TWI654075B - Conductive sheet - Google Patents

Conductive sheet

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Publication number
TWI654075B
TWI654075B TW106137140A TW106137140A TWI654075B TW I654075 B TWI654075 B TW I654075B TW 106137140 A TW106137140 A TW 106137140A TW 106137140 A TW106137140 A TW 106137140A TW I654075 B TWI654075 B TW I654075B
Authority
TW
Taiwan
Prior art keywords
conductive sheet
layer
conductive
patent application
light
Prior art date
Application number
TW106137140A
Other languages
English (en)
Other versions
TW201806757A (zh
Inventor
黑田大輔
Original Assignee
日商迪睿合股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪睿合股份有限公司 filed Critical 日商迪睿合股份有限公司
Publication of TW201806757A publication Critical patent/TW201806757A/zh
Application granted granted Critical
Publication of TWI654075B publication Critical patent/TWI654075B/zh

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Classifications

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Abstract

本發明之導電性片具有於基底基材之單面積層有導電性黏著層、且於基底基材之另一面積層有遮光性絕緣層之構造。本發明之導電性片使用具有於樹脂膜之雙面形成有同種金屬層之構造者作為基底基材。此處，導電性片之遮光性絕緣層表面具有1.0×108Ω/□以上之表面電阻值、80%以下之光澤度及1.0以上之光學濃度。

Description

導電性片
本發明係關於一種適於形成顯示面操作面板之顯示面操作面與其背面之導通之情形時等的導電性片。
作為先前之電磁波遮罩膠帶，業界提出有於鋁或銅等金屬箔之單面設置有導電性黏著層之導電性片(專利文獻1)。對此種導電性片，為了防止產生與其他導電體之接觸等引起之短路，進行如下改良：藉由於導電性片之未形成導電性黏著層之面，積層聚對苯二甲酸乙二酯(PET)膜作為絕緣性樹脂層，而對導電性片之單面賦予絕緣性。又，亦實施於導電性黏著層貼附剝離膜而提高操作性之措施。
且說，近年來，於智慧型手機、攜帶型遊戲機、自動售票機等中應用顯示面操作面板(所謂之觸控面板)，且為了自其顯示面操作面與其背面形成導通而使用導電性片。對於此種導電性片，亦為了防止與金屬殼體等其他導電體之無意之接觸而導致短路產生，而實施藉由於單面積層絕緣性樹脂膜而對該單面賦予絕緣性之措施。於利用此種導電性片自顯示面操作面板之顯示面操作面與其背面形成導通時，嘗試以導電性片之絕緣性樹脂膜成為外側之方式包住顯示面操作面板之外緣部。於該情形時，為 了提高透過顯示面操作面板進行視認之影像品質，或為了防止影像視認性之下降，而嘗試將絕緣性樹脂膜自身著色為黑色，或於絕緣性樹脂膜上進而形成黑印刷層，以使導電性片之絕緣性樹脂膜成為黑框。
專利文獻1：日本特開昭62-227985號公報
然而，若使專利文獻1之導電性片通過塗佈機，或自導電性片剝去剝離膜，則與PET膜相比，金屬層容易塑性變形，另一方面，PET膜容易彈性變形，因此有於導電性片容易產生捲曲等問題。又，於以包住顯示面操作面板之外緣部之方式，將導電性片貼附於顯示面操作面板之情形時，無法使導電性片對貼附部之階差或角部之形狀的追隨性充分，因此亦存在容易剝離而無法獲得必需之形狀保持性之問題。
本發明之目的在於解決以上先前技術之問題，本發明之目的在於對基底基材之單面積層有導電性黏著層、且於基底基材之另一面積層有遮光性絕緣層而成之導電性片，賦予不易產生捲曲之性質、良好之形狀穩定性、以及形狀追隨性。
本發明人發現，藉由採用於樹脂膜之雙面積層有同種金屬層之積層體作為成為導電性片之厚度方向之中心部分的基底基材，可達成上述目的，而完成本發明。
即，本發明提供一種導電性片，其係於基底基材之單面積層有導電性黏著層、且於基底基材之另一面積層有遮光性絕緣層而成，且基底基材具有於樹脂膜之雙面形成有同種金屬層之構造。
於該情形時，關於導電性片之遮光性絕緣層表面之絕緣性等級，表面電阻值較佳為1.0×108Ω/□以上，關於遮光性之等級，較佳為光澤度為80%以下且光學濃度為1以上。
又，本發明提供一種影像顯示模組，其具有：顯示面操作面板，係利用以包住顯示面操作面板之外緣部之方式配置之上述本發明之導電性片，來連接設置於顯示面操作面板之正面外緣部之正面電極與設置於背面外緣部之背面電極；及影像顯示面板，其利用該顯示面操作面板進行操作。
於基底基材之單面積層有導電性黏著層、且於基底基材之另一面積層有遮光性絕緣層之本發明之導電性片中，使用具有於樹脂膜之雙面形成有同種金屬層之構造者作為基底基材。因此，即便對導電性片施加張力，亦由於在樹脂膜之雙面之金屬層表現出相同之伸長率，故而可較強地抑制捲曲之產生。又，由於在絕緣膜之兩側配置有金屬層，因此能以對曲面或彎曲部(角部)等之發生變化之形狀而言形狀追隨性良好地進行貼附，並且形狀保持性亦優異。
又，若將導電性片之遮光性絕緣層表面之絕緣性等級設為1.0×108Ω/□以上之表面電阻值，則可抑制與其他導電體之接觸引起之短路的產生。又，若將遮光性之等級設為80%以下之光澤度且1以上之光學濃 度，則可於顯示面操作面板之外緣部設置霧狀之黑框，且可大幅提高透過顯示面操作面板進行觀察之影像之視認性。
1‧‧‧樹脂膜
2‧‧‧導電性黏著層側之金屬層
3‧‧‧遮光性絕緣層側之金屬層
10‧‧‧基底基材
20‧‧‧導電性黏著層
30‧‧‧遮光性絕緣層
30a‧‧‧黑色樹脂層
30b‧‧‧絕緣底塗層
30c‧‧‧無光清漆層
100‧‧‧導電性片
圖1係本發明之導電性片之剖面圖。
圖2係本發明之導電性片之剖面圖。
圖3係本發明之導電性片之剖面圖。
以下，對於本發明之導電性片，一面參照圖式，一面詳細地進行說明。
圖1係本發明之導電性片100之剖面圖，該導電性片100具有於基底基材10之單面形成有導電性黏著層20、且於另一面形成有遮光性絕緣層30之構造。
<基底基材>
本發明之導電性片100具有如下特徵：基底基材10具有於樹脂膜1之雙面積層有同種金屬層2、3之構造。藉此，可較強地抑制導電性片中捲曲之產生，並且可對導電性片賦予良好之形狀追隨性與形狀穩定性。
作為構成基底基材10之樹脂膜1，可較佳地應用用作導電性片之基底膜的樹脂膜。作為此種樹脂膜，可列舉：聚酯膜、聚烯烴膜、聚醯胺膜、聚胺基甲酸酯膜、聚苯乙烯膜等。其中，就獲取容易性、機械 強度、耐熱性、成本、防銹性等觀點而言，可較佳地應用聚酯膜、尤其是聚對苯二甲酸乙二酯膜。
作為構成基底基材10之樹脂膜1之層厚，為了保持導電性片之機械強度，又，確保良好之形狀追隨性以及形狀穩定性，較佳為5~20μm，更佳為7~15μm。
作為構成基底基材10之金屬層2、3，可應用先前之導電性片中所使用之金屬層。作為此種金屬層2、3，可列舉：鋁、銅、鎳、金、銀等。該等之中，就獲取容易性、機械強度、耐熱性、成本、防銹性等觀點而言，可較佳地應用鋁。
關於導電性黏著層20側之金屬層2以及遮光性絕緣層30側之金屬層3之層厚，為了保持導電性片之機械強度，又，確保良好之形狀追隨性以及形狀穩定性，分別較佳為5~20μm，更佳為7~15μm。
就同時實現形狀追隨性與形狀保持性之觀點而言，導電性黏著層20側之金屬層2之厚度[Mt1]、樹脂膜1的厚度[Bt]及遮光性絕緣層30側之金屬層3之厚度[Mt2]之比較佳為[Mt1]：[Bt]：[Mt2]=0.25~4：1：0.25~4，更佳為0.4~2.4：1：0.4~2.4。
對樹脂膜1之金屬層2、3之形成可藉由常法進行。例如可列舉：介隔由含有異氰酸酯系交聯劑等之聚酯系接著劑或聚胺基甲酸酯系接著劑等乾式接著劑形成之接著劑層(未圖示)，於樹脂膜1積層作為金屬層之金屬箔之方法；或藉由對樹脂膜1之雙面進行無電解金屬鍍敷，進而進行電解金屬鍍敷而形成金屬層2、3之方法；或藉由真空蒸鍍法於樹脂膜1之雙面積層金屬層2、3之方法等。其中，就較高之量產性、較低之製造 成本之方面而言，可較佳地應用介隔接著劑層積層金屬層之方法。
又，構成基底基材10之樹脂膜1之線膨脹係數[ppm/℃]由於如下傾向而會擔心層間剝離之產生：若過大，則容易產生捲曲，又，若過小，則於熱環境下積層構造變得不穩定之傾向，因此較佳為15~100ppm/℃，更佳為20~70ppm/℃。
又，就與樹脂膜1之積層構造之穩定性之觀點而言，金屬層2、3之線膨脹係數[ppm/℃]較佳為12~25ppm/℃，更佳為16~23ppm/℃。
若樹脂膜1之線膨脹係數與金屬層2、3之線膨脹係數之差過大，則有容易產生捲曲之傾向，因此較佳為40ppm/℃以下，更佳為25ppm/℃以下。
若構成基底基材10之樹脂膜1之基於JIS K7113之拉伸彈性模數[GPa]過小，則有容易捲曲之傾向，若過大，則有損及形狀追隨性之傾向，因此較佳為0.3~15GPa，更佳為2~7GPa。
又，若金屬層2、3之基於JIS K7113之拉伸彈性模數[GPa]過小，則有容易捲曲之傾向，若過大，則有損及形狀追隨性之傾向，因此較佳為45~200GPa，更佳為75~130GPa。
若構成基底基材10之樹脂膜1與金屬層2、3之基於JIS K7113之拉伸彈性模數的差過大，則有容易產生捲曲之傾向，因此較佳為100GPa以下，更佳為80GPa以下。
<遮光性絕緣層>
構成本發明之導電性片100之遮光性絕緣層30係對導電性片100賦予遮光性與絕緣性之層。此處，若導電性片100之遮光性絕緣層30表面之絕 緣性等級過低，則擔心短路之產生，因此表面電阻值較佳為1.0×108Ω/□以上，更佳為1.0×1010Ω/□以上。
又，關於遮光性絕緣層30之遮光性之等級，為了提高影像之視認性，基於JIS Z8741(入射角60°)之光澤度較佳為80%以下，更佳為40%以下，且基於JIS K7605之光學濃度較佳為1以上，更佳為1.2以上，進而較佳為1.4以上。
作為遮光性絕緣層30之層厚，若過薄則有損及欲達到之光學特性之傾向，若過厚則有容易產生裂痕之傾向，因此較佳為3~15μm，更佳為5~11μm。
作為此種遮光性絕緣層30，可採用其表面之表面電阻值、光澤度、光學濃度為上述範圍之各種構成。例如可列舉：如圖1所示，由經黑色著色劑著色之絕緣性樹脂所形成之單層黑色樹脂層的構成；如圖2或圖3所示，由經黑色著色劑著色之絕緣性樹脂所形成之黑色樹脂層30a、及形成於其單面之絕緣底塗層30b或無光清漆(matte varnish)層30c所構成的構成。
作為構成遮光性絕緣層30之黑色樹脂層之絕緣性樹脂，例如可列舉：聚乙烯、聚丙烯、乙烯-丙烯共聚物等乙烯-α-烯烴共聚物、聚甲基戊烯、聚氯乙烯、聚偏二氯乙烯、聚乙酸乙烯酯、乙烯-乙酸乙烯酯共聚物、聚乙烯醇、聚乙烯縮醛、聚偏二氟乙烯及聚四氟乙烯等氟系聚合物、聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯、聚苯乙烯、聚丙烯腈、苯乙烯-丙烯腈共聚物、丙烯腈-丁二烯-苯乙烯共聚物(ABS)樹脂、聚苯醚共聚物(PPE)樹脂、改質PPE樹脂、脂肪族聚醯胺類、芳香 族聚醯胺類、聚醯亞胺、聚醯胺醯亞胺、聚甲基丙烯酸、聚甲基丙烯酸甲酯等聚甲基丙烯酸酯類、聚丙烯酸類、聚碳酸酯、聚苯硫、聚碸、聚醚碸、聚醚腈、聚醚酮、聚酮、液晶聚合物、聚矽氧樹脂、離子聚合物等熱塑性樹脂。又，可列舉：苯乙烯-丁二烯嵌段共聚物或其氫化物、苯乙烯-異戊二烯嵌段共聚物或其氫化物、苯乙烯系熱塑性彈性體、烯烴系熱塑性彈性體、氯乙烯系熱塑性彈性體、聚酯系熱塑性彈性體、聚胺基甲酸酯系熱塑性彈性體、聚醯胺系熱塑性彈性體等熱塑性彈性體。進而可列舉：交聯橡膠、環氧樹脂、酚樹脂、聚醯亞胺樹脂、不飽和聚酯樹脂、鄰苯二甲酸二烯丙酯(diallyl phthalate)樹脂等。作為交聯橡膠之具體例，可列舉：天然橡膠、丙烯酸系橡膠、丁二烯橡膠、異戊二烯橡膠、苯乙烯-丁二烯共聚橡膠、腈橡膠、氫化腈橡膠、氯丁二烯橡膠、乙烯-丙烯共聚橡膠、氯化聚乙烯橡膠、氯磺化聚乙烯橡膠、丁基橡膠、鹵化丁基橡膠、氟橡膠、胺基甲酸酯橡膠、及聚矽氧橡膠等熱硬化性樹脂。亦可應用光硬化性樹脂。
又，作為黑色著色劑，可列舉：苯胺黑、碳黑、鈦黑等公知之黑色染料、黑色顏料。若該等著色劑之平均粒徑過小，則有於製造時難以均勻地混合至絕緣性樹脂中之可能性增高之傾向，若過大，則有遮光性絕緣層30之平滑性下降之傾向，因此較佳為10~500nm，更佳為50~100nm。又，若黑色著色劑於黑色樹脂層中之含量過少，則有無法獲得欲達到之光學特性之傾向，若過多，則擔心對鄰接之層之密接性下降或脫落，因此較佳為10~40質量%，更佳為15~30質量%。
又，作為圖2所示之絕緣底塗層30b，可列舉：於黑色樹脂層中所例示之絕緣性樹脂中，為了防止黏連而視需要調配有二氧化矽等填 料者。
若絕緣底塗層30b之層厚過薄，則有無法獲得欲達到之絕緣性之傾向，若過厚，則有無法獲得欲達到之形狀保持性之傾向，因此較佳為2~10μm，更佳為3~7μm。
又，作為圖3所示之無光清漆層30c，可列舉：為了平衡良好地實現暗光色調(matte tone)之較佳之外觀與良好之塗膜強度，使黑色樹脂層中所例示之絕緣性樹脂含有較佳為30~80質量%之二氧化矽、硫酸鋇、碳酸鈣、聚乙烯顆粒、聚苯乙烯顆粒、苯并胍胺顆粒等平均粒徑0.1~10μm的填料而成膜者。
若無光清漆層30c之層厚過薄，則有無法獲得欲達到之絕緣性之傾向，若過厚，則有無法獲得欲達到之形狀保持性或光學特性之傾向，因此較佳為2~10μm，更佳為3~7μm。
再者，於遮光性絕緣層30為如圖1所示之單層黑色樹脂層之情形時，作為黑色著色劑，就黑色著色劑本身為絕緣性之觀點而言，較佳為使用苯胺黑。又，於為如圖2或圖3所示之2層構造之情形時，作為黑色樹脂層30a之黑色著色劑，亦可為苯胺黑，但由於存在保證絕緣性之絕緣底塗層30b或無光清漆層30c，故而亦可於不損及本發明之效果之範圍內使用其本身表現出導電性之碳黑。
<導電性黏著層>
作為構成導電性片100之導電性黏著層20，可應用先前之導電性片之導電性黏著層。例如可列舉：於黑色樹脂層中所例示之絕緣性樹脂中，為確保表面電阻值成為500mΩ/□以下之導電性而調配足夠之量的碳黑或金 屬粒子等導電粒子而成膜者。
若導電性黏著層20之層厚過薄，則有無法獲得欲達到之黏著性之傾向，若過厚，則有無法獲得欲達到之導通特性之傾向，因此較佳為10~35μm，更佳為15~25μm。
<導電性片之製造>
本發明之導電性片可使用公知之方法製造。例如，於PET膜等樹脂膜之單面塗佈含有異氰酸酯硬化劑之胺基甲酸酯系接著劑等乾式接著劑，並積層鋁箔等金屬層後，於另一面同樣地塗佈乾式接著劑，並積層金屬層，藉此製作於雙面積層有金屬層之基底基材。接著，於剝離片上塗佈導電性黏著層用塗料，並進行乾燥而形成導電性黏著層，並於其上積層基底基材。繼而，藉由於該基底基材上，塗佈黑色樹脂層形成用黑油墨並進行乾燥，而形成遮光性絕緣層。藉此，可獲得圖1之導電性片。
除分別塗佈、乾燥黑色樹脂層與無光清漆層或絕緣底塗層而成膜以外，圖2及圖3之導電性片基本上亦可以與圖1之導電性片相同之方式製造。
本發明之導電性片可較佳地應用於將所導通之部位配置於具有起伏之平面的影像顯示模組、或成為所導通之部位未存在於同一平面之配置的影像顯示模組。
作為前者之例，可例示：筆記型電腦等之類的以利用導電性片將顯示面板連接至隔開任一彎曲部與階差而另行設置之基板的方式配置而成之影像顯示模組。如該筆記型電腦中所例示之影像顯示模組亦為本案發明之一部分。
又，作為後者之例，可例示：將顯示面操作面板與成為其操作對象之液晶顯示面板等影像顯示面板組合而成之影像顯示模組，且該顯示面操作面板係以利用導電性片包住顯示面操作面板之外緣部的方式，配置並連接設置於觸控面板等顯示面操作面板之正面外緣部之正面電極、及設置於背面外緣部之背面電極。該影像顯示模組亦為本案發明之一部分。
實施例
實施例1
於5μm厚之PET膜(Mylar，Teijin DuPont Films(股))之單面，以3g/m2(乾燥塗佈量換算)塗佈使用了異氰酸酯系硬化劑(Coronate L，Nippon Polyurethane Industry(股))之聚酯樹脂(UE3220，Unitika(股))，並積層7μm厚之軟質鋁箔(1030N-0材料，日本製箔(股))。同樣地於PET膜之另一面積層7μm厚之軟質鋁箔(1030N-0材料，日本製箔(股))，而製作基底基材。
以乾燥厚度成為25μm厚之方式將導電性黑色黏著劑(含有10質量%碳黑之丙烯酸系接著劑)塗佈於剝離PET膜並加以乾燥，藉此形成導電性之黑色黏著層，於該導電性黑色黏著層上，積層先前製作而成之基底基材。
繼而，以乾燥厚度成為3μm之方式將絕緣黑油墨{使苯胺黑(東京色材工業(股))分散於聚酯樹脂(Vylon 200，東洋紡織(股))中而成之油墨(Dexerials(股))}塗佈於該基底基材上並加以乾燥，從而形成遮光性絕緣層。藉此獲得表1所示之構成之導電性片。
實施例2
使用12μm厚之PET膜(E5100，東洋紡織(股))來代替基底基材之5μm厚之PET膜，除此以外，重複與實施例1相同之操作，藉此獲得表1所示之構成之導電性片。
實施例3
使用從基底基材側厚3μm之絕緣底塗層(聚酯樹脂(Vylon 200，東洋紡織(股)))、與形成於其上之碳黑黑油墨層{使碳黑(MA8，三菱化學(股))分散於聚酯樹脂(Vylon 200，東洋紡識(股))中而成之油墨(Dexerials(股))}的積層物作為遮光性絕緣層，除此以外，重複與實施例1相同之操作，藉此獲得表1所示之構成之導電性片。
實施例4
使用從基底基材側厚3μm之碳黑黑油墨層{使碳黑(MA8，三菱化學(股))分散於聚酯樹脂(Vylon 200，東洋紡織(股))中而成之油墨(Dexerials(股))}、與3μm厚之無光清漆層(LG6620，東京油墨(股))之積層物作為遮光性絕緣層，除此以外，重複與實施例1相同之操作，藉此獲得表1所示之構成之導電性片。
比較例1
使用3μm厚之碳黑黑油墨層{使碳黑(MA8，三菱化學(股))分散於聚酯樹脂(Vylon 200，東洋紡織(股))中而成之油墨(Dexerials(股))}作為遮光性絕緣層，除此以外，重複與實施例1相同之操作，藉此獲得表1所示之構成之導電性片。
比較例2
於形成碳黑黑油墨層前之基底基材之金屬層，塗佈實施例1中使用之 胺基甲酸酯系接著劑，並積層5μm厚之PET膜(Mylar，Teijin DuPont Films(股))，其後形成碳黑黑油墨層，除此以外，重複與比較例1相同之操作，藉此獲得表1所示之構成之導電性片。
比較例3
使用12μm厚之PET膜(E5100，東洋紡織(股))來代替經基底基材之鋁箔夾持的5μm厚之PET膜，除此以外，重複與比較例2相同之操作，藉此獲得表1所示之構成之導電性片。
比較例4
使用僅於5μm厚之PET膜之單面介隔實施例1中使用之接著劑而積層有軟質鋁箔者作為基底基材，於未積層軟質鋁箔之基底基材面直接使用與碳黑黑油墨層{使碳黑(MA8，三菱化學(股))分散於聚酯樹脂(Vylon 200，東洋紡織(股))中而成之油墨(Dexerials(股))}之積層物，除此以外，重複與比較例1相同之操作，藉此獲得表1所示之構成之導電性片。
比較例5
使用12μm厚之PET膜(E5100，東洋紡織(股))來代替基底基材之5μm厚之PET膜，除此以外，重複與比較例4相同之操作，藉此獲得表1所示之構成之導電性片。
比較例6
積層30μm厚之導電性不織布強化黏著膜(Sui-80-M30，Seiren(股))來代替於剝離PET膜形成導電性黏著層，除此以外，重複與比較例4相同之操作，藉此獲得表1所示之構成之導電性片。
比較例7
使用12μm厚之PET膜(E5100，東洋紡織(股))來代替基底基材之5μm厚之PET膜，除此以外，重複與比較例6相同之操作，藉此獲得表1所示之構成之導電性片。
<評價>
如以下所說明般，對所獲得之導電性片試驗評價「捲曲特性」、「形狀保持性」、「形狀追隨性(反彈性)」、「絕緣性(表面電阻值)」、「遮光性(光澤度以及光學濃度)」。將所獲得之結果示於表1中。
「捲曲特性」
將導電性片切取為寬度15mm、長度150mm之短條狀，於180°方向以1000mm/秒之速度將該切取所得之試驗試樣之導電性黏著層側之剝離片剝離，目測確認所產生之捲曲。將所產生之捲曲為1圈以內之情形判定為良好，將超過1圈之情形判定為不良。
「形狀保持性」
將導電性片切取為寬度15mm、長度50mm之短條狀，於180°方向以1000mm/秒之速度將該切取所得之試驗試樣之導電性黏著層側之剝離片剝離，於試樣之中心向遮光性絕緣層側彎曲為90°，目測確認能否於該狀態下保持形狀10秒鐘。將可保持形狀之情形判定為良好，將無法保持形狀之情形判定為不良。
「形狀追隨性(反彈性)」
將導電性片切取為長度15mm、寬度10mm之長方形，將該切取所得之試驗試樣之導電性黏著層側之剝離片去除，將其長邊側以包住厚度1mm之鋁板之厚度部分之方式、且以覆蓋鋁板表面之邊緣1mm之方式貼附，將 剩餘部分彎曲90°貼附於鋁板之背面，並於80℃、95%RH之環境下放置72小時，此時目測觀察是否產生剝離。將未產生剝離之情形判定為良好，將產生剝離之情形判定為不良。
「絕緣性(表面電阻值)」
使用電阻測定器(Hiresta，Mitsubishi Chemical Analytech(股))測定導電性片之遮光性絕緣層表面之表面電阻值。於實用上要求為1×108Ω/□以上。
「遮光性(光澤度以及光學濃度)」
根據JIS Z8741(入射角60°)，使用光澤度計(Gloss Checker IG-320，堀場製作所(股))測定導電性片之遮光性絕緣層表面之光澤度。於實用上要求為80%以下。又，根據JIS K7605，使用光學濃度計(反射濃度計RT924，Macbeth製造)測定遮光性絕緣層表面之光學濃度。於實用上要求為1.4以上。將滿足兩種性能者判斷為良好。
再者，關於實施例1~4及比較例1~5之導電性片之導電性黏著層、比較例6、7之導電性不織布強化黏著膜之導電性，係將切取為100×25mm之短條狀之試樣以架橋之方式貼附於隔開50mm而平行地配置之2片銅箔(1×25×100mm)之端部，並使用電阻測定器(Milliohmmeter 4332B，Agillent公司)測定2片銅箔間之電阻值。其結果為，任一試樣均顯示出遠低於500mΩ之50~60mΩ之非常低之電阻值。
實施例1~4之導電性片中，關於任一評價項目，均可獲得良好之結果。
與此相對，於比較例1之導電性片之情形時，由於未使用絕緣黑油墨，而使用顯示出導電性之碳黑黑油墨形成遮光性絕緣層，因此表面電阻值較低，未顯示出於實用上可令人滿意之絕緣性。
又，於比較例2之導電性片之情形時，儘管未使用絕緣黑油墨，而使用碳黑黑油墨形成遮光性絕緣層，但由於將絕緣性之PET膜配置於碳黑黑油墨層之下層，因此顯示出良好之絕緣性，但由於失去基底基材之厚度方向之對稱性，故而於捲曲特性方面產生問題。
於比較例3之導電性片之情形時，由於將比較例2之導電性片之基底基材之樹脂膜厚自5μm加厚為12μm，因此基底基材之厚度方向之對稱性差於比較例2，其結果為於形狀追隨性方面產生問題。
於比較例4及5之導電性片之情形時，均使用僅於單面積層鋁箔之基底基材，因此形狀追隨性良好，但於捲曲特性、形狀保持性方面產生問題。
於比較例6及7之導電性片之情形時，由於使用不織布強化黏著膜作為導電性黏著層，因此於捲曲特性方面未產生問題，但由於均使用僅於單面積層鋁箔之基底基材，故而於形狀保持性與形狀追隨性方面產生問題。
[產業上之可利用性]
於基底基材之單面積層有導電性黏著層、且於基底基材之另一面積層有遮光性絕緣層的本發明之導電性片係使用具有於樹脂膜之雙面 形成有同種金屬層之構造者作為基底基材。因此，即便對導電性片施加張力，樹脂膜之兩側之金屬層亦顯示相同之伸長率，故而可較強地抑制捲曲之產生，並且能以對曲面或彎曲部(角部)等之發生變化之形狀而言形狀追隨性亦良好地進行貼附，並且形狀保持性亦優異。因此，本發明之導電性片可用於將所導通之部位配置於具有起伏之平面的影像顯示模組、或成為所導通之部位不存在於同一平面之配置的影像顯示模組之製造。

Claims (22)

  1. 一種導電性片，係於基底基材之單面積層有導電性黏著層、且於基底基材之另一面積層有遮光性絕緣層而成者，且基底基材具有於樹脂膜之雙面積層有同種金屬層之構造，導電性黏著層側之金屬層之厚度[Mt1]、樹脂膜的厚度[Bt]及遮光性絕緣層側之金屬層之厚度[Mt2]之比為[Mt1]：[Bt]：[Mt2]=0.25~4：1：0.25~4。
  2. 一種導電性片，係於基底基材之單面積層有導電性黏著層、且於基底基材之另一面積層有遮光性絕緣層而成者，且基底基材具有於樹脂膜之雙面積層有同種金屬層之構造，導電性片之遮光性絕緣層表面具有1.0×108Ω/□以上之表面電阻值、80%以下之光澤度及1以上之光學濃度。
  3. 如申請專利範圍第1或2項之導電性片，其遮光性絕緣層表面具有1.0×1010Ω/□以上之表面電阻值、40%以下之光澤度及1.2以上之光學濃度。
  4. 如申請專利範圍第1或2項之導電性片，其中，基底基材具有於樹脂膜之雙面分別介隔接著劑層而積層有金屬層之構造。
  5. 如申請專利範圍第1或2項之導電性片，其中，構成基底基材之樹脂膜之線膨脹係數為15~100ppm/℃，金屬層之線膨脹係數為12~25ppm/℃。
  6. 如申請專利範圍第5項之導電性片，其中，構成基底基材之樹脂膜與金屬層間之線膨脹係數之差為40ppm/℃以下。
  7. 如申請專利範圍第1或2項之導電性片，其中，構成基底基材之樹脂膜之拉伸彈性模數(JIS K7113)為0.3~15GPa，金屬層之拉伸彈性模數為45~200GPa。
  8. 如申請專利範圍第7項之導電性片，其中，構成基底基材之樹脂膜與金屬層間之拉伸彈性模數(JIS K7113)差為100GPa以下。
  9. 如申請專利範圍第1或2項之導電性片，其中，構成基底基材之樹脂膜、導電性黏著層側之金屬層之厚度、及遮光性絕緣層側之金屬層之厚度均為5~20μm。
  10. 如申請專利範圍第1或2項之導電性片，其中，遮光性絕緣層為由經黑色著色劑著色之絕緣性樹脂形成之黑色樹脂層。
  11. 如申請專利範圍第10項之導電性片，其中，黑色著色劑為苯胺黑。
  12. 如申請專利範圍第1或2項之導電性片，其中，遮光性絕緣層係由如下所構成：由經黑色著色劑著色之絕緣性樹脂形成之黑色樹脂層、及形成於其至少單面之絕緣底塗層或無光清漆層。
  13. 如申請專利範圍第12項之導電性片，其中，黑色著色劑為碳黑。
  14. 如申請專利範圍第1或2項之導電性片，其於導電性黏著劑層側進而積層有剝離片，將切取為寬度15mm、長度150mm之短條狀試驗片的導電性黏著層側之剝離片，於180°方向以1000mm/秒之速度剝離，於剩餘之試驗片產生之捲曲為1圈以內。
  15. 如申請專利範圍第1或2項之導電性片，其於導電性黏著劑層側進而積層有剝離片，將切取為寬度15mm、長度50mm之短條狀試驗片的導電性黏著層側之剝離片，於180°方向以1000mm/秒之速度剝離，將剩餘之試驗片以其中心向遮光性絕緣層側彎曲為90°，於該狀態可保持形狀10秒鐘。
  16. 如申請專利範圍第1或2項之導電性片，其中，將切取為寬度10mm、長度15mm之短條狀試驗片的導電性黏著層側之長邊側以包住厚度1mm之鋁板之厚度部分之方式、且以覆蓋鋁板表面之邊緣1mm之方式貼附，將剩餘部分彎曲90°貼附於鋁板之背面，並於80℃、95%RH之環境下放置72小時，此時不產生剝離。
  17. 一種影像顯示模組，係利用申請專利範圍第1至16項中任一項之導電性片連接而成，且將所導通之部位配置於具有起伏之平面。
  18. 如申請專利範圍第17項之影像顯示模組，其中，上述具有起伏之平面為顯示面板之平面。
  19. 一種影像顯示模組，係利用申請專利範圍第1至16項中任一項之導電性片連接而成，且成為所導通之部位不存在於同一平面之配置。
  20. 如申請專利範圍第19項之影像顯示模組，其中，上述平面為顯示面操作面板之平面。
  21. 一種影像顯示模組，係具有：顯示面操作面板，係利用以包住顯示面操作面板之外緣部之方式配置的申請專利範圍第1至16項中任一項之導電性片，來連接設置於顯示面操作面板之正面外緣部之正面電極與設置於背面外緣部之背面電極；及影像顯示面板，係利用該顯示面操作面板進行操作。
  22. 一種影像顯示模組，係以利用申請專利範圍第1至16項中任一項之導電性片來包住構成影像顯示模組之至少一部分之構件的外緣部之方式貼附者。
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