TWI720953B - 泡鼓包裝用積層體、使用其之泡鼓包裝、及泡鼓包裝包裝體與其積層體之製造方法 - Google Patents
泡鼓包裝用積層體、使用其之泡鼓包裝、及泡鼓包裝包裝體與其積層體之製造方法 Download PDFInfo
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- TWI720953B TWI720953B TW104134891A TW104134891A TWI720953B TW I720953 B TWI720953 B TW I720953B TW 104134891 A TW104134891 A TW 104134891A TW 104134891 A TW104134891 A TW 104134891A TW I720953 B TWI720953 B TW I720953B
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- density polyethylene
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Abstract
本發明係提供一種即使為了包裝較大的藥劑等之內容物而將袋成形達一定的深度也不易發生成形不良之泡鼓包裝用積層體。本發明係賦予一種泡鼓包裝用積層體(B),其係依序具有基材薄膜(10)、具有25~100μm厚度之接著樹脂層(20)以及吸收薄膜(30),前述吸收薄膜(30)係包含含有熱塑性樹脂及無機吸收劑之吸收層(32)。
Description
本發明係關於泡鼓包裝用積層體、使用該積層體之泡鼓包裝及泡鼓包裝包裝體。尤其,本發明係關於即使為了包裝大量的藥劑等而成形具有深度的袋部也不會發生成形不良的泡鼓包裝用積層體、使用其之泡鼓包裝、及泡鼓包裝包裝體與其積層體之製造方法。
雖粉狀之藥劑係被封入較薄的紙袋或薄膜製袋等,但錠劑或膠囊劑等之藥劑係被封入稱為PTP(壓緊包裝(press-through pack))的泡鼓包裝。可藉由用手指壓擠被封入泡鼓包裝的藥劑,使薄片狀的蓋材破裂,接著取出藥劑。
藥劑有時會藉由吸收水分而使藥效成分變質。因此,以往係於用來封入泡鼓包裝的外裝袋內封入矽凝膠等之乾燥劑。但,於外裝袋內投入乾燥劑的作業會耗費工夫,又,亦恐有其被誤飲或誤食的疑慮。又,亦有外裝袋開封後無法將泡鼓包裝內保持在低濕度,而使藥劑的
劣化發展之問題。再者,依據藥劑而異,存在有容易氧化分解者,產生特有的味道者等,因此亦期望能吸收泡鼓包裝內之氧、味道等的氣體。
對於此,專利文獻1係揭示出:藉由於泡鼓包裝之內部積層具有吸附劑的吸附層,來提昇藥劑之長期安定性的技術。在此,首先於將基材薄膜與包含吸附層之吸收薄膜三明治疊層而成的積層體,成形圓頂狀的袋部分。接著,於該袋部分裝入作為錠劑的藥劑,並以蓋材將其密封。可推測依據此技術,即使不於外裝袋中一道裝入乾燥劑等,也能夠維持乾燥狀態、防止氧化及有效率的去除臭氣。
又,於藥劑當中,亦有不耐紫外線者,若包裝容器為透明,則恐有藥效成分劣化之虞。對於此,於專利文獻1中係進一步揭示有一種所謂的鋁泡鼓包裝,其係不僅於泡鼓包裝之內側的蓋材,亦於表側之泡鼓包裝用積層體形成鋁層的技術。依據此技術,雖由於在泡鼓包裝形成鋁層而無法辨識藥劑,但可遮斷紫外線,而進一步提高阻隔性。
於單純地組合有上述之2個技術的樣態中,當於泡鼓包裝用積層體形成圓頂狀之袋時,會發生圓頂的頂部分破裂,或於緣邊(hem)的部分或肩(shoulder)的部分發生龜裂之成形上的問題,但專利文獻2係為了應對此問題,而將於鋁層的吸收薄膜側積層有使用特定之聚合物的具有韌性之補強層的基材薄膜與吸收薄膜進行乾式疊層。
於專利文獻2中係藉由設置具有韌性之補強層而提昇積層體全體的強度,而減低成形不良。
專利文獻3係揭示有將吸收層與基材層藉由厚度20μm之接著樹脂層來三明治疊層而成之泡鼓包裝。
[專利文獻1]國際公開第2006/115264號
[專利文獻2]國際公開第2012/029323號
[專利文獻3]國際公開第2013/140821號
即使為減低成形不良之專利文獻2所記載的積層體,在想要成形直徑10mm、深度超過3.3mm之相對較深的袋之情況,仍舊存在較多成為成形不良者,並非為充分者。本發明者們係對於專利文獻1及專利文獻2所記載之積層體,針對欲使在成形如此深的袋時所發生的成形不良減低進行探討,發現此成形不良係起因於基材薄膜與吸收薄膜一部分分離之所謂的疊層浮起(laminate float)。
亦即,得知在專利文獻2所記載之積層體的情況,有時在吸收薄膜與補強層之間會發生疊層浮起,因此在袋成形時力不會均勻地傳遞至成形體,應力集中在局部而成為成形不良。針對此疊層浮起進一步調查原因,結
果得知即使吸收薄膜具有表層,也會因無機吸收劑的存在而於吸收薄膜的表面發生微細的凹凸,使表面粗度變高,因此,在吸收薄膜與補強層之間所成之因乾式疊層產生的接著會局部成為不良。
又,專利文獻3雖相較於專利文獻1及專利文獻2所記載之積層體而有些許改善,但在想要成形深的袋之情況,仍舊存在較多成形不良者,並非為充分者。
本發明係目的為提供一種即使為了包裝大量的藥劑等之內容物而以一定深度成形袋也不會發生成形不良的泡鼓包裝用積層體、使用其之泡鼓包裝、及泡鼓包裝包裝體與其積層體之製造方法。
因此,本發明者們係藉由與吸收薄膜相鄰接,使緩衝吸收薄膜之表面粗度的樹脂層較厚地存在,而可防止吸收薄膜與基材薄膜之疊層浮起,而完成可減低成形不良之發生的本發明之積層體。
亦即,本發明者們發現藉由具有以下之樣態的本發明,可解決上述課題。
一種泡鼓包裝用積層體,其係依序具有基材薄膜、具有25~100μm厚度之接著樹脂層以及吸收薄膜,前述吸收薄膜係包含含有熱塑性樹脂及無機吸收劑之
吸收層。
如態樣1之積層體,其中,前述接著樹脂層係包含聚烯烴系樹脂。
如態樣1或2之積層體,其中,前述接著樹脂層係藉由三明治疊層而形成。
如態樣1~3中任一項之積層體,其中,前述接著樹脂層係具有25~50μm厚度。
如態樣1~4中任一項之積層體,其中,前述吸收薄膜係具有前述接著樹脂層側之外表層、前述吸收層及內表層。
如態樣5之積層體,其中,前述吸收薄膜之前述外表層、前述吸收層及前述內表層被共擠壓。
一種泡鼓包裝,其係包含如態樣1~7中任一項之積層體,以及具有熱密封層及鋁層之蓋材,前述積層體與前述蓋材至少局部接著,且於前述積層體形成袋部而使前述積層體與前述蓋材之間能夠收納內容物。
一種泡鼓包裝包裝體,其係具有如態樣8之泡鼓包裝與收納於前述袋部的內容物。
一種泡鼓包裝用積層體之製造方法,其係包含以下步驟:賦予基材薄膜之步驟;賦予包含含有熱塑性樹脂及無機吸收劑之吸收層的吸收薄膜之步驟;於前述吸收薄膜與前述基材薄膜之間,或者於前述吸收薄膜上或前述基材薄膜上,形成具有25~100μm厚度之接著樹脂層,將前述吸收薄膜與前述基材薄膜進行接著之步驟。
如態樣10之泡鼓包裝用積層體之製造方法,其中,前述基材薄膜係依序包含基材層、鋁層及補強層,前述吸收薄膜係挾持前述吸收層而包含外表層及內表層,且前述接著樹脂層係形成於前述吸收薄膜的前述外表層與前述基材薄膜的前述補強層之間,或者前述吸收薄膜的前述外表層上或前述基材薄膜的前述補強層上。
依據本發明,可使成形不良之發生在最小限度內地生產具有帶深度的袋之附吸收層之泡鼓包裝。藉由使用如此之泡鼓包裝,而可以長期間安定的狀態保管較大的內容物。
藉由於此基材薄膜與吸收薄膜之間存在具有較厚的接著樹脂層而可減低成形不良之發生的本發明之效果,係於上述之專利文獻2中,若於吸收薄膜與鋁層之間使用由柔軟的樹脂所構成之補強層則會發生成形不良的事實(例如,專利文獻2之比較例4),及若將泡鼓包裝用積層體全體的厚度增加則一般成形性會降低,若考慮上述傾向,則結果出乎意料。
10‧‧‧基材薄膜
11‧‧‧基材層
12‧‧‧鋁層
13‧‧‧補強層
20‧‧‧接著樹脂層
30‧‧‧吸收薄膜
31‧‧‧外表層
32‧‧‧吸收層
33‧‧‧表層
40‧‧‧蓋材
41‧‧‧熱密封層
42‧‧‧鋁層
100‧‧‧內容物
A‧‧‧泡鼓包裝包裝體
B‧‧‧泡鼓包裝用積層體
[第1圖]係泡鼓包裝之概略圖。
[第2圖]係本發明之泡鼓包裝的層結構之概略圖。
本發明之泡鼓包裝用積層體係具有基材薄膜、吸收薄膜及使此等接著的接著樹脂層。基材薄膜係至少具有基材層,較佳係進一步於吸收薄膜側依序具有鋁層與補強層。又,吸收薄膜係具有包含熱塑性樹脂及無機吸收劑之吸收
層,進而具有內表層及外表層。較佳為,本發明之泡鼓包裝用積層體係依序包含或者依序構成最外層之基材層、鋁層、補強層、接著樹脂層、外表層、吸收層及與蓋材接觸之內表層。
本發明之積層體的厚度,就積層體之強度、韌性、在成形泡鼓包裝包裝體時之推擠穿過性、阻隔性等的觀點而言,例如可設為500μm以下、400μm以下、300μm以下、250μm以下、200μm以下、150μm以下、100μm以下、90μm以下、85μm以下、或80μm以下,又可設為50μm以上、60μm、或70μm以上。
另外,於本說明書中,「以A層及B層所構成之積層體」雖本質上意味著僅包含A層與B層之積層體,但意味著除了A層及B層以外,亦可在可得到本發明之有利的效果之範圍或者不損及有利的效果之範圍內包含其他層。例如,有時即使於A層與B層之間包含錨固塗層(anchor coat layer)等,亦表示為「以A層及B層所構成之積層體」。
基材薄膜係將吸收薄膜與外部環境隔離,並賦予積層體全體適當的韌性、強度等。基材薄膜係可包含基材層,進一步依序包含鋁層及補強層。於此情況,基材層係可構成泡鼓包裝用積層體的最外層。
基材薄膜的厚度,就維持阻隔性,且賦予本
發明之積層體全體強度等的觀點而言,可設為例如150μm以下、或100μm以下,又可設為20μm以上、30μm、或50μm以上。
基材層係包含熱塑性樹脂,作為該熱塑性樹脂係可列舉例如:聚烯烴系樹脂、聚氯乙烯、聚偏二氯乙烯(PVDC)、聚氯三氟乙烯、聚四氟乙烯、飽和或不飽和聚酯(例如,聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯)、聚醯胺(例如,耐隆(註冊商標)、耐隆6、耐隆MXD6)、聚丙烯腈(PAN),可將此等之薄膜單層或複數層組合來作為基材層使用。
作為聚烯烴系樹脂係可列舉:低密度聚乙烯(LDPE)、直鏈狀低密度聚乙烯(LLDPE)、中密度聚乙烯(MDPE)、高密度聚乙烯(HDPE)、使用茂金屬觸媒聚合而成的聚乙烯、丙烯均聚物、丙烯-乙烯嵌段共聚物、丙烯-乙烯無規共聚物、使用茂金屬觸媒聚合而成的聚丙烯、氯化聚丙烯、聚甲基戊烯、乙烯-丙烯酸共聚物(EEA)、乙烯-甲基丙烯酸共聚物(EMAA)、乙烯-乙基丙烯酸酯共聚物(EEA)、乙烯-甲基丙烯酸酯共聚物(EMA)、乙烯-乙基丙烯酸酯共聚物、乙烯-乙酸乙烯酯共聚物(EVA)、離子聚合物、羧酸變性聚乙烯、羧酸變性聚丙烯、羧酸變性乙烯-乙酸乙烯酯共聚物。
基材層的厚度,例如可設為8μm以上、10μm以上、或12μm以上,且可設為50μm以下、或25μm以下。
鋁層亦可為包含純鋁(Al)箔、鋁合金箔之層。其他,作為鋁層係可列舉具有鋁蒸鍍膜等之樹脂層,作為讓此等之蒸鍍膜堆積的樹脂層係可列舉:聚烯烴系樹脂(特別是延伸或無延伸聚丙烯)、聚氯乙烯、飽和聚酯(例如,聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯)、聚醯胺(例如,耐隆(註冊商標)、耐隆6、耐隆MXD6)。
鋁層的厚度,例如可設為7μm以上、10μm以上、或12μm以上,且可設為50μm以下、45μm以下、或30μm以下。
作為補強層亦可使用能夠作為基材層使用的樹脂層。作為補強層,為了賦予適度的韌性,較佳係包含聚醯胺、飽和或不飽和聚酯(例如,聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯)及聚氯乙烯。尤其,作為補強層較佳為專利文獻2所揭示之補強層。
補強層的厚度,例如可設為8μm以上、10μm以上、或12μm以上,且可設為80μm以下、60μm以下、50μm以下、或25μm以下。
作為基材薄膜之各層的疊層之方法係可使用乾式疊層、擠壓疊層等周知的疊層方法。
接著樹脂層係具有25~100μm厚度,且將基材薄膜與吸收薄膜進行接著。
接著樹脂層係只要為可緩衝吸收薄膜之凹凸
的層,則無特別限定,但為了發揮有效的效果,可設為25μm以上、26μm以上、30μm以上、35μm以上、或40μm以上,又,可設為100μm以下、80μm以下、60μm以下、或50μm以下。在50μm以下的情況,由於基材薄膜與吸收薄膜之以三明治疊層所致之接著樹脂層的形成為容易,故為佳。以三明治疊層所形成之接著樹脂層由於通常為10~15μm左右,因此本發明所使用之接著樹脂層係可說是較厚。
接著樹脂層,例如可包含聚烯烴系樹脂,聚烯烴系樹脂當中,尤其以低密度聚乙烯(LDPE)為佳。
接著樹脂層係將成為接著樹脂層之熔融樹脂擠壓於吸收薄膜與基材薄膜之間,藉由使此等接著之三明治疊層而形成。
吸收薄膜係包含含有無機吸收劑及熱塑性樹脂之吸收層。較佳為,在調整吸收層之吸收速度及表面粗度等的目的下,吸收薄膜係包含於吸收層之至少單面包含熱塑性樹脂的表層。更佳為,吸收薄膜係依序具有位於基材薄膜側之外表層、吸收層及內表層。於此情況中,較佳為內表層係在與蓋材之間具有熱密封性。亦即,內表層係可構成與基材薄膜或基材層相反側之泡鼓包裝用積層體的最外層。
吸收層、外表層及內表層係包含熱塑性樹脂,作為此等之樹脂亦可列舉:聚烯烴系樹脂、飽和或不
飽和聚酯、聚氯乙烯(PVC)、聚苯乙烯、聚碳酸酯、聚醯胺及此等之混合物,較佳係可列舉聚烯烴系樹脂。
吸收層係由於含有無機吸收劑,因此可吸收液體及氣體之至少一方。作為吸收對象,特別是水分、有機及無機之氣體,可列舉例如:二氧化碳、氨、硫化氫、氧、氯、氯化氫等。無機吸收劑亦可包含於外表層及/或內表層中。
作為無機吸收劑係可列舉:氧化鈣、氯化鈣、硫酸鈣、硫酸鎂、硫酸鈉、碳酸鈣、氧化鎂、氧化鋇、五氧化二磷、過氯酸鎂、過錳酸鉀、過錳酸鈉、硫代硫酸鈉等之化學吸附劑及鋁氧、氧化鋁、矽酸鎂、生石灰、矽凝膠、無機之分子篩等之物理吸附劑。作為無機之分子篩的例子雖無限定,但可列舉具有可使鋁矽酸鹽礦物、黏土、多孔質玻璃、微細孔性活性碳、沸石、活性碳、或水等之小分子擴散之開口結構的化合物,可將此等單獨或者複數組合而使用。
又,作為無機吸收劑亦可列舉:鐵粉(例如,還原鐵粉、噴霧鐵粉、活性鐵粉等)、氧化亞鐵、亞鐵鹽等之鐵系氧吸收劑、鹵素化金屬(例如,氯化鈉、溴化鈉、碘化鈉、氯化鉀、溴化鉀、碘化鉀、氯化鈣、氯化鎂、氯化鋇等)、缺氧氧化鈰、亞硫酸鹽、亞硫酸氫鹽、連二亞硫酸鹽等之去氧劑。
此等當中,尤其以作為無機吸收劑之沸石為佳。作為沸石係可使用天然沸石、人工沸石、合成沸石。
沸石係使用於藉由分子之大小的差異來分離物質之多孔質的粒狀物質,且具有均勻的細孔之結構,由於會吸收進入細孔的空洞之小的分子而具有一種篩的作用,因此可吸收水(水蒸氣)、有機氣體等。作為合成沸石的一例子係有分子篩(molecular sieve;UNION SHO WA股份有限公司),其中,尤其可使用細孔(吸收口)徑為0.3nm~1nm之分子篩。例如,作為細孔徑為0.3nm、0.4nm、0.5nm、1nm之分子篩,係可個別使用分子篩3A、分子篩4A、分子篩5A、分子篩13X。
無機吸收劑之平均粒徑(於藉由雷射繞射/散射法所求得之粒度分布中之積算值50%時的粒徑)雖無特別限定,但例如可為體積基準中值徑(d50)為100nm以上、500nm以上、1μm以上、或5μm以上者,或者可為100μm以下、50μm以下、30μm以下、或15μm以下者。於本發明中係可配合被吸收物質、內容物之性質、吸收薄膜之表面粗度、目的之吸收速度等,而適當分別使用上述之無機吸收劑。
無機吸收劑,就吸收能力的觀點而言,相對於吸收層之重量而可於吸收層中包含5重量%以上、10重量%以上、20重量%以上、30重量%以上、40重量%以上、或50重量%以上之範圍,又,就對熱塑性樹脂之分散性及成形性的觀點而言,可於吸收層中包含90重量%以下、80重量%以下、70重量%以下、或60重量%以下之範圍。
又,可將無機吸收劑設為5體積%以上、10體積%以上、20體積%以上、或30體積%以上,且可設為70體積%以下、65體積%以下、60體積%以下、55體積%以下、或50體積%以下。
另外,於計算層中所包含之無機吸收劑的體積%之情況,在無機吸收劑的比重為不明確時,係可藉由測定該層之比重來求出,並依據該測定值、與無機吸收劑及熱塑性樹脂之添加重量、以及熱塑性樹脂之比重而求出無機吸收劑的體積%。例如,於使用無機吸收劑50g,與比重0.9g/cm3之熱塑性樹脂50g所成形之層的比重為1.1g/cm3之情況,該層中所包含的無機吸收劑係可將比重計算為1.41g/cm3,可以說在該層中存在38.9體積%。
雖無機吸收劑亦可包含於內表層及/或外表層中,但較佳為考慮該等之層的成形性、與其他層之貼合容易性等,而在外表層之無機吸收劑的含量為10體積%以下、7體積%以下或5體積%以下,在內表層之無機吸收劑的含量為40體積%以下、30體積%以下、28.8體積%以下、20體積%以下、10體積%以下、7體積%以下或5體積%以下。
吸收薄膜的厚度係例如300μm以下、200μm以下、150μm以下、或130μm以下,又,30μm以上、40μm以上、或50μm以上。尤其,若為150μm以下,則由於推擠穿過性為良好而為佳。
吸收層的厚度係例如200μm以下、150μm以
下、或100μm以下,又,20μm以上、30μm以上、或40μm以上。
內表層及外表層的厚度係例如30μm以下、20μm以下、或15μm以下,又,5μm以上、8μm以上、或10μm以上。
可將吸收層單層之吸收薄膜藉由將無機吸收劑與熱塑性樹脂進行充氣法、T模法、壓延法、澆注法、加壓成形、擠壓成形或射出成形而成形。
可藉由多層充氣法製造包含外表層、吸收層及內表層之吸收薄膜。其係藉由複數之擠壓機同時將複數之樹脂擠壓成管狀,將空氣送至其中使其膨脹,而製造多層薄膜的方法。如此一來,可使吸收層與表層進行共擠壓而成形,而得到吸收薄膜。
在藉由充氣法來製造吸收薄膜之前,較佳係在將熱塑性樹脂與無機吸收劑以雙軸混練機進行加熱混練之後,加工成錠狀,藉此而製作吸收層用的樹脂組成物(錠)。進而,亦可藉由將上述錠與熱塑性樹脂之錠進行乾摻合,而將無機吸收劑之含有率進行稀釋調整。接著,使用吸收層用之錠,與外表層用的熱塑性樹脂之錠,藉由多層充氣法來進行多層製膜,藉此而製造吸收薄膜。亦可在藉由充氣法製造出吸收層之後,將另外製造出之表層藉由熱壓著等進行疊層,而得到吸收薄膜。
於藉由T模法來製造吸收層單層之吸收薄膜的情況,亦可在事前先製作包含無機吸收劑與熱塑性樹脂
之錠,再將薄膜進行成形。此時,亦可於吸收層的其中一方或兩方之面將表層進行共擠壓,而得到包含吸收層及表層之吸收薄膜。
亦可藉由將吸收層及表層進行充氣法、T模法、壓延法、澆鑄法、加壓成形、擠壓成形或射出成形,分別形成為薄膜狀或薄片狀,並將該等以周知的方法進行疊層,藉此而得到吸收薄膜。
在將包含吸收層及表層之吸收薄膜藉由多層T模法或多層充氣法進行共擠壓而成形的情況,由於是以表層熔融後的狀態接著於吸收層,因此尤其是起因於吸收層之表面粗度會容易反映在吸收薄膜的表面上。因而,藉由接著樹脂層來緩衝吸收薄膜之表面粗度的本發明,在使用藉由共擠壓而成形的吸收薄膜的情況特別有利。
本發明之泡鼓包裝用積層體係除了上述之層以外,亦可於任意的2個層之間進一步具有用以提高印刷層、2層間之接著的錨固塗層、底漆層等。
本發明之泡鼓包裝係具有上述之泡鼓包裝用積層體及蓋材。泡鼓包裝用積層體與蓋材係至少部分接著。可於泡鼓包裝用積層體進行用以收納錠劑等之內容物的袋部之成形,之後,將藥劑收容於袋部,使蓋材接著,而製作將內
容物收納於泡鼓包裝之袋部的泡鼓包裝包裝體。
作為本發明之泡鼓包裝的內容物係只要是會因與外氣之接觸而劣化的物品則無限定,除了藥劑以外,亦可列舉:食品、化妝品、醫療機器、電子零件等。又,作為藥劑,除了醫藥品製劑以外,亦可包含洗淨劑、農藥等。
蓋材係包含熱密封層與鋁層。作為該熱密封層係可使用於上述之表層所能使用的熱塑性樹脂,較佳係可使用聚丙烯。蓋材的熱密封層及泡鼓包裝用積層體之與蓋材接著的層,就提高接著性的觀點而言,可適當選擇彼此之樹脂。
作為蓋材之鋁層係可使用與關於基材薄膜之上述的鋁層相同者。較佳為,蓋材係於鋁箔上塗佈有作為熱密封層之聚丙烯的形態。
亦可將蓋材設為於鋁箔塗佈聚烯烴系聚合物合金等之易剝離性樹脂的形態,或者積層有易剝離性薄膜的形態。於此情況中,藉由使泡鼓包裝與蓋材在接著界面進行剝離,而可容易取出內容物。
第1圖係泡鼓包裝包裝體A之概略圖。在此,於依序由基材薄膜10、接著樹脂層20及吸收薄膜30積層而成的泡鼓包裝用積層體B接著蓋材40,在形成於
積層體B的圓頂狀之袋部內含有內容物100。
第2圖係本發明之泡鼓包裝包裝體A的層結構之概略圖。於此圖中係顯示泡鼓包裝包裝體A之袋部未形成的端部,於依序由包含基材層11、鋁層12及補強層13之基材薄膜10、接著樹脂層20、以及吸收薄膜30積層而成的泡鼓包裝用積層體B接著蓋材40。吸收薄膜30係由外表層31、第2吸收層32及內表層33所構成,又,蓋材40係由熱密封層41及鋁層42所構成。
於作為基材層之25μm的耐隆(Ny)薄膜及作為鋁層之40μm的鋁(A1)箔的積層體(AL/AL基材、股份有限公司UACJ製箔),使用乾式疊層(INVEX引導塗佈機,Techno Smart股份有限公司)來積層作為補強層之12μm的聚對苯二甲酸乙二酯(LUMIRROR 12S10,Toray股份有限公司),而得到基材薄膜。在此,作為乾式疊層之接著劑係使用包含主劑(Takelac(商標)XA1151,三井化學股份有限公司)與硬化劑(Takenate(商標)A12,三井化學股份有限公司)之聚胺基甲酸酯系接著劑,以牽引速度(haul-off speed)10m/min,形成厚度5μm之接著層。
藉由將無機吸收劑之沸石(沸石4A,UNION SHO WA股份有限公司)與熱塑性樹脂之LDPE(PETROTHENE 202,TOSOH股份有限公司)之錠,使用雙軸擠壓機(PCM70,池貝股份有限公司製),進行混練/顆粒化,而得到吸收層用之沸石含有率47重量%的錠。
準備LLDPE(EVOLUE SP2520,Prime Polymer股份有限公司)之錠作為內表層及外表層用之樹脂,與上述之吸收層用之錠一起以170℃,牽引速度10m/min,藉由以氣冷方式充氣所致之共擠壓成形而得到吸收薄膜。在此,使用三層充氣成形機(TUL-600R,Placo股份有限公司)。又,將吸收層的厚度設為90μm,將內表層及外表層的厚度設為20μm。
將基材薄膜之補強層與吸收薄膜之外表層藉由乾式疊層而接著。在此,使用乾式疊層(INVEX引導塗佈機,Techno Smart股份有限公司),及包含主劑(Takelac(商標)XA1151,三井化學股份有限公司)與硬化劑(Takenate(商標)A12,三井化學股份有限公司)之聚胺基甲酸酯系接著劑,以牽引速度10m/min,形成厚度5μm之接著層,而得到比較例1之積層體。
藉由三明治疊層並改變接著樹脂層的厚度來形成基材薄膜之補強層與吸收薄膜之外表層,而得到比較例2~3及實施例1~3之積層體。在此,使用三明治疊層(TP45.45 P46010,Placo股份有限公司),將接著樹脂層用之LDPE(suntec-LD L1850K,Asahi Kasei Chemicals股份有限公司)以300℃進行熔融而擠壓,以牽引速度30~45m/min,而得到積層體。另外,在將此等接著之前,於基材薄膜之補強層上以膜厚1μm塗佈錨固塗佈劑(主劑:Takelac(商標)XA1151,三井化學股份有限公司/硬化劑:Takenate(商標)A12,三井化學股份有限公司)。
於如上述方式所得到的積層體上,以泡鼓成形機成形用以收容內容物之袋部,調查成形不良之發生率。
具體而言,於上述之積層體上在室溫下成形深度5.75mm之袋部。成形機係使用JAPAN AUTOMATIC MACHINE股份有限公司之高速油壓沖床(HYP505H)。插塞材質係(黏度平均分子量550萬之超高分子量聚乙烯樹脂,NEWLIGHT(商標),作新工業股份有限公司),插塞徑為13mm,成形速度係設為200mm/s。將此試驗重複進行10次,將於所成形之袋部目視觀察無發生破裂或損傷等之外觀不良的情況作為合格品,並調查其個數。
將結果顯示於下。
如由此結果得以明瞭般,可知若接著樹脂層之厚度增加則成形不良之發生會減少,若使用40μm之厚度的接著樹脂層,則即使成形5.75mm深度之袋部也不會發生成形不良。
於本發明之使用有吸收層的泡鼓包裝用積層體係可成形較深的袋,使用其之泡鼓包裝係可將較大的內容物以長期間安定(將變質作抑制)的狀態進行保管。
10:基材薄膜
11:基材層
12:鋁層
13:補強層
20:接著樹脂層
30:吸收薄膜
31:外表層
32:吸收層
33:表層
40:蓋材
41:熱密封層
42:鋁層
B:泡鼓包裝用積層體
Claims (12)
- 一種為了成形圓頂狀的袋部分之泡鼓包裝用積層體,其係依序具有基材薄膜、具有超過30μm且100μm以下厚度之接著樹脂層以及吸收薄膜,前述吸收薄膜係包含含有熱塑性樹脂及無機吸收劑之吸收層,且前述接著樹脂層係包含由低密度聚乙烯、直鏈狀低密度聚乙烯、中密度聚乙烯、高密度聚乙烯、使用茂金屬觸媒聚合而成的聚乙烯、丙烯均聚物、丙烯-乙烯嵌段共聚物、丙烯-乙烯無規共聚物、使用茂金屬觸媒聚合而成的聚丙烯、氯化聚丙烯、聚甲基戊烯之群選出的樹脂,並藉由三明治疊層而形成。
- 如請求項1之積層體,其中,前述接著樹脂層係包含低密度聚乙烯。
- 如請求項1或2之積層體,其中,前述接著樹脂層係具有超過30μm且50μm以下厚度。
- 如請求項1或2之積層體,其中,前述吸收薄膜係具有前述接著樹脂層側之外表層、前述吸收層及內表層。
- 如請求項4之積層體,其中,前述吸收薄膜之前述外表層、前述吸收層及前述內表層被共擠壓。
- 一種為了成形圓頂狀的袋部分之泡鼓包裝用積層體,其係由以下之層所構成:具有12~25μm厚度,且包含由聚烯烴系樹脂、聚氯乙烯、聚偏二氯乙烯、聚氯三氟乙烯、聚四氟乙烯、飽和 或不飽和聚酯、聚醯胺、及聚丙烯腈所成之群中選出的樹脂之基材層;具有7~45μm厚度之鋁層;具有8~60μm厚度,且包含由聚氯乙烯、飽和或不飽和聚酯、及聚醯胺所成之群中選出的樹脂之補強層;具有超過30μm且50μm以下厚度,包含由低密度聚乙烯、直鏈狀低密度聚乙烯、中密度聚乙烯、高密度聚乙烯、使用茂金屬觸媒聚合而成的聚乙烯、丙烯均聚物、丙烯-乙烯嵌段共聚物、丙烯-乙烯無規共聚物、使用茂金屬觸媒聚合而成的聚丙烯、氯化聚丙烯、聚甲基戊烯之群選出的樹脂,且藉由三明治疊層而形成之接著樹脂層;具有10~30μm厚度,且包含聚烯烴系樹脂之外表層;具有10~200μm厚度,且包含聚烯烴系樹脂及5~70體積%的沸石之吸收層;以及具有10~30μm厚度,且包含聚烯烴系樹脂之內表層。
- 如請求項6之積層體,其中,前述接著樹脂層係包含低密度聚乙烯。
- 一種泡鼓包裝,其係包含如請求項1~7中任一項之積層體,以及具有熱密封層及鋁層之蓋材,前述積層體與前述蓋材至少局部接著,且於前述積層體形成袋部而使前述積層體與前述蓋材之間能夠收納內容物。
- 一種泡鼓包裝包裝體,其係具有如請求項8之泡鼓 包裝與收納於前述袋部的內容物。
- 一種為了成形圓頂狀的袋部分之泡鼓包裝用積層體之製造方法,其係包含以下步驟:賦予基材薄膜之步驟;賦予包含含有熱塑性樹脂及無機吸收劑之吸收層的吸收薄膜之步驟;於前述吸收薄膜與前述基材薄膜之間,或者於前述吸收薄膜上或前述基材薄膜上,藉由三明治疊層形成具有超過30μm且100μm以下厚度之接著樹脂層,將前述吸收薄膜與前述基材薄膜進行接著之步驟,前述接著樹脂層係包含由低密度聚乙烯、直鏈狀低密度聚乙烯、中密度聚乙烯、高密度聚乙烯、使用茂金屬觸媒聚合而成的聚乙烯、丙烯均聚物、丙烯-乙烯嵌段共聚物、丙烯-乙烯無規共聚物、使用茂金屬觸媒聚合而成的聚丙烯、氯化聚丙烯、聚甲基戊烯之群選出的樹脂。
- 如請求項10之製造方法,其中,前述基材薄膜係依序包含基材層、鋁層、及補強層,前述吸收薄膜係挾持前述吸收層而包含外表層及內表層,且前述接著樹脂層係形成於前述吸收薄膜的前述外表層與前述基材薄膜的前述補強層之間,或者前述吸收薄膜的前述外表層上或前述基材薄膜的前述補強層上。
- 如請求項10或11之製造方法,其中,前述接著樹脂層係包含低密度聚乙烯。
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EP3397476B2 (en) | 2015-12-29 | 2024-08-21 | adapa flexibles Denmark Slagelse A/S | A method for providing a chemical resistant film |
JP2018065575A (ja) * | 2016-10-17 | 2018-04-26 | 共同印刷株式会社 | ブリスターパック用蓋材 |
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US20030203141A1 (en) * | 2002-04-25 | 2003-10-30 | Blum John B. | Blister package |
TW201221359A (en) * | 2010-09-01 | 2012-06-01 | Kyodo Printing Co Ltd | Laminate, packaging container, and packaging body |
Also Published As
Publication number | Publication date |
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WO2016063987A1 (ja) | 2016-04-28 |
JP6684718B2 (ja) | 2020-04-22 |
EP3210907A4 (en) | 2018-06-20 |
US20170341351A1 (en) | 2017-11-30 |
CN107074419B (zh) | 2019-11-05 |
TW201630741A (zh) | 2016-09-01 |
EP3210907A1 (en) | 2017-08-30 |
EP3210907B1 (en) | 2019-07-17 |
CN107074419A (zh) | 2017-08-18 |
KR20170074882A (ko) | 2017-06-30 |
JPWO2016063987A1 (ja) | 2017-08-03 |
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