TW202215514A - 保持機構 - Google Patents

保持機構 Download PDF

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TW202215514A
TW202215514A TW110133908A TW110133908A TW202215514A TW 202215514 A TW202215514 A TW 202215514A TW 110133908 A TW110133908 A TW 110133908A TW 110133908 A TW110133908 A TW 110133908A TW 202215514 A TW202215514 A TW 202215514A
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frame
wafer
permanent magnet
holding
holding mechanism
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TW110133908A
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齋藤良信
柿沼良典
森俊
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日商迪思科股份有限公司
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    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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Abstract

[課題]提供一種即使未充分精密地完成環狀框架的定位，仍然可以確實地保持環狀框架之保持機構。 [解決手段]一種保持機構，包含吸引保持晶圓之晶圓保持部、及配設在晶圓保持部的外周且支撐框架之框架支撐部。框架支撐部包含永久磁鐵。

Description

保持機構
本發明是有關於一種保持框架單元之保持機構，前述框架單元在中央具備有容置晶圓的開口部之由強磁性體所構成的環狀框架的開口部定位有晶圓，並將晶圓與環狀框架貼附於黏著膠帶，而將環狀框架與晶圓形成為一體。
於正面形成有已將IC、LSI等複數個器件藉由交叉之複數條分割預定線來區劃之器件區域、與圍繞器件區域之外周剩餘區域的晶圓，可在背面被磨削而形成為所期望的厚度之後，藉由切割(dicing)裝置、雷射加工裝置來分割成一個個的器件晶片，並可將所分割出的各個器件晶片利用於行動電話、個人電腦等電氣機器上。
又，晶圓在被搬入到切割裝置、雷射加工裝置之前，會形成為框架單元之形態，前述框架單元是將晶圓定位在中央具備有容置晶圓的開口部之由強磁性體所構成的環狀框架的開口部，且和環狀框架一體地被黏著膠帶所貼附而形成。
並且，將框架單元藉由搬送機構來搬送，且保持在切割裝置、雷射加工裝置的保持機構來對晶圓施行加工(參照例如專利文獻1)。 先前技術文獻 專利文獻
專利文獻1：日本特開2015-135888號公報
發明欲解決之課題
搬送機構包含吸引保持環狀框架之框架保持部、因應於需要而配設且吸引保持晶圓之晶圓保持部、及搬送臂。又，保持機構包含隔著黏著膠帶來吸引保持晶圓之晶圓保持部、及夾持環狀框架之框架支撐部。不過，在保持機構中，由於將環狀框架夾入之夾具是藉由使豎立狀態之板件旋轉成水平地放倒，而從上方來夾入環狀框架之構造，所以會有以下問題：若未藉由搬送機構將環狀框架充分精密地定位時，會無法在保持機構保持環狀框架。
據此，本發明之目的在於提供一種即使未充分精密地完成環狀框架的定位，仍然可以確實地保持環狀框架之保持機構。 用以解決課題之手段
根據本發明，可提供一種保持框架單元的保持機構，前述框架單元在中央具備有容置晶圓的開口部之由強磁性體所構成的環狀框架的該開口部定位有晶圓，並將晶圓與環狀框架貼附於黏著膠帶，而將環狀框架與晶圓形成為一體，該保持機構具備：晶圓保持部，吸引保持晶圓；及框架支撐部，配設於該晶圓保持部的外周且支撐環狀框架，該框架支撐部包含永久磁鐵。
較佳的是，該框架支撐部包含使已磁吸於該永久磁鐵之環狀框架脫離的脫離部。較佳的是，該脫離部至少由以下所構成：筒體，由非磁性體所形成且容置該永久磁鐵；及進退部，使該永久磁鐵與該筒體相對地進退，且使該永久磁鐵從該筒體相對地後退來使環狀框架從該永久磁鐵脫離。 發明效果
根據本發明，由於保持機構具備吸引保持晶圓之晶圓保持部、及配設在該晶圓保持部的外周且支撐環狀框架之框架支撐部，且該框架支撐部包含永久磁鐵，因此即使未充分精密地完成環狀框架的定位，仍然可以保持環狀框架。
用以實施發明之形態
以下，一面參照圖式一面說明本發明實施形態之保持機構。
參照圖1來作說明，以符號2來表示整體之保持機構具備吸引保持晶圓之晶圓保持部4、及配設於晶圓保持部4的外周且支撐環狀框架之框架支撐部6。
晶圓保持部4包含圓板狀的吸附夾頭8、及嵌合於吸附夾頭8的外周之罩殼10。吸附夾頭8是由多孔質材料所形成，並透過流路而連接於吸引組件(未圖示)。如圖1所示，吸附夾頭8的上表面是露出的，另一方面，吸附夾頭8的外周部以及下表面被罩殼10所覆蓋。並且，在晶圓保持部4中，是形成為藉由作動吸引組件而在吸附夾頭8的上表面生成吸引力，來吸引保持已載置於吸附夾頭8的上表面之晶圓。
重要的是，框架支撐部6包含磁吸環狀框架之永久磁鐵12。又，如圖2所示，框架支撐部6宜包含使已磁吸於永久磁鐵12之環狀框架脫離的脫離部14。本實施形態的脫離部14包含筒體16與進退部18，前述筒體16是由非磁性體所形成且容置永久磁鐵12，前述進退部18使永久磁鐵12與筒體16相對地進退，並使永久磁鐵12從筒體16相對地後退來讓環狀框架從永久磁鐵12脫離。
如圖1所示，框架支撐部6在晶圓保持部4的圓周方向上隔著間隔而配置有複數個(在本實施形態中為4個)。在本實施形態中，框架支撐部6的筒體16的每一個，透過從晶圓保持部4的罩殼10的外周朝徑方向外側延伸之一對支撐棒20而連接於罩殼10。在各筒體16的上端容置有磁吸環狀框架之永久磁鐵12。再者，各筒體16在徑方向上移動自如地被支撐棒20所支撐，並形成為可以藉由調整各筒體16的徑方向位置來支撐尺寸不同的複數個種類的環狀框架。
參照圖2來說明，本實施形態之永久磁鐵12具有：圓柱狀的主部12a，以上端面來磁吸環狀框架；及環狀的凸緣部12b，從主部12a的下端朝徑方向外側延伸。又，永久磁鐵12是在圖2(a)所示的上升位置、與圖2(b)所示的下降位置之間朝上下方向移動自如地容置在筒體16的內部。如藉由參照圖2而可理解地，在上升位置中，永久磁鐵12的上表面與筒體16的上表面為面齊平，在下降位置中，永久磁鐵12的上表面位於比筒體16的上表面更下方例如5mm左右。
如圖2所示，於筒體16的上下方向中間部設置有分隔壁22，且藉由此分隔壁22，將筒體16的內部分隔為容置永久磁鐵12之上側容置室24、及容置進退部18之下側容置室26。在分隔壁22的中央部形成有貫通孔22a。
上側容置室24的上端側形成有朝筒體16的徑方向內側突出的突出部24a。如圖2(a)所示，當從進退部18向上來對永久磁鐵12施加力時，永久磁鐵12的凸緣部12b的上端會卡在突出部24a的下端，藉此可將永久磁鐵12定位在上升位置。另一方面，當從進退部18向下來對永久磁鐵12施加力時，會如圖2(b)所示，永久磁鐵12的下表面接觸於分隔壁22的上表面，而將永久磁鐵12定位在下降位置。又，於下側容置室26中，在上下方向上隔著間隔而形成有上部開口26a以及下部開口26b。
參照圖2繼續說明，本實施形態的進退部18具有從永久磁鐵12的下端通過貫通孔22a朝下方延伸之桿件28、固定於桿件28的下端且配置於下側容置室26之活塞30、配置在活塞30的下方之線圈彈簧32、及連接於下側容置室26的上部開口26a之壓縮空氣供給源25。
在進退部18中，藉由停止壓縮空氣從壓縮空氣供給源往下側容置室26的供給，並藉由線圈彈簧32將活塞30朝上方上推，而對永久磁鐵12施加向上的力，使永久磁鐵12相對於筒體16上升，並將永久磁鐵12定位在上升位置。又，進退部18藉由從壓縮空氣供給源25往下側容置室26供給壓縮空氣而將活塞30朝下方下推，而對永久磁鐵12施加向下的力，使永久磁鐵12相對於筒體16下降，而將永久磁鐵12定位在下降位置。再者，藉由將活塞30朝下方下推，可從下部開口26b排出空氣。
並且，保持機構2的脫離部14會形成為：將永久磁鐵12定位在可將已載置於筒體16之環狀框架以永久磁鐵12來磁吸之上升位置，並且將永久磁鐵12定位在可讓已載置於筒體16之環狀框架從永久磁鐵12脫離之下降位置。
在圖3中所顯示的是藉由如上述之保持機構2所保持的框架單元34。框架單元34是透過圓形的黏著膠帶40來將環狀框架36與圓板狀的晶圓38一體化之單元。環狀框架36是由強磁性體所形成，且在中央具備容置晶圓38之圓形的開口部36a。晶圓38可由矽等來形成。晶圓38的正面38a被格子狀的複數條分割預定線42區劃成複數個矩形區域，且在複數個矩形區域的每一個形成有IC、LSI等的器件44。在本實施形態中是如圖3所示，將晶圓38的背面38b貼附到已定位於環狀框架36的開口部36a之黏著膠帶40，而將環狀框架36與晶圓38一體化。
在圖4中顯示有可裝設上述之保持機構2的切割裝置46。在本實施形態的切割裝置46中，將保持機構2設置成在以箭頭X表示的X軸方向上移動自如。再者，在圖1以箭頭Y表示之Y軸方向是正交於X軸方向之方向，在圖1以箭頭Z表示之Z軸方向是正交於X軸方向以及Y軸方向的每一個方向之上下方向。又，X軸方向以及Y軸方向所規定的XY平面實質上是水平的。
切割裝置46具備：切削單元48，可旋轉地設置有對已保持在保持機構2之晶圓38進行切削的切削刀片48a；拍攝單元50，拍攝已保持在保持機構2之晶圓38；片匣載置台54，升降自如，且可供容置有複數片框架單元34之片匣52載置；搬出入機構58，將切削前的框架單元34從片匣52拉出，並搬出到暫置工作台56並且將已定位在暫置工作台56之切削完畢的框架單元34搬入片匣52；第一搬送機構60，將已從片匣52搬出至暫置工作台56之切削前的框架單元34搬送至保持機構2；洗淨單元62，洗淨切削完畢的框架單元34；及第二搬送機構64，將切削完畢的框架單元34從保持機構2搬送至洗淨單元62。
參照圖5來說明第一搬送機構60。第一搬送機構60包含以在Z軸方向上延伸之軸線66為中心而旋轉自如且在Z軸方向上升降自如的支撐軸68、固定於支撐軸68的上端之L字形的臂70、及附設在臂70的前端之框架單元保持部72。
框架單元保持部72具有：一對板件74，互相隔著間隔而固定在臂70的前端下表面；複數個永久磁鐵76，裝設於一對板件74的下表面且對環狀框架36進行磁吸；及圓板狀的吸附片78，配置在一對板件74之間且吸引保持晶圓38。第一搬送機構60之永久磁鐵76的磁力比保持機構2之永久磁鐵12的磁力更弱。又，於吸附片78的下表面形成有複數個吸引孔(未圖示)，且各吸引孔已連接於吸引組件。
參照圖6來說明第二搬送機構64。第二搬送機構64包含在Y軸方向上移動自如地設置之Y軸可動構件80、及使Y軸可動構件80在Y軸方向上移動之Y軸進給機構82。Y軸進給機構82具有連結於Y軸可動構件80且在Y軸方向上延伸之滾珠螺桿84、及使滾珠螺桿84旋轉之馬達86。Y軸進給機構82藉由滾珠螺桿84將馬達86的旋轉運動轉換成直線運動並傳達至Y軸可動構件80，而使Y軸可動構件80沿著在Y軸方向上延伸之一對引導軌道88在Y軸方向上移動。
在Y軸可動構件80的前端下表面，透過可由氣缸等適當的致動器所構成之升降機構90而以升降自如的方式連結有框架單元保持部92。框架單元保持部92具有：H形狀的板件94，固定於升降機構90的下端；複數個永久磁鐵96，裝設於板件94的下表面且對環狀框架36進行磁吸；及圓板狀的吸附片98，配置在板件94的中央部下表面且吸引保持晶圓38。第二搬送機構64的永久磁鐵96之磁力比保持機構2的永久磁鐵12之磁力更弱。又，於吸附片98的下表面形成有複數個吸引孔(未圖示)，且各吸引孔已透過流路100而連接於吸引組件。
在使用切割裝置46來將框架單元34的晶圓38分割成按一個個的器件44之器件晶片時，首先會實施搬出步驟，前述搬出步驟是藉由搬出入機構58將切削前的框架單元34從片匣52搬出至暫置工作台56。
實施搬出步驟之後，實施第一搬送步驟，前述第一搬送步驟是藉由第一搬送機構60將框架單元34從暫置工作台56搬送至保持機構2。在第一搬送步驟中，首先是將第一搬送機構60的永久磁鐵76定位到環狀框架36的上方，並且將吸附片78定位到晶圓38的上方。接著，藉由使臂70下降，使永久磁鐵76的下表面接觸於環狀框架36的上表面，而以永久磁鐵76的磁力來保持環狀框架36，並且使吸附片78的下表面接觸於晶圓38的正面38a，而以吸附片78的吸引力來保持晶圓38。
接著，在使臂70上升，而使框架單元34從暫置工作台56離開後，使臂70旋轉，並且將框架單元34定位到已定位在裝卸位置(圖4所示之位置)之保持機構2的上方。接著，藉由使臂70下降，使環狀框架36的下表面接觸於保持機構2的永久磁鐵12的上表面，而以永久磁鐵12的磁力來保持環狀框架36，並且使晶圓38的背面38b側(黏著膠帶40側)接觸於保持機構2的吸附夾頭8的上表面，而以吸附夾頭8的吸引力來保持晶圓38。此時會事先將保持機構2的永久磁鐵12定位在上升位置。
接著，在解除第一搬送機構60的吸附片78的吸引力之後，使第一搬送機構60的臂70上升。如上述，由於第一搬送機構60的永久磁鐵76之磁力比保持機構2的永久磁鐵12之磁力更弱，因此環狀框架36會從永久磁鐵76交接至永久磁鐵12。然後，當使臂70上升時，框架單元34會保持於保持機構2，而從第一搬送機構60離開。如此進行，而將框架單元34從暫置工作台56搬送至保持機構2。
在實施第一搬送步驟之後，實施分割步驟，前述分割步驟是使保持機構2移動至切削單元48下方的切削加工位置，並以切削刀片48a沿著以保持機構2所保持之晶圓38的分割預定線42來施行切削加工，來分割成按每個器件44的器件晶片。
在實施分割步驟之後，實施第二搬送步驟，前述第二搬送步驟是藉由第二搬送機構64將框架單元34從保持機構2搬送至洗淨單元62。在第二搬送步驟中，首先，使保持機構2移動至裝卸位置，並且將第二搬送機構64的永久磁鐵96定位在環狀框架36的上方，並且將吸附片98定位在晶圓38的上方。接著，藉由使框架單元保持部92下降，而使永久磁鐵96的下表面接觸於環狀框架36的上表面，而以永久磁鐵96的磁力來保持環狀框架36，並且使吸附片98的下表面接觸於晶圓38的正面38a，而以吸附片98的吸引力來保持晶圓38。
接著，在解除保持機構2之吸附夾頭8的吸引力並且將保持機構2的永久磁鐵12定位到下降位置後，使框架單元保持部92上升。如上述，第二搬送機構64的永久磁鐵96的磁力比保持機構2的永久磁鐵12的磁力更弱，由於將保持機構2的永久磁鐵12定位在下降位置時，永久磁鐵12會從環狀框架36離開，因此對於已載置於筒體16的環狀框架36，從已接觸於環狀框架36之第二搬送機構64的永久磁鐵96作用的磁力，會變得比從保持機構2的永久磁鐵12作用的磁力更強。從而，當使框架單元保持部92上升時，框架單元34會被第二搬送機構64的框架單元保持部92所保持，而從保持機構2離開。然後，使第二搬送機構64的Y軸進給機構82以及升降機構90作動，將框架單元34搬送至洗淨單元62。
已實施第二搬送步驟之後，實施藉由洗淨單元62洗淨在分割步驟中所產生之切削屑的洗淨步驟，且接著實施藉由第一搬送機構60將框架單元34從洗淨單元62搬送至暫置工作台56的第三搬送步驟。然後，實施藉由搬出入機構58從暫置工作台56將框架單元34搬入片匣52的搬入步驟。
雖然未圖示，但暫置工作台56以及洗淨單元62的每一個和保持機構2同樣地具備有永久磁鐵與脫離部，前述永久磁鐵具有比第一、第二搬送機構60、64的永久磁鐵76、96的磁力更強的磁力，前述脫離部是使已磁吸於永久磁鐵之環狀框架36脫離。然後，在第二搬送步驟之時，可藉由洗淨單元62的永久磁鐵來磁吸被第二搬送機構64所搬送來之框架單元34的環狀框架36，藉此將框架單元34從第二搬送機構64交接至洗淨單元62。
在第三搬送步驟之時，可藉由洗淨單元62的脫離部讓已磁吸於洗淨單元62的永久磁鐵之環狀框架36從永久磁鐵脫離，藉此變得可進行框架單元34從洗淨單元62往第一搬送機構60之交接。又，可藉由暫置工作台56的永久磁鐵來磁吸被第一搬送機構60從洗淨單元62所搬送來之框架單元34的環狀框架36，藉此將框架單元34從第一搬送機構60交接至暫置工作台56。
再者，在搬出步驟以及第一搬送步驟之時，暫置工作台56的永久磁鐵是藉由脫離部而從可磁吸環狀框架36的位置後退。藉此，形成為在從片匣52往暫置工作台56之由搬出入機構58所進行之框架單元34的搬出、從暫置工作台56往保持機構2之由第一搬送機構60所進行之框架單元34的搬送之時，不會讓暫置工作台56的永久磁鐵磁吸環狀框架36，而不會成為框架單元34的搬出、搬送之障礙。
如以上所述，在本實施形態的保持機構2中，因為是藉由永久磁鐵12的磁力來保持環狀框架36，所以即使未充分精密地完成環狀框架36對保持機構2的定位，仍然可以確實地保持環狀框架36。
再者，在第一搬送機構60中，亦可形成為：在未設置有吸附片78的情形下，藉由永久磁鐵76來磁吸環狀框架36，而保持框架單元34。又，在第二搬送機構64中，也和第一搬送機構60同樣，亦可形成為：在未設置有吸附片98的情形下，藉由永久磁鐵96來磁吸環狀框架36，而保持框架單元34。
2:保持機構 4:晶圓保持部 6:框架支撐部 8:吸附夾頭 10:罩殼 12,76,96:永久磁鐵 12a:主部 12b:凸緣部 14:脫離部 16:筒體 18:進退部 20:支撐棒 22:分隔壁 22a:貫通孔 24:上側容置室 24a:突出部 25:壓縮空氣供給源 26:下側容置室 26a:上部開口 26b:下部開口 28:桿件 30:活塞 32:線圈彈簧 34:框架單元 36:環狀框架 36a:環狀框架的開口部 38:晶圓 38a:晶圓的正面 38b:晶圓的背面 40:黏著膠帶 42:分割預定線 44:器件 46:切割裝置 48:切削單元 48a:切削刀片 50:拍攝單元 52:片匣 54:片匣載置台 56:暫置工作台 58:搬出入機構 60:第一搬送機構 62:洗淨單元 64:第二搬送機構 66:軸線 68:支撐軸 70:臂 72:框架單元保持部 74,94:板件 78,98:吸附片 80:Y軸可動構件 82:Y軸進給機構 84:滾珠螺桿 86:馬達 88:引導軌道 90:升降機構 92:框架單元保持部 100:流路 X,Y,Z:方向
圖1是本發明實施形態之保持機構的立體圖。 圖2之(a)是圖1所示之脫離部的剖面圖，(b)是在永久磁鐵已後退的狀態下的脫離部的剖面圖。 圖3是框架單元的立體圖。 圖4是具備圖1所示之保持機構的切割裝置的立體圖。 圖5是圖4所示之第一搬送機構的立體圖。 圖6是圖4所示之第二搬送機構的立體圖。
2:保持機構
4:晶圓保持部
6:框架支撐部
8:吸附夾頭
10:罩殼
12:永久磁鐵
16:筒體
20:支撐棒

Claims (3)

  1. 一種保持機構，保持框架單元，前述框架單元在中央具備有容置晶圓的開口部之由強磁性體所構成的環狀框架的該開口部定位有該晶圓，並將該晶圓與該環狀框架貼附於黏著膠帶，而將該環狀框架與該晶圓形成為一體，前述保持機構具備： 晶圓保持部，吸引保持該晶圓；及 框架支撐部，配設於該晶圓保持部的外周且支撐該環狀框架， 該框架支撐部包含永久磁鐵。
  2. 如請求項1之保持機構，其中該框架支撐部更包含使已磁吸於該永久磁鐵之該環狀框架脫離的脫離部。
  3. 如請求項1之保持機構，其中該脫離部包含：筒體，由非磁性體所形成且容置該永久磁鐵；及進退部，使該永久磁鐵與該筒體相對地進退， 且使該永久磁鐵從該筒體相對地後退來使該環狀框架從該永久磁鐵脫離。
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