JPWO2016063987A1 - ブリスターパック用積層体、それを用いたブリスターパック、及びブリスターパック包装体、並びにその積層体の製造方法 - Google Patents
ブリスターパック用積層体、それを用いたブリスターパック、及びブリスターパック包装体、並びにその積層体の製造方法 Download PDFInfo
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- JPWO2016063987A1 JPWO2016063987A1 JP2016555416A JP2016555416A JPWO2016063987A1 JP WO2016063987 A1 JPWO2016063987 A1 JP WO2016063987A1 JP 2016555416 A JP2016555416 A JP 2016555416A JP 2016555416 A JP2016555416 A JP 2016555416A JP WO2016063987 A1 JPWO2016063987 A1 JP WO2016063987A1
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- film
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- blister pack
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Abstract
Description
《態様1》
基材フィルム、25〜100μmの厚みを有する接着樹脂層、並びに吸収フィルムをこの順で有し、
前記吸収フィルムが、熱可塑性樹脂及び無機吸収剤を含む吸収層を含む、
ブリスターパック用の積層体。
《態様2》
前記接着樹脂層が、ポリオレフィン系樹脂を含む、態様1に記載の積層体。
《態様3》
前記接着樹脂層が、サンドラミネートによって形成されている、態様1又は2に記載の積層体。
《態様4》
前記接着樹脂層が、25〜50μmの厚みを有する、態様1〜3のいずれか一項に記載の積層体。
《態様5》
前記吸収フィルムが、前記接着樹脂層側の外スキン層、前記吸収層、及び内スキン層を有する、態様1〜4のいずれか一項に記載の積層体。
《態様6》
前記吸収フィルムの前記外スキン層、前記吸収層、及び前記内スキン層が、共押出されている、態様5に記載の積層体。
《態様7》
以下の層で構成される、ブリスターパック用の積層体:
12〜25μmの厚みを有し、かつポリオレフィン系樹脂、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリクロロトリフルオロエチレン、ポリテトラフルオロエチレン、飽和又は不飽和ポリエステル、ポリアミド、及びポリアクリロニトリルからなる群から選択される樹脂を含む、基材層;
7〜45μmの厚みを有する、アルミニウム層;
8〜60μmの厚みを有し、かつポリ塩化ビニル、飽和又は不飽和ポリエステル、及ポリアミドからなる群から選択される樹脂を含む、補強層;
25〜50μmの厚みを有し、ポリオレフィン系樹脂を含み、かつサンドラミネートによって形成されている、接着樹脂層;
10〜30μmの厚みを有し、かつポリオレフィン系樹脂を含む、外スキン層;
10〜200μmの厚みを有し、かつポリオレフィン系樹脂及び5〜70体積%のゼオライトを含む、吸収層;並びに
10〜30μmの厚みを有し、かつポリオレフィン系樹脂を含む、内スキン層。
《態様8》
態様1〜7のいずれか一項に記載の積層体、並びにヒートシール層及びアルミニウム層を有する蓋材を含み、前記積層体と前記蓋材とが少なくとも部分的に接着しており、かつ前記積層体にポケット部が形成されて前記積層体と前記蓋材との間に内容物が収納可能になっている、ブリスターパック。
《態様9》
態様8に記載のブリスターパックと、前記ポケット部に収納された内容物とを有するブリスターパック包装体。
《態様10》
以下の工程を含む、ブリスターパック用積層体の製造方法:
基材フィルムを与える工程;
熱可塑性樹脂及び無機吸収剤を含む吸収層を含む吸収フィルムを与える工程;
前記吸収フィルムと前記基材フィルムとの間に、又は前記吸収フィルム上若しくは前記基材フィルム上に、25〜100μmの厚みを有する接着樹脂層を形成し、前記吸収フィルムと前記基材フィルムとを接着する工程。
《態様11》
前記基材フィルムが、基材層、アルミニウム層、及び補強層をこの順で含み、
前記吸収フィルムが、前記吸収層を挟んで外スキン層及び内スキン層を含み、かつ
前記接着樹脂層が、前記吸収フィルムの前記外スキン層と前記基材フィルムの前記補強層との間に、又は前記吸収フィルムの前記外スキン層上若しくは前記基材フィルムの前記補強層上に形成される、
態様10に記載のブリスターパック用積層体の製造方法。
本発明のブリスターパック用の積層体は、基材フィルム、吸収フィルム、及びこれらを接着させる接着樹脂層を有する。基材フィルムは、少なくとも基材層を有し、好ましくはアルミニウム層と補強層とをこの順で吸収フィルム側にさらに有する。また、吸収フィルムは、熱可塑性樹脂及び無機吸収剤を含む吸収層を有し、さらに内スキン層及び外スキン層を有する。好ましくは、本発明のブリスターパック用の積層体は、最外層の基材層、アルミニウム層、補強層、接着樹脂層、外スキン層、吸収層、及び蓋材と接触する内スキン層をこの順で含み、又はこの順で構成される。
基材フィルムは、吸収フィルムを外部環境と隔離し、積層体全体に適切なコシ、強度等を与える。基材フィルムは、基材層を含み、さらにアルミニウム層、及び補強層をこの順で含んでもよい。この場合、基材層は、ブリスターパック用積層体の最外層を構成してもよい。
接着樹脂層は、25〜100μmの厚みを有し、基材フィルムと吸収フィルムとを接着する。
吸収フィルムは、無機吸収剤及び熱可塑性樹脂を含む吸収層を含む。好ましくは、吸収層の吸収速度及び表面粗さを調整する等の目的で、吸収フィルムは、吸収層の少なくとも片面に熱可塑性樹脂を含むスキン層を含む。さらに好ましくは、吸収フィルムは、基材フィルム側に位置する外スキン層、吸収層、及び内スキン層をこの順で有する。この場合、好ましくは内スキン層は、蓋材との間でヒートシール性を有する。すなわち、内スキン層は、基材フィルム又は基材層とは反対側のブリスターパック用積層体の最外層を構成してもよい。
本発明のブリスターパック用の積層体は、上記の層の他に、任意の2つの層の間に、印刷層、2層間の接着を高めるためのアンカーコート層、プライマー層等をさらに有してもよい。
本発明のブリスターパックは、上記のブリスターパック用積層体、及び蓋材を有する。ブリスターパック用積層体と蓋材は、少なくとも部分的に接着する。ブリスターパック用積層体に、錠剤等の内容物を収納するためのポケット部の成形をした後に薬剤をポケット部に収容し、蓋材を接着させて、ブリスターパックのポケット部に内容物を収納したブリスターパック包装体を作製することができる。
本発明のブリスターパックの内容物としては、外気との接触によって劣化しうる物であれば限定されるものではなく、薬剤の他、食品、化粧品、医療機器、電子部品等を挙げることができる。また、薬剤としては、医薬品製剤の他、洗浄剤、農薬等を含む。
蓋材は、ヒートシール層とアルミニウム層とを含む。そのヒートシール層としては、上記のスキン層に使用できる熱可塑性樹脂を用いることができ、好ましくはポリプロピレンを用いることができる。蓋材のヒートシール層と、ブリスターパック用積層体の蓋材と接着する層とは、接着性を高める観点から、互いの樹脂を適宜選択することができる。
〈基材フィルムの作製〉
基材層である25μmのナイロン(Ny)フィルム及びアルミニウム層である40μmのアルミニウム(Al)箔の積層体(AL/AL基材、株式会社UACJ製箔)に、補強層である12μmのポリエチレンテレフタレート(ルミラー12S10、東レ株式会社)を、ドライラミネーター(INVEXパイロットコーター、株式会社テクノスマート)を用いて積層し、基材フィルムを得た。ここで、ドライラミネートの接着剤として、主剤(タケラック(商標)XA1151、三井化学株式会社)と硬化剤(タケネート(商標)A12、三井化学株式会社)とを含むポリウレタン系接着剤を用いて、引取速度10m/minで、厚さ5μmの接着層を形成した。
無機吸収剤のゼオライト(モレキュラーシーブ4A、ユニオン昭和株式会社)と、熱可塑性樹脂のLDPE(ペトロセン202、東ソー株式会社)のペレットとを、二軸押出機(PCM70、株式会社池貝)を使用して、混練・ペレット化することで、吸収層用のゼオライト含有率47重量%のペレットを得た。
・比較例1の積層体
基材フィルムの補強層と吸収フィルムの外スキン層とを、ドライラミネートによって接着した。ここでは、ドライラミネーター(INVEXパイロットコーター、株式会社テクノスマート)及び、主剤(タケラック(商標)XA1151、三井化学株式会社)と硬化剤(タケネート(商標)A12、三井化学株式会社)とを含むポリウレタン系接着剤を用いて、引取速度10m/minとして、厚さ5μmの接着層を形成し、比較例1の積層体を得た。
基材フィルムの補強層と吸収フィルムの外スキン層とを、サンドラミネートによって接着樹脂層の厚みを変えて形成して、比較例2〜3及び実施例1〜3の積層体を得た。ここでは、サンドラミネーター(TP45.45 P46010、株式会社プラコー)を用いて、接着樹脂層用のLDPE(サンテック−LD L1850K、旭化成ケミカルズ株式会社)を300℃で溶融させて押し出して、引き取り速度30〜45m/minで積層体を得た。なお、これらを接着させる前には、基材フィルムの補強層にアンカーコート剤(主剤:タケラック(商標)XA1151、三井化学株式会社)/硬化剤:タケネート(商標)A12、三井化学株式会社)を、厚さ1μmで塗布した。
このようにして得た積層体に、ブリスター成形機で内容物を収容するためのポケット部を成形し、成形不良の発生率を調べた。
11 基材層
12 アルミニウム層
13 補強層
20 接着樹脂層
30 吸収フィルム
31 外スキン層
32 吸収層
33 スキン層
40 蓋材
41 ヒートシール層
42 アルミニウム層
100 内容物
A ブリスターパック包装体
B ブリスターパック用積層体
Claims (11)
- 基材フィルム、25〜100μmの厚みを有する接着樹脂層、並びに吸収フィルムをこの順で有し、
前記吸収フィルムが、熱可塑性樹脂及び無機吸収剤を含む吸収層を含む、
ブリスターパック用の積層体。 - 前記接着樹脂層が、ポリオレフィン系樹脂を含む、請求項1に記載の積層体。
- 前記接着樹脂層が、サンドラミネートによって形成されている、請求項1又は2に記載の積層体。
- 前記接着樹脂層が、25〜50μmの厚みを有する、請求項1〜3のいずれか一項に記載の積層体。
- 前記吸収フィルムが、前記接着樹脂層側の外スキン層、前記吸収層、及び内スキン層を有する、請求項1〜4のいずれか一項に記載の積層体。
- 前記吸収フィルムの前記外スキン層、前記吸収層、及び前記内スキン層が、共押出されている、請求項5に記載の積層体。
- 以下の層で構成される、ブリスターパック用の積層体:
12〜25μmの厚みを有し、かつポリオレフィン系樹脂、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリクロロトリフルオロエチレン、ポリテトラフルオロエチレン、飽和又は不飽和ポリエステル、ポリアミド、及びポリアクリロニトリルからなる群から選択される樹脂を含む、基材層;
7〜45μmの厚みを有する、アルミニウム層;
8〜60μmの厚みを有し、かつポリ塩化ビニル、飽和又は不飽和ポリエステル、及ポリアミドからなる群から選択される樹脂を含む、補強層;
25〜50μmの厚みを有し、ポリオレフィン系樹脂を含み、かつサンドラミネートによって形成されている、接着樹脂層;
10〜30μmの厚みを有し、かつポリオレフィン系樹脂を含む、外スキン層;
10〜200μmの厚みを有し、かつポリオレフィン系樹脂及び5〜70体積%のゼオライトを含む、吸収層;並びに
10〜30μmの厚みを有し、かつポリオレフィン系樹脂を含む、内スキン層。 - 請求項1〜7のいずれか一項に記載の積層体、並びにヒートシール層及びアルミニウム層を有する蓋材を含み、前記積層体と前記蓋材とが少なくとも部分的に接着しており、かつ前記積層体にポケット部が形成されて前記積層体と前記蓋材との間に内容物が収納可能になっている、ブリスターパック。
- 請求項8に記載のブリスターパックと、前記ポケット部に収納された内容物とを有するブリスターパック包装体。
- 以下の工程を含む、ブリスターパック用積層体の製造方法:
基材フィルムを与える工程;
熱可塑性樹脂及び無機吸収剤を含む吸収層を含む吸収フィルムを与える工程;
前記吸収フィルムと前記基材フィルムとの間に、又は前記吸収フィルム上若しくは前記基材フィルム上に、25〜100μmの厚みを有する接着樹脂層を形成し、前記吸収フィルムと前記基材フィルムとを接着する工程。 - 前記基材フィルムが、基材層、アルミニウム層、及び補強層をこの順で含み、
前記吸収フィルムが、前記吸収層を挟んで外スキン層及び内スキン層を含み、かつ
前記接着樹脂層が、前記吸収フィルムの前記外スキン層と前記基材フィルムの前記補強層との間に、又は前記吸収フィルムの前記外スキン層上若しくは前記基材フィルムの前記補強層上に形成される、
請求項10に記載のブリスターパック用積層体の製造方法。
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US11376814B2 (en) | 2015-12-29 | 2022-07-05 | Danapak Flexibles A/S | Method for providing an extreme chemical resistant film, a film and laminate obtainable therefrom |
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JP2019010768A (ja) * | 2017-06-29 | 2019-01-24 | 共同印刷株式会社 | 吸湿及びガス吸着用フィルム、並びに包装用積層体 |
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JP7152143B2 (ja) * | 2017-11-15 | 2022-10-12 | 株式会社Uacj | ブリスター包装体 |
CN108284650B (zh) * | 2017-12-29 | 2021-01-15 | 永新股份(黄山)包装有限公司 | 一种冲压成型易揭开启药膏包装复合膜以及制备方法 |
JP2020011737A (ja) * | 2018-07-13 | 2020-01-23 | 共同印刷株式会社 | 包装袋 |
EP3871877A1 (en) | 2018-08-08 | 2021-09-01 | Danapak Flexibles A/S | Improved films and laminates for use in packaging reactive compounds |
US11396413B2 (en) * | 2018-09-20 | 2022-07-26 | Csp Technologies, Inc. | One or more blister packages containing active material and methods of making and using same |
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US20170341351A1 (en) | 2017-11-30 |
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JP6684718B2 (ja) | 2020-04-22 |
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