TWI752996B - 環氧樹脂組成物及半導體裝置 - Google Patents

環氧樹脂組成物及半導體裝置 Download PDF

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Publication number
TWI752996B
TWI752996B TW106127614A TW106127614A TWI752996B TW I752996 B TWI752996 B TW I752996B TW 106127614 A TW106127614 A TW 106127614A TW 106127614 A TW106127614 A TW 106127614A TW I752996 B TWI752996 B TW I752996B
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TW
Taiwan
Prior art keywords
epoxy resin
resin composition
less
melt viscosity
hardening
Prior art date
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TW106127614A
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English (en)
Chinese (zh)
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TW201821526A (zh
Inventor
中木恭兵
妹尾政宣
Original Assignee
日商住友電木股份有限公司
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Publication of TW201821526A publication Critical patent/TW201821526A/zh
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Publication of TWI752996B publication Critical patent/TWI752996B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW106127614A 2016-09-05 2017-08-15 環氧樹脂組成物及半導體裝置 TWI752996B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2016-172600 2016-09-05
JP2016172600 2016-09-05

Publications (2)

Publication Number Publication Date
TW201821526A TW201821526A (zh) 2018-06-16
TWI752996B true TWI752996B (zh) 2022-01-21

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TW106127614A TWI752996B (zh) 2016-09-05 2017-08-15 環氧樹脂組成物及半導體裝置

Country Status (4)

Country Link
JP (1) JP6907773B2 (ja)
KR (1) KR102373908B1 (ja)
CN (1) CN107793553A (ja)
TW (1) TWI752996B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019225733A1 (ja) * 2018-05-25 2019-11-28 パナソニックＩｐマネジメント株式会社 電子部品補強用熱硬化性樹脂組成物、半導体装置及び半導体装置の製造方法
KR102181351B1 (ko) * 2019-03-07 2020-11-20 주식회사 케이씨씨 에폭시 수지 조성물
JP6954485B1 (ja) * 2021-02-17 2021-10-27 住友ベークライト株式会社 射出成形用封止樹脂組成物
WO2024024883A1 (ja) * 2022-07-29 2024-02-01 ナガセケムテックス株式会社 モールドアンダーフィル封止用シートおよびこれを用いる電子部品実装基板の封止方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI440647B (zh) * 2008-07-03 2014-06-11 Asahi Kasei Chemicals Corp 改質樹脂組成物、其製造方法及含該組成物之硬化性樹脂組成物
JP2016027133A (ja) * 2014-06-30 2016-02-18 新日鉄住金化学株式会社 芳香族ポリエステル含有硬化性樹脂組成物、硬化物、電気・電子部品及び回路基板

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JPS61276861A (ja) * 1985-05-31 1986-12-06 Nippon Paint Co Ltd 金属素材用プライマ−組成物
JPH0195900A (ja) * 1987-10-07 1989-04-13 Takeda Chem Ind Ltd 打錠装置
JPH11158350A (ja) * 1997-09-24 1999-06-15 Hitachi Chem Co Ltd エポキシ樹脂組成物、これを用いたぺースト状組成物およびこれを用いて製造される半導体装置
JP2003238659A (ja) * 2002-02-22 2003-08-27 Toray Ind Inc エポキシ樹脂組成物およびエポキシ樹脂部材の製造方法
EP1848754B8 (en) * 2005-02-18 2008-07-16 Henkel AG & Co. KGaA Low shrinkage amine-curing epoxy resin compositions comprising a lactone
JP5035548B2 (ja) * 2008-02-13 2012-09-26 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP5708486B2 (ja) * 2009-06-03 2015-04-30 住友ベークライト株式会社 半導体封止用樹脂組成物及び半導体装置
JP2013032510A (ja) * 2011-06-29 2013-02-14 Toray Ind Inc エポキシ樹脂組成物、成形材料および繊維強化複合材料
JPWO2014126253A1 (ja) * 2013-02-18 2017-02-02 株式会社ダイセル エポキシ樹脂組成物及びその硬化物、プリプレグ、並びに繊維強化複合材料
JP2015083634A (ja) * 2013-10-25 2015-04-30 日立化成株式会社 エポキシ樹脂組成物、このエポキシ樹脂組成物を用いた電子部品装置及び電子部品装置の製造方法。
US10025182B2 (en) * 2014-03-20 2018-07-17 Zeon Corporation Radiation-sensitive resin composition and electronic device
KR102338614B1 (ko) * 2014-06-30 2021-12-13 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 방향족 폴리에스테르 함유 경화성 수지 조성물, 경화물, 전기·전자 부품 및 회로 기판
JP6938869B2 (ja) * 2016-03-16 2021-09-22 住友ベークライト株式会社 エポキシ樹脂組成物および半導体装置
CN107200995A (zh) * 2016-03-16 2017-09-26 住友电木株式会社 环氧树脂组合物和半导体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI440647B (zh) * 2008-07-03 2014-06-11 Asahi Kasei Chemicals Corp 改質樹脂組成物、其製造方法及含該組成物之硬化性樹脂組成物
JP2016027133A (ja) * 2014-06-30 2016-02-18 新日鉄住金化学株式会社 芳香族ポリエステル含有硬化性樹脂組成物、硬化物、電気・電子部品及び回路基板

Also Published As

Publication number Publication date
CN107793553A (zh) 2018-03-13
TW201821526A (zh) 2018-06-16
KR102373908B1 (ko) 2022-03-14
KR20180027336A (ko) 2018-03-14
JP2018039981A (ja) 2018-03-15
JP6907773B2 (ja) 2021-07-21

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