SG11201610483UA - Workpiece securing sheet with attached resin layer - Google Patents

Workpiece securing sheet with attached resin layer

Info

Publication number
SG11201610483UA
SG11201610483UA SG11201610483UA SG11201610483UA SG11201610483UA SG 11201610483U A SG11201610483U A SG 11201610483UA SG 11201610483U A SG11201610483U A SG 11201610483UA SG 11201610483U A SG11201610483U A SG 11201610483UA SG 11201610483U A SG11201610483U A SG 11201610483UA
Authority
SG
Singapore
Prior art keywords
resin layer
attached resin
securing sheet
workpiece securing
workpiece
Prior art date
Application number
SG11201610483UA
Inventor
Masanori Yamagishi
Naoya Saiki
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG11201610483UA publication Critical patent/SG11201610483UA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
SG11201610483UA 2014-09-22 2015-09-17 Workpiece securing sheet with attached resin layer SG11201610483UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014192505 2014-09-22
PCT/JP2015/076548 WO2016047565A1 (en) 2014-09-22 2015-09-17 Workpiece securing sheet with attached resin layer

Publications (1)

Publication Number Publication Date
SG11201610483UA true SG11201610483UA (en) 2017-03-30

Family

ID=55581092

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201610483UA SG11201610483UA (en) 2014-09-22 2015-09-17 Workpiece securing sheet with attached resin layer

Country Status (6)

Country Link
JP (1) JP6817813B2 (en)
KR (1) KR102421250B1 (en)
CN (1) CN106661395B (en)
SG (1) SG11201610483UA (en)
TW (1) TWI688633B (en)
WO (1) WO2016047565A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019187249A1 (en) * 2018-03-30 2019-10-03 リンテック株式会社 Multilayer body for preventing warp of cured sealed body and method for producing cured sealed body
CN109456708B (en) * 2018-11-06 2021-03-02 合肥鑫晟光电科技有限公司 Adhesive film, packaging method of display panel and display device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4300393B2 (en) * 2002-07-04 2009-07-22 日立化成工業株式会社 Adhesive sheet, semiconductor device and manufacturing method thereof
JP4275522B2 (en) * 2003-12-26 2009-06-10 日東電工株式会社 Dicing die bond film
JP2006245352A (en) * 2005-03-04 2006-09-14 Nitta Ind Corp Wafer dicing tape, and semiconductor-chip picking-up method
JP4794971B2 (en) * 2005-03-23 2011-10-19 古河電気工業株式会社 Dicing die bond sheet
JP4822885B2 (en) * 2006-03-14 2011-11-24 日東電工株式会社 Adhesive sheet for semiconductor
JP2007254590A (en) * 2006-03-23 2007-10-04 Nippon Steel Chem Co Ltd Die bond dicing film
JP2007258437A (en) * 2006-03-23 2007-10-04 Nippon Steel Chem Co Ltd Die bond dicing laminate film
JP4717051B2 (en) * 2007-11-08 2011-07-06 日東電工株式会社 Dicing die bond film
EP2151858A2 (en) * 2008-08-04 2010-02-10 Nitto Denko Corporation Dicing die-bonding film
EP2151857A2 (en) * 2008-08-04 2010-02-10 Nitto Denko Corporation Dicing die-bonding film
JP4845065B2 (en) * 2009-08-05 2011-12-28 古河電気工業株式会社 Adhesive film and tape for semiconductor wafer processing
JP5143196B2 (en) * 2009-09-28 2013-02-13 日東電工株式会社 Film for semiconductor devices
KR101083959B1 (en) * 2010-02-01 2011-11-16 닛토덴코 가부시키가이샤 Film for producing semiconductor device and process for producing semiconductor device
JP2011174042A (en) * 2010-02-01 2011-09-08 Nitto Denko Corp Film for producing semiconductor device and method for producing semiconductor device
CN102511077B (en) * 2010-08-05 2015-07-29 古河电气工业株式会社 Adhesive film and semiconductor wafer processing adhesive tape
JP5781302B2 (en) 2010-12-28 2015-09-16 日東電工株式会社 Radiation curable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
JP5184685B1 (en) * 2011-09-26 2013-04-17 古河電気工業株式会社 Semiconductor wafer processing tape
JP5294358B2 (en) * 2012-01-06 2013-09-18 古河電気工業株式会社 Wafer processing tape and semiconductor device manufacturing method using the same
JP6333596B2 (en) * 2014-03-26 2018-05-30 リンテック株式会社 Manufacturing method of workpiece fixing sheet with resin layer

Also Published As

Publication number Publication date
CN106661395A (en) 2017-05-10
JPWO2016047565A1 (en) 2017-06-29
TWI688633B (en) 2020-03-21
KR20170058910A (en) 2017-05-29
WO2016047565A1 (en) 2016-03-31
KR102421250B1 (en) 2022-07-14
TW201623505A (en) 2016-07-01
JP6817813B2 (en) 2021-01-20
CN106661395B (en) 2021-05-28

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