TWI658351B - 壓力式流量控制裝置 - Google Patents

壓力式流量控制裝置 Download PDF

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Publication number
TWI658351B
TWI658351B TW105118225A TW105118225A TWI658351B TW I658351 B TWI658351 B TW I658351B TW 105118225 A TW105118225 A TW 105118225A TW 105118225 A TW105118225 A TW 105118225A TW I658351 B TWI658351 B TW I658351B
Authority
TW
Taiwan
Prior art keywords
pressure
control device
type flow
flow control
passage
Prior art date
Application number
TW105118225A
Other languages
English (en)
Chinese (zh)
Other versions
TW201701095A (zh
Inventor
廣瀬
吉田俊英
松本篤諮
平田薰
池田信一
西野功二
土肥亮介
杉田勝幸
Original Assignee
日商富士金股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士金股份有限公司 filed Critical 日商富士金股份有限公司
Publication of TW201701095A publication Critical patent/TW201701095A/zh
Application granted granted Critical
Publication of TWI658351B publication Critical patent/TWI658351B/zh

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/004—Actuating devices; Operating means; Releasing devices actuated by piezoelectric means
    • F16K31/007—Piezoelectric stacks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K7/00—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves
    • F16K7/12—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm
    • F16K7/14—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Flow Control (AREA)
TW105118225A 2013-12-05 2014-12-01 壓力式流量控制裝置 TWI658351B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-252167 2013-12-05
JP2013252167A JP6372998B2 (ja) 2013-12-05 2013-12-05 圧力式流量制御装置

Publications (2)

Publication Number Publication Date
TW201701095A TW201701095A (zh) 2017-01-01
TWI658351B true TWI658351B (zh) 2019-05-01

Family

ID=53273128

Family Applications (2)

Application Number Title Priority Date Filing Date
TW103141600A TWI566067B (zh) 2013-12-05 2014-12-01 Pressure flow control device
TW105118225A TWI658351B (zh) 2013-12-05 2014-12-01 壓力式流量控制裝置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW103141600A TWI566067B (zh) 2013-12-05 2014-12-01 Pressure flow control device

Country Status (7)

Country Link
US (1) US10372145B2 (enExample)
JP (1) JP6372998B2 (enExample)
KR (2) KR102087645B1 (enExample)
CN (1) CN105556411A (enExample)
DE (1) DE112014005572T5 (enExample)
TW (2) TWI566067B (enExample)
WO (1) WO2015083343A1 (enExample)

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US10385998B2 (en) 2015-08-24 2019-08-20 Fujikin Incorporated Fixing structure for seal member in fluid control apparatus, joint, and fluid control apparatus
JP6799862B2 (ja) 2015-10-28 2020-12-16 株式会社フジキン 流量信号補正方法およびこれを用いた流量制御装置
KR102056140B1 (ko) * 2016-02-29 2019-12-16 가부시키가이샤 후지킨 유량 제어 장치
US10665430B2 (en) * 2016-07-11 2020-05-26 Tokyo Electron Limited Gas supply system, substrate processing system and gas supply method
JP6786096B2 (ja) * 2016-07-28 2020-11-18 株式会社フジキン 圧力式流量制御装置
JP7054207B2 (ja) * 2016-10-14 2022-04-13 株式会社フジキン 流体制御装置
JP7245600B2 (ja) 2016-12-15 2023-03-24 株式会社堀場エステック 流量制御装置、及び、流量制御装置用プログラム
WO2018123852A1 (ja) * 2016-12-26 2018-07-05 株式会社フジキン 圧電素子駆動式バルブおよび流量制御装置
CN106876304B (zh) * 2017-02-24 2019-09-10 成都京东方光电科技有限公司 一种湿法刻蚀排气系统及湿法刻蚀装置
CN111373182A (zh) * 2017-11-24 2020-07-03 株式会社富士金 阀装置以及使用该阀装置的控制装置的控制方法、流体控制装置以及半导体制造装置
JP7529664B2 (ja) * 2019-07-08 2024-08-06 株式会社堀場エステック 流量制御装置、流量測定方法、及び、流量制御装置用プログラム
JP7569791B2 (ja) * 2019-09-05 2024-10-18 株式会社堀場エステック 流量制御弁又は流量制御装置
KR102771310B1 (ko) * 2019-12-25 2025-02-24 가부시키가이샤 후지킨 압력 제어 장치
JP7169034B2 (ja) * 2020-03-05 2022-11-10 株式会社フジキン 流量制御装置および流量制御方法
JP2022029854A (ja) 2020-08-05 2022-02-18 株式会社堀場エステック 流量制御装置、流量制御方法、及び、流量制御プログラム
WO2022190711A1 (ja) 2021-03-11 2022-09-15 株式会社フジキン 気化器および気化供給装置
JP7045738B1 (ja) * 2021-03-23 2022-04-01 株式会社リンテック 常時閉型流量制御バルブ
KR20230000975A (ko) * 2021-06-25 2023-01-03 가부시키가이샤 호리바 에스텍 유체 제어 장치, 유체 제어 시스템, 유체 제어 장치용 프로그램 및 유체 제어 방법
CN113977451B (zh) * 2021-10-25 2023-08-25 长鑫存储技术有限公司 半导体设备的检测系统及检测方法
CN119103392B (zh) * 2024-11-08 2025-01-28 陕西星环聚能科技有限公司 一种用于可控核聚变装置的压电阀和可控核聚变装置

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US5669408A (en) * 1995-06-12 1997-09-23 Fujikin Incorporated Pressure type flow rate control apparatus
US6289923B1 (en) * 1998-05-29 2001-09-18 Fujikin Incorporated Gas supply system equipped with pressure-type flow rate control unit
JP2001296198A (ja) * 2000-04-14 2001-10-26 Nagano Keiki Co Ltd 圧力センサ
TW201234155A (en) * 2010-07-09 2012-08-16 Entegris Inc Flow controller
TWM489440U (en) * 2014-06-27 2014-11-01 Cheng-Yu Huang Portable cylinder audio speaker

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JP6475441B2 (ja) * 2014-09-01 2019-02-27 株式会社フジキン 圧電素子駆動式バルブ及び圧電素子駆動式バルブを備えた流量制御装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5669408A (en) * 1995-06-12 1997-09-23 Fujikin Incorporated Pressure type flow rate control apparatus
US6289923B1 (en) * 1998-05-29 2001-09-18 Fujikin Incorporated Gas supply system equipped with pressure-type flow rate control unit
JP2001296198A (ja) * 2000-04-14 2001-10-26 Nagano Keiki Co Ltd 圧力センサ
TW201234155A (en) * 2010-07-09 2012-08-16 Entegris Inc Flow controller
TWM489440U (en) * 2014-06-27 2014-11-01 Cheng-Yu Huang Portable cylinder audio speaker

Also Published As

Publication number Publication date
DE112014005572T5 (de) 2016-12-01
JP6372998B2 (ja) 2018-08-15
KR101902855B1 (ko) 2018-10-01
TW201535081A (zh) 2015-09-16
TWI566067B (zh) 2017-01-11
WO2015083343A1 (ja) 2015-06-11
US20160349763A1 (en) 2016-12-01
US10372145B2 (en) 2019-08-06
KR20180108851A (ko) 2018-10-04
JP2015109022A (ja) 2015-06-11
TW201701095A (zh) 2017-01-01
CN105556411A (zh) 2016-05-04
KR20160028474A (ko) 2016-03-11
KR102087645B1 (ko) 2020-03-11

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