TWI688633B - 具有樹脂層的工件固定片 - Google Patents
具有樹脂層的工件固定片 Download PDFInfo
- Publication number
- TWI688633B TWI688633B TW104130756A TW104130756A TWI688633B TW I688633 B TWI688633 B TW I688633B TW 104130756 A TW104130756 A TW 104130756A TW 104130756 A TW104130756 A TW 104130756A TW I688633 B TWI688633 B TW I688633B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin layer
- meth
- curable resin
- acrylate
- mass
- Prior art date
Links
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-192505 | 2014-09-22 | ||
JP2014192505 | 2014-09-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201623505A TW201623505A (zh) | 2016-07-01 |
TWI688633B true TWI688633B (zh) | 2020-03-21 |
Family
ID=55581092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104130756A TWI688633B (zh) | 2014-09-22 | 2015-09-17 | 具有樹脂層的工件固定片 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6817813B2 (ko) |
KR (1) | KR102421250B1 (ko) |
CN (1) | CN106661395B (ko) |
SG (1) | SG11201610483UA (ko) |
TW (1) | TWI688633B (ko) |
WO (1) | WO2016047565A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7240378B2 (ja) * | 2018-03-30 | 2023-03-15 | リンテック株式会社 | 硬化封止体の反り防止用積層体、及び、硬化封止体の製造方法 |
CN109456708B (zh) * | 2018-11-06 | 2021-03-02 | 合肥鑫晟光电科技有限公司 | 胶膜、显示面板的封装方法及显示装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI403568B (zh) * | 2010-02-01 | 2013-08-01 | Nitto Denko Corp | 半導體裝置製造用薄膜及半導體裝置的製造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4300393B2 (ja) * | 2002-07-04 | 2009-07-22 | 日立化成工業株式会社 | 接着シート並びに半導体装置及びその製造方法 |
JP4275522B2 (ja) * | 2003-12-26 | 2009-06-10 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP2006245352A (ja) * | 2005-03-04 | 2006-09-14 | Nitta Ind Corp | ウエハのダイシング用テープ、半導体チップのピックアップ方法 |
JP4794971B2 (ja) * | 2005-03-23 | 2011-10-19 | 古河電気工業株式会社 | ダイシングダイボンドシート |
JP4822885B2 (ja) * | 2006-03-14 | 2011-11-24 | 日東電工株式会社 | 半導体用粘着シート |
JP2007258437A (ja) * | 2006-03-23 | 2007-10-04 | Nippon Steel Chem Co Ltd | ダイボンドダイシング積層フィルム |
JP2007254590A (ja) * | 2006-03-23 | 2007-10-04 | Nippon Steel Chem Co Ltd | ダイボンドダイシングフィルム |
JP4717051B2 (ja) * | 2007-11-08 | 2011-07-06 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
EP2151857A2 (en) * | 2008-08-04 | 2010-02-10 | Nitto Denko Corporation | Dicing die-bonding film |
JP4994429B2 (ja) * | 2008-08-04 | 2012-08-08 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP4845065B2 (ja) * | 2009-08-05 | 2011-12-28 | 古河電気工業株式会社 | 粘着フィルム及び半導体ウエハ加工用テープ |
JP5143196B2 (ja) * | 2009-09-28 | 2013-02-13 | 日東電工株式会社 | 半導体装置用フィルム |
JP2011174042A (ja) * | 2010-02-01 | 2011-09-08 | Nitto Denko Corp | 半導体装置製造用フィルム及び半導体装置の製造方法 |
CN102511077B (zh) * | 2010-08-05 | 2015-07-29 | 古河电气工业株式会社 | 粘合薄膜以及半导体晶片加工用胶带 |
JP5781302B2 (ja) | 2010-12-28 | 2015-09-16 | 日東電工株式会社 | 放射線硬化型粘着剤組成物及び粘着シート |
JP5184685B1 (ja) * | 2011-09-26 | 2013-04-17 | 古河電気工業株式会社 | 半導体ウエハ加工用テープ |
JP5294358B2 (ja) * | 2012-01-06 | 2013-09-18 | 古河電気工業株式会社 | ウエハ加工用テープ及びこれを使用した半導体装置の製造方法 |
JP6333596B2 (ja) * | 2014-03-26 | 2018-05-30 | リンテック株式会社 | 樹脂層付きワーク固定シートの製造方法 |
-
2015
- 2015-09-17 TW TW104130756A patent/TWI688633B/zh active
- 2015-09-17 WO PCT/JP2015/076548 patent/WO2016047565A1/ja active Application Filing
- 2015-09-17 SG SG11201610483UA patent/SG11201610483UA/en unknown
- 2015-09-17 CN CN201580037767.4A patent/CN106661395B/zh active Active
- 2015-09-17 KR KR1020177000230A patent/KR102421250B1/ko active IP Right Grant
- 2015-09-17 JP JP2016550156A patent/JP6817813B2/ja active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI403568B (zh) * | 2010-02-01 | 2013-08-01 | Nitto Denko Corp | 半導體裝置製造用薄膜及半導體裝置的製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201623505A (zh) | 2016-07-01 |
CN106661395A (zh) | 2017-05-10 |
WO2016047565A1 (ja) | 2016-03-31 |
SG11201610483UA (en) | 2017-03-30 |
KR102421250B1 (ko) | 2022-07-14 |
KR20170058910A (ko) | 2017-05-29 |
JPWO2016047565A1 (ja) | 2017-06-29 |
JP6817813B2 (ja) | 2021-01-20 |
CN106661395B (zh) | 2021-05-28 |
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