TWI660980B - 聚醯亞胺前驅體及／或含聚醯亞胺之組合物、以及聚醯亞胺膜 - Google Patents

聚醯亞胺前驅體及／或含聚醯亞胺之組合物、以及聚醯亞胺膜 Download PDF

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TWI660980B
TWI660980B TW104105930A TW104105930A TWI660980B TW I660980 B TWI660980 B TW I660980B TW 104105930 A TW104105930 A TW 104105930A TW 104105930 A TW104105930 A TW 104105930A TW I660980 B TWI660980 B TW I660980B
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Taiwan
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formula
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tetracarboxylic acid
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TW104105930A
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TW201538572A (zh
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山口美香
杉山二郎
野口浩
古賀智子
石窪章
加藤剛司
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日商三菱化學股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/10—Transparent films; Clear coatings; Transparent materials

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW104105930A 2014-02-21 2015-02-24 聚醯亞胺前驅體及／或含聚醯亞胺之組合物、以及聚醯亞胺膜 TWI660980B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2014032147 2014-02-21
JP2014-032147 2014-02-21
JP2014131668 2014-06-26
JP2014-131668 2014-06-26
JP2015000993 2015-01-06
JP2015-000993 2015-01-06

Publications (2)

Publication Number Publication Date
TW201538572A TW201538572A (zh) 2015-10-16
TWI660980B true TWI660980B (zh) 2019-06-01

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TW104105930A TWI660980B (zh) 2014-02-21 2015-02-24 聚醯亞胺前驅體及／或含聚醯亞胺之組合物、以及聚醯亞胺膜

Country Status (5)

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JP (2) JP5888472B2 (ko)
KR (1) KR102268406B1 (ko)
CN (1) CN106029743B (ko)
TW (1) TWI660980B (ko)
WO (1) WO2015125895A1 (ko)

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WO2017010566A1 (ja) * 2015-07-16 2017-01-19 宇部興産株式会社 ポリアミック酸溶液組成物およびポリイミドフィルム
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JP6718678B2 (ja) * 2015-12-25 2020-07-08 ソマール株式会社 ポリイミド共重合体及びそれを用いた成形体
JP6900152B2 (ja) * 2016-04-07 2021-07-07 株式会社カネカ ガラス代替材料用のフィルム
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KR101952823B1 (ko) * 2017-01-20 2019-02-27 스미또모 가가꾸 가부시키가이샤 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법
KR20200026191A (ko) * 2017-05-10 2020-03-10 듀폰 일렉트로닉스, 인크. 전자 장치의 가요성 기판용 저색도 중합체
KR101912737B1 (ko) * 2017-05-23 2018-10-30 주식회사 대림코퍼레이션 레이저 박리 용이성 및 고내열성을 갖는 폴리아믹산 수지의 제조방법 및 이를 이용하여 제조한 폴리이미드 필름
JP2019049661A (ja) * 2017-09-11 2019-03-28 シャープ株式会社 配向膜、液晶パネル及び液晶パネルの製造方法
KR102462579B1 (ko) 2018-06-22 2022-11-03 미쯔비시 케미컬 주식회사 제올라이트 함유 폴리이미드 수지 복합재, 제올라이트 함유 폴리이미드 수지 전구체 조성물, 필름, 및 전자 디바이스
KR102030841B1 (ko) * 2018-07-26 2019-10-10 에스케이씨코오롱피아이 주식회사 방향족 카르복실산을 포함하는 폴리이미드 전구체 조성물 및 이를 이용하여 제조되는 폴리이미드 필름
JP7463964B2 (ja) 2018-08-24 2024-04-09 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
CN109281702A (zh) * 2018-09-28 2019-01-29 黄旭东 一种防治煤炭自燃用阻化剂的制备方法
WO2020067558A1 (ja) 2018-09-29 2020-04-02 日鉄ケミカル＆マテリアル株式会社 ポリイミド前駆体及びそれから生じるポリイミド並びにフレキシブルデバイス
KR102004659B1 (ko) * 2018-10-31 2019-10-01 에스케이씨코오롱피아이 주식회사 폴리이미드 필름의 접착성을 향상시키기 위한 폴리이미드 전구체 조성물 및 이로부터 제조되는 폴리이미드 필름
KR101992576B1 (ko) * 2018-10-31 2019-06-24 에스케이씨코오롱피아이 주식회사 폴리이미드 피복물의 내열성을 향상시키기 위한 도체 피복용 폴리이미드 바니쉬 및 이로부터 제조된 폴리이미드 피복물
DE102019206559A1 (de) * 2019-05-07 2020-11-26 Aktiebolaget Skf Imidzusammensetzung und Schutzmittelzusammensetzung mit der Imidzusammensetzung
KR102121307B1 (ko) * 2019-07-19 2020-06-11 에스케이씨코오롱피아이 주식회사 폴리이미드 필름의 접착성을 향상시키기 위한 폴리이미드 전구체 조성물 및 이로부터 제조되는 폴리이미드 필름
KR102246218B1 (ko) * 2019-09-27 2021-04-29 피아이첨단소재 주식회사 폴리아믹산 조성물, 이의 제조방법 및 이를 포함하는 폴리이미드 필름
KR102246227B1 (ko) * 2019-09-27 2021-04-29 피아이첨단소재 주식회사 폴리아믹산 조성물, 이의 제조방법 및 이를 포함하는 폴리이미드 필름
JPWO2021132109A1 (ko) 2019-12-26 2021-07-01
CN111363354A (zh) * 2020-03-27 2020-07-03 中天电子材料有限公司 聚酰亚胺无色透明薄膜及其制备方法、光学pi膜
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Also Published As

Publication number Publication date
JP6540382B2 (ja) 2019-07-10
JP2016128555A (ja) 2016-07-14
CN106029743A (zh) 2016-10-12
JP5888472B2 (ja) 2016-03-22
KR20160125377A (ko) 2016-10-31
JPWO2015125895A1 (ja) 2017-03-30
KR102268406B1 (ko) 2021-06-23
TW201538572A (zh) 2015-10-16
CN106029743B (zh) 2019-03-29
WO2015125895A1 (ja) 2015-08-27

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