TWI738712B - 貫通電極基板及其製造方法 - Google Patents

貫通電極基板及其製造方法 Download PDF

Info

Publication number
TWI738712B
TWI738712B TW106103724A TW106103724A TWI738712B TW I738712 B TWI738712 B TW I738712B TW 106103724 A TW106103724 A TW 106103724A TW 106103724 A TW106103724 A TW 106103724A TW I738712 B TWI738712 B TW I738712B
Authority
TW
Taiwan
Prior art keywords
substrate
hole
electrode portion
electrode
holes
Prior art date
Application number
TW106103724A
Other languages
English (en)
Chinese (zh)
Other versions
TW201742196A (zh
Inventor
前川慎志
馬渡宏
Original Assignee
日商大日本印刷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商大日本印刷股份有限公司 filed Critical 日商大日本印刷股份有限公司
Publication of TW201742196A publication Critical patent/TW201742196A/zh
Application granted granted Critical
Publication of TWI738712B publication Critical patent/TWI738712B/zh

Links

Images

Classifications

    • H10W78/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
    • H10W70/635—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H10W72/07254—
    • H10W72/247—
    • H10W72/823—
    • H10W90/00—
    • H10W90/22—
    • H10W90/724—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
TW106103724A 2016-02-05 2017-02-03 貫通電極基板及其製造方法 TWI738712B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016021288A JP2017139433A (ja) 2016-02-05 2016-02-05 貫通電極基板及びその製造方法
JP2016-021288 2016-02-05

Publications (2)

Publication Number Publication Date
TW201742196A TW201742196A (zh) 2017-12-01
TWI738712B true TWI738712B (zh) 2021-09-11

Family

ID=59499693

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106103724A TWI738712B (zh) 2016-02-05 2017-02-03 貫通電極基板及其製造方法
TW110128560A TWI772135B (zh) 2016-02-05 2017-02-03 貫通電極基板及其製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW110128560A TWI772135B (zh) 2016-02-05 2017-02-03 貫通電極基板及其製造方法

Country Status (4)

Country Link
US (1) US10755996B2 (enExample)
JP (1) JP2017139433A (enExample)
TW (2) TWI738712B (enExample)
WO (1) WO2017135395A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7173728B2 (ja) 2017-10-26 2022-11-16 日東電工株式会社 撮像素子実装基板
CN110708880A (zh) * 2019-09-11 2020-01-17 广东工业大学 一种在石英玻璃上制备复杂电路图案的方法
EP4351286A4 (en) 2021-08-17 2024-11-20 Samsung Electronics Co., Ltd. INTERPOSER AND ELECTRONIC DEVICE THEREFOR
US20230088392A1 (en) * 2021-09-21 2023-03-23 Intel Corporation Thermally conductive sleeves around tgvs for improved heat dissipation in glass core substrates or glass interposers
JP2026001247A (ja) * 2022-11-24 2026-01-07 株式会社フジクラ 配線板の製造方法、及び、配線板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031812A (ja) * 2002-06-27 2004-01-29 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2015170784A (ja) * 2014-03-10 2015-09-28 大日本印刷株式会社 配線板、配線板の製造方法、配線板部材
JP2015211147A (ja) * 2014-04-28 2015-11-24 京セラサーキットソリューションズ株式会社 配線基板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001160601A (ja) 1999-12-02 2001-06-12 Ngk Spark Plug Co Ltd 多層配線基板
JP2001217508A (ja) * 2000-01-31 2001-08-10 Toshiba Corp プリント基板
KR100487256B1 (ko) * 2002-10-31 2005-05-03 엘지.필립스 엘시디 주식회사 폴리 실리콘 박막 트랜지스터 제조방법
KR100883769B1 (ko) * 2002-11-08 2009-02-18 엘지디스플레이 주식회사 액정표시장치용 어레이기판 제조방법
US7576413B2 (en) * 2004-11-30 2009-08-18 Kyushu Institute Of Technology Packaged stacked semiconductor device and method for manufacturing the same
JP2006202819A (ja) * 2005-01-18 2006-08-03 Shinko Electric Ind Co Ltd 多層配線板の製造方法
JP4735767B2 (ja) 2008-10-16 2011-07-27 大日本印刷株式会社 貫通電極基板及び半導体装置
JP5619372B2 (ja) 2009-04-16 2014-11-05 大日本印刷株式会社 撮像素子モジュール
US20130313687A1 (en) * 2012-01-13 2013-11-28 Zycube Co., Ltd. Through via/the buried via elrctrolde material and the said via structure and the said via manufacturing method
JP6013960B2 (ja) 2013-03-28 2016-10-25 京セラ株式会社 配線基板
JP6255744B2 (ja) * 2013-06-28 2018-01-10 ヤマハ株式会社 楽曲表示装置および楽曲表示方法
JP5811220B2 (ja) 2014-03-28 2015-11-11 株式会社ニコン 撮像モジュール
JP2015207580A (ja) * 2014-04-17 2015-11-19 凸版印刷株式会社 配線基板およびその製造方法
KR102635858B1 (ko) * 2017-01-05 2024-02-15 삼성전자주식회사 이미지 센서

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031812A (ja) * 2002-06-27 2004-01-29 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2015170784A (ja) * 2014-03-10 2015-09-28 大日本印刷株式会社 配線板、配線板の製造方法、配線板部材
JP2015211147A (ja) * 2014-04-28 2015-11-24 京セラサーキットソリューションズ株式会社 配線基板

Also Published As

Publication number Publication date
TW201742196A (zh) 2017-12-01
JP2017139433A (ja) 2017-08-10
US10755996B2 (en) 2020-08-25
TWI772135B (zh) 2022-07-21
US20190080977A1 (en) 2019-03-14
WO2017135395A1 (ja) 2017-08-10
TW202147530A (zh) 2021-12-16

Similar Documents

Publication Publication Date Title
JP7276403B2 (ja) 貫通電極基板及び実装基板
TWI738712B (zh) 貫通電極基板及其製造方法
JP2022133310A (ja) 貫通電極基板及びその製造方法、並びに実装基板
JP7279769B2 (ja) 有孔基板及び実装基板
JP7400873B2 (ja) 貫通電極基板、貫通電極基板の製造方法及び実装基板
JP7245452B2 (ja) 実装基板及び実装基板の製造方法
JP2023052180A (ja) 貫通電極基板、貫通電極基板を備える実装基板並びに貫通電極基板の製造方法
TWI508240B (zh) Laminated wiring board
JP2012248754A (ja) 半導体装置の製造方法、及び半導体装置
JP2018160607A (ja) 貫通電極基板、貫通電極基板を備える実装基板並びに貫通電極基板の製造方法
JP7790509B2 (ja) 配線基板及び配線基板を備える実装基板並びに配線基板の製造方法
JP7163069B2 (ja) 貫通電極基板及びその製造方法
JP4458974B2 (ja) 多数個取り配線基板
JP5197920B2 (ja) 貫通電極基板及びその製造方法
JP2018170440A (ja) 貫通電極基板、貫通電極基板を備える実装基板並びに貫通電極基板の製造方法
JP2018037541A (ja) 有孔基板の製造方法及び有孔基板
JP7307898B2 (ja) 貫通電極基板及びその製造方法
JP2018061063A (ja) 貫通電極基板及びその製造方法
JP7020009B2 (ja) 貫通配線を有する配線基板とその作製方法
JP2017204610A (ja) 実装基板及びそれを備える電子機器
JP2017204611A (ja) 貫通電極基板及びそれを備える実装基板