TWI691248B - 電子模組以及電子模組之製造方法 - Google Patents

電子模組以及電子模組之製造方法 Download PDF

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TWI691248B
TWI691248B TW107132309A TW107132309A TWI691248B TW I691248 B TWI691248 B TW I691248B TW 107132309 A TW107132309 A TW 107132309A TW 107132309 A TW107132309 A TW 107132309A TW I691248 B TWI691248 B TW I691248B
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substrate
connecting body
electronic component
electronic
conductive adhesive
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TW107132309A
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TW201931965A (zh
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松嵜理
池田康亮
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日商新電元工業股份有限公司
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Abstract

本發明之電子模組，包括：第一基板(11)；電子元件(13、23)，設置在第一基板(11)之一側；第二基板(21)，設置在電子元件(13、23)之一側；第一連結體(210)，設置在第一基板(11)與第二基板(21)之間；第二連結體(220)，設置在第一基板(11)與第二基板(21)之間，且長度比第一連結體(210)更短；以及封裝部(90)，至少封裝電子元件。其中，第一連結體(210)不與電子元件電連接，第二連結體(220)與電子元件(13、23)電連接。

Description

電子模組以及電子模組之製造方法
本發明涉及一種具有第一基板和第二基板、以及設置在第一基板與第二基板之間之電子元件之電子模組以及電子模組之製造方法。
以往，在封裝樹脂內設置有複數個電子元件之電子模組已被普遍認知（例如，參照特開2014-45157號）。對於這種電子模組行業普遍希望能夠將其小型化。
電子模組所包含之電子元件之數量一旦變多，電子模組之第一基板以及與第一基板相向設置之第二基板在面方向上之尺寸也會隨之變大。像這樣第一基板以及第二基板之尺寸一旦變大，那在焊接（soruda）步驟、回流(reflow)步驟等熱處理步驟中之這些第一基板以及第二基板就可能會發生翹曲與變形。
此外，在將電子模組藉由封裝樹脂等來封裝之情況下，第一基板以及第二基板會被藉由金屬模具來按壓。包含第一基板以及第二基板之構件中由於存在公差，所以相比金屬模具之厚度方向之尺寸，將電子模組之部件組裝後之厚度方向之厚度有時會變大。在這種情況下一旦受到來自金屬模具之較強按壓力，會有發生電性故障之可能性。
本發明在於提供一種電子模組以及電子模組之製造方法，其能夠防止第一基板以及第二基板發生翹曲與變形，此外還能夠降低發生電性故障之可能性。
本發明涉及之電子模組，其包括： 第一基板； 電子元件，設置在所述第一基板的一側； 第二基板，設置在所述電子元件的一側； 第一連結體，設置在所述第一基板與所述第二基板之間； 第二連結體，設置在所述第一基板與所述第二基板之間，且長度比所述第一連結體更短；以及 封裝部，至少封裝所述電子元件， 其中，第一連結體不與電子元件電連接， 第二連結體與電子元件電連接。
本發明涉及之電子模組，其中，第二連結體具有彈性構造。
本發明涉及之電子模組，其中，第一連結體具有主體部、以及橫截面積比主體部更小之接合部。
本發明涉及之電子模組，其中，第一連結體具有橫截面積連續縮小之傾斜部。
本發明涉及之電子模組，其中，第一連結體被設置為複數個，第二連結體也被設置為複數個。
本發明涉及之電子模組，其中，第一連結體與第二連結體構成一對之組結構。
本發明涉及之電子模組，其中，第一連結體與第二連結體被設置為相同數量。
本發明涉及之電子模組，其中： 第一連結體藉由導電性黏合劑與設置在第一基板之第一導體層或第一基板連結，並且藉由導電性黏合劑與設置在第二基板之第二導體層或第二基板連結， 第二連結體藉由導電性黏合劑與設置在第一基板之第一導體層或第一基板連結，並且藉由導電性黏合劑與設置在第二基板之第二導體層或第二基板連結， 與第二連結體接觸之導電性黏合劑之厚度，比與第一連結體接觸之導電性黏合劑之厚度更厚。
本發明涉及之電子模組，其中，第二連結體設置在電子元件與第二基板之間、電子元件與第一基板之間、或設置在第一基板側之第一電子元件與設置在第二基板側之第二電子元件之間。
本發明涉及之電子模組，其中，相比第一連結體，第二連結體可以設置在更向周緣內部。
本發明涉及之電子模組之製造方法，其包括： 將電子元件設置在第一基板之一側之步驟； 將未與電子元件電連接之第一連結體設置在第一基板與第二基板之間之步驟； 將長度比第一連結體更短，以及與電子元件電連接之第二連結體設置在第一基板與第二基板之間之步驟；以及 在第一基板與第二基板之間提供封裝樹脂，以及將電子元件、第一連結體以及第二連結體藉由封裝樹脂封裝之步驟。
發明效果
根據本發明之一種態樣，由於設置有第一連結體以及第二連結體，所以就能夠防止第一基板以及第二基板發生翹曲與變形。此外，未與電子元件電連接之第一連結體，其長度比與電子元件電連接之第二連結體更長。因此，即使是在受到來自金屬模具之按壓力之情況下，也能夠藉由第一連結體來承受按壓力。這樣一來，就能夠防止與電子元件電連接之，並且承擔電功能之第二連結體發生故障，進而還能夠降低電子模組中發生電性故障之可能性。
第一實施方式
《構成》
在本實施方式中，“一側”是指第1圖之上方側，“另一側”是指第1圖之下方側。將第1圖之上下方向稱為“第一方向”，將左右方向稱為“第二方向”，將紙面之表裡方向稱為“第三方向”。將包含第二方向以及第三方向之面內方向叫做“面方向”，將從一側進行觀看叫做“從平面看”。
本實施方式之電子模組具有第一電子單元與第二電子單元。
如第1圖所示，第一電子單元具有：第一基板11、設置在第一基板11之一側之複數個第一導體層12、以及設置在第一導體層12之一側之第一電子元件13。其中，第一電子元件13既可以是開關元件，也可以是控制元件。當第一電子元件13是開關元件時，第一電子元件13也可以是MOSFET與IGBT。此外，作為第一電子元件13，也能夠使用二極體（diode）、電晶體（transistor）以及閘流體等。第一電子元件13以及後述之第二電子元件23其各自可以由半導體元件所構成，而作為半導體材料，也可以是矽、碳化矽、氮化鎵等。第一電子元件13可以藉由焊錫等導電性黏合劑5與第一導體層12連接。
如第2圖所示，第一電子元件13之一側設置有第一連接體60。第一連接體60可以藉由焊錫等導電性黏合劑5（第2圖中無圖示）與第一電子元件13連接。
如第1圖所示，第二電子單元具有第二基板21與設置在第二基板21之另一側之第二導體層22。第二電子元件23可以藉由焊錫等導電性黏合劑5設置在第二基板21。
如第2圖所示，第一連接體60之一側也設置有第二電子元件23。第二導體層22之另一側設置有第二連接體70。第二連接體70可以藉由焊錫等導電性黏合劑5與第二電子元件23以及第二導體層22連接。
第二電子元件23既可以是開關元件，也可以是控制元件。當第二電子元件23是開關元件時，第二電子元件23也可以是MOSFET與IGBT。此外，作為第二電子元件23，也能夠使用二極體、電晶體以及閘流體等。
如第2圖所示，第一連接體60具有第一頭部61與從第一頭部61向另一側延伸之第一柱部62。第二連接體70具有第二頭部71與從第二頭部71向另一側延伸之第二柱部72。第一連接體60之截面為大致呈T字形，第二連接體70之截面也為大致呈T字形。
作為第一基板11以及第二基板21，能夠採用陶瓷基板、絕緣樹脂層等。而作為導電性黏合劑5，除了焊錫，也能夠使用將Ag與Cu作為主要成分之材料。作為第一連接體60以及第二連接體70之材料，能夠使用Cu等金屬。其中，作為基板11、21例如能夠使用形成電路圖案後之金屬基板，在這種情況下，基板11、21兼做導體層12、22。作為金屬基板與導體層12、22，能夠使用銅、鋁、鉬等。
電子模組具有由封裝樹脂等構成之封裝部90，封裝：已述之第一電子元件13、第二電子元件23、第一連接體60、第二連接體70、第一導體層12、以及第二導體層22等。
如第1圖所示，端子部110、120具有與第一電子元件13電連接之第一端子部110、與第二電子元件23電連接之第二端子部120。
第一導體層12藉由導電性黏合劑5可以與第一端子部110連接，第一端子部110之前端側露出至封裝部90之外部，以及能夠與外部裝置連接。第二導體層22藉由導電性黏合劑5可以與第二端子部120連接，第二端子部120之前端側露出至封裝部90之外部，以及也能夠與外部裝置連接。第一端子部110之前端以及第二端子部120之前端，可以向一側或另一側彎曲。
第1圖中雖然展示了第一端子部110以及第二端子部120是呈直線形之態樣，但是不限於此，第一端子部110具有：與第一導體層12連接之第一端子基端部、露出至封裝部90之外部之第一端子外部部分、以及設置在第一端子基端部與第一端子外部部分之間之，以及在第一端子基端部側向另一側彎曲之第一彎曲部。第一端子基端部藉由導電性黏合劑5也可以與第一導體層12連接。
第二端子部120具有：與第二導體層22連接之第二端子基端部、露出至封裝部90之外部之第二端子外部部分、以及設置在第二端子基端部與第二端子外部部分之間，以及在第二端子基端部側向一側彎曲之第二彎曲部。第二端子基端部藉由導電性黏合劑5也可以與第二導體層22連接。
第一基板11與第二基板21之間，設置有第一連結體210與長度比第一連結體210更短之第二連結體220。其中，第一連結體210不與電子元件13、23電連接，第二連結體220與電子元件13、23電連接。第一連結體210例如藉由導體層12、22可以與電子元件13、23電連接。也可以不限於這種態樣，能夠採用第一連結體210與第二連結體220長度為實質性相同之態樣。此處之長度為實質性相同是指，第一連結體210與第二連結體220之長度差，在第一連結體210與第二連結體220中長度較長一方之５％以內。因此，當將第一連結體210與第二連結體220中長度較長一方之長度設為L1， 長度較短一方之長度設為L0之情況下，當成為L1-L0≦L1×0.05時，本實施方式中之第一連結體210與第二連結體220就可以說是長度為實質性相同。
第一連結體210之第一方向上之長度，可以是與第一基板11以及第二基板21之設計高度（在第一方向之間隔）對應之長度。此處之“設計高度對應之長度”是指，在設計高度之±５％以內。其中，當將成為封裝部90之封裝樹脂注入金屬模具內時，第一基板11以及第二基板21或後述之第一散熱板151以及第二散熱板152被藉由金屬模具從一側按壓。
第一連結體210可以是由圓柱形、角柱形等柱形構成。第二連結體220同樣也可以是由圓柱形、角柱形等柱形構成。第一連結體210與第二連結體220之形狀無需相同，可以是第一連結體210由圓柱形構成、第二連結體220由角柱形構成，也可以是第一連結體210由角柱形構成、第二連結體220由圓柱形構成。
第一連結體210可以僅設置為1個，也可以如第3圖以及第4圖所示般設置為複數個。同樣的，第二連結體220可以僅設置為1個，也可以如第3圖以及第4圖所示般設置為複數個。如第3圖所示般第一連結體210與第二連結體220可以設置為相同數量，以及構成一對之組結構。此處之“構成一對之組結構”是指，在面方向上，位於與第一連結體210最短距離之第二連結體220被設置為1個，構成第一連結體210與第二連結體220是一對之結構。
相比第一連結體210，第二連結體220可以設置在更向周緣內部。在採用複數個第二連結體220之情況下，相比第一連結體210，第二連結體220各自也可以定位在更向周緣內部。但是，不限於這種態樣，相比第一連結體210，第二連結體220也可以設置在更向周緣外部。其中，周緣內部是指，在面方向上離封裝部90之周緣端部之距離是遠距離，相比第一連結體210，第二連結體220可以設置在更向周緣內部是指，從第二連結體220至看到封裝部90之周緣端部後之距離比從第一連結體210至看到封裝部90之周緣端部後之距離更遠。
至少1個第一連結體210藉由導電性黏合劑5，與設置在第一基板11之第一導體層12或由金屬基板構成之第一基板11連結，以及，藉由導電性黏合劑5也可以與設置在第二基板21之第二導體層22或由金屬基板構成之第二基板21連結。
至少1個第二連結體220藉由導電性黏合劑5，與設置在第一基板11之第一導體層12或由金屬基板構成之第一基板11連結，以及，藉由導電性黏合劑5也可以與設置在第二基板21之第二導體層22或由金屬基板構成之第二基板21連結。
如第1圖所示，與第一連結體210接觸之導電性黏合劑5之厚度，可以比與第二連結體220接觸之導電性黏合劑5之厚度更薄。其中，第一連結體210以及第二連結體220以相同之態樣，藉由導電性黏合劑5與第一導體層12或由金屬基板構成之第一基板11連結，以及，在藉由導電性黏合劑5與第二導體層22或由金屬基板構成之第二基板21連結之情況下，由於第二連結體220之長度比第一連結體210更短，所以大體上就必然能夠將與第二連結體220接觸之導電性黏合劑5之厚度，比與第一連結體210接觸之導電性黏合劑5之厚度更厚。以及由於第二連結體220與電子元件電連接，藉由這樣將導電性黏合劑5保持充分之厚度就能夠實現提高可靠性。
如第5圖所示，可以在第一頭部61之一側之面上設置有第一溝部64。其中，第一溝部64從平面看（面方向），雖然設置在第一柱部62之周緣外部，但是也可以設置在周緣外部之一部分上，還可以設置在第一柱部62之整個周緣外部上。在第一頭部61之一側之面上，以及在第一溝部64之邊緣內部可以設置焊錫等導電性黏合劑5，以及還可以藉由導電性黏合劑5設置第二電子元件23。
如第5圖所示，從平面看，第一電子元件13是從第一頭部61露出至外部之態樣。在第一電子元件13是MOSFET等開關元件之情況下，在從外部露出後之部分上可以設置第一閘極端子13g等。同樣的，在第二電子元件23是MOSFET等開關元件之情況下，在一側之面上也可以設置第二閘極端子23g等。如第5圖所示第一電子元件13之一側之面上具有第一閘極端子13g與第一源極端子13s，第二電子元件23之一側之面上具有第二閘極端子23g與第二源極端子23s。在這種情況下，第二連接體70藉由導電性黏合劑5與第二電子元件23之第二源極端子23s連接，無圖示之連接件藉由導電性黏合劑5與第二電子元件23之第二閘極端子23g連接。此外，第一連接體60藉由導電性黏合劑5可以與第一電子元件13之第一源極端子13s和設置在第二電子元件23之另一側之第二汲極端子連接。設置在第一電子元件13之另一側之第一汲極端子藉由導電性黏合劑5也可以與第一導體層12連接。第一電子元件13之第一閘極端子13g藉由導電性黏合劑5與無圖示之連接件連接，該連接件95藉由導電性黏合劑5也可以與第一導體層12連接。
在只要第一電子元件13以及第二電子元件23之任意一方是開關元件之情況下，可以考慮將裝載於第一連接體60之第二電子元件23作為低發熱性之控制元件，將第一電子元件13作為開關元件。相反的，也可以考慮將裝載於第一連接體60之第二電子元件23作為開關元件，將第一電子元件13作為低發熱性之控制元件。
端子部110、120與導體層12、22之接合，不僅可以使用焊錫等導電性黏合劑5之方式，也可使用激光焊接、以及超音波接合方式來進行。其中，端子部110、120也可以設置在與第一連結體210或第二連結體220是相反側之周緣側部。作為其中一例，如第1圖所示，第二連結體220之周緣外部設置有第一連結體210，與第一連結體210以及第二連結體220是相反側之周緣側部設置有端子部110、120，該端子部也可以構成突出至封裝部90之周緣外部之結構。
如第1圖以及第2圖所示，第一基板11之另一側（裡面側）設置有由銅基板等構成之第一散熱板151。同樣的，第二基板12之一側（裡面側）也設置有由銅基板等構成之第二散熱板152。
《製造方法》
下面，對本實施方式之電子模組之製造方法之一例進行說明。
首先，在第一夾具500上設置第一電子元件13（第一電子元件設置步驟，參照第6圖（a））。其中，第6圖展示了與第2圖不同之製造晶片模組之步驟，例如第二電子元件23在面方向上成為容置於第一連接體60內之尺寸。
接下來，藉由焊錫等導電性黏合劑5將第一連接體60設置在第一電子元件13上（第一連接體設置步驟，參照第6圖（b））。其中，第6圖中焊錫等導電性黏合劑5無圖示。
之後，藉由導電性黏合劑5將第二電子元件23設置在第一連接體60上（第二電子元件設置步驟，參照第6圖（c））。其中，第一連接體60上之導電性黏合劑5設置在第一電子元件13之第一溝部64之周緣內部。
將第二連接體70設置在第二夾具550上（第二電子元件設置步驟，參照第6圖（d））。第二夾具550可以在設置有第二連接體70之位置上具有複數個夾具凹部560。夾具凹部560之高度可以與晶片模組之高度對應。其中，夾具凹部560之高度與晶片模組之高度對應是指，夾具凹部560之高度大於將導電性黏合劑5之厚度計算在內之晶片模組之整體設計厚度。
在使用吸附部件等將第二連接體70吸附於第二夾具550後之狀態下將第二夾具550翻轉，以及藉由導電性黏合劑5將第二連接體70設置在第二電子元件23上（翻轉裝載步驟，參照第6圖（e））。
接著，對導電性黏合劑5加熱融化後再使其硬化（回流）（第一硬化步驟）。藉由這樣，來製造具有第一電子元件13以及第二電子元件23之晶片模組。
接下來，對製造電子模組之方法進行說明。其中，對於晶片模組在第7圖中無圖示。
將晶片模組之第一電子元件13藉由導電性黏合劑5裝載於設置在第一基板11之第一導體層12上（晶片模組裝載步驟）。
在進行晶片模組裝載步驟之同時或進行前後，藉由導電性黏合劑5將第一電子元件13裝載於第一導體層12上（第一電子元件裝載步驟，參照第7圖（a））。以及藉由導電性黏合劑5將連接件95裝載於第一電子元件13以及第一導體層12上。
在進行第一電子元件裝載步驟之同時或進行前後，將第一連結體210藉由導電性黏合劑5設置在第一基板11之表面側之第一導體層12上（第一連結體裝載步驟，參照第7圖（a））。
在進行第一連結體裝載步驟之同時或進行前後，將第二連結體220藉由導電性黏合劑5設置在第一基板11之表面側之第一導體層12上（第二連結體裝載步驟，參照第7圖（a））。
在進行第二連結體裝載步驟之同時或進行前後，將第一端子部110藉由導電性黏合劑5設置在第一基板11之表面側之第一導體層12上。
將第二電子元件23藉由導電性黏合劑5設置在第二基板21之表面側之第二導體層22上（第二電子元件裝載步驟，參照第7（b））。
在進行第二電子元件裝載步驟之同時或進行前後，將第二端子部120藉由導電性黏合劑5設置在第二基板21之表面側之第二導體層22上。
接著，對設置在第一基板11側以及第二基板21側之導電性黏合劑5加熱融化後再使其硬化（回流）。
接下來，將第二基板21翻轉，以及第一連結體210以及第二連結體220藉由導電性黏合劑5與第二基板21之第二導體層22連接（翻轉步驟，參照第7圖（c））。這時，第二導體層22藉由導電性黏合劑5與晶片模組之第二連接體70連接。
然後，在第一基板11與第二基板21之間提供封裝樹脂，以及藉由封裝樹脂將晶片模組、第一電子元件13、第二電子元件23、第一連結體210、以及第二連結體220等封裝，來形成封裝部90（封裝步驟，參照第7圖（c））。
藉由完成以上過程，來製造本實施方式之電子模組。
《作用・效果》
下面，對由上述過之結構構成之本實施方式中之作用・效果之一例進行說明。其中，在“作用・效果”中說明之所有態樣，都能夠採用於上述結構。
在本實施方式中，當採用設置有第一連結體210以及第二連結體220之態樣時，就能夠防止第一基板11以及第二基板21發生翹曲與變形。更為具體的是，由於在製造電子模組之步驟中會進行加熱，所以第一基板11以及第二基板21會有發生翹曲變形之可能性。例如，由於在焊接步驟、回流步驟等步驟中會進行加熱，所以第一基板11以及第二基板21會有發生翹曲變形之可能性。這一點，在採用設置有第一連結體210以及第二連結體220之態樣時，就能夠防止第一基板11以及第二基板21產生這種翹曲與變形。其中，由於第一基板11以及第二基板21之面方向上之尺寸越大，這種翹曲以及變形發生之可能性就越大，所以在這種情況下，使用本實施方式之第一基板11以及第二基板21是非常有幫助的。
即使是藉由採用第一連接體60或第二連接體70也能夠防止第一基板11以及第二基板21產生翹曲與變形。此外，藉由採用第一連接體60或第二連接體70，還能夠將從第一電子元件13或第二電子元件23產生之熱量有效地進行散熱。
包含第一基板11以及第二基板21之構件中由於存在公差，所以相比金屬模具之厚度方向之尺寸，將電子模組之部件組裝後之厚度方向（第一方向）之厚度有時會變大。在這種情況下一旦受到來自金屬模具之較強按壓力，會有發生電性故障之可能性。這一點，當未與電子元件電連接之第一連結體210是採用比與電子元件電連接之第二連結體220之長度更長之態樣時，即使是在受到來自金屬模具之按壓力之情況下，也能夠藉由第一連結體210來承受按壓力。這樣一來，就能夠防止與電子元件電連接之，以及承擔電功能之第二連結體220發生故障，進而還能夠降低電子模組中發生電性故障之可能性。
在受到來自金屬模具之較強按壓力之情況下，從即使第一連結體210破損也沒影響來說，相比第二連結體220，採用第一連結體210設置在更向周緣外部之態樣是有幫助的。鑒於在第一基板11以及第二基板21發生翹曲與變形之效果，很有可能是由於在周緣外部上施加較大之力所導致的。
與第二連結體220接觸之導電性黏合劑5之厚度，可以比與第一連結體210接觸之導電性黏合劑5之厚度更厚。由於第二連結體220與電子元件電連接，所以藉由這樣將導電性黏合劑5保持充分之厚度就能夠有利於實現提高可靠性。
如第3圖以及第4圖所示，在採用第一連結體210是被設置有複數個之態樣時，就能夠有利於更準確地防止第一基板11以及第二基板21發生翹曲與變形。作為其中一例，第一連結體210可以至少設置為4個以上，以及也可以設置為能夠支撐第一基板11以及第二基板21之4個角部。
如第3圖以及第4圖所示，即使是採用第二連結體220是被設置有複數個之態樣時，也能夠有利於更準確地防止第一基板11以及第二基板21發生翹曲與變形。作為其中一例，第二連結體220可以至少設置為4個以上，以及也可以設置為能夠支撐第一基板11以及第二基板21之4個角部。
在採用第一連結體210與第二連結體220是構成一對之組結構時，藉由第一連結體210，就能夠有利於防止引起第一基板11以及第二基板21發生翹曲與變形起因之按壓力，施加在對應之第二連結體220（成為組結構後之第二連結體220）上。其中，考慮到對於第二連結體220之影響，第一連結體210之數量比第二連結體220之數量更多之態樣是有幫助的。另一方面，由於第一連結體210是無電功能之部件，所以控制其數量也是有幫助之。因此，在控制對於第二連結體220影響之同時，從不增加無電功能之部件數量之觀點來看，第一連結體210與第二連結體220是被設置為相同數量之態樣是有幫助的。如第4圖所示，第二連結體220之數量也可以比第一連結體210之數量更多。
第二實施方式
接下來，對本發明之第二實施方式進行說明。
在第一實施方式中，第二連結體220是由圓柱形、角柱形等柱形構成之態樣。在本實施方式中，如第8圖所示般第二連結體220是具有彈性構造之態樣。關於除此以外其他之構造，與第一實施方式相同，能夠採用第一實施方式中說明過之所有態樣。對於第一實施方式中說明過之部件使用相同符號進行說明。
作為彈性構造能夠採用各種態樣。作為其中一例，在沿第一方向之縱截面上，可以是如第8圖所示般之Z形構造，也可以是如第9圖（a）所示般之C形構造，還可以是如第9圖（b）所示般之M字形構造。
在採用如本實施方式般之第二連結體220是具有彈性構造之態樣時，即使是對第二連結體220施加按壓力等之情況下，藉由第二連結體220其自身也能夠吸收該按壓力。因此，就能夠防止第二連結體220其自身發生較大之故障。所以，還能夠更降低在電子模組中發生電故障之可能性。
如第9圖（c）及（d）所示，在第二連結體220之一側端部之面上可以設置突出至一側之突出部225。同樣的，在第二連結體220之另一側端部之面上也可以設置突出至另一側之突出部225。在設置有這種突出部225之情況下，就能夠有利於確保導電性黏合劑5之厚度。當對第二連結體220施加按壓力時，由於導電性黏合劑5會被壓碎，所以有無法確保導電性黏合劑5之充分厚度之可能性。這一點，藉由設置如本實施方式般之突出部225，就能夠有利於更準確地確保導電性黏合劑5之充分厚度。其中，突出部225可以只設置在第二連結體220之一側端部之面上以及另一側端部之面上之任意一方。
第三實施方式
接下來，對本發明之第三實施方式進行說明。
在上述各實施方式中，第一連結體210是由圓柱形、角柱形等柱形構成之態樣。在本實施方式中，如第10圖所示，第一連結體210是具有主體部215、以及橫截面積比主體部215更小之接合部216。在本實施方式中，能夠採用上述各實施方式中說明過之所有態樣。對於上述各實施方式中說明過之部件使用相同符號進行說明。
在採用如本實施方式般之橫截面積較小之接合部216時，當從第一基板11、第二基板21等沿第一方向施加過度之力之情況下，能夠藉由接合部216將第一連結體210折斷。因此，就能夠防止因第一連結體210對第一基板11或第二基板21運作過度之力。雖然設置第一連結體210是用於防止第一基板11以及第二基板21發生翹曲與變形，但是因為該第一連結體210會對第一基板11或第二基板21施加過度之力，進而對第一基板11或第二基板21會有發生故障之可能性。藉由採用如本實施方式般之接合部216，在施加過度之力時能夠藉由接合部216將第一連結體210折斷，還能夠防止因第一連結體210對第一基板11或第二基板21運作過度之力。
主體部215以及接合部216之形狀能夠採用各種形狀。作為其中一例，主體部215可以是具有後述之傾斜部217之構造（參照第10圖（a）），也可以是具有圓柱形、角柱形等柱形之構造（參照第10圖（b））。作為接合部216，例如能夠採用具有圓柱形、角柱形等柱形之構造，也可以是具有傾斜部之構造。
第四實施方式
接下來，對本發明之第四實施方式進行說明。
在本實施方式中，如第11圖所示，第一連結體210是具有橫截面積為連續縮小之傾斜部217之態樣。在本實施方式中，也能夠採用上述各實施方式中說明過之所有態樣。對於上述各實施方式中說明過之部件使用相同符號進行說明。
如已述般，雖然設置第一連結體210是用於防止第一基板11以及第二基板21發生翹曲與變形，但是因為該第一連結體210會對第一基板11或第二基板21施加過度之力，進而對第一基板11或第二基板21會有發生故障之可能性。藉由採用如本實施方式般之傾斜部217，在施加過度之力時，第一連結體210之一部分會在傾斜部217中之橫截面（面方向上之截面）為較小之部位處折斷，這樣就能夠有利於防止因第一連結體210向第一基板11或第二基板21運作過度之力。其中，在第11圖（a）所示之態樣中，橫截面為較小之部位是位於前端側（第11圖（a）之上方側)之部分（前端部），在第11圖（b）所示之態樣中，橫截面為較小之部位是位於中央部（第11圖（b）之上下方向之中心部）之部分（中央部）。
第五實施方式
接下來，對本發明之第五實施方式進行說明。
在上述各實施方式中，雖然使用了截面是大致呈T字形之第一連接體60，但是本實施方式之第一連接體60是如第12圖所示般，具有從第一頭部61向另一側延伸之4個支撐部65（65a-65d）。支撐部65與第一導體層12或第一基板11對接。在本實施方式中，也能夠採用上述各實施方式中說明過之所有態樣。對於上述各實施方式中說明過之部件使用相同符號進行說明。
雖然在本實施方式中說明了使用4個支撐部65之態樣，但是不限於此，也可以使用1、2、3或5個以上之支撐部65。
當設置有如本實施方式般之從第一頭部61延伸之支撐部65時，在實際安裝第二電子元件23時或實際安裝完第二電子元件23後，就能夠防止因第二電子元件23之重量而導致第一連接體60傾斜。此外，支撐部65藉由與第一基板11或第一導體層12對接，就能夠提高散熱性。特別是在支撐部65是與第一導體層12對接之情況下，能夠有利於更提高散熱效果。
當採用如本實施方式般之具有複數個支撐部65之第一連接體60時，能夠對因第一基板11以及第二基板21之熱量所導致之翹曲與變形進一步給予更強之反彈力。也就是說，雖然如已述般之在電子模組之製造步驟中由於進行加熱會施加導致第一基板11以及第二基板21發生翹曲變形之力，但是藉由使用具有複數個支撐部65之第一連接體60，以及加入第一連結體210之作用，即使是依靠第一連接體60，也能夠藉由第二電子元件23、第二連接體70、第三連接體80、以及連接件85等，來有利於更準確地防止第一基板11以及第二基板21發生翹曲變形。
第六實施方式
接下來，對本發明之第六實施方式進行說明。
在上述各實施方式中雖然說明了使用具有第二柱部72以及截面是大致呈T字形之第二連接體70，但是在本實施方式中，如第13所示，第二連接體70具有從第二頭部71向另一側延伸之延伸部75（75a,75b）。在本實施方式中，也能夠採用上述各實施方式中說明過之所有態樣。對於上述各實施方式中說明過之部件使用相同符號進行說明。
在本實施方式中雖然對使用了2個延伸部75之態樣進行說明，但是不限於此，也可以使用1個或3個以上之延伸部75。
根據本實施方式，由於設置有延伸部75，所以就能夠將第二電子元件23處之熱量更有效地進行散熱，以及即使是藉由第二連接體70也能夠實現提高散熱效果。此外，如本實施方式般在設置有複數個延伸部75之情況下，有利於進一步實現更高之散熱效果。
在使用如本實施方式般之具有複數個延伸部之第二連接體70時，能夠對因第一基板11以及第二基板21之熱量所導致之翹曲與變形進一步給予更大之反彈力。也就是說，雖然如已述般之在電子模組之製造步驟中由於進行加熱會施加導致第一基板11以及第二基板21發生翹曲變形之力，但是藉由使用具有複數個延伸部之第二連接體70，以及加入第一連結體210之作用，即使是依靠第二連接體70，也能夠有利於更準確地防止第一基板11以及第二基板21發生翹曲與變形。
第七實施方式
接下來，對本發明之第七實施方式進行說明。
在上述各實施方式中雖然說明了使用第一連接體60以及第二連接體70之態樣，但是不限於此。也可以不設置第一連接體60以及第二連接體70。作為其中一例，可以是如第1所示般之態樣，也可以是如第2所示般之不設置第一連接體60以及第二連接體70之態樣。在本實施方式中，能夠獲得過之對第一連結體210以及第二連結體220說明過之效果。
第八實施方式
接下來，對本發明之第八實施方式進行說明。
在本實施方式中，在電子元件13、23與第二基板11、21之間或相向之電子元件13、23之間至少設置有1個第二連結體220。在第14圖所示之態樣中，展示了設置有第一電子元件13以及第二電子元件23之態樣，在第15圖所示之態樣中，展示了設置有第一電子元件13之態樣。關於除此以外其他之結構，與第七實施方式相同。在本實施方式中，也能夠採用上述各實施方式中說明過之所有態樣。對於上述各實施方式中說明過之部件使用相同符號進行說明。其中，在第15圖中，雖然展示了只設置有第一電子元件13之態樣，但是不限於此，也能夠採用只設置有第二電子元件23之態樣。
如第14圖所示，當在第一電子元件13與第二電子元件23之間設置有第二連結體220時，藉由第二連結體220，就能夠將第二電子元件23與第一電子元件13電連接。
如第15圖所示，在第一電子元件13與第二基板21之間設置有第二連結體220，藉由第二連結體220，也可以採用將第二導體層22或由金屬基板構成之第二基板21與第一電子元件13電連接之態樣。
同樣的，在第二電子元件23與第一基板11之間設置有第二連結體220，藉由第二連結體220，也可以採用將第一導體層12或由金屬基板構成之第一基板11與第二電子元件23電連接之態樣。
如所述般，在本實施方式中，能夠採用上述各實施方式中說明過之所有態樣，也能夠採用所述過之第二連結體220是具有彈性構造之態樣（在第14圖以及第15圖中展示了具有這種彈性構造之態樣）。當採用第二連結體220是具有彈性構造之態樣時，能夠有利於防止對電子元件13、23施加較強之按壓力。
第九實施方式
接下來，對本發明之第九實施方式進行說明。
在本實施方式中，僅使用第一電子元件13以及第二電子元件23之任意1方，關於除此以外其他之結構，與第七實施方式相同。在第16圖中，雖然展示了只設置有第一電子元件13之態樣，但是不限於此，也能夠採用只設置有第二電子元件23之態樣。在本實施方式中，也能夠採用上述各實施方式中說明過之所有態樣。在本實施方式中，也能夠獲得過之對第一連結體210以及第二連結體220說明過之效果。
上述各實施方式中之記載以及附圖中所展示之內容，僅為用於說明申請專利範圍中記載之發明之一個例子，本發明不受上述記載之實施方式以及附圖中所展示之內容所限制。另外，本發明最初申請之請申請專利範圍僅為一例，可根據說明書、附圖之記載，對申請專利範圍進行適宜地修改。
5‧‧‧導電性黏合劑11、21‧‧‧基板12、22‧‧‧導體層13、23‧‧‧電子元件13s、23s‧‧‧源極端子13g、23g‧‧‧閘極端子60、70‧‧‧連接體61、71‧‧‧頭部62、72‧‧‧柱部64‧‧‧溝部65、65a、65b、65c、65d‧‧‧支撐部70、75a、75b‧‧‧延伸部90‧‧‧封裝部95‧‧‧連接件110、120‧‧‧端子部151、152‧‧‧散熱版210、220‧‧‧連結體215‧‧‧主體部216‧‧‧接合部217‧‧‧傾斜部225‧‧‧突出部500、550‧‧‧夾具560‧‧‧夾具凹部
第1圖是本發明之第一實施方式中使用之電子模組之縱截面圖。
第2圖是本發明之第一實施方式中使用之電子模組之另一個縱截面圖。
第3圖是展示本發明之第一實施方式中使用之第一連結體以及第二連結體之平面圖。雖然實際上無法看見封裝部內之第一連結體以及第二連結體，但是在第3圖中，展示了位於封裝部內之第一連結體以及第二連結體。
第4圖是展示本發明之第一實施方式中使用之第一連結體以及第二連結體之另一個平面圖。雖然實際上無法看見封裝部內之第一連結體以及第二連結體，但是在第4圖中，也展示了位於封裝部內之第一連結體以及第二連結體。
第5圖是展示本發明之第一實施方式中使用之第一連接體、第一電子元件以及第二電子元件之平面圖。
第6圖（a）至（e）是展示本發明之第一實施方式中使用之晶片模組之製造步驟之縱截面圖。
第7圖（a）至（c）是展示本發明之第一實施方式中使用之電子模組之製造步驟之縱截面圖。第7圖（a）至（c）是展示與第1對應之縱截面。
第8圖是本發明之第二實施方式中使用之電子模組之縱截面圖。
第9圖（a）至（d）是本發明之第二實施方式中使用之第二連結體之縱截面圖。
第10圖（a）及（b）是本發明之第三實施方式中使用之第二連結體之縱截面圖。
第11圖（a）及（b）是本發明之第四實施方式中使用之第二連結體之縱截面圖。
第12圖是展示本發明之第五實施方式中使用之第一連接體、第一電子元件以及第二電子元件之平面圖。
第13圖是用於展示本發明之第六實施方式中使用之第一連接體以及第二連接體之縱截面圖。
第14圖是本發明之第八實施方式中使用之電子模組之縱截面圖。
第15圖是本發明之第八實施方式中使用之另一個態樣之電子模組之縱截面圖。
第16圖是本發明之第九實施方式中使用之電子模組之縱截面圖。
5‧‧‧導電性黏合劑
11、21‧‧‧基板
12、22‧‧‧導體層
13、23‧‧‧電子元件
90‧‧‧封裝部
95‧‧‧連接件
110、120‧‧‧端子部
151、152‧‧‧散熱版
210、220‧‧‧連結體

Claims (11)

  1. 一種電子模組，其包括： 第一基板； 電子元件，設置在該第一基板之一側； 第二基板，設置在該電子元件之一側； 第一連結體，設置在該第一基板與該第二基板之間； 第二連結體，設置在該第一基板與該第二基板之間，且長度比該第一連結體更短；以及 封裝部，至少封裝該電子元件， 其中，該第一連結體不與該電子元件電連接， 該第二連結體與導電性黏合劑不同，並且與該電子元件電連接， 該第一連結體是（1）由柱形構成、（2）具有主體部、以及橫截面積比該主體部更小之接合部、或（3）具有橫截面積為連續縮小之傾斜部。
  2. 一種電子模組，其包括： 第一基板； 電子元件，設置在該第一基板之一側； 第二基板，設置在該電子元件之一側； 第一連結體，設置在該第一基板與該第二基板之間； 第二連結體，設置在該第一基板與該第二基板之間，且長度比該第一連結體更短；以及 封裝部，至少封裝該電子元件， 其中，該第一連結體不與該電子元件電連接， 該第二連結體與該電子元件電連接， 該第一連結體是（1）由柱形構成、（2）具有主體部、以及橫截面積比該主體部更小之接合部、或（3）具有橫截面積為連續縮小之傾斜部， 該第二連結體具有彈性構造。
  3. 如申請專利範圍第1項或第2項所述之電子模組，其中該第一連結體具有該主體部、以及橫截面積比該主體部更小之該接合部。
  4. 如申請專利範圍第1項或第2項所述之電子模組，其中該第一連結體具有橫截面積連續縮小之該傾斜部。
  5. 如申請專利範圍第1項或第2項所述之電子模組，其中該第一連結體被設置為複數個，該第二連結體也被設置為複數個。
  6. 一種電子模組，其包括： 第一基板； 電子元件，設置在該第一基板之一側； 第二基板，設置在該電子元件之一側； 第一連結體，設置在該第一基板與該第二基板之間； 第二連結體，設置在該第一基板與該第二基板之間，且長度比該第一連結體更短；以及 封裝部，至少封裝該電子元件， 其中，該第一連結體不與該電子元件電連接， 該第二連結體與該電子元件電連接， 該第一連結體被設置為複數個， 該第二連結體也被設置為複數個， 該第一連結體與該第二連結體構成一對之組結構。
  7. 如申請專利範圍第6項所述之電子模組，其中該第一連結體與該第二連結體被設置為相同數量。
  8. 一種電子模組，其包括： 第一基板； 電子元件，設置在該第一基板之一側； 第二基板，設置在該電子元件之一側； 第一連結體，設置在該第一基板與該第二基板之間； 第二連結體，設置在該第一基板與該第二基板之間，且長度比該第一連結體更短；以及 封裝部，至少封裝該電子元件， 其中，該第一連結體不與該電子元件電連接， 該第二連結體與該電子元件電連接， 該第一連結體藉由導電性黏合劑與設置在該第一基板之第一導體層或該第一基板連結，並且藉由導電性黏合劑與設置在該第二基板之第二導體層或該第二基板連結， 該第二連結體藉由導電性黏合劑與設置在該第一基板之該第一導體層或該第一基板連結，並且藉由導電性黏合劑與設置在該第二基板之該第二導體層或該第二基板連結， 與該第二連結體接觸之導電性黏合劑之厚度，比與該第一連結體接觸之導電性黏合劑之厚度更厚。
  9. 如申請專利範圍第1項、第2項、第6項及第8項中之任一項所述之電子模組，其中該第二連結體設置在該電子元件與該第二基板之間、該電子元件與該第一基板之間、或設置在該第一基板側之第一電子元件與設置在該第二基板側之第二電子元件之間。
  10. 如申請專利範圍第1項、第2項、第6項及第8項中之任一項所述之電子模組，其中相比該第一連結體，該第二連結體可以設置在更向周緣內部。
  11. 一種電子模組之製造方法，其包括： 將電子元件設置在第一基板之一側之步驟； 將未與該電子元件電連接之第一連結體設置在該第一基板與第二基板之間之步驟； 將長度比該第一連結體更短，以及與該電子元件電連接之第二連結體設置在該第一基板與該第二基板之間之步驟；以及 在該第一基板與該第二基板之間提供封裝樹脂，以及將該電子元件、該第一連結體以及該第二連結體藉由該封裝樹脂封裝之步驟， 其中該第一連結體是（1）由柱形構成、（2）具有主體部、以及橫截面積比該主體部更小之接合部、或（3）具有橫截面積為連續縮小之傾斜部。
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