CN104303289B - 电子模块及其制造方法 - Google Patents

电子模块及其制造方法 Download PDF

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Publication number
CN104303289B
CN104303289B CN201380002160.3A CN201380002160A CN104303289B CN 104303289 B CN104303289 B CN 104303289B CN 201380002160 A CN201380002160 A CN 201380002160A CN 104303289 B CN104303289 B CN 104303289B
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interarea
substrate
cap
electronic component
electronic module
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CN104303289A (zh
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池田康亮
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Shindengen Electric Manufacturing Co Ltd
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Shindengen Electric Manufacturing Co Ltd
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Abstract

本发明提供一种可小型化的电子模块及其制造方法。本发明涉及的电子模块1包括：电子模块10，具有包含主面11a及主面11b的基板11，并具有安装在主面11a上的电子元件12；电子模块20，具有包含主面21a及主面21b且主面21a被配置为与主面11a相对向的基板21，具有安装在主面11a上且通过连接部件18与电子元件12电连接的电子元件22，并具有安装在主面21b上且通过将基板21向厚度方向贯穿的连接部件19与电子元件电12电连接的电子元件23，并且，电子模块20通过连接部件18、19与电子模块10热连接；以及散热器30，在内部设有收纳部31a，将电子模块10、20收纳在收纳部31a中，从而使得主面11b与收纳部31a的内壁面相接触。

Description

电子模块及其制造方法
技术领域
本发明涉及一种电子模块（module）及其制造方法，更具体的是涉及一种具有散热器（heat sink）的电子模块及其制造方法。
背景技术
以往，作为一种电子模块，已知一种从输入电力获得所需的输出电力的调节器（regulator）。如图6所示，以往的调节器100包括功率部110，控制部120及散热器130。功率部110通过安装在基板111上的半导体开关（switching）元件等的电子元件112进行电力转换。控制部120通过安装在基板121上的控制元件等的电子零件122来控制功率部110。功率部110和控制部120通过连接端子113被电连接。散热器130具有底板部（base plate）131，和被垂直设置在这个底板部131的下面的多个鳍片（fin）132。另外，调节器100通过外部连接端子123与外部的机器相连接。
在以往的调节器100中，如图6所示，功率部110和控制部120都设置在散热器130的底板部131上。
另外，在专利文献一中记载了作为一种电子模块的半导体装置，把设有鳍片的冷却部件设置在半导体芯片（chip）的两面，从而改善了散热性。由于把冷却部件设置在了半导体芯片的两面，因此电子模块的尺寸（size）变大。
如上所述，在以往的调节器等的电子模块中，由于功率部110和控制部120被排列设置在同一平面上，因此整体的尺寸变大。即、以往存在难以将调节器等具有散热器的电子模块小型化的问题。
先行技术文献
专利文献
专利文献一日本特许公开2001-156225号公报
发明内容
因此，本发明的目的在于提供一种可小型化的电子模块及其制造方法。
本发明提供一种电子模块，其特征在于，包括：第一电子模块，具有包含第一主面及所述第一主面的相反一侧的第二主面的第一基板，并具有安装在所述第一主面上的第一电子元件；第二电子模块，具有包含第三主面及所述第三主面的相反一侧的第四主面且所述第三主面被配置为与所述第一主面相对向的第二基板，具有安装在所述第三主面上且通过第一连接部件与所述第一电子元件电连接的第二电子元件，并具有安装在所述第四主面上且通过将所述第二基板向厚度方向贯穿的第二连接部件与所述第一电子元件电连接的第三电子元件，并且，所述第二电子模块通过所述第一连接部件及所述第二连接部件与所述第一电子模块热连接；以及散热器，具有在内部设有收纳部的底板部，并且将所述第一电子模块及所述第二电子模块收纳在所述收纳部从而使得所述第一基板的所述第二主面与所述收纳部的内壁面相接触。
本发明的电子模块还可以包括：盖部，在容纳所述第二基板且覆盖所述第一基板的所述第一主面的同时，外表面与所述散热器的所述收纳部的内壁面相接触，其中，所述第二基板的侧面与所述盖部的内表面相接触。
在本发明的电子模块中，所述盖部还可以由表面被绝缘处理的金属构成。
本发明的电子模块还可以包括：封装树脂，被填充在所述盖部的内部，从而将所述第一电子元件、所述第二电子元件及所述第三电子元件埋设。
本发明的电子模块还可以包括：盖部，覆盖所述第二基板的所述第四主面，且外表面与所述散热器的所述收纳部的内壁面相接触。
本发明的电子模块还可以包括：封装树脂，被填充在所述盖部的内部，从而将所述第三电子元件埋设。
本发明的电子模块还可以包括：封装树脂，被填充在所述第一电子模块及所述第二电子模块之间，从而将所述第一电子元件及所述第二电子元件埋设。
在本发明的电子模块中，还可以是所述第一基板具有：第一绝缘基材；导体模板，被设置在所述第一绝缘基材的所述第一主面侧的主面上，通过导电性接合构件与所述第一电子元件电连接；以及导体层，被设置在所述第一绝缘基材的所述第二主面侧的主面上，与所述散热器的所述收纳部的内壁面相接触。
在本发明的电子模块中，还可以是在所述导体层上设有凹部，在所述凹部上配置有热传导部件，从而使得所述热传导部件与所述收纳部的内壁面相接触。
本发明还提供一种电子模块的制造方法，其特征在于，包括：在第一基板的一个主面上通过导电性接合构件装载第一电子元件的工序；在第二基板的一个主面上通过导电性接合构件装载第二电子元件，并在所述第二基板的另一个主面上通过导电性接合构件装载第三电子元件的工序；由导电性的材料构成的第一连接部件被夹持在所述第一电子元件与所述第二电子元件之间，并且，将所述第二基板配置为与所述第一基板相对向从而使得由导电性的材料构成的第二连接部件插入并贯穿将所述第二基板向厚度方向贯穿的贯穿孔并与所述第一电子元件通过导电性接合构件相连接后，实施加热处理从而将所述第一电子元件、所述第二电子元件及所述第三电子元件和所述第一连接部件及第二连接部件固定，从而制造层积模块的组装工序；以及将所述层积模块收纳在设在散热器的底板部的内部的收纳部中，从而使得所述第一基板的另一个主面与所述收纳部的内壁面相接触的收纳工序。
本发明的电子模块的制造方法还可以是在所述组装工序之后，且在所述收纳工序之前，包括：将具有与所述收纳部相嵌合的外形的盖部覆盖所述层积模块，从而使得所述盖部容纳所述第二基板并且覆盖所述第一基板的所述第一主面的工序，其中，在所述收纳工序中，将被所述盖部覆盖的所述层积模块收纳在所述散热器中，从而使得所述盖部的外表面与所述收纳部的内壁面相接触。
在本发明的电子模块的制造方法中，还可以是在所述盖部上设有将所述盖部向厚度方向贯穿的树脂注入口，在所述第二基板上设有将所述第二基板向厚度方向贯穿的贯穿口，在所述层积模块上覆盖了所述盖部后，通过从所述盖部的所述树脂注入口注入树脂，向所述盖部内填充树脂，从而将所述第一电子元件、所述第二电子元件及所述第三电子元件埋设。
本发明的电子模块的制造方法还可以是在所述组装工序之后，且在所述收纳工序之前，包括：将具有与所述收纳部相嵌合的外形的盖部覆盖所述层积模块，从而使得所述盖部覆盖所述第二基板的所述第四主面的工序，其中，在所述收纳工序中，将被所述盖部覆盖的所述层积模块收纳在所述散热器中，从而使得所述盖部的外表面与所述收纳部的内壁面相接触。
在本发明的电子模块的制造方法中，还可以是在所述盖部上设有将所述盖部向厚度方向贯穿的树脂注入口，所述电子模块的制造方法还包括：在所述层积模块上覆盖了所述盖部后，通过从所述盖部的所述树脂注入口注入树脂，向所述盖部内填充树脂，从而将所述第三电子元件埋设的工序；以及在所述收纳工序之后，向所述收纳部内填充树脂，从而将所述第一电子元件及所述第二电子元件埋设的工序。
发明效果
在本发明涉及的电子模块中，第一电子模块以及通过第一、第二连接部件与第一电子模块热连接的第二电子模块被收纳在设置在散热器的底板部的收纳部中，从而使得第一基板的第二主面与收纳部的内壁面相接触。这样，就不用在底板部上设置第一电子模块及第二电子模块，并且，底板部的平面尺寸减小到了与第一电子模块及第二电子模块中平面尺寸较大一方的尺寸相同的程度。因此，根据本发明，能够将电子模块大幅度地小型化。
附图说明
图1是本发明的实施方式一涉及的电子模块的截面图；
图2是实施方式一涉及的两个电子模块层积的层积模块的截面图；
图3是实施方式一涉及的设有收纳部的散热器的截面图；
图4是实施方式一涉及的在导体层的凹部中配置有热传导部件的基板的截面图；
图5是本发明实施方式二涉及的电子模块的截面图；以及
图6是以往的电子模块的斜视图。
具体实施方式
以下，参照附图对本发明的实施方式进行说明。另外，在各图中对具有同等功能的构成要素给予相同的符号，且不重复对同一符号的构成要素的详细说明。另外，附图是示意的，各构成要素的厚度与平面尺寸的关系、各构成要素之间的厚度的比例等与实际的情况不同。
实施方式一
对于本发明的实施方式一，参照图1至图3进行说明。图1是实施方式一涉及的电子模块1的截面图。图2是两个电子模块10、20层积的层积模块29的截面图。图3是实施方式一涉及的设有收纳部31a的散热器30的截面图。
实施方式一涉及的电子模块1包括电子模块10、层积在这个电子模块10上的电子模块20、以及将电子模块10和电子模块20收纳在内部的散热器30。
如图2所示，电子模块10和电子模块20层积，从而构成层积模块29。基板21的平面尺寸比基板11的平面尺寸更小。并且，将层积模块29向厚度方向看时是电子模块20层积在电子模块10的上面，使得基板21被基板11所包含。
电子模块20通过由导电性的材料构成的连接部件18、19、28，与电子模块10电连接且热连接。连接部件18、19、28，如图2所示，被设置为将基板21向厚度方向贯穿。
连接部件18将电子元件12与电子元件22电连接。连接部件19将电子元件12与电子元件23电连接。连接部件28将导体模板（pattern）14与导体模板25、26电连接。
从谋求低噪音（noise）化的观点出发，连接部件18、19、28最好设置为将各电子元件之间以最短距离连接。例如，连接部件18、19、28可以由笔直的板状或柱状的部件所构成。
另外，连接部件18、19、28的材质例如是铜（Cu）、钼（Mo）、铜和钼的合金（Cu-Mo）、或是铜和钨的合金（Cu-W）。
以下，对各构成要素详细地进行说明。
电子模块10包括：具有主面11a和这个主面11a的相反一侧的主面11b的基板11，以及安装在主面11a上的电子元件12。
如图2所示，基板11具有由陶瓷（ceramic）等绝缘材料构成的绝缘基材13，将由导体构成的导体层（铜箔等）加工成模板而形成的导体模板14，以及由铜等的导体构成的导体层15。导体模板14被设置在绝缘基材13的基板11的主面11a一侧的主面上，即、图2中绝缘基材13的上面。导体层15被设置在绝缘基材13的基板11的主面11b一侧的主面上，即、图2中绝缘基材13的下面。导体模板14通过焊料等的导电性接合构件16，与电子元件12电连接。
另外，由图1也可知，基板11的导体层15与散热器30的收纳部31a的内壁面相接触。
电子元件12例如是发热量比电子模块20的电子元件22、23更大的元件。更具体地，电子元件12是功率MOSFET或绝缘栅双极晶体管（IGBT）等的开关元件。电子元件12的控制端子12a是用于将作为开关元件的电子元件12控制为导通状态或断开状态的控制端子。图2中，作为开关元件的电子元件12对流向上下方向的电流进行控制。
电子模块20，如图2所示，具有基板21、安装在基板21的一个面上的电子元件22、以及安装在基板21的另一个面上的电子元件23。
如图2所示，基板21具有主面21a及主面21a的相反一侧的主面21b，被配置为主面21a与基板11的主面11a相对向。
基板21具有由陶瓷等绝缘材料构成的绝缘基材24，以及将设置在绝缘基材24上的导体层（铜箔等）加工成模板而形成的导体模板25、26。导体模板25被设置在绝缘基材24的基板21的主面21b一侧的主面上，即、图2中绝缘基材24的上面。导体模板26被设置在绝缘基材24的基板21的主面21a一侧的主面上，即、图2中绝缘基材24的下面。
另外，如图2所示，基板21上设有将基板21向厚度方向贯穿的贯穿孔27。
电子元件22，如图2所示，安装在基板21的主面21a上，通过连接部件18与电子元件12电连接。更具体的是，电子元件22通过导电性接合构件16与导体模板26电连接的同时，通过连接部件18与电子元件12电连接。电子元件22例如是与作为开关元件的电子元件12并联连接的整流元件。
电子元件23被安装在基板21的主面21b上，通过连接部件19与电子元件12（的控制端子12a）电连接。电子元件23通过导电性接合构件（没有图示）与导体模板25电连接。电子元件23例如是控制电子元件12的有源元件（控制芯片）。在基板21的主面21b上，也安装有电阻、电容器（condenser）及线圈（coil）等无源元件。
散热器30用于冷却电子模块10和电子模块20，如图3所示，具有在内部设有收纳部31a的底板部31，以及垂直设置在底板部31上的多个鳍片32。
收纳部31a例如被设置为从底板部31的一个侧面贯穿到相反一侧的侧面的贯穿孔。另外，也可以使得收纳部31a由在底板部31的一个侧面或上表面形成的凹部所构成。
如图1所示，散热器30把电子模块10及电子模块20收纳在收纳部31a中，从而使得基板11的主面11b与收纳部31a的内壁面相接触。
如上所述，在本实施方式的电子模块1中，电子模块10和电子模块20层积，从而构成层积模块29。在这个层积模块29中，电子模块10和电子模块20通过连接部件18、19、28被热连接。而且，层积模块29被收纳在散热器30中，从而使得基板11与收纳部31a的内壁面相接触。
这样，就不用在底板部31上设置电子模块10和电子模块20，并且，底板部31的平面尺寸减小到与电子模块10、20中平面尺寸较大一方的尺寸相同的程度。因此，根据本实施方式，能够将电子模块1大幅度地小型化。
另外，从安装在电子模块10、20上的电子元件12、22、23散发出的热，由于从电子模块10的基板11排放到了散热器30，因此散热性得以确保。
另外，在层积电子模块10和电子模块20的同时，通过连接部件18、19、28将电子元件之间电连接，因而能够缩短这两个电子模块之间的配线距离从而降低配线电阻和寄生电感（inductance）等。因此，根据本实施方式，能够将电子模块1低噪音化。
本实施方式涉及的电子模块1，如图1所示，具有与收纳部31a相嵌合的外形，包括覆盖层积模块29的盖（cap）部40。这个盖部40在容纳基板21并覆盖基板11的主面11a的同时，外表面与收纳部31a的内壁面相接触。而且，基板21的侧面21c与盖部40的内表面相接触。另外，不增大底板部31，而是通过将收纳部31a的容积增大一些，就可以设置盖部40。因此，即使设置了盖部40，电子模块1的尺寸也不会增加。
盖部40最好是由表面被绝缘处理的金属（例如被铝阳极氧化（alumite）处理的铝（aluminum））构成，但也可以由树脂等的绝缘体构成。另外，在盖部40上，如图1所示，设有将盖部40向厚度方向贯穿的树脂注入口41。树脂注入口41例如被设置在盖部40的上表面（与基板21相对向的面）。
通过设置盖部40，使得电子模块10及电子模块20的热不仅可以从基板11，还可以从盖部40向散热器30散发。例如，当电子元件12是散热量大的开关元件时，从电子元件12发出的热，经过基板11从而被散发的同时，还经过连接部件18、19，电子模块10及盖部40从而被散发。因此，根据本实施方式，能够提高散热性。
如以上说明的那样，在电子模块1中，由于还可以从盖部40散热，层积模块29和散热器30之间的热阻减少，因此能够提高散热性。所以，根据本实施方式，能够将电子模块小型化的同时提高散热性。
进一步，在具有盖部40的电子模块1中，电子模块10及电子模块20以密闭状态被收纳在散热器30中。这样，能够在将随着电子模块1的动作而向外部放出的电磁波减少的同时，抑制由于从外部的电磁波而导致的对电子模块的动作的影响。
另外，如图1所示，电子模块1也可以进一步包括填充在盖部40的内部的封装树脂45。这个封装树脂45被填充在盖部40的内部，从而将电子元件12，电子元件22及电子元件23埋设（埋入并设置）。这样，能够提高对于振动、温度及湿度等的外部环境的承受能力。
另外，封装树脂45含有由热传导率高的材料构成的填充物（filler），还可以由能提高热传导性的树脂构成。这样，能够进一步提高电子模块1的散热性。
另外，如图4所示，也可以在基板11上配置散热片（sheet）和散热膏（grease）等的热传导部件17。具体是，也可以使得在导体层15上设有凹部15a，热传导部件17被配置在凹部15a上，以使得热传导部件17与收纳部31a的内壁面相接触。这样，与在没有设置凹部15a的基板11和收纳部31a的内壁面之间配置热传导部件的情况相比，绝缘基材13与散热器30之间的距离仅缩短了凹部15a的深度的部分。其结果，能够进一步提高电子模块1的散热性。
随后，对实施方式一涉及的电子模块1的制造方法进行说明。
首先，在基板11的主面11a上通过导电性接合构件16装载电子元件12。更具体的是，在基板11的主面11a上将焊膏等的导电性接合构件16印刷形成在预定的位置上，之后，将电子元件12通过安装机（mounter）装载在导电性接合构件16上。同样地，在基板21的主面21a上通过导电性接合构件16装载电子元件22，并在基板21的主面21b上通过导电性接合构件16装载电子元件23。
随后，如图2所示，将装载了电子元件22、23的基板21与装载了电子元件12的基板11对向配置。这时，连接部件18被夹持在电子元件12与电子元件22之间，并且，连接部件19插入并贯穿基板21的贯穿孔并与电子元件12通过导电性接合构件16相连接。之后，实施加热处理（回流（reflow））,将电子元件12、22、23及连接部件18、19固定。从而制造层积模块29（组装工序）。这样，由于能够通过一次性回流（整体回流）制造层积模块29，因此能够缩短制造工序数量及制造时间。另外，回流后，根据需要，将安装在基板21上的电子元件之间通过金属线（wire）电连接也是可以的。
随后，将盖部40覆盖层积模块29，从而使得盖部40容纳基板21且覆盖基板11的主面11a。换句话说，将盖部40覆盖层积模块29，以使得盖部40的开口端与基板11的主面11a碰接。另外，如图1所示，以盖部40覆盖层积模块29的状态，基板21的侧面21c与盖部40的内表面相接触。另外，盖部40通过粘合剂（硅粘合剂）被固定在基板11上。
随后，通过从盖部40的树脂注入口41注入树脂，向盖部40中填充树脂，从而将电子元件12、电子元件22及电子元件23埋设（树脂填充工序）。更详细的是，向树脂注入口41注入的树脂充满由盖部40和基板21划分成的空间（上部空间），同时，还穿过贯穿孔27充满由盖部40、基板11及基板21划分成的空间（下部空间）。之后，最终地，树脂填充上部空间及下部空间，将电子元件12、电子元件22及电子元件23埋设。这样，通过在基板21上设置贯穿孔27，从而不再需要以上部空间和下部空间将树脂填充工序分开，能够提高树脂填充工序的效率。
随后，将制造出的层积模块29收纳在设置在散热器30的底板部31内部的收纳部31a中，从而使得基板11的主面11b与收纳部31a的内壁面相接触（收纳工序）。在本工序中，把被盖部40覆盖的层积模块29收纳在散热器30内，以使得盖部40的外表面与收纳部31a的内壁面相接触。
经过上述工序，即可以制造可小型化的同时能够保持散热性的电子模块1（图1）。
实施方式二
对于本发明的实施方式二，参照图5进行说明。图5是实施方式二涉及的电子模块1A的截面图。实施方式二与实施方式一的不同点之一在于盖部的结构。以下，围绕这个不同点对实施方式二进行说明。
如图5所示，在实施方式二中，盖部40A覆盖基板21的主面21b，而基板11与基板21之间的空间没有被盖部40A所覆盖。另外，盖部40A的外表面与散热器30的收纳部31a的内壁面相接触。
另外，盖部40A比较理想的是由表面被绝缘处理的金属（例如被铝阳极氧化处理的铝）构成，但也可以使其由绝缘体构成。
如图5所示，在盖部40A上，设有将盖部40A向厚度方向贯穿的树脂注入口42。树脂注入口42例如被设置在盖部40A的上表面（与基板21相对向的面）。通过从树脂注入口42注入树脂，能够形成封装树脂45A（后述）。
通过设置这样的盖部40A，使得电子模块10及电子模块20的热不仅可以从基板11，还可以从盖部40A向散热器30散发。因此，与实施方式一的情况相同，根据实施方式二，能够将电子模块小型化的同时提高散热性。
另外，如图5所示，电子模块1A也可以进一步具有填充在盖部40A的内部的封装树脂45A。这个封装树脂45A被填充在盖部40A的内部，从而将电子元件23埋设。这样，就能够提高对于振动、温度及湿度等外部环境的承受能力。
另外，如图5所示，电子模块1A还可以进一步包括为了将电子元件12及电子元件22埋设，而被填充在电子模块10及电子模块20之间的封装树脂45B。
封装树脂45A、45B含有由热传导率高的材料构成的填充物，也可以由能够提高热传导性的树脂构成。这样，能够进一步提高电子模块1A的散热性。
随后，对实施方式二涉及的电子模块1A的制造方法进行说明。到制造层积模块29为止的工序由于与实施方式一涉及的电子模块1的制造方法相同，因此省略其说明，仅从接下来的工序开始进行说明。
如图5所示，将具有与散热器30的收纳部31a相嵌合的外形的盖部40A覆盖层积模块29，从而使得盖部40A覆盖基板21的主面21b。换句话说，将盖部40A覆盖层积模块29，以使得盖部40A的开口端与基板21的主面21b碰接。盖部40A通过粘合剂（硅粘合剂等）被固定在基板21上。
随后，通过从盖部40A的树脂注入口42注入树脂，来向盖部40A中填充树脂，从而将电子元件23埋设。
随后，将制成的层积模块29收纳在散热器30的收纳部31a中，从而使得基板11的主面11b与收纳部31a的内壁面相接触（收纳工序）。在本工序中，是将被盖部40A覆盖的层积模块29收纳在散热器30中，从而使得盖部40A的外表面与收纳部31a的内壁面相接触。另外，如图5所示，在收纳状态下，也可以使得基板21的端部与收纳部31a内壁面相接触，从而进一步提高散热性。
随后，为了将电子元件12及电子元件22埋设，而向收纳部31a中填充树脂。在本工序中，为了防止树脂从收纳部31a漏出从而使树脂填充工作容易进行，与形成为贯穿孔的情况相比，收纳部31a在底板部31的侧面或是上表面形成为凹部形状更好。
经过上述工序，即可以制造可小型化的同时能够保持散热性的电子模块1A（图5）。
基于上述的记载，若是本行业者，也许能够想到本发明的追加效果和种种的变形，而本发明的实施形态，不限于上述各个实施方式。也可以对不同的实施方式之间的构成要素适宜地进行组合。在不脱离从权利要求书中规定的内容及其对等物推导出的本发明的概括性的思想和主旨的范围内，可以有种种的追加，变更及部分删除。
符号说明
1、1A电子模块
10、20电子模块
11、21、111、121基板
12、22、23、112、122电子元件
12a控制端子
13、24绝缘基材
14、25、26导体模板
15导体层
15a凹部
16导电性接合构件
17热传导部件
18、19、28连接部件
21c侧面
27贯穿孔
29层积模块
30、130散热器
31、131底板部
31a收纳部
32、132鳍片
40、40A盖部
41、42树脂注入口
45、45A、45B封装树脂
100调节器
110功率部
113连接端子
120控制部
123外部连接端子

Claims (15)

1.一种电子模块，其特征在于，包括：
第一电子模块，具有包含第一主面及所述第一主面的相反一侧的第二主面的第一基板，并具有安装在所述第一主面上的第一电子元件；
第二电子模块，具有包含第三主面及所述第三主面的相反一侧的第四主面且所述第三主面被配置为与所述第一主面相对向的第二基板，具有安装在所述第三主面上且通过第一连接部件与所述第一电子元件电连接的第二电子元件，并具有安装在所述第四主面上且通过将所述第二基板向厚度方向贯穿的第二连接部件与所述第一电子元件电连接的第三电子元件，并且，所述第二电子模块通过所述第一连接部件及所述第二连接部件与所述第一电子模块热连接；以及
散热器，具有在内部设有收纳部的底板部，并且将所述第一电子模块及所述第二电子模块收纳在所述收纳部从而使得所述第一基板的所述第二主面与所述收纳部的内壁面相接触并且使得所述第二基板被配置在所述收纳部内。
2.根据权利要求1所述的电子模块，其特征在于，还包括：
盖部，在容纳所述第二基板且覆盖所述第一基板的所述第一主面的同时，外表面与所述散热器的所述收纳部的内壁面相接触，
其中，所述第二基板的侧面与所述盖部的内表面相接触。
3.根据权利要求2所述的电子模块，其特征在于：
其中，所述盖部由表面被绝缘处理的金属构成。
4.根据权利要求2所述的电子模块，其特征在于，还包括：
封装树脂，被填充在所述盖部的内部，从而将所述第一电子元件、所述第二电子元件及所述第三电子元件埋设。
5.根据权利要求1所述的电子模块，其特征在于，还包括：
盖部，覆盖所述第二基板的所述第四主面，且外表面与所述散热器的所述收纳部的内壁面相接触。
6.根据权利要求5所述的电子模块，其特征在于：
其中，所述盖部由表面被绝缘处理的金属构成。
7.根据权利要求5所述的电子模块，其特征在于，还包括：
封装树脂，被填充在所述盖部的内部，从而将所述第三电子元件埋设。
8.根据权利要求5所述的电子模块，其特征在于，还包括：
封装树脂，被填充在所述第一电子模块及所述第二电子模块之间，从而将所述第一电子元件及所述第二电子元件埋设。
9.根据权利要求1所述的电子模块，其特征在于：
其中，所述第一基板具有：
第一绝缘基材；
导体模板，被设置在所述第一绝缘基材的所述第一主面侧的主面上，通过导电性接合构件与所述第一电子元件电连接；以及
导体层，被设置在所述第一绝缘基材的所述第二主面侧的主面上，与所述散热器的所述收纳部的内壁面相接触。
10.根据权利要求9所述的电子模块，其特征在于：
其中，在所述导体层上设有凹部，在所述凹部上配置有热传导部件，从而使得所述热传导部件与所述收纳部的内壁面相接触。
11.一种电子模块的制造方法，其特征在于，包括：
在第一基板的一个主面上通过导电性接合构件装载第一电子元件的工序；
在第二基板的一个主面上通过导电性接合构件装载第二电子元件，并在所述第二基板的另一个主面上通过导电性接合构件装载第三电子元件的工序；
由导电性的材料构成的第一连接部件被夹持在所述第一电子元件与所述第二电子元件之间，并且，将所述第二基板配置为与所述第一基板相对向从而使得由导电性的材料构成的第二连接部件插入并贯穿将所述第二基板向厚度方向贯穿的贯穿孔并与所述第一电子元件通过导电性接合构件相连接后，实施加热处理从而将所述第一电子元件、所述第二电子元件及所述第三电子元件和所述第一连接部件及第二连接部件固定，从而制造层积模块的组装工序；以及
将所述层积模块收纳在设在散热器的底板部的内部的收纳部中，从而使得所述第一基板的另一个主面与所述收纳部的内壁面相接触并且使得所述第二基板被配置在所述收纳部内的收纳工序。
12.根据权利要求11所述的电子模块的制造方法，其特征在于，在所述组装工序之后，且在所述收纳工序之前，还包括：
将具有与所述收纳部相嵌合的外形的盖部覆盖所述层积模块，从而使得所述盖部容纳所述第二基板并且覆盖所述第一基板的所述一个主面的工序，
其中，在所述收纳工序中，将被所述盖部覆盖的所述层积模块收纳在所述散热器中，从而使得所述盖部的外表面与所述收纳部的内壁面相接触。
13.根据权利要求12所述的电子模块的制造方法，其特征在于：
其中，在所述盖部上设有将所述盖部向厚度方向贯穿的树脂注入口，
在所述第二基板上设有将所述第二基板向厚度方向贯穿的贯穿口，
在所述层积模块上覆盖了所述盖部后，通过从所述盖部的所述树脂注入口注入树脂，向所述盖部内填充树脂，从而将所述第一电子元件、所述第二电子元件及所述第三电子元件埋设。
14.根据权利要求11所述的电子模块的制造方法，其特征在于，在所述组装工序之后，且在所述收纳工序之前，还包括：
将具有与所述收纳部相嵌合的外形的盖部覆盖所述层积模块，从而使得所述盖部覆盖所述第二基板的所述另一个主面的工序，
其中，在所述收纳工序中，将被所述盖部覆盖的所述层积模块收纳在所述散热器中，从而使得所述盖部的外表面与所述收纳部的内壁面相接触。
15.根据权利要求14所述的电子模块的制造方法，其特征在于：
其中，在所述盖部上设有将所述盖部向厚度方向贯穿的树脂注入口，
所述电子模块的制造方法还包括：
在所述层积模块上覆盖了所述盖部后，通过从所述盖部的所述树脂注入口注入树脂，向所述盖部内填充树脂，从而将所述第三电子元件埋设的工序；以及
在所述收纳工序之后，向所述收纳部内填充树脂，从而将所述第一电子元件及所述第二电子元件埋设的工序。
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