | 平面研削盤 |
TW201436949A (zh) * | 2013-01-30 | 2014-10-01 | Komatsu Ntc Ltd | 研磨加工方法 |
JP2018051665A (ja) * | 2016-09-27 | 2018-04-05 | 株式会社塩 | 数値制御研削装置、その制御装置、制御方法、及び制御プログラム |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5347954B2 (ja) * | 1973-03-23 | 1978-12-25 | ||
JPS62114875A (ja) * | 1985-11-14 | 1987-05-26 | Mitsubishi Heavy Ind Ltd | 横軸自動平面研削盤での送り時間短縮方法 |
JPH03196950A (ja) * | 1989-12-27 | 1991-08-28 | Toshiba Corp | 研削加工方法 |
JP3210704B2 (ja) * | 1991-11-06 | 2001-09-17 | 日立ビアメカニクス株式会社 | 研削盤およびトラバース研削方法 |
JPH0994745A (ja) * | 1995-09-29 | 1997-04-08 | Hitachi Seiko Ltd | 平面形状のトラバース研削方法 |
JP4215228B2 (ja) * | 1999-10-26 | 2009-01-28 | 独立行政法人理化学研究所 | 卓上4軸鏡面加工装置 |
JP2002052444A (ja) * | 2000-08-08 | 2002-02-19 | Okamoto Machine Tool Works Ltd | 平面研削装置およびワ−クの研削方法 |
JP4764564B2 (ja) | 2001-04-17 | 2011-09-07 | 株式会社岡本工作機械製作所 | 円筒状ワ−クのスキップシフトプランジ研削方法 |
US8585467B2 (en) * | 2008-10-31 | 2013-11-19 | Corning Incorporated | Linear pressure feed grinding with voice coil |
CN102267053A (zh) * | 2011-02-21 | 2011-12-07 | 天津市北闸口仪表机床厂 | 一种改进切刀行进方向的数控车床 |
JP2012222123A (ja) * | 2011-04-08 | 2012-11-12 | Mitsubishi Electric Corp | 半導体ウェハの研削方法 |
JP5930871B2 (ja) * | 2012-06-27 | 2016-06-08 | コマツNtc株式会社 | 研削加工装置およびその制御方法 |
JP5813058B2 (ja) * | 2013-07-02 | 2015-11-17 | ファナック株式会社 | 複合形固定サイクルの開始点経路短縮機能を有する数値制御装置 |
JP6887846B2 (ja) * | 2017-03-28 | 2021-06-16 | 株式会社東京精密 | 研削装置 |
-
2019
- 2019-03-22 JP JP2019054515A patent/JP7098257B2/ja active Active
-
2020
- 2020-02-25 KR KR1020200022950A patent/KR102689707B1/ko active IP Right Grant
- 2020-03-03 TW TW109106871A patent/TWI761776B/zh active
- 2020-03-05 CN CN202010147137.5A patent/CN111716171B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002086354A (ja) * | 2000-09-12 | 2002-03-26 | Hitachi Via Mechanics Ltd | 平面研削盤 |
TW201436949A (zh) * | 2013-01-30 | 2014-10-01 | Komatsu Ntc Ltd | 研磨加工方法 |
JP2018051665A (ja) * | 2016-09-27 | 2018-04-05 | 株式会社塩 | 数値制御研削装置、その制御装置、制御方法、及び制御プログラム |
Also Published As
Publication number | Publication date |
---|---|
KR20200112664A (ko) | 2020-10-05 |
CN111716171B (zh) | 2022-03-25 |
JP7098257B2 (ja) | 2022-07-11 |
TW202035063A (zh) | 2020-10-01 |
KR102689707B1 (ko) | 2024-07-29 |
CN111716171A (zh) | 2020-09-29 |
JP2020151826A (ja) | 2020-09-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5352331B2 (ja) | ウェーハの面取り加工方法 | |
TWI761776B (zh) | 研磨裝置的控制裝置、程式及研磨方法 | |
JP3334609B2 (ja) | 薄板縁部の加工方法および加工機 | |
TWI600496B (zh) | 晶圓的倒角加工方法、晶圓的倒角加工裝置及磨石角度調整輔助具 | |
JPH06333893A (ja) | 半導体基板の研磨方法 | |
KR102507777B1 (ko) | 웨이퍼의 제조 방법 및 웨이퍼 | |
KR102023125B1 (ko) | 피가공물의 평평한 표면을 가공하는 방법 | |
US6336842B1 (en) | Rotary machining apparatus | |
JP6717106B2 (ja) | ツルーイング装置及びツルーイング方法 | |
US6439969B1 (en) | Apparatus and method of chamfering wafer | |
JP7424755B2 (ja) | 保持面形成方法 | |
JP2008177348A (ja) | ウェーハ面取り加工方法およびその装置 | |
KR102267749B1 (ko) | 판재의 테두리 가공 지석 및 모따기 장치 | |
WO2024099307A1 (zh) | 一种用于cmp设备抛光垫沟槽修整的方法 | |
JP2012143831A (ja) | 研削盤および砥石車のツルーイング方法 | |
JP7158702B2 (ja) | 面取り研削装置 | |
CN106985004B (zh) | 凸轮磨削装置以及凸轮磨削方法 | |
JP7347967B2 (ja) | 研削方法 | |
CN106985005B (zh) | 凸轮磨削装置以及凸轮磨削方法 | |
CN110769979B (zh) | 修整方法、修整装置、砂轮及磨床 | |
JP4890104B2 (ja) | スクライブ方法及びその装置 | |
JP7292799B2 (ja) | 修正方法 | |
JP7568273B2 (ja) | 研削盤の運転方法及び研削盤 | |
JP2024157735A (ja) | 研削制御装置及び研削方法 | |
JP7219358B2 (ja) | ウェーハの面取り装置 |