TWI669041B - 印刷電路板及其製造方法 - Google Patents

印刷電路板及其製造方法 Download PDF

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Publication number
TWI669041B
TWI669041B TW106135163A TW106135163A TWI669041B TW I669041 B TWI669041 B TW I669041B TW 106135163 A TW106135163 A TW 106135163A TW 106135163 A TW106135163 A TW 106135163A TW I669041 B TWI669041 B TW I669041B
Authority
TW
Taiwan
Prior art keywords
layer
copper
conductive
less
copper surface
Prior art date
Application number
TW106135163A
Other languages
English (en)
Chinese (zh)
Other versions
TW201831068A (zh
Inventor
曹元珍
馬庫 拉格
德克 提又斯
林釗文
Original Assignee
德商德國艾托特克公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德商德國艾托特克公司 filed Critical 德商德國艾托特克公司
Publication of TW201831068A publication Critical patent/TW201831068A/zh
Application granted granted Critical
Publication of TWI669041B publication Critical patent/TWI669041B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW106135163A 2016-10-14 2017-10-13 印刷電路板及其製造方法 TWI669041B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP16193971.5A EP3310137B1 (en) 2016-10-14 2016-10-14 Method for manufacturing a printed circuit board
??16193971.5 2016-10-14

Publications (2)

Publication Number Publication Date
TW201831068A TW201831068A (zh) 2018-08-16
TWI669041B true TWI669041B (zh) 2019-08-11

Family

ID=57136780

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106135163A TWI669041B (zh) 2016-10-14 2017-10-13 印刷電路板及其製造方法

Country Status (7)

Country Link
US (1) US10477700B2 (https=)
EP (1) EP3310137B1 (https=)
JP (1) JP7213801B2 (https=)
KR (1) KR102413015B1 (https=)
CN (1) CN109845415B (https=)
TW (1) TWI669041B (https=)
WO (1) WO2018069421A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11991835B2 (en) 2019-03-01 2024-05-21 Atotech Deutschland Gmbh Method for increasing adhesion strength between a metal and an organic material
CN110856348A (zh) * 2019-10-09 2020-02-28 广东利尔化学有限公司 一种用于pcb除胶后处理中和还原剂
CN110798980A (zh) * 2019-10-12 2020-02-14 西安金百泽电路科技有限公司 一种改善渗油及油墨入孔的方法
JP7474095B2 (ja) * 2020-03-31 2024-04-24 リンテック株式会社 接着シート、及び接着シートの使用方法
JP2021194831A (ja) * 2020-06-12 2021-12-27 Ckd株式会社 スクリーンマスク検査方法及びスクリーンマスク検査装置
US11388822B2 (en) 2020-08-28 2022-07-12 Applied Materials, Inc. Methods for improved polymer-copper adhesion
CN112577982A (zh) * 2020-12-09 2021-03-30 广州添利电子科技有限公司 一种pcb表面处理金属薄层质量分析方法
CN117597469A (zh) 2021-06-09 2024-02-23 德国艾托特克有限两合公司 铜层与有机层的复合物及其制造方法

Citations (4)

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WO2009125845A1 (ja) * 2008-04-10 2009-10-15 ソニーケミカル＆インフォメーションデバイス株式会社 フレキシブル配線板の製造方法
US20140261897A1 (en) * 2010-07-06 2014-09-18 Atotech Deutschland Gmbh Methods of Treating Metal Surfaces and Devices Formed Thereby
TW201438918A (zh) * 2013-02-08 2014-10-16 Ymt Co Ltd 具有銅薄層構成之基材的生產方法，印刷電路板之製造方法以及經由上述方法製造之印刷電路板
TW201526728A (zh) * 2013-12-19 2015-07-01 Zhen Ding Technology Co Ltd 可撓式電路板及其製作方法

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DE4316087A1 (de) 1993-05-13 1994-11-17 Morton Int Inc Verfahren zum bildmäßigen Metallisieren von strukturierten Leiterplatten
JP4219641B2 (ja) * 2002-08-26 2009-02-04 新日鐵化学株式会社 アルカリ現像型感光性樹脂組成物
CN1875669A (zh) * 2004-04-19 2006-12-06 株式会社荣恩电子 具有走线间隙填充树脂的印刷电路板及其制造方法
EP2065927B1 (en) * 2007-11-27 2013-10-02 Imec Integration and manufacturing method of Cu germanide and Cu silicide as Cu capping layer
JP2010166099A (ja) * 2010-04-30 2010-07-29 Ibiden Co Ltd プリント配線板及びプリント配線板の製造方法
JP6030401B2 (ja) * 2012-10-12 2016-11-24 三井金属鉱業株式会社 表面処理銅箔の製造方法
EP2754732B1 (en) * 2013-01-15 2015-03-11 ATOTECH Deutschland GmbH Aqueous composition for etching of copper and copper alloys
CN104255086B (zh) * 2013-02-28 2018-09-18 东海神栄电子工业株式会社 基板的制造方法、基板以及掩蔽膜
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Publication number Priority date Publication date Assignee Title
WO2009125845A1 (ja) * 2008-04-10 2009-10-15 ソニーケミカル＆インフォメーションデバイス株式会社 フレキシブル配線板の製造方法
US20140261897A1 (en) * 2010-07-06 2014-09-18 Atotech Deutschland Gmbh Methods of Treating Metal Surfaces and Devices Formed Thereby
TW201438918A (zh) * 2013-02-08 2014-10-16 Ymt Co Ltd 具有銅薄層構成之基材的生產方法，印刷電路板之製造方法以及經由上述方法製造之印刷電路板
TW201526728A (zh) * 2013-12-19 2015-07-01 Zhen Ding Technology Co Ltd 可撓式電路板及其製作方法

Also Published As

Publication number Publication date
KR20190066041A (ko) 2019-06-12
US10477700B2 (en) 2019-11-12
WO2018069421A1 (en) 2018-04-19
CN109845415A (zh) 2019-06-04
US20190297732A1 (en) 2019-09-26
EP3310137B1 (en) 2019-02-27
KR102413015B1 (ko) 2022-06-24
EP3310137A1 (en) 2018-04-18
JP7213801B2 (ja) 2023-01-27
CN109845415B (zh) 2020-12-08
JP2019530986A (ja) 2019-10-24
TW201831068A (zh) 2018-08-16

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