JP6441737B2 - 切削装置 - Google Patents

切削装置 Download PDF

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Publication number
JP6441737B2
JP6441737B2 JP2015092101A JP2015092101A JP6441737B2 JP 6441737 B2 JP6441737 B2 JP 6441737B2 JP 2015092101 A JP2015092101 A JP 2015092101A JP 2015092101 A JP2015092101 A JP 2015092101A JP 6441737 B2 JP6441737 B2 JP 6441737B2
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JP
Japan
Prior art keywords
workpiece
cutting
pair
auxiliary
temporary placement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015092101A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016207988A (ja
Inventor
大河原　聡
聡 大河原
惇 八木原
惇 八木原
健太郎 寺師
健太郎 寺師
勝彦 赤瀬
勝彦 赤瀬
伸太郎 松岡
伸太郎 松岡
万平 田中
万平 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2015092101A priority Critical patent/JP6441737B2/ja
Priority to TW105107381A priority patent/TWI674180B/zh
Priority to KR1020160048047A priority patent/KR102405690B1/ko
Priority to CN201610274010.3A priority patent/CN106098621B/zh
Publication of JP2016207988A publication Critical patent/JP2016207988A/ja
Application granted granted Critical
Publication of JP6441737B2 publication Critical patent/JP6441737B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2015092101A 2015-04-28 2015-04-28 切削装置 Active JP6441737B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015092101A JP6441737B2 (ja) 2015-04-28 2015-04-28 切削装置
TW105107381A TWI674180B (zh) 2015-04-28 2016-03-10 切削裝置
KR1020160048047A KR102405690B1 (ko) 2015-04-28 2016-04-20 절삭 장치
CN201610274010.3A CN106098621B (zh) 2015-04-28 2016-04-28 切削装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015092101A JP6441737B2 (ja) 2015-04-28 2015-04-28 切削装置

Publications (2)

Publication Number Publication Date
JP2016207988A JP2016207988A (ja) 2016-12-08
JP6441737B2 true JP6441737B2 (ja) 2018-12-19

Family

ID=57486683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015092101A Active JP6441737B2 (ja) 2015-04-28 2015-04-28 切削装置

Country Status (4)

Country Link
JP (1) JP6441737B2 (ko)
KR (1) KR102405690B1 (ko)
CN (1) CN106098621B (ko)
TW (1) TWI674180B (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6560110B2 (ja) * 2015-11-30 2019-08-14 株式会社ディスコ 切削装置
JP6736682B2 (ja) 2016-10-24 2020-08-05 パイオニア株式会社 センサ装置、センシング方法、プログラム及び記憶媒体
KR101856875B1 (ko) 2016-12-06 2018-05-10 에스케이실트론 주식회사 웨이퍼 캐리어 두께 측정장치
JP6762220B2 (ja) * 2016-12-15 2020-09-30 株式会社ディスコ 加工装置の搬送機構
JP6896326B2 (ja) * 2017-03-06 2021-06-30 株式会社ディスコ 加工装置
JP6909621B2 (ja) * 2017-04-24 2021-07-28 株式会社ディスコ ウォータージェット加工装置
JP6855130B2 (ja) * 2017-06-16 2021-04-07 株式会社ディスコ 加工装置
US11837487B2 (en) * 2017-07-12 2023-12-05 Tokyo Electron Limited Transfer device, substrate processing system, transfer method and substrate processing method
JP7032122B2 (ja) * 2017-12-22 2022-03-08 株式会社ディスコ 切削装置
JP7463032B2 (ja) 2020-05-22 2024-04-08 株式会社ディスコ 被加工物の保持機構及び加工装置
CN114043368B (zh) * 2021-11-01 2024-02-06 宁波市易特磁业有限公司 一种磁性材料切割装置及加工方法
CN117276161B (zh) * 2023-11-22 2024-02-02 和研半导体设备(沈阳)有限公司 一种晶圆加工系统及方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05338728A (ja) * 1992-06-05 1993-12-21 Fujitsu Ltd ウエーハ搬送方法及び装置
JP3493282B2 (ja) * 1997-07-02 2004-02-03 株式会社ディスコ 切削方法
JP3203364B2 (ja) * 1997-12-01 2001-08-27 株式会社東京精密 アライメント方法及びその装置
JP3203365B2 (ja) * 1997-12-02 2001-08-27 株式会社東京精密 ダイシング装置におけるワーク切断方法
JPH11204461A (ja) * 1998-01-09 1999-07-30 Disco Abrasive Syst Ltd フレーム位置決め装置及びフレーム位置決め方法
JP2000232080A (ja) 1999-02-10 2000-08-22 Disco Abrasive Syst Ltd 被加工物の分割システム及びペレットの移し替え装置
JP4447074B2 (ja) 1999-06-21 2010-04-07 株式会社ディスコ 切削装置
JP2001053034A (ja) * 1999-08-13 2001-02-23 Tokyo Seimitsu Co Ltd ワークテーブルの送り機構及びダイシング装置
JP2002299288A (ja) * 2001-04-02 2002-10-11 Tokyo Seimitsu Co Ltd バーコードリーダ付半導体製造装置
JP3956643B2 (ja) * 2001-04-27 2007-08-08 株式会社東京精密 ダイシングマシン
US6826986B2 (en) * 2001-05-05 2004-12-07 Ah Beng Lim Bi-directional singulation system and method
JP4796249B2 (ja) 2001-09-14 2011-10-19 株式会社ディスコ 板状物の搬送機構および搬送機構を備えたダイシング装置
JP2004235250A (ja) * 2003-01-28 2004-08-19 Disco Abrasive Syst Ltd 切削装置
JP4813855B2 (ja) 2005-09-12 2011-11-09 株式会社ディスコ 切削装置および加工方法
JP2010003876A (ja) 2008-06-20 2010-01-07 Disco Abrasive Syst Ltd 切削装置
JP5373517B2 (ja) 2009-09-14 2013-12-18 株式会社ディスコ 搬送機構および加工装置
JP5964548B2 (ja) 2011-02-24 2016-08-03 株式会社ディスコ ウエーハ加工装置
JP5975703B2 (ja) * 2012-04-09 2016-08-23 株式会社ディスコ 切削装置
JP6214901B2 (ja) * 2013-04-04 2017-10-18 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
CN106098621B (zh) 2021-08-03
JP2016207988A (ja) 2016-12-08
TWI674180B (zh) 2019-10-11
KR20160128224A (ko) 2016-11-07
TW201703957A (zh) 2017-02-01
CN106098621A (zh) 2016-11-09
KR102405690B1 (ko) 2022-06-03

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