TWI676664B - 觸摸面板 - Google Patents

觸摸面板 Download PDF

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Publication number
TWI676664B
TWI676664B TW104107142A TW104107142A TWI676664B TW I676664 B TWI676664 B TW I676664B TW 104107142 A TW104107142 A TW 104107142A TW 104107142 A TW104107142 A TW 104107142A TW I676664 B TWI676664 B TW I676664B
Authority
TW
Taiwan
Prior art keywords
adhesive
scattering prevention
touch panel
sheet
cover glass
Prior art date
Application number
TW104107142A
Other languages
English (en)
Chinese (zh)
Other versions
TW201542750A (zh
Inventor
大橋仁
Hitoshi Ohashi
高橋洋一
Yoichi Takahashi
Original Assignee
日商琳得科股份有限公司
Lintec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司, Lintec Corporation filed Critical 日商琳得科股份有限公司
Publication of TW201542750A publication Critical patent/TW201542750A/zh
Application granted granted Critical
Publication of TWI676664B publication Critical patent/TWI676664B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/14—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW104107142A 2014-03-07 2015-03-06 觸摸面板 TWI676664B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2014/056067 2014-03-07
PCT/JP2014/056067 WO2015132975A1 (fr) 2014-03-07 2014-03-07 Feuille adhésive de prévention de diffusion

Publications (2)

Publication Number Publication Date
TW201542750A TW201542750A (zh) 2015-11-16
TWI676664B true TWI676664B (zh) 2019-11-11

Family

ID=54054804

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104107142A TWI676664B (zh) 2014-03-07 2015-03-06 觸摸面板

Country Status (5)

Country Link
JP (1) JP6251801B2 (fr)
KR (1) KR102196579B1 (fr)
CN (1) CN106062111B (fr)
TW (1) TWI676664B (fr)
WO (1) WO2015132975A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102090970B1 (ko) * 2015-11-06 2020-03-20 와커 헤미 아게 기판의 라미네이션 방법 및 이 방법에 의해 제조된 생성물
WO2017159789A1 (fr) * 2016-03-17 2017-09-21 王子ホールディングス株式会社 Feuille adhésive, et stratifié
KR102179018B1 (ko) * 2016-03-17 2020-11-16 오지 홀딩스 가부시키가이샤 점착제 조성물 및 점착 시트
KR102549675B1 (ko) * 2021-08-05 2023-06-30 (주)유티아이 강도가 개선된 플렉시블 커버 윈도우

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101802122A (zh) * 2007-09-20 2010-08-11 东洋纺织株式会社 粘合片、触摸面板用上部电极及图像显示装置
JP2011170511A (ja) * 2010-02-17 2011-09-01 Alps Electric Co Ltd 静電容量式の入力装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3695514B2 (ja) * 1999-09-10 2005-09-14 クレハエラストマー株式会社 表示画面用保護フィルム
JP4784720B2 (ja) * 2001-09-25 2011-10-05 信越化学工業株式会社 粘着テープ
JP5179640B2 (ja) * 2005-04-08 2013-04-10 日東電工株式会社 発泡部材
JP2007034027A (ja) * 2005-07-28 2007-02-08 Nof Corp ディスプレイ用表面材及びそれを備えたディスプレイ
CN103013368A (zh) * 2006-03-24 2013-04-03 信越化学工业株式会社 平板显示器的表面的保护方法
DE102009011165A1 (de) * 2009-03-04 2010-09-09 Tesa Se Haftklebemasse
CN102803419B (zh) * 2009-06-18 2015-06-10 日东电工株式会社 光学用粘合片
JP2011168652A (ja) 2010-02-16 2011-09-01 Lintec Corp 飛散防止用粘着シート、飛散防止ガラスパネル、および携帯情報端末機器
JP5469194B2 (ja) 2011-05-02 2014-04-09 日東電工株式会社 粘着剤、粘着剤層、および粘着シート
JP5760679B2 (ja) * 2011-05-18 2015-08-12 王子ホールディングス株式会社 ハードコートフィルム及び積層体
JP2013166873A (ja) * 2012-02-16 2013-08-29 Nitto Denko Corp 発泡部材用キャリアテープ、発泡部材複合体、ポリエステル系発泡部材の搬送方法、ポリエステル系発泡部材の加工方法、および、ポリエステル系発泡部材の組み付け方法
KR101907238B1 (ko) * 2014-07-16 2018-10-12 주식회사 엘지화학 점착제층을 포함하는 터치 스크린 패널

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101802122A (zh) * 2007-09-20 2010-08-11 东洋纺织株式会社 粘合片、触摸面板用上部电极及图像显示装置
JP2011170511A (ja) * 2010-02-17 2011-09-01 Alps Electric Co Ltd 静電容量式の入力装置

Also Published As

Publication number Publication date
TW201542750A (zh) 2015-11-16
JP6251801B2 (ja) 2017-12-20
KR20160137570A (ko) 2016-11-30
KR102196579B1 (ko) 2020-12-30
CN106062111B (zh) 2020-02-28
JPWO2015132975A1 (ja) 2017-04-06
WO2015132975A1 (fr) 2015-09-11
CN106062111A (zh) 2016-10-26

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