TWI654234B - Adhesive sheet for semiconductor processing - Google Patents

Adhesive sheet for semiconductor processing

Info

Publication number
TWI654234B
TWI654234B TW106110948A TW106110948A TWI654234B TW I654234 B TWI654234 B TW I654234B TW 106110948 A TW106110948 A TW 106110948A TW 106110948 A TW106110948 A TW 106110948A TW I654234 B TWI654234 B TW I654234B
Authority
TW
Taiwan
Prior art keywords
copolymer
styrene
resin
ethylene
adhesive
Prior art date
Application number
TW106110948A
Other languages
English (en)
Chinese (zh)
Other versions
TW201800463A (zh
Inventor
河田暁
Original Assignee
日商古河電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商古河電氣工業股份有限公司 filed Critical 日商古河電氣工業股份有限公司
Publication of TW201800463A publication Critical patent/TW201800463A/zh
Application granted granted Critical
Publication of TWI654234B publication Critical patent/TWI654234B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
TW106110948A 2016-03-31 2017-03-31 Adhesive sheet for semiconductor processing TWI654234B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2016-073264 2016-03-31
JP2016073264 2016-03-31

Publications (2)

Publication Number Publication Date
TW201800463A TW201800463A (zh) 2018-01-01
TWI654234B true TWI654234B (zh) 2019-03-21

Family

ID=59965578

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106110948A TWI654234B (zh) 2016-03-31 2017-03-31 Adhesive sheet for semiconductor processing

Country Status (7)

Country Link
JP (1) JP6606191B2 (ja)
KR (1) KR102350744B1 (ja)
CN (1) CN107995997B (ja)
MY (1) MY186142A (ja)
SG (1) SG11201800287UA (ja)
TW (1) TWI654234B (ja)
WO (1) WO2017170437A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7112205B2 (ja) * 2018-02-13 2022-08-03 株式会社ディスコ 分割装置
CN109536068B (zh) * 2018-11-16 2021-08-17 宁波激智科技股份有限公司 一种高粘保护膜及其制备方法
CN109880551A (zh) * 2019-03-05 2019-06-14 广东聚益新材有限公司 无醛阻燃粘结剂及其制备方法和应用、板状材料
JP7458374B2 (ja) * 2019-03-26 2024-03-29 リンテック株式会社 剥離シート
CN111995812B (zh) * 2020-08-19 2022-06-14 中裕软管科技股份有限公司 一种燃气管道修复用的高气密性材料及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5140910B2 (ja) * 2005-08-30 2013-02-13 住友ベークライト株式会社 フィルム基材および半導体ウエハ加工用粘着テープ
JP2007100064A (ja) 2005-09-07 2007-04-19 Furukawa Electric Co Ltd:The ダイシング用粘着テープ
JP5143352B2 (ja) * 2005-11-14 2013-02-13 電気化学工業株式会社 フィルム基材及び粘着テープ
JP5448430B2 (ja) * 2007-12-18 2014-03-19 古河電気工業株式会社 ウエハ貼着用貼着シートおよびウエハの加工方法
JPWO2011004825A1 (ja) * 2009-07-08 2012-12-20 古河電気工業株式会社 ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法
JP2011216704A (ja) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The 半導体ウェハ加工用粘着テープ
JP2013098443A (ja) * 2011-11-02 2013-05-20 Furukawa Electric Co Ltd:The 半導体用接着シート
JP5993255B2 (ja) * 2012-09-11 2016-09-14 三菱樹脂株式会社 アクリル系樹脂フィルム及びダイシング用粘着シート
JP6107230B2 (ja) * 2013-02-28 2017-04-05 住友ベークライト株式会社 ダイシングフィルム
JP6264126B2 (ja) * 2014-03-20 2018-01-24 日立化成株式会社 ウエハ加工用テープ
JP6330468B2 (ja) * 2014-05-13 2018-05-30 住友ベークライト株式会社 ダイシングフィルム用基材フィルムおよびダイシングフィルム
SG11201610385RA (en) * 2014-07-01 2017-01-27 Asahi Chemical Ind Polyolefin-based resin composition, film, medical bag, and tube

Also Published As

Publication number Publication date
TW201800463A (zh) 2018-01-01
WO2017170437A1 (ja) 2017-10-05
CN107995997A (zh) 2018-05-04
MY186142A (en) 2021-06-25
KR20180127300A (ko) 2018-11-28
JP6606191B2 (ja) 2019-11-13
KR102350744B1 (ko) 2022-01-14
SG11201800287UA (en) 2018-02-27
JPWO2017170437A1 (ja) 2019-02-07
CN107995997B (zh) 2023-11-14

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