KR102087645B1 - 압력식 유량 제어 장치 - Google Patents

압력식 유량 제어 장치 Download PDF

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Publication number
KR102087645B1
KR102087645B1 KR1020187026983A KR20187026983A KR102087645B1 KR 102087645 B1 KR102087645 B1 KR 102087645B1 KR 1020187026983 A KR1020187026983 A KR 1020187026983A KR 20187026983 A KR20187026983 A KR 20187026983A KR 102087645 B1 KR102087645 B1 KR 102087645B1
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South Korea
Prior art keywords
pressure
passage portion
control valve
passage
control
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KR1020187026983A
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Korean (ko)
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KR20180108851A (ko
Inventor
타카시 히로세
토시히데 요시다
아츠시 마츠모토
카오루 히라타
노부카즈 이케다
코지 니시노
료스케 도히
카츠유키 스기타
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가부시키가이샤 후지킨
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Publication of KR20180108851A publication Critical patent/KR20180108851A/ko
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Publication of KR102087645B1 publication Critical patent/KR102087645B1/ko
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/004—Actuating devices; Operating means; Releasing devices actuated by piezoelectric means
    • F16K31/007—Piezoelectric stacks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K7/00—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves
    • F16K7/12—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm
    • F16K7/14—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Flow Control (AREA)
KR1020187026983A 2013-12-05 2014-11-25 압력식 유량 제어 장치 Active KR102087645B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-252167 2013-12-05
JP2013252167A JP6372998B2 (ja) 2013-12-05 2013-12-05 圧力式流量制御装置
PCT/JP2014/005885 WO2015083343A1 (ja) 2013-12-05 2014-11-25 圧力式流量制御装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020167003232A Division KR101902855B1 (ko) 2013-12-05 2014-11-25 압력식 유량 제어 장치

Publications (2)

Publication Number Publication Date
KR20180108851A KR20180108851A (ko) 2018-10-04
KR102087645B1 true KR102087645B1 (ko) 2020-03-11

Family

ID=53273128

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020167003232A Active KR101902855B1 (ko) 2013-12-05 2014-11-25 압력식 유량 제어 장치
KR1020187026983A Active KR102087645B1 (ko) 2013-12-05 2014-11-25 압력식 유량 제어 장치

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Application Number Title Priority Date Filing Date
KR1020167003232A Active KR101902855B1 (ko) 2013-12-05 2014-11-25 압력식 유량 제어 장치

Country Status (7)

Country Link
US (1) US10372145B2 (enExample)
JP (1) JP6372998B2 (enExample)
KR (2) KR101902855B1 (enExample)
CN (1) CN105556411A (enExample)
DE (1) DE112014005572T5 (enExample)
TW (2) TWI658351B (enExample)
WO (1) WO2015083343A1 (enExample)

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US9904299B2 (en) * 2015-04-08 2018-02-27 Tokyo Electron Limited Gas supply control method
KR102456760B1 (ko) * 2015-06-25 2022-10-19 일리노이즈 툴 워크스 인코포레이티드 압전 구동기 유형 밸브
CN107532740B (zh) * 2015-08-24 2019-11-19 株式会社富士金 流体控制装置中的密封部件的固定构造、接头及流体控制装置
JP6799862B2 (ja) 2015-10-28 2020-12-16 株式会社フジキン 流量信号補正方法およびこれを用いた流量制御装置
WO2017150331A1 (ja) * 2016-02-29 2017-09-08 株式会社フジキン 流量制御装置
US10665430B2 (en) * 2016-07-11 2020-05-26 Tokyo Electron Limited Gas supply system, substrate processing system and gas supply method
JP6786096B2 (ja) * 2016-07-28 2020-11-18 株式会社フジキン 圧力式流量制御装置
JP7054207B2 (ja) * 2016-10-14 2022-04-13 株式会社フジキン 流体制御装置
JP7245600B2 (ja) 2016-12-15 2023-03-24 株式会社堀場エステック 流量制御装置、及び、流量制御装置用プログラム
US11054052B2 (en) * 2016-12-26 2021-07-06 Fujikin Incorporated Piezoelectric-element-driven valve and flow rate control device
CN106876304B (zh) * 2017-02-24 2019-09-10 成都京东方光电科技有限公司 一种湿法刻蚀排气系统及湿法刻蚀装置
CN111373182A (zh) * 2017-11-24 2020-07-03 株式会社富士金 阀装置以及使用该阀装置的控制装置的控制方法、流体控制装置以及半导体制造装置
JP7529664B2 (ja) * 2019-07-08 2024-08-06 株式会社堀場エステック 流量制御装置、流量測定方法、及び、流量制御装置用プログラム
CN114364907B (zh) * 2019-09-05 2024-10-11 株式会社堀场Stec 流量控制阀和流量控制装置
US12334355B2 (en) 2019-12-25 2025-06-17 Fujikin Incorporated Pressure control device
KR102725477B1 (ko) * 2020-03-05 2024-11-04 가부시키가이샤 후지킨 유량 제어 장치 및 유량 제어 방법
JP2022029854A (ja) 2020-08-05 2022-02-18 株式会社堀場エステック 流量制御装置、流量制御方法、及び、流量制御プログラム
JP7577382B2 (ja) 2021-03-11 2024-11-05 株式会社フジキン 気化器および気化供給装置
JP7045738B1 (ja) * 2021-03-23 2022-04-01 株式会社リンテック 常時閉型流量制御バルブ
KR20230000975A (ko) * 2021-06-25 2023-01-03 가부시키가이샤 호리바 에스텍 유체 제어 장치, 유체 제어 시스템, 유체 제어 장치용 프로그램 및 유체 제어 방법
CN113977451B (zh) * 2021-10-25 2023-08-25 长鑫存储技术有限公司 半导体设备的检测系统及检测方法
CN119103392B (zh) * 2024-11-08 2025-01-28 陕西星环聚能科技有限公司 一种用于可控核聚变装置的压电阀和可控核聚变装置

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Publication number Priority date Publication date Assignee Title
JP2001296198A (ja) * 2000-04-14 2001-10-26 Nagano Keiki Co Ltd 圧力センサ
KR101662586B1 (ko) 2009-01-28 2016-10-05 하이닥 플루이드테크닉 게엠베하 비례 압력 제어 밸브

Also Published As

Publication number Publication date
KR101902855B1 (ko) 2018-10-01
US20160349763A1 (en) 2016-12-01
TWI658351B (zh) 2019-05-01
CN105556411A (zh) 2016-05-04
TWI566067B (zh) 2017-01-11
DE112014005572T5 (de) 2016-12-01
KR20160028474A (ko) 2016-03-11
JP2015109022A (ja) 2015-06-11
KR20180108851A (ko) 2018-10-04
US10372145B2 (en) 2019-08-06
WO2015083343A1 (ja) 2015-06-11
TW201701095A (zh) 2017-01-01
JP6372998B2 (ja) 2018-08-15
TW201535081A (zh) 2015-09-16

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