TWI688633B - 具有樹脂層的工件固定片 - Google Patents

具有樹脂層的工件固定片 Download PDF

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Publication number
TWI688633B
TWI688633B TW104130756A TW104130756A TWI688633B TW I688633 B TWI688633 B TW I688633B TW 104130756 A TW104130756 A TW 104130756A TW 104130756 A TW104130756 A TW 104130756A TW I688633 B TWI688633 B TW I688633B
Authority
TW
Taiwan
Prior art keywords
resin layer
meth
curable resin
acrylate
mass
Prior art date
Application number
TW104130756A
Other languages
English (en)
Chinese (zh)
Other versions
TW201623505A (zh
Inventor
山岸正憲
佐伯尙哉
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201623505A publication Critical patent/TW201623505A/zh
Application granted granted Critical
Publication of TWI688633B publication Critical patent/TWI688633B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
TW104130756A 2014-09-22 2015-09-17 具有樹脂層的工件固定片 TWI688633B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-192505 2014-09-22
JP2014192505 2014-09-22

Publications (2)

Publication Number Publication Date
TW201623505A TW201623505A (zh) 2016-07-01
TWI688633B true TWI688633B (zh) 2020-03-21

Family

ID=55581092

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104130756A TWI688633B (zh) 2014-09-22 2015-09-17 具有樹脂層的工件固定片

Country Status (6)

Country Link
JP (1) JP6817813B2 (ja)
KR (1) KR102421250B1 (ja)
CN (1) CN106661395B (ja)
SG (1) SG11201610483UA (ja)
TW (1) TWI688633B (ja)
WO (1) WO2016047565A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7240378B2 (ja) * 2018-03-30 2023-03-15 リンテック株式会社 硬化封止体の反り防止用積層体、及び、硬化封止体の製造方法
CN109456708B (zh) * 2018-11-06 2021-03-02 合肥鑫晟光电科技有限公司 胶膜、显示面板的封装方法及显示装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI403568B (zh) * 2010-02-01 2013-08-01 Nitto Denko Corp 半導體裝置製造用薄膜及半導體裝置的製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4300393B2 (ja) * 2002-07-04 2009-07-22 日立化成工業株式会社 接着シート並びに半導体装置及びその製造方法
JP4275522B2 (ja) * 2003-12-26 2009-06-10 日東電工株式会社 ダイシング・ダイボンドフィルム
JP2006245352A (ja) * 2005-03-04 2006-09-14 Nitta Ind Corp ウエハのダイシング用テープ、半導体チップのピックアップ方法
JP4794971B2 (ja) * 2005-03-23 2011-10-19 古河電気工業株式会社 ダイシングダイボンドシート
JP4822885B2 (ja) * 2006-03-14 2011-11-24 日東電工株式会社 半導体用粘着シート
JP2007258437A (ja) * 2006-03-23 2007-10-04 Nippon Steel Chem Co Ltd ダイボンドダイシング積層フィルム
JP2007254590A (ja) * 2006-03-23 2007-10-04 Nippon Steel Chem Co Ltd ダイボンドダイシングフィルム
JP4717051B2 (ja) * 2007-11-08 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4628479B2 (ja) * 2008-08-04 2011-02-09 日東電工株式会社 ダイシング・ダイボンドフィルム
EP2151858A2 (en) * 2008-08-04 2010-02-10 Nitto Denko Corporation Dicing die-bonding film
JP4845065B2 (ja) * 2009-08-05 2011-12-28 古河電気工業株式会社 粘着フィルム及び半導体ウエハ加工用テープ
JP5143196B2 (ja) * 2009-09-28 2013-02-13 日東電工株式会社 半導体装置用フィルム
JP2011174042A (ja) * 2010-02-01 2011-09-08 Nitto Denko Corp 半導体装置製造用フィルム及び半導体装置の製造方法
CN102511077B (zh) * 2010-08-05 2015-07-29 古河电气工业株式会社 粘合薄膜以及半导体晶片加工用胶带
JP5781302B2 (ja) 2010-12-28 2015-09-16 日東電工株式会社 放射線硬化型粘着剤組成物及び粘着シート
JP5184685B1 (ja) * 2011-09-26 2013-04-17 古河電気工業株式会社 半導体ウエハ加工用テープ
JP5294358B2 (ja) * 2012-01-06 2013-09-18 古河電気工業株式会社 ウエハ加工用テープ及びこれを使用した半導体装置の製造方法
JP6333596B2 (ja) * 2014-03-26 2018-05-30 リンテック株式会社 樹脂層付きワーク固定シートの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI403568B (zh) * 2010-02-01 2013-08-01 Nitto Denko Corp 半導體裝置製造用薄膜及半導體裝置的製造方法

Also Published As

Publication number Publication date
JPWO2016047565A1 (ja) 2017-06-29
CN106661395B (zh) 2021-05-28
KR102421250B1 (ko) 2022-07-14
JP6817813B2 (ja) 2021-01-20
KR20170058910A (ko) 2017-05-29
TW201623505A (zh) 2016-07-01
CN106661395A (zh) 2017-05-10
SG11201610483UA (en) 2017-03-30
WO2016047565A1 (ja) 2016-03-31

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