DE112014005572T5 - Vorrichtung zur druckabhängigen Durchflußregelung - Google Patents

Vorrichtung zur druckabhängigen Durchflußregelung Download PDF

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Publication number
DE112014005572T5
DE112014005572T5 DE112014005572.7T DE112014005572T DE112014005572T5 DE 112014005572 T5 DE112014005572 T5 DE 112014005572T5 DE 112014005572 T DE112014005572 T DE 112014005572T DE 112014005572 T5 DE112014005572 T5 DE 112014005572T5
Authority
DE
Germany
Prior art keywords
pressure
flow rate
passage
control valve
fluid passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112014005572.7T
Other languages
German (de)
English (en)
Inventor
Toshihide Yoshida
Atsushi Matsumoto
Kouji Nishino
Ryousuke Dohi
Katsuyuki Sugita
Takashi Hirose
Kaoru Hirata
Nobukazu Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikin Inc
Original Assignee
Fujikin Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikin Inc filed Critical Fujikin Inc
Publication of DE112014005572T5 publication Critical patent/DE112014005572T5/de
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/004—Actuating devices; Operating means; Releasing devices actuated by piezoelectric means
    • F16K31/007—Piezoelectric stacks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K7/00—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves
    • F16K7/12—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm
    • F16K7/14—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Flow Control (AREA)
DE112014005572.7T 2013-12-05 2014-11-25 Vorrichtung zur druckabhängigen Durchflußregelung Withdrawn DE112014005572T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013252167A JP6372998B2 (ja) 2013-12-05 2013-12-05 圧力式流量制御装置
JP2013-252167 2013-12-05
PCT/JP2014/005885 WO2015083343A1 (ja) 2013-12-05 2014-11-25 圧力式流量制御装置

Publications (1)

Publication Number Publication Date
DE112014005572T5 true DE112014005572T5 (de) 2016-12-01

Family

ID=53273128

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112014005572.7T Withdrawn DE112014005572T5 (de) 2013-12-05 2014-11-25 Vorrichtung zur druckabhängigen Durchflußregelung

Country Status (7)

Country Link
US (1) US10372145B2 (enExample)
JP (1) JP6372998B2 (enExample)
KR (2) KR102087645B1 (enExample)
CN (1) CN105556411A (enExample)
DE (1) DE112014005572T5 (enExample)
TW (2) TWI658351B (enExample)
WO (1) WO2015083343A1 (enExample)

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US10385998B2 (en) 2015-08-24 2019-08-20 Fujikin Incorporated Fixing structure for seal member in fluid control apparatus, joint, and fluid control apparatus
KR102020811B1 (ko) 2015-10-28 2019-09-11 가부시키가이샤 후지킨 유량 신호 보정 방법 및 이것을 사용한 유량 제어 장치
US10641407B2 (en) * 2016-02-29 2020-05-05 Fujikin Incorporated Flow rate control device
US10665430B2 (en) * 2016-07-11 2020-05-26 Tokyo Electron Limited Gas supply system, substrate processing system and gas supply method
JP6786096B2 (ja) * 2016-07-28 2020-11-18 株式会社フジキン 圧力式流量制御装置
JP7054207B2 (ja) * 2016-10-14 2022-04-13 株式会社フジキン 流体制御装置
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KR102162045B1 (ko) * 2016-12-26 2020-10-06 가부시키가이샤 후지킨 압전 소자 구동식 밸브 및 유량 제어 장치
CN106876304B (zh) * 2017-02-24 2019-09-10 成都京东方光电科技有限公司 一种湿法刻蚀排气系统及湿法刻蚀装置
CN111373182A (zh) * 2017-11-24 2020-07-03 株式会社富士金 阀装置以及使用该阀装置的控制装置的控制方法、流体控制装置以及半导体制造装置
JP7529664B2 (ja) * 2019-07-08 2024-08-06 株式会社堀場エステック 流量制御装置、流量測定方法、及び、流量制御装置用プログラム
WO2021044721A1 (ja) * 2019-09-05 2021-03-11 株式会社堀場エステック 流量制御弁又は流量制御装置
KR102771310B1 (ko) 2019-12-25 2025-02-24 가부시키가이샤 후지킨 압력 제어 장치
WO2021176864A1 (ja) * 2020-03-05 2021-09-10 株式会社フジキン 流量制御装置および流量制御方法
JP2022029854A (ja) * 2020-08-05 2022-02-18 株式会社堀場エステック 流量制御装置、流量制御方法、及び、流量制御プログラム
US20240101446A1 (en) 2021-03-11 2024-03-28 Fujikin Incorporated Vaporizer and vaporization supply device
JP7045738B1 (ja) * 2021-03-23 2022-04-01 株式会社リンテック 常時閉型流量制御バルブ
KR20230000975A (ko) * 2021-06-25 2023-01-03 가부시키가이샤 호리바 에스텍 유체 제어 장치, 유체 제어 시스템, 유체 제어 장치용 프로그램 및 유체 제어 방법
CN113977451B (zh) * 2021-10-25 2023-08-25 长鑫存储技术有限公司 半导体设备的检测系统及检测方法
CN119103392B (zh) * 2024-11-08 2025-01-28 陕西星环聚能科技有限公司 一种用于可控核聚变装置的压电阀和可控核聚变装置

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Also Published As

Publication number Publication date
KR20180108851A (ko) 2018-10-04
KR101902855B1 (ko) 2018-10-01
WO2015083343A1 (ja) 2015-06-11
JP2015109022A (ja) 2015-06-11
TW201535081A (zh) 2015-09-16
CN105556411A (zh) 2016-05-04
KR20160028474A (ko) 2016-03-11
KR102087645B1 (ko) 2020-03-11
TW201701095A (zh) 2017-01-01
US20160349763A1 (en) 2016-12-01
JP6372998B2 (ja) 2018-08-15
US10372145B2 (en) 2019-08-06
TWI566067B (zh) 2017-01-11
TWI658351B (zh) 2019-05-01

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R409 Internal rectification of the legal status completed
R409 Internal rectification of the legal status completed
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee