TWI674180B - 切削裝置 - Google Patents

切削裝置 Download PDF

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Publication number
TWI674180B
TWI674180B TW105107381A TW105107381A TWI674180B TW I674180 B TWI674180 B TW I674180B TW 105107381 A TW105107381 A TW 105107381A TW 105107381 A TW105107381 A TW 105107381A TW I674180 B TWI674180 B TW I674180B
Authority
TW
Taiwan
Prior art keywords
pair
workpiece
cutting
auxiliary
cassette
Prior art date
Application number
TW105107381A
Other languages
English (en)
Chinese (zh)
Other versions
TW201703957A (zh
Inventor
大河原聡
八木原惇
寺師健太郎
赤瀬勝彦
松岡伸太郎
田中万平
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201703957A publication Critical patent/TW201703957A/zh
Application granted granted Critical
Publication of TWI674180B publication Critical patent/TWI674180B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW105107381A 2015-04-28 2016-03-10 切削裝置 TWI674180B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-092101 2015-04-28
JP2015092101A JP6441737B2 (ja) 2015-04-28 2015-04-28 切削装置

Publications (2)

Publication Number Publication Date
TW201703957A TW201703957A (zh) 2017-02-01
TWI674180B true TWI674180B (zh) 2019-10-11

Family

ID=57486683

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105107381A TWI674180B (zh) 2015-04-28 2016-03-10 切削裝置

Country Status (4)

Country Link
JP (1) JP6441737B2 (ko)
KR (1) KR102405690B1 (ko)
CN (1) CN106098621B (ko)
TW (1) TWI674180B (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6560110B2 (ja) * 2015-11-30 2019-08-14 株式会社ディスコ 切削装置
WO2018079561A1 (ja) 2016-10-24 2018-05-03 パイオニア株式会社 センサ装置、センシング方法、プログラム及び記憶媒体
KR101856875B1 (ko) * 2016-12-06 2018-05-10 에스케이실트론 주식회사 웨이퍼 캐리어 두께 측정장치
JP6762220B2 (ja) * 2016-12-15 2020-09-30 株式会社ディスコ 加工装置の搬送機構
JP6896326B2 (ja) * 2017-03-06 2021-06-30 株式会社ディスコ 加工装置
JP6909621B2 (ja) * 2017-04-24 2021-07-28 株式会社ディスコ ウォータージェット加工装置
JP6855130B2 (ja) * 2017-06-16 2021-04-07 株式会社ディスコ 加工装置
KR102581316B1 (ko) * 2017-07-12 2023-09-22 도쿄엘렉트론가부시키가이샤 반송 장치, 기판 처리 시스템, 반송 방법 및 기판 처리 방법
JP7032122B2 (ja) * 2017-12-22 2022-03-08 株式会社ディスコ 切削装置
JP7463032B2 (ja) 2020-05-22 2024-04-08 株式会社ディスコ 被加工物の保持機構及び加工装置
CN114043368B (zh) * 2021-11-01 2024-02-06 宁波市易特磁业有限公司 一种磁性材料切割装置及加工方法
CN117276161B (zh) * 2023-11-22 2024-02-02 和研半导体设备(沈阳)有限公司 一种晶圆加工系统及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1126402A (ja) * 1997-07-02 1999-01-29 Disco Abrasive Syst Ltd 精密切削装置及び切削方法
US6354912B1 (en) * 1997-12-02 2002-03-12 Tokyo Seimitsu Co., Ltd. Workpiece cutting method for use with dicing machine
JP2002299288A (ja) * 2001-04-02 2002-10-11 Tokyo Seimitsu Co Ltd バーコードリーダ付半導体製造装置
TW200414968A (en) * 2003-01-28 2004-08-16 Disco Corp Machining apparatus equipped with rotary tool

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05338728A (ja) * 1992-06-05 1993-12-21 Fujitsu Ltd ウエーハ搬送方法及び装置
JP3203364B2 (ja) * 1997-12-01 2001-08-27 株式会社東京精密 アライメント方法及びその装置
JPH11204461A (ja) * 1998-01-09 1999-07-30 Disco Abrasive Syst Ltd フレーム位置決め装置及びフレーム位置決め方法
JP2000232080A (ja) 1999-02-10 2000-08-22 Disco Abrasive Syst Ltd 被加工物の分割システム及びペレットの移し替え装置
JP4447074B2 (ja) * 1999-06-21 2010-04-07 株式会社ディスコ 切削装置
JP2001053034A (ja) * 1999-08-13 2001-02-23 Tokyo Seimitsu Co Ltd ワークテーブルの送り機構及びダイシング装置
JP3956643B2 (ja) * 2001-04-27 2007-08-08 株式会社東京精密 ダイシングマシン
US6826986B2 (en) * 2001-05-05 2004-12-07 Ah Beng Lim Bi-directional singulation system and method
JP4796249B2 (ja) 2001-09-14 2011-10-19 株式会社ディスコ 板状物の搬送機構および搬送機構を備えたダイシング装置
JP4813855B2 (ja) 2005-09-12 2011-11-09 株式会社ディスコ 切削装置および加工方法
JP2010003876A (ja) 2008-06-20 2010-01-07 Disco Abrasive Syst Ltd 切削装置
JP5373517B2 (ja) 2009-09-14 2013-12-18 株式会社ディスコ 搬送機構および加工装置
JP5964548B2 (ja) 2011-02-24 2016-08-03 株式会社ディスコ ウエーハ加工装置
JP5975703B2 (ja) * 2012-04-09 2016-08-23 株式会社ディスコ 切削装置
JP6214901B2 (ja) * 2013-04-04 2017-10-18 株式会社ディスコ 切削装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1126402A (ja) * 1997-07-02 1999-01-29 Disco Abrasive Syst Ltd 精密切削装置及び切削方法
US6354912B1 (en) * 1997-12-02 2002-03-12 Tokyo Seimitsu Co., Ltd. Workpiece cutting method for use with dicing machine
JP2002299288A (ja) * 2001-04-02 2002-10-11 Tokyo Seimitsu Co Ltd バーコードリーダ付半導体製造装置
TW200414968A (en) * 2003-01-28 2004-08-16 Disco Corp Machining apparatus equipped with rotary tool

Also Published As

Publication number Publication date
KR102405690B1 (ko) 2022-06-03
CN106098621B (zh) 2021-08-03
JP2016207988A (ja) 2016-12-08
JP6441737B2 (ja) 2018-12-19
TW201703957A (zh) 2017-02-01
CN106098621A (zh) 2016-11-09
KR20160128224A (ko) 2016-11-07

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