JP6372998B2 - 圧力式流量制御装置 - Google Patents

圧力式流量制御装置 Download PDF

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Publication number
JP6372998B2
JP6372998B2 JP2013252167A JP2013252167A JP6372998B2 JP 6372998 B2 JP6372998 B2 JP 6372998B2 JP 2013252167 A JP2013252167 A JP 2013252167A JP 2013252167 A JP2013252167 A JP 2013252167A JP 6372998 B2 JP6372998 B2 JP 6372998B2
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JP
Japan
Prior art keywords
pressure
pressure detection
control valve
detection chamber
orifice
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013252167A
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English (en)
Japanese (ja)
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JP2015109022A (ja
JP2015109022A5 (enExample
Inventor
廣瀬　隆
隆 廣瀬
俊英 吉田
俊英 吉田
松本　篤諮
篤諮 松本
薫 平田
薫 平田
池田　信一
信一 池田
西野　功二
功二 西野
土肥　亮介
亮介 土肥
勝幸 杉田
勝幸 杉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikin Inc
Original Assignee
Fujikin Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2013252167A priority Critical patent/JP6372998B2/ja
Application filed by Fujikin Inc filed Critical Fujikin Inc
Priority to DE112014005572.7T priority patent/DE112014005572T5/de
Priority to US15/034,002 priority patent/US10372145B2/en
Priority to CN201480049537.5A priority patent/CN105556411A/zh
Priority to KR1020187026983A priority patent/KR102087645B1/ko
Priority to KR1020167003232A priority patent/KR101902855B1/ko
Priority to PCT/JP2014/005885 priority patent/WO2015083343A1/ja
Priority to TW105118225A priority patent/TWI658351B/zh
Priority to TW103141600A priority patent/TWI566067B/zh
Publication of JP2015109022A publication Critical patent/JP2015109022A/ja
Publication of JP2015109022A5 publication Critical patent/JP2015109022A5/ja
Application granted granted Critical
Publication of JP6372998B2 publication Critical patent/JP6372998B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/004—Actuating devices; Operating means; Releasing devices actuated by piezoelectric means
    • F16K31/007—Piezoelectric stacks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K7/00—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves
    • F16K7/12—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm
    • F16K7/14—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Flow Control (AREA)
JP2013252167A 2013-12-05 2013-12-05 圧力式流量制御装置 Active JP6372998B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2013252167A JP6372998B2 (ja) 2013-12-05 2013-12-05 圧力式流量制御装置
US15/034,002 US10372145B2 (en) 2013-12-05 2014-11-25 Pressure-type flow rate control device
CN201480049537.5A CN105556411A (zh) 2013-12-05 2014-11-25 压力式流量控制装置
KR1020187026983A KR102087645B1 (ko) 2013-12-05 2014-11-25 압력식 유량 제어 장치
KR1020167003232A KR101902855B1 (ko) 2013-12-05 2014-11-25 압력식 유량 제어 장치
PCT/JP2014/005885 WO2015083343A1 (ja) 2013-12-05 2014-11-25 圧力式流量制御装置
DE112014005572.7T DE112014005572T5 (de) 2013-12-05 2014-11-25 Vorrichtung zur druckabhängigen Durchflußregelung
TW105118225A TWI658351B (zh) 2013-12-05 2014-12-01 壓力式流量控制裝置
TW103141600A TWI566067B (zh) 2013-12-05 2014-12-01 Pressure flow control device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013252167A JP6372998B2 (ja) 2013-12-05 2013-12-05 圧力式流量制御装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018086041A Division JP6606221B2 (ja) 2018-04-27 2018-04-27 圧力式流量制御装置

Publications (3)

Publication Number Publication Date
JP2015109022A JP2015109022A (ja) 2015-06-11
JP2015109022A5 JP2015109022A5 (enExample) 2016-12-15
JP6372998B2 true JP6372998B2 (ja) 2018-08-15

Family

ID=53273128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013252167A Active JP6372998B2 (ja) 2013-12-05 2013-12-05 圧力式流量制御装置

Country Status (7)

Country Link
US (1) US10372145B2 (enExample)
JP (1) JP6372998B2 (enExample)
KR (2) KR101902855B1 (enExample)
CN (1) CN105556411A (enExample)
DE (1) DE112014005572T5 (enExample)
TW (2) TWI566067B (enExample)
WO (1) WO2015083343A1 (enExample)

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US10385998B2 (en) 2015-08-24 2019-08-20 Fujikin Incorporated Fixing structure for seal member in fluid control apparatus, joint, and fluid control apparatus
WO2017073038A1 (ja) 2015-10-28 2017-05-04 株式会社フジキン 流量信号補正方法およびこれを用いた流量制御装置
US10641407B2 (en) * 2016-02-29 2020-05-05 Fujikin Incorporated Flow rate control device
US10665430B2 (en) * 2016-07-11 2020-05-26 Tokyo Electron Limited Gas supply system, substrate processing system and gas supply method
JP6786096B2 (ja) * 2016-07-28 2020-11-18 株式会社フジキン 圧力式流量制御装置
WO2018070464A1 (ja) * 2016-10-14 2018-04-19 株式会社フジキン 流体制御装置
JP7245600B2 (ja) 2016-12-15 2023-03-24 株式会社堀場エステック 流量制御装置、及び、流量制御装置用プログラム
US11054052B2 (en) * 2016-12-26 2021-07-06 Fujikin Incorporated Piezoelectric-element-driven valve and flow rate control device
CN106876304B (zh) * 2017-02-24 2019-09-10 成都京东方光电科技有限公司 一种湿法刻蚀排气系统及湿法刻蚀装置
WO2019102882A1 (ja) * 2017-11-24 2019-05-31 株式会社フジキン バルブ装置およびその制御装置を用いた制御方法、流体制御装置および半導体製造装置
WO2021005879A1 (ja) * 2019-07-08 2021-01-14 株式会社堀場エステック 流量制御装置、流量測定方法、及び、流量制御装置用プログラム
KR20220058536A (ko) * 2019-09-05 2022-05-09 가부시키가이샤 호리바 에스텍 유량 제어 밸브 또는 유량 제어 장치
US12334355B2 (en) * 2019-12-25 2025-06-17 Fujikin Incorporated Pressure control device
KR102725477B1 (ko) 2020-03-05 2024-11-04 가부시키가이샤 후지킨 유량 제어 장치 및 유량 제어 방법
JP2022029854A (ja) * 2020-08-05 2022-02-18 株式会社堀場エステック 流量制御装置、流量制御方法、及び、流量制御プログラム
US20240101446A1 (en) 2021-03-11 2024-03-28 Fujikin Incorporated Vaporizer and vaporization supply device
JP7045738B1 (ja) * 2021-03-23 2022-04-01 株式会社リンテック 常時閉型流量制御バルブ
KR20230000975A (ko) * 2021-06-25 2023-01-03 가부시키가이샤 호리바 에스텍 유체 제어 장치, 유체 제어 시스템, 유체 제어 장치용 프로그램 및 유체 제어 방법
CN113977451B (zh) * 2021-10-25 2023-08-25 长鑫存储技术有限公司 半导体设备的检测系统及检测方法
CN119103392B (zh) * 2024-11-08 2025-01-28 陕西星环聚能科技有限公司 一种用于可控核聚变装置的压电阀和可控核聚变装置

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Also Published As

Publication number Publication date
TW201535081A (zh) 2015-09-16
TW201701095A (zh) 2017-01-01
KR20160028474A (ko) 2016-03-11
US10372145B2 (en) 2019-08-06
JP2015109022A (ja) 2015-06-11
WO2015083343A1 (ja) 2015-06-11
US20160349763A1 (en) 2016-12-01
TWI658351B (zh) 2019-05-01
KR101902855B1 (ko) 2018-10-01
KR20180108851A (ko) 2018-10-04
KR102087645B1 (ko) 2020-03-11
TWI566067B (zh) 2017-01-11
CN105556411A (zh) 2016-05-04
DE112014005572T5 (de) 2016-12-01

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