SG11201800287UA - Removable adhesive sheet for semiconductor processing - Google Patents
Removable adhesive sheet for semiconductor processingInfo
- Publication number
- SG11201800287UA SG11201800287UA SG11201800287UA SG11201800287UA SG11201800287UA SG 11201800287U A SG11201800287U A SG 11201800287UA SG 11201800287U A SG11201800287U A SG 11201800287UA SG 11201800287U A SG11201800287U A SG 11201800287UA SG 11201800287U A SG11201800287U A SG 11201800287UA
- Authority
- SG
- Singapore
- Prior art keywords
- adhesive sheet
- semiconductor processing
- removable adhesive
- removable
- semiconductor
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016073264 | 2016-03-31 | ||
PCT/JP2017/012456 WO2017170437A1 (ja) | 2016-03-31 | 2017-03-27 | 半導体加工用粘着シート |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201800287UA true SG11201800287UA (en) | 2018-02-27 |
Family
ID=59965578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201800287UA SG11201800287UA (en) | 2016-03-31 | 2017-03-27 | Removable adhesive sheet for semiconductor processing |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6606191B2 (ja) |
KR (1) | KR102350744B1 (ja) |
CN (1) | CN107995997B (ja) |
MY (1) | MY186142A (ja) |
SG (1) | SG11201800287UA (ja) |
TW (1) | TWI654234B (ja) |
WO (1) | WO2017170437A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7112205B2 (ja) * | 2018-02-13 | 2022-08-03 | 株式会社ディスコ | 分割装置 |
CN109536068B (zh) * | 2018-11-16 | 2021-08-17 | 宁波激智科技股份有限公司 | 一种高粘保护膜及其制备方法 |
CN109880551A (zh) * | 2019-03-05 | 2019-06-14 | 广东聚益新材有限公司 | 无醛阻燃粘结剂及其制备方法和应用、板状材料 |
JP7458374B2 (ja) * | 2019-03-26 | 2024-03-29 | リンテック株式会社 | 剥離シート |
CN111995812B (zh) * | 2020-08-19 | 2022-06-14 | 中裕软管科技股份有限公司 | 一种燃气管道修复用的高气密性材料及其制备方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5140910B2 (ja) * | 2005-08-30 | 2013-02-13 | 住友ベークライト株式会社 | フィルム基材および半導体ウエハ加工用粘着テープ |
JP2007100064A (ja) | 2005-09-07 | 2007-04-19 | Furukawa Electric Co Ltd:The | ダイシング用粘着テープ |
JP5143352B2 (ja) * | 2005-11-14 | 2013-02-13 | 電気化学工業株式会社 | フィルム基材及び粘着テープ |
JP5448430B2 (ja) * | 2007-12-18 | 2014-03-19 | 古河電気工業株式会社 | ウエハ貼着用貼着シートおよびウエハの加工方法 |
JPWO2011004825A1 (ja) * | 2009-07-08 | 2012-12-20 | 古河電気工業株式会社 | ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法 |
JP2011216704A (ja) * | 2010-03-31 | 2011-10-27 | Furukawa Electric Co Ltd:The | 半導体ウェハ加工用粘着テープ |
JP2013098443A (ja) * | 2011-11-02 | 2013-05-20 | Furukawa Electric Co Ltd:The | 半導体用接着シート |
JP5993255B2 (ja) * | 2012-09-11 | 2016-09-14 | 三菱樹脂株式会社 | アクリル系樹脂フィルム及びダイシング用粘着シート |
JP6107230B2 (ja) * | 2013-02-28 | 2017-04-05 | 住友ベークライト株式会社 | ダイシングフィルム |
JP6264126B2 (ja) * | 2014-03-20 | 2018-01-24 | 日立化成株式会社 | ウエハ加工用テープ |
JP6330468B2 (ja) * | 2014-05-13 | 2018-05-30 | 住友ベークライト株式会社 | ダイシングフィルム用基材フィルムおよびダイシングフィルム |
SG11201610385RA (en) * | 2014-07-01 | 2017-01-27 | Asahi Chemical Ind | Polyolefin-based resin composition, film, medical bag, and tube |
-
2017
- 2017-03-27 CN CN201780002840.3A patent/CN107995997B/zh active Active
- 2017-03-27 SG SG11201800287UA patent/SG11201800287UA/en unknown
- 2017-03-27 MY MYPI2018700842A patent/MY186142A/en unknown
- 2017-03-27 KR KR1020187007178A patent/KR102350744B1/ko active IP Right Grant
- 2017-03-27 WO PCT/JP2017/012456 patent/WO2017170437A1/ja active Application Filing
- 2017-03-27 JP JP2017554096A patent/JP6606191B2/ja active Active
- 2017-03-31 TW TW106110948A patent/TWI654234B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI654234B (zh) | 2019-03-21 |
TW201800463A (zh) | 2018-01-01 |
WO2017170437A1 (ja) | 2017-10-05 |
CN107995997A (zh) | 2018-05-04 |
MY186142A (en) | 2021-06-25 |
KR20180127300A (ko) | 2018-11-28 |
JP6606191B2 (ja) | 2019-11-13 |
KR102350744B1 (ko) | 2022-01-14 |
JPWO2017170437A1 (ja) | 2019-02-07 |
CN107995997B (zh) | 2023-11-14 |
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