TWI692024B - 濕式蝕刻裝置 - Google Patents

濕式蝕刻裝置 Download PDF

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Publication number
TWI692024B
TWI692024B TW106106835A TW106106835A TWI692024B TW I692024 B TWI692024 B TW I692024B TW 106106835 A TW106106835 A TW 106106835A TW 106106835 A TW106106835 A TW 106106835A TW I692024 B TWI692024 B TW I692024B
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TW
Taiwan
Prior art keywords
phosphoric acid
aqueous solution
acid aqueous
section
concentration
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TW106106835A
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English (en)
Chinese (zh)
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TW201724250A (zh
Inventor
小林信雄
黑川禎明
濱田晃一
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芝浦機械電子裝置股份有限公司
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51599576&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI692024(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 芝浦機械電子裝置股份有限公司 filed Critical 芝浦機械電子裝置股份有限公司
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    • H10P72/0402—
    • H10P50/642—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H10P50/644—
    • H10P50/667—
    • H10P72/0414—
    • H10P72/0422—
    • H10P72/0424—
    • H10P72/0431—
    • H10P72/0602—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
TW106106835A 2013-03-29 2014-03-21 濕式蝕刻裝置 TWI692024B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013073721 2013-03-29
JP2013-073721 2013-03-29
JP2014045275A JP6302708B2 (ja) 2013-03-29 2014-03-07 ウェットエッチング装置
JP2014-045275 2014-03-07

Publications (2)

Publication Number Publication Date
TW201724250A TW201724250A (zh) 2017-07-01
TWI692024B true TWI692024B (zh) 2020-04-21

Family

ID=51599576

Family Applications (4)

Application Number Title Priority Date Filing Date
TW106106835A TWI692024B (zh) 2013-03-29 2014-03-21 濕式蝕刻裝置
TW109109663A TWI739355B (zh) 2013-03-29 2014-03-21 濕式蝕刻裝置
TW110118487A TWI810572B (zh) 2013-03-29 2014-03-21 濕式蝕刻裝置
TW103110681A TWI660419B (zh) 2013-03-29 2014-03-21 濕式蝕刻裝置

Family Applications After (3)

Application Number Title Priority Date Filing Date
TW109109663A TWI739355B (zh) 2013-03-29 2014-03-21 濕式蝕刻裝置
TW110118487A TWI810572B (zh) 2013-03-29 2014-03-21 濕式蝕刻裝置
TW103110681A TWI660419B (zh) 2013-03-29 2014-03-21 濕式蝕刻裝置

Country Status (5)

Country Link
US (1) US20140290859A1 (enExample)
JP (1) JP6302708B2 (enExample)
KR (4) KR101596119B1 (enExample)
CN (2) CN104078391B (enExample)
TW (4) TWI692024B (enExample)

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JP6843173B2 (ja) * 2019-03-29 2021-03-17 東京エレクトロン株式会社 基板処理装置、および基板処理方法
KR102822643B1 (ko) * 2019-07-25 2025-06-18 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
JP7412134B2 (ja) * 2019-11-01 2024-01-12 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7516742B2 (ja) * 2019-11-05 2024-07-17 東京エレクトロン株式会社 基板を処理する装置、処理ガスを濃縮する装置、及び基板を処理する方法
CN110993614B (zh) * 2019-11-27 2022-06-10 深圳市华星光电半导体显示技术有限公司 显示面板制备装置及方法
CN111106041A (zh) * 2019-12-10 2020-05-05 上海华力集成电路制造有限公司 湿法刻蚀机台及湿法刻蚀药液的回收方法
TW202134174A (zh) * 2020-02-12 2021-09-16 日商東京威力科創股份有限公司 磷酸處理液的再生裝置、基板處理裝置、磷酸處理液的再生方法及基板處理方法
JP7504636B2 (ja) * 2020-03-24 2024-06-24 芝浦メカトロニクス株式会社 処理液製造装置、基板処理装置、処理液製造方法及び基板処理方法
CN114195245A (zh) * 2020-09-02 2022-03-18 中国科学院微电子研究所 腐蚀液回收再利用装置及方法
KR102670179B1 (ko) * 2020-09-09 2024-05-28 가부시키가이샤 스크린 홀딩스 기판 처리 방법, 및 기판 처리 장치
KR102715366B1 (ko) * 2020-12-18 2024-10-10 세메스 주식회사 처리액 공급 장치 및 처리액 공급 방법
KR102583556B1 (ko) * 2021-01-07 2023-10-10 세메스 주식회사 처리액 공급 장치 및 처리액 공급 장치의 고형 제거 방법
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Also Published As

Publication number Publication date
CN104078391B (zh) 2017-09-22
CN107452649A (zh) 2017-12-08
KR101596119B1 (ko) 2016-02-19
KR20140118868A (ko) 2014-10-08
JP6302708B2 (ja) 2018-03-28
TW201448020A (zh) 2014-12-16
TWI660419B (zh) 2019-05-21
TW201724250A (zh) 2017-07-01
TW202029329A (zh) 2020-08-01
CN107452649B (zh) 2020-10-20
KR20190142305A (ko) 2019-12-26
US20140290859A1 (en) 2014-10-02
KR20160147239A (ko) 2016-12-22
TWI739355B (zh) 2021-09-11
KR20160006142A (ko) 2016-01-18
TW202135158A (zh) 2021-09-16
TWI810572B (zh) 2023-08-01
KR102253286B1 (ko) 2021-05-20
CN104078391A (zh) 2014-10-01
JP2014209581A (ja) 2014-11-06
KR101687924B1 (ko) 2016-12-19
KR102062749B1 (ko) 2020-01-06

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