TWI739025B - 混合接合結構及其製造方法 - Google Patents

混合接合結構及其製造方法 Download PDF

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TWI739025B
TWI739025B TW107128598A TW107128598A TWI739025B TW I739025 B TWI739025 B TW I739025B TW 107128598 A TW107128598 A TW 107128598A TW 107128598 A TW107128598 A TW 107128598A TW I739025 B TWI739025 B TW I739025B
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Taiwan
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conductor
integrated circuit
dielectric layer
conductors
interconnection structure
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TW107128598A
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Chinese (zh)
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TW201926483A (zh
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蔡伯宗
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台灣積體電路製造股份有限公司
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    • H01L27/1462—Coatings
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    • H—ELECTRICITY
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    • H01L27/144—Devices controlled by radiation
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    • H01L2924/20—Parameters
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    • H01L2924/20104—Temperature range 100 C=<T<150 C, 373.15 K =< T < 423.15K
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