TWI750674B - Die bonding device and manufacturing method of semiconductor device - Google Patents

Abstract

The subject of this invention is the technique which can inspect the external appearance of the paste adhesive which changes in shape after application|coating. The solution, the die bonding machine is constituted as: In the login action before mass production, The time from the operation of applying the paste-like adhesive during mass production to the metal frame to the operation of ingesting the paste-like adhesive was measured, After applying the paste-like adhesive to the metal frame, the time for the measurement is waited, and the paste-like adhesive applied to the metal frame is taken in to obtain a reference inspection image.

Description

Die bonding device and manufacturing method of semiconductor device

The present application relates to a die bonder, which can be applied to, for example, a die bonder having the function of applying a paste adhesive.

As part of the manufacturing process of semiconductor devices, there is a process in which a semiconductor wafer (hereinafter referred to as a die) is mounted on a wiring board or lead frame (organic substrate such as metal, glass, epoxy resin, etc.) and packaged together. A part of the process includes a process of dividing a die from a semiconductor wafer (hereinafter simply referred to as a wafer) (dicing process) and a bonding process of mounting the divided die on a substrate. The semiconductor manufacturing equipment used for the bonding process is a die bonder.

The die bonder is a device that uses resin paste, solder, gold plating, etc. as bonding materials to bond (mount and adhere) the die on the substrate or the bonded die. In a die bonder for bonding die, for example, to the surface of a substrate, the die is sucked from the wafer by a suction nozzle called a collet, picked up, transported to the substrate, a pressing force is applied, and by The action (work) of heating the bonding material for bonding is repeated.

When resin is used as a bonding material, resin paste, such as Ag epoxy resin and acrylic acid, is used as an adhesive (hereinafter referred to as a paste adhesive). The paste adhesive for adhering the die to the lead frame or the like is enclosed in a syringe, and the syringe is moved up and down with respect to the lead frame, and the paste adhesive is injected and applied. That is, a predetermined amount of the paste-like adhesive is applied to a predetermined position by a syringe filled with the paste-like adhesive, and the die is pressed and baked to adhere to the paste-like adhesive. An identification camera is installed near the syringe, and the identification camera confirms whether or not the applied paste-like adhesive is applied in a predetermined shape and only a predetermined amount is applied to a predetermined position. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2013-197277

(The problem to be solved by the invention)

In order to improve the adhesiveness with respect to a board|substrate of a mold resin which seals the die of the board|substrate, such as a lead frame, mounted in a metal frame (frame), the board|substrate is sandblasted. However, after the paste-like adhesive is applied, the paste-like adhesive bleeds out due to the fine unevenness formed on the substrate, and the applied pasty-like adhesive undergoes a shape change. Therefore, inspection of the applied paste adhesive is difficult. The subject of this application is to provide a technique for inspecting the appearance of a paste-like adhesive whose shape has changed after application. Other problems and novel features can be clearly understood from the description of this specification and the accompanying drawings. (means to solve the problem)

A brief outline of the representative persons in this case is as follows. That is, the die sticker is constructed as: In the login action before mass production, The time from the operation of applying the paste-like adhesive during mass production to the metal frame to the operation of ingesting the paste-like adhesive was measured, After applying the paste-like adhesive to the metal frame, the time for the measurement is waited, and the paste-like adhesive applied to the metal frame is taken in to obtain a reference inspection image. [Effect of invention]

According to the above-mentioned die bonding apparatus, the appearance of the paste-like adhesive whose shape has changed after application can be inspected.

Hereinafter, embodiments, modifications, and examples will be described with reference to the drawings. However, in the following description, the same components are denoted by the same reference numerals, and overlapping descriptions are omitted. In addition, in the drawings, the width, thickness, shape, etc. of each part are shown schematically rather than the actual form in order to clarify the description, but they are only examples and are not intended to limit the interpreter of the present invention.

First, application of the paste-like adhesive will be described with reference to FIG. 1 . FIG. 1( a ) is a diagram showing a photographed image of a paste-like adhesive applied to a carrier tray on which lead frames of the carrier tray are arranged in a grid pattern, and FIG. 1( b ) shows the binarization of FIG. 1( a ) image of the figure.

The application of the paste-like adhesive to the lead frame of the metal frame is performed, for example, in a preformed portion before being provided in the bonding portion. First, in the preform, the positioning of the lead frame LF to which the paste-like adhesive is applied is performed using an identification camera. The positioning is performed by pattern matching or the like in the same manner as the bonding head portion. Next, in the preformed part, the paste-like adhesive PA is injected from the nozzle at the tip of the enclosed syringe, and is applied according to the trajectory of the nozzle. The syringe is driven on the XYZ axes according to the shape to be applied, and the syringe is applied by drawing a free trajectory such as a X mark shape or a cross shape according to the trajectory. Finally, the state of the paste-like adhesive PA after application is inspected (appearance inspection is performed) in the preformed portion using an identification camera. Check the presence, coating area, coating shape (insufficient, overflowing) of the paste-like adhesive PA as required. In addition to the binarization process shown in Fig. 1(b), the method of calculating the prime numbers after separating the paste regions, the method of comparing the scores according to the pattern matching, etc. to proceed. Hereinafter, the application pattern of the paste-like adhesive PA will be described in the shape of an X mark.

As shown in FIG. 1( a ), depending on the coating state of the paste adhesive, there are shortages (the middle stage of FIG. 1( a ), overflow (the lower stage of FIG. 1( a )), and the like. In addition, the upper stage of FIG.1(a) is a case where the application state of the paste adhesive is normal.

The lead frame is sandblasted in order to obtain adhesion with a mold resin that seals the lead frame as a substrate to which the die is bonded. 2 and 3, the problems related to the application of the paste adhesive to the sandblasted lead frame will be described. FIG. 2( a ) is a diagram showing a photographed image immediately after the paste-like adhesive is applied to the surface of the sandblasted lead frame, and FIG. 2( b ) shows a state after a predetermined time has elapsed from FIG. 2( a ) Fig. 2(c) is a conceptual cross-sectional view taken along line AA of Fig. 2(b), Fig. 2(d) is a diagram showing the binarized image of Fig. 2(a), Fig. 2(e) It is a figure which shows the binary image of FIG.2(b). FIG. 3 is a view showing a photographed image of a paste-like adhesive applied to the carrier tray in which the lead frames of the carrier tray are arranged in a grid pattern.

Once the paste-like adhesive PA is applied to the pad TB serving as the die-mounting portion of the sandblasted lead frame LF, as shown in FIG. 2(b)(c) , the paste becomes The adhesive PA will ooze out thinly. The surface of the sandblasted lead frame LF is not flat but has fine irregularities. The paste-like adhesive PA applied so as to be immersed in the unevenness oozes out. In this specification, this exudation is referred to as breeding BO. Proliferating BO spreads thinly in a uniform direction over time in the initial stage. In addition, even in a lead frame that is not sandblasted, when the viscosity of the paste adhesive is small, the paste adhesive spreads over time.

In the visual inspection immediately after the application of the paste-like adhesive PA, the inspection is completed before the proliferation of the proliferative BO. However, for some reasons, when re-examination is required or after a predetermined period of time has elapsed, changes in proliferative BO need to be considered. Proliferation is the exudation of the solvent and the exudation of the paste itself. The exudation of the cream itself was judged to be poor when there was a change in proliferating BO. This can be detected by the binarized image of FIG. 2(e) after a predetermined time has elapsed after application and the binarized image of FIG. 2(d) just after application registered in advance.

On the other hand, the proliferation of BO hardly affects the coating amount of the paste-like adhesive PA, and if the proliferation of BO itself is not a defect, if a certain amount of time has passed after the application of the paste-like adhesive PA, the Appearance inspection is performed by the image captured by the recognition camera installed above the applied paste-like adhesive PA, even if the amount of the paste-like adhesive PA is intended to be measured, it cannot be detected due to the influence of the proliferation of BO. Correct amount of paste (area/applied shape). If the captured image is binarized in this way, as shown in Fig. 2(e), the proliferating BO is also regarded as a paste application area, so the paste portion PST and the proliferating BO cannot be separated. In the current inspection system, it is determined that the coating is too much.

The case where inspection is required after a predetermined time has elapsed from the application of the paste-like adhesive PA will be described with reference to FIG. 3 .

FIG. 3 shows that the paste-like adhesive PA is applied in order from the upper-right carrier plate on which the lead frames LF are arranged in a lattice form in the downward direction. From the uppermost position of the second row, the paste-like adhesive PA is sequentially applied in the downward direction, and then the third row and the fourth row are similarly applied. Therefore, the paste-like adhesive PAS applied to the uppermost tray in the first row has the longest elapsed time after application, and the paste-like adhesive PAE applied to the lowermost tray in the fourth row is applied After the elapsed time is the smallest.

As shown in FIG. 3 , if the appearance inspection of the paste adhesive applied to all the trays in the four rows is performed after the application of the four rows, that is, after the application of the paste adhesive PAE, the results are as shown in FIG. 3 . In general, the expansion of the multiplication BO differs for each carrier. Usually, the visual inspection of the paste adhesive is performed in each row, so the paste adhesive of the first coated tray and the last coated tray of the row are the expansion meeting of the proliferating BO. Different on each disc.

When a full carrier inspection is performed after coating a plurality of carriers in one row or a plurality of rows, the time from coating to inspection differs for each carrier, and the expansion of the multiplication BO differs for each carrier. The results will vary depending on where the disc is loaded.

Next, an outline of an embodiment for solving the above-mentioned problems will be described with reference to FIG. 4 . FIG. 4( a ) is a diagram showing a photographed image immediately after the paste-like adhesive is applied to the surface of the lead frame, and FIG. 4( b ) is a diagram showing a photographed image of a state where a predetermined time has elapsed from FIG. 4( a ), FIG. 4( c ) is a diagram showing the binarized image in FIG. 4( a ), FIG. 4( d ) is a diagram showing the binary image in FIG. 4( b ), and FIG. 4( e ) is a diagram showing the binary image in FIG. 4( b ). a) is a diagram of the binarized image, and FIG. 4( f ) is a diagram showing the binarized image obtained by removing the proliferating changes from FIG. 4( b ).

In the first embodiment, the registration timing of the reference inspection image serving as the reference is matched with the inspection timing of the continuous operation during mass production, and as shown in FIG. 4(d), inspection is performed by image recognition including proliferation. determination. On the other hand, in the second embodiment, the original coating amount (shape) is predicted from the expansion of the proliferation, and as shown in FIG. 4( f ), the change in the proliferation is removed for inspection and determination. In the third embodiment, inspection and determination are performed by separating and proliferating from the paste portion by illumination. Hereinafter, the inspection method of each of them will be described in detail.

(first embodiment) The inspection method of the paste adhesive according to the first embodiment will be described with reference to FIGS. 5 and 6 . FIG. 5 is a flowchart illustrating a method of acquiring a reference inspection image. FIG. 6( a ) is a diagram showing a photographed image immediately after the paste-like adhesive is applied to the surface of the lead frame, and FIG. 6( b ) is a diagram showing a photographed image of a state passing through point A from FIG. 6( a ), FIG. 6( c ) is a diagram showing a captured image in a state where B points have passed from FIG. 6( a ), FIG. 6( d ) is a diagram showing the binarized image in FIG. 6( a ), and FIG. 6( e ) is a FIG. 6( b ) is a diagram showing the binarized image, and FIG. 6( f ) is a diagram showing the binarized image in FIG. 6( c ).

As described above, in the first embodiment, the registration timing of the reference inspection image serving as the reference is matched with the inspection timing during mass production, and inspection determination is performed by image recognition including proliferation. The inspection method described below is performed by a control device included in the die bonder controlling an identification camera or the like as an imaging device.

First, the operation of registering (acquiring an image) at an actual recognition timing will be described. (Step S1: Acquisition of mass production conditions (recognition timing)) In fact, no application is performed, and the operation is empty (step S11 ), and the timing (time) from the application of the continuous operation during mass production to the appearance inspection (recognition) imaged by the identification camera is measured (step S12 ). As described in FIG. 3 , after the paste adhesive PA is applied to the plurality of carriers TB of the lead frame LF, the steps from the first applied paste PAS to the last applied paste PAE At the time of the sequential visual inspection, the time from each application to the visual inspection was measured. Thereby, the appearance inspection timing at the time of mass production is obtained.

(Step S2: Acquisition of the reference inspection image) The actual application of the paste-like adhesive PA to the carrier tray TB as the lead frame LF of the first substrate is performed once, and settings such as illumination are determined (step S21 ). The measurement of the elapsed time was started simultaneously with coating. Wait until the measured elapsed time reaches the time measured in step S12 (actual measurement time) (step S22 ), that is, the actual recognition timing of the appearance inspection timing of mass production, and obtain the reference of the paste adhesive PA by the recognition camera. The inspection image is stored in the memory device included in the control device and registered (step S23). For example, when the time measured in step S12 is A minutes, the photographed image in Fig. 6(b) is registered as a reference inspection image, and when the time measured in step S12 is B minutes, the photographed image in Fig. 6(c) is registered as a reference inspection image. It is registered as a reference inspection image. When the time measured in step S11 is one, one inspection image is acquired, and when the time measured in step S11 is plural, plural reference inspection images for each time are acquired. Thereby, the reference inspection image of the visual inspection timing at the time of mass production is acquired.

In mass production, inspections and judgments are carried out by continuous operation. In the appearance inspection after the application of the paste-like adhesive PA to the carrier tray TB of the lead frame LF as the second substrate, an image is obtained by an identification camera, and the image is compared with the reference inspection image registered in step S23, and the application is determined. Is it normal. For example, binarize the photographed image of the visual inspection at the time of mass production, and when the time measured in step S12 is A minutes, compare with the binarized image shown in FIG. 6(e), and the time measured in step S12 When it is divided into B, compare it with the binarized image shown in Fig. 6(f).

In the first embodiment, since the change in the two-dimensional shape of the paste-like adhesive is considered at the time of identification and registration, it is possible to distinguish between the initial coating amount and the change over time, by referring to the registration of the inspection image and the appearance at the time of mass production The conditions of the acquisition timing of the inspection image of the inspection match, and accurate inspection determination becomes possible. That is, the registration timing of the reference inspection image is matched with the acquisition timing of the inspection image during mass production (continuous operation), and the shape change of the applied paste adhesive is detected. As a result, it is possible to stabilize the determination of the presence or absence of abnormality of the applied paste-like adhesive, and to enable accurate inspection and determination. In addition, by automating the registration timing of the reference inspection image (the device is adapted to the mass production conditions), it is possible to eliminate the difference depending on the operator, and the operation rate can also be improved.

Hereinafter, representative modifications and other embodiments of the embodiment will be described with reference to some examples. In the description of the following modification examples and other embodiments, the same reference numerals as those of the above-described embodiment can be used for parts having the same structure and function as those described in the above-described embodiment. In addition, the description concerning such a part is a description which can be suitably used for the above-mentioned embodiment in the range which does not contradict technically. In addition, a part of the above-mentioned embodiment, a plurality of modified examples, and all or part of other embodiments can be appropriately combined and applied within the scope of technical inconsistency.

(first modification) Changes by time after application of the paste-like adhesive PA can also be detected. A method of acquiring a reference inspection image according to a modification (first modification) of the first embodiment will be described with reference to FIG. 7 . FIG. 7 is a flowchart illustrating a method of acquiring a reference inspection image.

After step S2 in FIG. 5 , a reference inspection image of the paste adhesive PA applied to the carrier tray TB of the lead frame LF as the first substrate is obtained by the recognition camera, and the elapsed time when the reference inspection image is obtained is obtained. (step S24). Based on the previously acquired reference inspection image and the latest reference inspection image, it is determined whether or not the expansion of the proliferation is saturated (step S25 ). Steps S24 and S25 are repeated, and the saturation time of the expansion saturation of the proliferation is obtained (step S26).

That is, according to the elapse of time after coating, for example, as shown in FIGS. 6( a ) to ( c ), the reference inspection images are acquired a plurality of times. From these reference inspection images, confirmation of changes over time and confirmation of saturation time are performed. After coating, when the inspection was not performed before the device was stopped, the determination at the restart of mass production was performed based on the time from coating to the inspection after the device was restarted (here, referred to as the device stop time). When the device stop time is within the saturation time, it is determined using the reference inspection image corresponding to the device stop time. When the device stop time is longer than the saturation time, it is determined using the reference inspection image corresponding to the saturation time.

(Second Embodiment) The inspection method of the paste adhesive according to the second embodiment will be described with reference to FIGS. 8 to 11 . FIG. 8 is a flowchart illustrating registration of the expanded extension. FIG. 9 is a flowchart illustrating the appearance inspection at the start of construction. FIG. 10 is a diagram illustrating prediction of the application amount (shape) of the paste-like adhesive immediately after application. FIG. 10( a ) is a diagram showing a photographed image immediately after the paste-like adhesive is applied to the surface of the lead frame, and FIG. 10( b ) is a diagram showing a photographed image of a state passing through point A from FIG. 10( a ), FIG. 10( c ) is a diagram showing a captured image in a state in which point B has passed from FIG. 10( a ). Fig. 10(d) is a diagram showing the captured image in the state where the point A has passed from Fig. 10(a), Fig. 10(e) is a diagram showing the binarized image in Fig. 10(d), and Fig. 10(f) is a The binarized image immediately after application was calculated from the binarized image in FIG. 10( d ). FIG. 10( g ) is a diagram showing the captured image in the state where B points have passed from FIG. 10( a ), FIG. 10( h ) is a diagram showing the binarized image in FIG. 10( g ), and FIG. 10( i ) is a The binarized image immediately after the application was calculated from the binarized image in FIG. 10( h ). FIG. 11 is a diagram illustrating an example of a shape-related prediction method.

As described above, in the second embodiment, the original coating amount (shape) is predicted from the expansion of the proliferation, and the inspection determination is performed by removing the change in the proliferation. Hereinafter, it demonstrates in detail.

As shown in FIG. 8 , by performing an imitation operation (registration operation), the speed of expansion of the proliferation is investigated for each item type and a database is formed. Hereinafter, the imitation operation will be described.

The lead frame LF as the first substrate is transported to the place where the paste-like adhesive PA is applied (step S31 ), and the illumination value is determined (step S32 ). Next, the measurement of the elapse of time is started at the same time as the application of the paste-like adhesive PA to the carrier plate TB of the lead frame LF as the first substrate (step S33 ). Immediately after application, the recognition camera is used to capture the paste-like adhesive PA to take in the image, and at the same time, a timestamp (timestamp) is obtained (step S34 ), and the area of the area of the applied paste-like adhesive PA is measured from the imaged image and the at least one of the shapes (step S35). After that, steps S34 and S35 are repeated every predetermined time until the expansion of the proliferation is saturated.

In the continuous operation at the start of the work, as shown in FIG. 9 , the lead frame LF as the second substrate is conveyed to the place where the paste-like adhesive PA is applied (step S41 ), and the paste-like adhesive PA is applied on the second substrate as the The lead frame LF is placed on the tray TB (step S42). The measurement of the elapse of time is started at the same time when the paste-like adhesive PA is applied (step S43 ). After the application, at a predetermined timing, the paste-like adhesive PA is captured using the recognition camera, and a time stamp is acquired while taking in the image (step S44 ).

The area and shape of the region of the paste-like adhesive PA immediately after application are predicted from the elapsed time calculated from the time stamp acquired in step S44 and the image acquired when imitating the action (step S45 ). At this time, the image acquired in step S44 is checked by normal image processing. For example, when the elapsed time since the application is A minutes, as shown in FIG. 10(e), the image in which the detected application area is binarized is calculated according to the elapsed time obtained by imitation. Shrinkage treatment was performed depending on the amount of shrinkage, and the area and shape immediately after coating were calculated. Thereby, the predicted image at the time of coating shown in FIG.10(f) is produced, and the coating amount at the time of coating is predicted as a result. When the elapsed time since the application is B minutes, as shown in FIG. 10(h), the image in which the detected application area is binarized depends on the elapsed time obtained by imitating the action. The shrinkage treatment was carried out according to the amount of shrinkage, and the area and shape immediately after coating were calculated. Thereby, the predicted image at the time of coating as shown in FIG.10(i) is produced, and the coating amount at the time of coating is predicted as a result.

As a shape prediction method, simple image expansion processing or image shrinkage processing may be used. The number of contractions or expansions relative to elapsed time is determined by the data obtained while imitating the movement. The image expansion processing or the image shrinkage processing is performed in eight directions or four directions. As shown in FIG. 11 , the starting point may be set at each inflection point (· mark) of the penlite trajectory in the shape of the × mark, and the outer side of the contour line indicated by the arrow when imitating the action may be obtained. The amount of change in direction per time, which is used to calculate the forecast calculation. Variation forecasts are also available for area only.

Inspection and determination are performed based on the area and shape predicted in step S45 and the area and shape of the image immediately after application at the time of the imitation operation (step S45 ). For example, the inspection is performed by comparing the area or shape of the predicted application area of the paste-like adhesive PA with the application shape used as a reference when the memory imitates the action, or the like. The extraction of the area of the coating area is performed by calculating a pixel of a specific lightness (extraction from histogram data, etc.) or by detection of blobs. The comparison of the shapes of the application regions is obtained by imitating the operation to obtain reference data that can compare the binarized data, and then compare the reference data with the data of the expected shape by difference processing or the like.

In the inspection method of the second embodiment, it is assumed that the speed and direction of proliferation and expansion within a certain period of time after application are reproduced as in the calculation formula determined in advance. Therefore, the upper limit time during which the proliferation continues to expand uniformly is also measured in advance by the imitation action, and the process of invalidating the measurement result after the elapse of the upper limit time is also performed.

In the second embodiment, since the growth progresses by a certain amount within a certain period of time, the application state of the paste from which the growth portion is removed can be confirmed.

(Second modification example) 8 and 12 , an inspection method of a paste-like adhesive according to a modification (second modification) of the second embodiment will be described. FIG. 12 is a flowchart illustrating the appearance inspection at the start of construction.

The inspection method of the paste-like adhesive of the second modification is to compare the photographed image or shape of each elapsed time when imitating the action with the photographed image or shape obtained at the start of mass production. It is the same as steps S41-S44 at the time of the imitation operation and the start of construction of the second embodiment.

A photographed image or shape data is held for each elapsed time after application of the paste adhesive PA on the carrier tray TB of the lead frame LF as the first substrate during the imitation operation (steps S34, S35). The elapsed time from the application of the paste-like adhesive PA to the inspection on the carrier tray TB of the lead frame LF serving as the second substrate is measured in the continuous operation at the start of construction (step S43 ). Based on the value of the elapsed time, which image to compare with when imitating an action is selected. That is, the image or shape data at the time of imitating the action corresponding to the elapsed time are acquired (step S45a). Inspection and determination are performed based on the image acquired in step S44 or based on its shape data and the image or shape data acquired in step 45a (step S46a).

(third embodiment) In the second embodiment, the original coating amount (shape) is predicted from the expansion of the proliferation, and the change in the proliferation is removed for inspection and determination, but the third embodiment separates the proliferation from the paste by illumination. The inspection method of the paste-like adhesive of the third embodiment will be described with reference to FIG. 13 . FIG. 13 is a diagram showing an imaging device and an illumination device according to a third embodiment.

As shown in FIG. 2( c ), since the paste portion PST and the proliferating BO are three-dimensionally different, the proliferating BO is made dark and the paste portion PST is bright and separated. Proliferation of BO appears dark with respect to the substrate surface in most cases after coating (like a state where concrete appears dark after rain). Therefore, if the difference processing of the image after the application is performed from the image before the application, the multiplication BO will always appear dark (negative image). Therefore, as long as the differential processing is performed in the mode of rounding off negative numbers, the multiplying BO part can be excluded. However, the paste part PST is not necessarily bright. This is because of the characteristics of liquid surface reflection, and when the epi-illumination encounters parallel light, the surrounding portion of the paste portion PST may become dark. Therefore, as shown in FIG. 13 , if it is used in combination with oblique lighting (ideally, a ring or square type), the peripheral part of the paste part PST will definitely become brighter.

As shown in FIG. 13 , the lighting device ID of the third embodiment includes coaxial lighting CL and oblique lighting OL including epi-illumination. The coaxial illumination CL is composed of the illumination LS and the half mirror HM, and irradiates light along the optical axis of the imaging device CAM. The oblique light illumination OL irradiates light obliquely with respect to the optical axis. Since the coating area of the paste-like adhesive PA is the liquid surface, specular reflection is generated by illumination, and bright lines or dark parts are generated according to the position of illumination. For example, in the image obtained by illuminating the OL with oblique light, bright lines appear in the periphery of the application area, and dark areas appear in the center of the application area. This is because the incident direction of the illumination is low in the oblique light illumination OL. On the other hand, in the image acquired by the coaxial illumination CL, a bright line appears in the center of the application area, and a dark portion appears in the periphery of the application area. This is because the incident direction of the illumination is high in the coaxial illumination CL. By using coaxial illumination CL and oblique illumination OL together, dark parts can be removed. [Example]

14-16, the structure of the die bonder which concerns on the die bonder which is an Example is demonstrated. FIG. 14 is a conceptual diagram of the die bonder of the embodiment viewed from above. FIG. 15 is a configuration diagram of an optical system of the die bonder of FIG. 14 . FIG. 16 is a block diagram showing a schematic configuration of a control system of the die bonder of FIG. 14 .

The die bonder 10 has a wafer supply unit 1 , a workpiece supply and transfer unit 2 , and a die bonding unit 3 roughly differentiated.

The wafer supply unit 1 includes a pod lifter 11 and a pickup device 12 . The pod lifter 11 is a pod (not shown) having a filled wafer ring 16 , and sequentially supplies the wafer ring 16 to the pickup device 12 . The pickup device 12 moves the wafer ring 16 so as to pick up the desired die D from the wafer ring 16 to lift up the die D.

The workpiece supply and conveyance unit 2 includes a stack loader 21, a frame feeder 22, and an unloader 23, and conveys the lead frame LF (see FIG. 15) in the arrow direction. The stack loader 21 supplies the lead frame LF to which the die D is attached to the frame feeder 22 . The frame feeder 22 conveys the lead frame LF to the unloader 23 via two processing positions on the frame feeder 22 . The unloader 23 stores the conveyed lead frame LF.

The die bonding portion 3 includes a preformed portion (paste application unit) 31 and a bonding head portion 32 . The preform part 31 uses a syringe 36 (see FIG. 15 ) to apply a paste-like adhesive PA such as epoxy resin to the lead frame LF conveyed by the frame feeder 22 . The syringe 36 has the paste-like adhesive PA enclosed therein, and can be applied by extruding the paste-like adhesive PA from the tip of the nozzle to the lead frame LF by air pressure. When the lead frame LF is, for example, a multi-connected lead frame in which a plurality of unit lead frames are arranged in a row and connected in series, the paste-like adhesive PA is applied to the pad of each unit lead frame. Here, the lead frame LF is sandblasted. The bonding head 32 picks up the die D from the pickup device 12 and ascends, and moves the die D to the bonding point on the frame feeder 22 . Then, the bonding head 32 lowers the die D at the bonding point, and bonds the die D to the lead frame LF coated with the paste-like adhesive PA.

The bonding head 32 includes a ZY drive shaft 60 that moves the bonding head 35 in the Z-axis direction (height direction) and moves in the Y-axis direction, and an X-drive shaft 70 that moves in the X-axis direction. The ZY drive shaft 60 has the Y drive shaft 40 that reciprocates in the Y-axis direction indicated by the arrow C, that is, the bonding head 35 reciprocates between the pickup position in the pickup device 12 and the bonding point, and is used to remove the wafer from the wafer. 14. The Z drive axis 50 that picks up the die D or is joined to the lead frame LF and moved up and down. The X drive shaft 70 is the X direction that moves the entire ZY drive shaft 60 in the direction in which the lead frame LF is conveyed.

As shown in FIG. 15 , the optical system 88 is provided with the adhesive recognition camera 33 as a camera for grasping the application position of the syringe 36 and the like, and grasping the bonding position of the bonding head 35 to the conveyed lead frame LF. The substrate recognition camera 34 and the wafer recognition camera 15 for grasping the pick-up position of the die D picked up by the bonding head 35 from the wafer 14 are provided. Each recognition camera captures an image using an illumination device that illuminates an object. The dies D diced into the mesh shape in the wafer 14 are fixed to the dicing tape 17 , and the dicing tape 17 is fixed to the wafer ring 16 .

With this configuration, the paste-like adhesive PA is applied to the correct position by the syringe 36 , the die D is surely picked up by the bonding head 35 and bonded to the correct position of the lead frame LF.

As shown in FIG. 16 , the control system 80 includes a control device 8 , a drive unit 86 , a signal unit 87 , and an optical system 88 . The control device 8 is roughly divided into a control and arithmetic device 81 mainly composed of a CPU (Central Processor Unit), a memory device 82 , an input/output device 83 , a bus line 84 , and a power supply unit 85 . The memory device 82 includes a main memory device 82a including a RAM for storing processing programs and the like, and an auxiliary memory device 82b including an HDD for storing control data, image data, and the like necessary for control. The input/output device 83 includes a monitor 83a for displaying device status and information, a touch panel 83b for inputting instructions from an operator, a mouse 83c for operating the monitor, and an image capture device for capturing image data from the optical system 88 Device 83d. In addition, the I/O device 83 is a motor control device 83 e including a drive unit 86 that controls the XY stage (not shown) of the wafer supply unit 1 or the ZY drive shaft of the bonding head stage, etc., and controls various sensor signals. Or the I/O signal control device 83f that takes in signals or controls from the signal section 87 of switches such as lighting devices. The optical system 88 includes the wafer recognition camera 15 , the adhesive recognition camera 33 , and the substrate recognition camera 34 . The control/calculation device 81 takes in necessary data via the bus line 84, performs calculation, and sends the information to the control or monitor 83a of the bonding head 35 and the like.

The control device 8 stores the image data captured by the optical system 88 in the memory device 82 via the image capture device 83d. With the software programmed according to the stored image data, the control/calculation device 81 is used to perform positioning of the die D and the lead frame LF, inspection of the application pattern of the paste adhesive PA, and inspection of the die D and the lead frame LF surface inspection. Based on the positions of the die D and the lead frame LF calculated by the control and arithmetic device 81 , the drive unit 86 is actuated by software via the motor control device 83e. Through this process, the positioning of the die D on the wafer 14 is performed, and the driving unit of the wafer supply unit 1 and the die bonding unit 3 is operated to bond the die D to the lead frame LF. The camera used in the optical system 88 is a gray scale, a color, or the like, and the light intensity is digitized.

Next, a method of manufacturing a semiconductor device using the die bonder according to the embodiment will be described with reference to FIG. 17 . FIG. 17 is a flowchart showing a method of manufacturing a semiconductor device.

(Step S51: Wafer/Substrate Loading Process) The wafer ring 16 holding the dicing tape 17 to which the die D divided from the wafer 14 is attached is accommodated in a wafer cassette (not shown) and carried into the die bonder 10 . The control device 8 supplies the wafer ring 16 to the wafer supply unit 1 from the wafer cassette filled with the wafer ring 16 . Then, the lead frame LF is prepared and carried into the die bonder 10 . The control device 8 supplies the lead frames LF from the stack loader 21 to the frame feeder 22 .

(Step S52: Picking up the project) The control device 8 moves the wafer ring 16 in such a way that the desired die D can be picked up from the wafer ring 16 to the pick-up device 12 to lift the die D, and pick up and peel off the wafer 14 by the bonding head 35 . the grain D.

(Step S53: bonding process) The control apparatus 8 acquires the image of the surface of the lead frame LF before application by the adhesive recognition camera 33, and confirms the surface to which the paste adhesive PA is to be applied. If there is no problem on the surface to be applied, the control device 8 applies the paste-like adhesive PA from the syringe 36 to the lead frame LF conveyed by the frame feeder 22 . When the lead frame LF is a multi-connection lead frame, the paste adhesive PA is applied to all the pads. The control device 8 reconfirms the paste-like adhesive PA after application with the adhesive identification camera 33 by the inspection method of any one of the first embodiment, the second embodiment, the third embodiment, and the modified examples thereof. Whether it is applied correctly, check the applied paste adhesive PA. If there is no problem with the application, the control device 8 will bond the die D picked up by the bonding head 35 to the lead frame LF to which the paste-like adhesive PA is applied.

(Step S54: Substrate removal process) The control device 8 supplies the lead frame LF to which the die D is bonded to the unloader 23 via the frame supply machine 22 . The lead frame LF is unloaded from the die bonder 10 .

As mentioned above, the invention developed by the inventors has been specifically described based on the embodiments, modifications, and examples. However, the present invention is not limited to the above-described embodiments, modifications, and examples, and various modifications are of course possible.

For example, in Embodiment 1, the example in which the idle operation is not actually applied in step S11 has been described, but in step S11, actual application may be performed.

Furthermore, Embodiment 2 has been described as an example in which the speed of expansion of proliferation is investigated by product type by performing the imitation operation (registration operation), and the database is created. A plurality of recognition cameras are installed at predetermined intervals, and the speed of proliferation and expansion is calculated by product type from the inspection image of the paste shape applied to the passing lead frame and the conveying speed of the lead frame, and the database is stored. In addition, since the status at the time of mass production can be continuously confirmed, automatic correction of the database or detection of abnormality or change point of paste application by using data deviation can also be performed.

In addition, the embodiment has described an example in which the die D picked up from the wafer 14 is bonded to the lead frame LF by the bonding head 35, but an intermediate stage may be provided between the wafer 14 and the lead frame LF, and the pick-up The die D picked up from the wafer 14 is placed on the intermediate stage, and the die D is picked up again from the intermediate stage by the bonding head 35 and bonded to the transferred lead frame LF.

8: Control device 10: Die sticking machine (die sticking device) 33: Adhesive recognition camera (camera device) 35: Splice head D: grain LF: Lead frame (substrate) PA: paste adhesive

[ Fig. 1] Fig. 1 is a diagram illustrating application of a paste-like adhesive. [ Fig. 2] Fig. 2 is a diagram illustrating a problem in applying a paste-like adhesive to a sandblasted lead frame. [ Fig. 3] Fig. 3 is a diagram illustrating a problem in applying a paste-like adhesive to a sandblasted lead frame. [ Fig. 4] Fig. 4 is a diagram illustrating the outline of the embodiment. 5] It is a figure explaining the inspection method of the paste adhesive agent concerning 1st Embodiment. 6] It is a figure explaining the inspection method of the paste adhesive agent concerning 1st Embodiment. [ Fig. 7] Fig. 7 is a diagram illustrating a method for inspecting a paste-like adhesive according to a first modification. [ Fig. 8] Fig. 8 is a diagram illustrating an inspection method of the paste-like adhesive according to the second embodiment. [ Fig. 9] Fig. 9 is a diagram illustrating an inspection method of the paste-like adhesive according to the second embodiment. [ Fig. 10] Fig. 10 is a diagram illustrating an inspection method of the paste-like adhesive according to the second embodiment. FIG. 11 is a diagram illustrating an example of a shape-related prediction method. [ Fig. 12] Fig. 12 is a diagram illustrating an inspection method of a paste-like adhesive according to a second modification. [ Fig. 13] Fig. 13 is a diagram illustrating an inspection method of the paste-like adhesive according to the third embodiment. Fig. 14 is a conceptual diagram of the die bonder of the embodiment viewed from above. [ Fig. 15] Fig. 15 is a configuration diagram of an optical system of the die bonder of Fig. 14 . 16 is a block diagram showing a schematic configuration of a control system of the die bonder of FIG. 14 . 17 is a flowchart showing a method of manufacturing a semiconductor device.

Claims (11)

A die bonding device, which is characterized by comprising: an imaging device that captures a paste-like adhesive applied on a substrate; a bonding head that mounts a die on the substrate coated with the paste-like adhesive and a control device for performing an appearance inspection based on an image of the paste-like adhesive captured by the imaging device, wherein the control device is configured to: The time from the operation of applying the adhesive paste to the substrate to the operation of capturing the adhesive paste by the imaging device, and the time to wait for the measurement after the first adhesive paste is applied to the first substrate, Then, the first adhesive paste coated on the first substrate is captured by the imaging device, and a reference inspection image is obtained. The die bonding apparatus according to claim 1, wherein the control device is configured to, during mass production, after the second adhesive paste is applied to the second substrate, and then the imaging is performed when the measured time elapses. The apparatus picks up the second paste adhesive applied on the second substrate to obtain an inspection image, and performs an appearance inspection based on the inspection image and the reference inspection image. The die bonding device of claim 2, wherein the control device is configured as: In the registration operation, according to the elapse of time after the application of the first adhesive paste, the imaging device captures the first adhesive paste multiple times to obtain a plurality of reference inspection images. A die bonding device, which is characterized by comprising: an imaging device that captures a paste-like adhesive applied on a substrate; a bonding head that mounts a die on the substrate coated with the paste-like adhesive and a control device for performing an appearance inspection based on the image of the paste-like adhesive captured by the imaging device, wherein the control device is configured to measure the amount of time after the first paste-like adhesive is applied to the first substrate. The elapsed time is the elapsed time when the first paste-like adhesive is captured several times by the imaging device to obtain a plurality of images and each of the plurality of images, and each is measured from each of the plurality of images The area or shape of the first paste-like adhesive in the elapsed time at the time of imaging is measured, and the elapsed time after the second paste-like adhesive is applied to the substrate is measured during mass production, and the second image is captured by the imaging device. The second elapsed time when the inspection image and the imaging of the inspection image are obtained with the paste adhesive, and the second elapsed time is calculated from the area or shape of the first paste adhesive based on the second elapsed time and the elapsed time in the imaging. The expected area or expected shape at the time of application of the paste adhesive, The appearance inspection is performed based on the aforementioned expected area or the aforementioned expected shape. A die bonding device, which is characterized by comprising: an imaging device that captures a paste-like adhesive applied on a substrate; a bonding head that mounts a die on the substrate coated with the paste-like adhesive and a control device for performing an appearance inspection based on the image of the paste-like adhesive captured by the imaging device, wherein the control device is configured to measure the amount of time after the first paste-like adhesive is applied to the first substrate. The elapsed time is the elapsed time when the first paste adhesive is captured by the imaging device multiple times to obtain plural images or plural shape data based on the plural images, and obtain the imaging of each of the plural images. In mass production, the elapsed time after the second paste adhesive is applied to the second substrate is measured, and the second paste adhesive is captured by the imaging device to obtain an inspection image or a second inspection image based on the inspection image. shape data, and obtain the second elapsed time at the time of imaging of the inspection image, select the image or shape data corresponding to the second elapsed time from the acquired plural images or the plural shape data, according to the selected image or The shape data and the aforementioned inspection image or the aforementioned second shape data are used for visual inspection. The die bonding device of any one of claims 1 to 5, Among them, it further includes: a wafer ring jig for holding the dicing tape with the die attached; and a syringe for applying the paste adhesive on the substrate. A method of manufacturing a semiconductor device, characterized in that the die bonding device includes: a process of loading a second substrate; a process of applying a second paste-like adhesive on the second substrate; and applying the second paste-like adhesive to the second substrate. After the adhesive is applied to the second substrate, when the measurement time elapses, the imaging device captures the second paste-like adhesive applied to the second substrate to obtain an inspection image, and performs the inspection according to the inspection. The image and the process of performing the appearance inspection with reference to the inspection image, the die bonding apparatus is provided with: an imaging device which captures the paste-like adhesive applied on the substrate; and a bonding head which mounts the die on the coating On the substrate having the paste adhesive; and a control device for performing an appearance inspection based on the image of the paste adhesive captured by the imaging device, and the control device is used in the registration operation before mass production, Measuring the time from the operation of applying the adhesive paste in mass production to the substrate to the operation of capturing the adhesive paste by the imaging device, After the first adhesive paste is applied to the first substrate, the first adhesive paste applied to the first substrate is captured by the imaging device and a reference inspection image is obtained after waiting for the measurement time. The method for manufacturing a semiconductor device according to claim 7, wherein, in the registration operation, the control device uses the imaging device to capture the first image a plurality of times in accordance with the elapse of time after the application of the first paste-like adhesive. One paste adhesive to obtain multiple reference inspection images. A method of manufacturing a semiconductor device, characterized in that the die bonding device includes: a process of loading a second substrate; a process of applying a second paste-like adhesive on the second substrate; measuring the process of applying the second paste-like adhesive The elapsed time after the adhesive is applied to the second substrate, and the second elapsed time when the image pickup device captures the second paste-like adhesive to obtain the inspection image and the second elapsed time when the inspection image is captured, based on the second elapsed time The area or shape of the first paste-like adhesive during the elapsed time at the time of imaging is calculated to calculate the expected area or expected shape of the second paste-like adhesive when applying, and the appearance inspection is performed based on the above-mentioned expected area or the above-mentioned expected shape. The process of the invention, the die bonding apparatus is provided with: an imaging device, which captures the paste-like adhesive applied on the substrate; and a bonding head, which mounts the die on the substrate coated with the above-mentioned paste-like adhesive ; and a control device, which is based on the above-mentioned paste taken by the above-mentioned camera device The image of the adhesive is used for visual inspection, and the control device measures the elapsed time after the first adhesive paste is applied to the first substrate, and the imaging device captures the first adhesive paste several times to obtain the result. The area or shape of the first paste-like adhesive for the elapsed time during imaging of each of the plurality of images and the plurality of images is measured from each of the plurality of images. A method of manufacturing a semiconductor device, characterized in that the die bonding device includes: a process of loading a second substrate; a process of applying a second paste-like adhesive on the second substrate; measuring the process of applying the second paste-like adhesive The elapsed time after the adhesive is applied to the second substrate, the second paste-like adhesive is captured by the imaging device to obtain the inspection image or the second shape data based on the inspection image, and the imaging of the inspection image is obtained The second elapsed time is to select a reference inspection image or shape data corresponding to the second elapsed time from the obtained plural images or the plural shape data, and based on the selected image or shape data and the inspection image or the first The process of performing visual inspection with two shape data, the die bonding device is provided with: a camera device, which captures the paste-like adhesive applied on the substrate; and a bonding head, which mounts the die on the paste coated on the aforementioned substrate of the like adhesive; and A control device for performing appearance inspection based on the image of the paste-like adhesive captured by the imaging device, the control device for measuring the elapsed time after the first paste-like adhesive is applied to the first substrate, and using the above-mentioned The imaging device captures the first paste adhesive a plurality of times to obtain plural images or plural shape data based on the plural images, and obtains the elapsed time of imaging of each of the plural images. The method for manufacturing a semiconductor device according to any one of claims 7 to 10, further comprising: a process of carrying in a wafer ring jig holding a dicing tape to which the die is attached; picking up the die from the dicing tape The process of dice; and the process of mounting the picked-up die on the aforementioned substrate.

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