TWI714681B - 銀粉末、銀糊及電子元件 - Google Patents

銀粉末、銀糊及電子元件 Download PDF

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Publication number
TWI714681B
TWI714681B TW105140528A TW105140528A TWI714681B TW I714681 B TWI714681 B TW I714681B TW 105140528 A TW105140528 A TW 105140528A TW 105140528 A TW105140528 A TW 105140528A TW I714681 B TWI714681 B TW I714681B
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TW
Taiwan
Prior art keywords
silver
silver powder
less
electrode
powder
Prior art date
Application number
TW105140528A
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English (en)
Chinese (zh)
Other versions
TW201734218A (zh
Inventor
立花寛己
村橋大輔
平松厚佑
Original Assignee
日商則武股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商則武股份有限公司 filed Critical 日商則武股份有限公司
Publication of TW201734218A publication Critical patent/TW201734218A/zh
Application granted granted Critical
Publication of TWI714681B publication Critical patent/TWI714681B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
TW105140528A 2015-12-25 2016-12-08 銀粉末、銀糊及電子元件 TWI714681B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015253416 2015-12-25
JP2015-253416 2015-12-25

Publications (2)

Publication Number Publication Date
TW201734218A TW201734218A (zh) 2017-10-01
TWI714681B true TWI714681B (zh) 2021-01-01

Family

ID=59090350

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105140528A TWI714681B (zh) 2015-12-25 2016-12-08 銀粉末、銀糊及電子元件

Country Status (5)

Country Link
JP (1) JP6158461B1 (ko)
KR (1) KR102505753B1 (ko)
CN (1) CN108430670B (ko)
TW (1) TWI714681B (ko)
WO (1) WO2017110255A1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6967845B2 (ja) * 2016-09-27 2021-11-17 株式会社ノリタケカンパニーリミテド 銀ペーストおよび電子素子
JP7159549B2 (ja) * 2017-11-30 2022-10-25 住友金属鉱山株式会社 導電ペーストの作製方法
JP7272834B2 (ja) * 2018-04-11 2023-05-12 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
JP7320515B2 (ja) * 2018-08-30 2023-08-03 田中貴金属工業株式会社 低温焼成用の銀インク
KR102308468B1 (ko) * 2018-12-28 2021-10-06 대주전자재료 주식회사 구형 은 분말 및 이의 제조방법
JP2020152961A (ja) * 2019-03-20 2020-09-24 尾池工業株式会社 薄片状銀粒子、銀分散液、及び導電性ペースト
KR102263618B1 (ko) * 2019-03-29 2021-06-10 대주전자재료 주식회사 혼합 은 분말 및 이를 포함하는 도전성 페이스트
CN110459343B (zh) * 2019-06-19 2020-12-18 南通天盛新能源股份有限公司 一种全铝背场晶体硅太阳能电池用低温烧结型背面银浆
US20220119315A1 (en) * 2020-02-05 2022-04-21 Ferro Corporation M7 LTCC-Silver System And Related Dielectric Compositions For High Frequency Applications
US20230150273A1 (en) 2020-03-31 2023-05-18 Kyocera Corporation Thermal head and thermal printer
CN111739675B (zh) * 2020-06-19 2021-03-05 潮州三环（集团）股份有限公司 一种厚膜电阻浆料
JP2021009843A (ja) * 2020-10-01 2021-01-28 株式会社ノリタケカンパニーリミテド 銀ペーストおよび電子素子
JP7185795B2 (ja) * 2021-03-10 2022-12-07 Ｄｏｗａエレクトロニクス株式会社 銀粉及びその製造方法
EP4306239A1 (en) 2021-03-10 2024-01-17 DOWA Electronics Materials Co., Ltd. Silver powder and production method therefor
CN114255907A (zh) * 2021-12-23 2022-03-29 江苏飞特尔通信有限公司 一种低温烧结ltcc用导电银浆及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200626262A (en) * 2004-11-25 2006-08-01 Dowa Mining Co Silver powder and method for producing same
JP2011071057A (ja) * 2009-09-28 2011-04-07 Kyoto Elex Kk 加熱硬化型導電性ペースト組成物およびその導電性ペースト組成物を用いた電極並びに配線パターンの形成方法
TW201420234A (zh) * 2012-11-29 2014-06-01 Sumitomo Metal Mining Co 銀粉及銀膏
TW201528289A (zh) * 2013-12-25 2015-07-16 Noritake Co Ltd 加熱硬化型導電性糊

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5092630B2 (ja) 2007-09-04 2012-12-05 住友金属鉱山株式会社 微粒銀粉およびその製造方法並びにその微粒銀粉を用いた導電性ペースト用分散液
JP5688895B2 (ja) * 2008-12-26 2015-03-25 Ｄｏｗａエレクトロニクス株式会社 微小銀粒子粉末と該粉末を使用した銀ペースト
JP5285639B2 (ja) 2010-02-26 2013-09-11 京都エレックス株式会社 太陽電池素子の電極形成用導電性ペースト
CN101834004B (zh) * 2010-05-28 2013-01-09 中国乐凯胶片集团公司 一种太阳能电池电极导电银浆用银粉及其制备方法
JP5740925B2 (ja) * 2010-11-15 2015-07-01 ナガセケムテックス株式会社 導電性コーティング組成物及び積層体
KR102007046B1 (ko) * 2011-01-26 2019-08-02 나믹스 가부시끼가이샤 도전성 페이스트 및 그 제조 방법
JP2012153979A (ja) * 2012-04-02 2012-08-16 Dowa Holdings Co Ltd 銀粉およびその製造方法
JP5505535B1 (ja) * 2012-12-07 2014-05-28 住友金属鉱山株式会社 銀粉
JP6282616B2 (ja) * 2014-07-30 2018-02-21 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
JP6814529B2 (ja) * 2015-03-26 2021-01-20 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200626262A (en) * 2004-11-25 2006-08-01 Dowa Mining Co Silver powder and method for producing same
JP2011071057A (ja) * 2009-09-28 2011-04-07 Kyoto Elex Kk 加熱硬化型導電性ペースト組成物およびその導電性ペースト組成物を用いた電極並びに配線パターンの形成方法
TW201420234A (zh) * 2012-11-29 2014-06-01 Sumitomo Metal Mining Co 銀粉及銀膏
TW201528289A (zh) * 2013-12-25 2015-07-16 Noritake Co Ltd 加熱硬化型導電性糊

Also Published As

Publication number Publication date
TW201734218A (zh) 2017-10-01
WO2017110255A1 (ja) 2017-06-29
KR20180099724A (ko) 2018-09-05
CN108430670B (zh) 2020-04-24
CN108430670A (zh) 2018-08-21
JPWO2017110255A1 (ja) 2017-12-21
KR102505753B1 (ko) 2023-03-06
JP6158461B1 (ja) 2017-07-05

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