TWI750674B - 黏晶裝置及半導體裝置的製造方法 - Google Patents

黏晶裝置及半導體裝置的製造方法 Download PDF

Info

Publication number
TWI750674B
TWI750674B TW109117611A TW109117611A TWI750674B TW I750674 B TWI750674 B TW I750674B TW 109117611 A TW109117611 A TW 109117611A TW 109117611 A TW109117611 A TW 109117611A TW I750674 B TWI750674 B TW I750674B
Authority
TW
Taiwan
Prior art keywords
paste
adhesive
substrate
image
inspection
Prior art date
Application number
TW109117611A
Other languages
English (en)
Chinese (zh)
Other versions
TW202119506A (zh
Inventor
小橋英晴
牧浩
中島宜久
高野晴之
內藤大輔
Original Assignee
日商捷進科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商捷進科技有限公司 filed Critical 日商捷進科技有限公司
Publication of TW202119506A publication Critical patent/TW202119506A/zh
Application granted granted Critical
Publication of TWI750674B publication Critical patent/TWI750674B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/756—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/75611—Feeding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/75981—Apparatus chuck
    • H01L2224/75982—Shape
    • H01L2224/75983—Shape of the mounting surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Die Bonding (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW109117611A 2019-09-13 2020-05-27 黏晶裝置及半導體裝置的製造方法 TWI750674B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-166864 2019-09-13
JP2019166864A JP7300353B2 (ja) 2019-09-13 2019-09-13 ダイボンディング装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW202119506A TW202119506A (zh) 2021-05-16
TWI750674B true TWI750674B (zh) 2021-12-21

Family

ID=74862503

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110134196A TWI756160B (zh) 2019-09-13 2020-05-27 黏晶裝置及半導體裝置的製造方法
TW109117611A TWI750674B (zh) 2019-09-13 2020-05-27 黏晶裝置及半導體裝置的製造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW110134196A TWI756160B (zh) 2019-09-13 2020-05-27 黏晶裝置及半導體裝置的製造方法

Country Status (4)

Country Link
JP (2) JP7300353B2 (ko)
KR (2) KR102446631B1 (ko)
CN (1) CN112509939B (ko)
TW (2) TWI756160B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023041413A (ja) * 2021-09-13 2023-03-24 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP2023042715A (ja) 2021-09-15 2023-03-28 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120097335A1 (en) * 2009-08-24 2012-04-26 Derek Siu Wing Or Method and system for bonding electrical devices using an electrically conductive adhesive
JP2012099524A (ja) * 2010-10-29 2012-05-24 Hitachi High-Tech Instruments Co Ltd ダイボンダ装置、ダイボンダ方法、及びダイボンダ品質評価設備
US20130016205A1 (en) * 2011-07-13 2013-01-17 Hitachi High-Tech Instruments Co., Ltd. Die Bonder

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2539015B2 (ja) * 1988-11-18 1996-10-02 株式会社日立製作所 ペレットボンディング方法およびその装置
JP2850816B2 (ja) * 1995-12-18 1999-01-27 日本電気株式会社 バンプ接合検査装置及び検査方法
US6597496B1 (en) * 1999-10-25 2003-07-22 The Board Of Trustees Of The University Of Illinois Silicon nanoparticle stimulated emission devices
JP3732082B2 (ja) * 2000-09-25 2006-01-05 株式会社新川 ボンディング装置およびボンディング方法
JP3736390B2 (ja) * 2001-06-25 2006-01-18 松下電器産業株式会社 塗布状態検査方法
JP3591489B2 (ja) 2001-06-25 2004-11-17 松下電器産業株式会社 粘性材料塗布装置および粘性材料塗布方法
CN1220254C (zh) * 2001-12-07 2005-09-21 雅马哈株式会社 半导体器件的制造方法和用于制造半导体器件的设备
JP4869776B2 (ja) * 2006-04-28 2012-02-08 ヤマハ発動機株式会社 印刷検査装置及び印刷装置
JP5092649B2 (ja) * 2007-09-27 2012-12-05 日本電気株式会社 塗布剤の劣化検査装置及び劣化検査方法並びに劣化検査プログラム
JP5634021B2 (ja) * 2008-11-12 2014-12-03 株式会社東芝 半導体装置の製造装置および半導体装置の製造方法
US9653424B2 (en) * 2009-09-21 2017-05-16 Alpha And Omega Semiconductor Incorporated Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
JP2011080888A (ja) 2009-10-08 2011-04-21 Panasonic Corp 塗布状態検査方法
JP5302175B2 (ja) * 2009-12-14 2013-10-02 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5402774B2 (ja) 2010-03-26 2014-01-29 パナソニック株式会社 ペースト塗布装置およびペースト塗布方法
JP6022782B2 (ja) 2012-03-19 2016-11-09 ファスフォードテクノロジ株式会社 ダイボンダ
JP6152248B2 (ja) * 2012-04-19 2017-06-21 ファスフォードテクノロジ株式会社 ペースト塗布装置及びペースト塗布方法並びにダイボンダ
JP2014179560A (ja) 2013-03-15 2014-09-25 Hitachi High-Tech Instruments Co Ltd 斜め認識カメラ及びダイボンダ
JP6062545B2 (ja) * 2013-06-13 2017-01-18 日立オートモティブシステムズ株式会社 半導体装置とその製造方法、および、熱式空気流量センサとその製造方法
JP6128337B2 (ja) * 2014-10-23 2017-05-17 パナソニックＩｐマネジメント株式会社 半導体装置の製造方法及び製造装置
JP6685126B2 (ja) * 2015-12-24 2020-04-22 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
CN107134422A (zh) * 2016-02-29 2017-09-05 上海微电子装备（集团）股份有限公司 芯片键合装置及方法
JP6912329B2 (ja) * 2017-09-06 2021-08-04 ヤマハ発動機株式会社 基板作業装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120097335A1 (en) * 2009-08-24 2012-04-26 Derek Siu Wing Or Method and system for bonding electrical devices using an electrically conductive adhesive
JP2012099524A (ja) * 2010-10-29 2012-05-24 Hitachi High-Tech Instruments Co Ltd ダイボンダ装置、ダイボンダ方法、及びダイボンダ品質評価設備
TW201232679A (en) * 2010-10-29 2012-08-01 Hitachi High Tech Instr Co Ltd Die bonding device, die bonding method and die bonding quality evaluation equipment
US20130016205A1 (en) * 2011-07-13 2013-01-17 Hitachi High-Tech Instruments Co., Ltd. Die Bonder

Also Published As

Publication number Publication date
JP2021044466A (ja) 2021-03-18
JP2023099606A (ja) 2023-07-13
TW202119506A (zh) 2021-05-16
JP7458532B2 (ja) 2024-03-29
KR20210031811A (ko) 2021-03-23
KR102446631B1 (ko) 2022-09-23
CN112509939B (zh) 2024-03-01
TW202201570A (zh) 2022-01-01
TWI756160B (zh) 2022-02-21
CN112509939A (zh) 2021-03-16
KR20220054559A (ko) 2022-05-03
KR102447306B1 (ko) 2022-09-26
JP7300353B2 (ja) 2023-06-29

Similar Documents

Publication Publication Date Title
TWI725498B (zh) 黏晶裝置及半導體裝置的製造方法
JP7458532B2 (ja) ダイボンディング装置および半導体装置の製造方法
JP7161870B2 (ja) ダイボンダおよび半導体装置の製造方法
JP7102271B2 (ja) 半導体製造装置および半導体装置の製造方法
JP7029900B2 (ja) ダイボンディング装置および半導体装置の製造方法
CN110491795B (zh) 粘取元件、微型发光二极管光学检修设备及光学检修方法
TWI649820B (zh) 半導體製造裝置及半導體裝置的製造方法
JP7225337B2 (ja) 半導体製造装置および半導体装置の製造方法
JP2022098312A (ja) ダイボンディング装置および半導体装置の製造方法
US20220262688A1 (en) Adhesion device, micro device optical inspection and repairing equipment and optical inspection and repairing method
JP7082862B2 (ja) ダイボンディング装置、半導体装置の製造方法および半導体製造システム
JP7408455B2 (ja) ダイボンディング装置および半導体装置の製造方法
TW202412150A (zh) 晶粒鍵合裝置以及晶粒鍵合方法
JP7502493B1 (ja) 半導体製造装置、塗布装置および半導体装置の製造方法
TWI786739B (zh) 晶粒接合裝置及半導體裝置之製造方法
TW202314870A (zh) 黏晶裝置及半導體裝置的製造方法
JP2024024567A (ja) 半導体製造装置および半導体装置の製造方法
CN116759329A (zh) 安装装置、检查装置及半导体器件的制造方法
TW202312318A (zh) 黏晶裝置及半導體裝置的製造方法
TW202305959A (zh) 黏晶裝置及半導體裝置的製造方法
JP2024129750A (ja) 半導体製造装置、検査装置および半導体装置の製造方法