TWI652302B - 硬化性組成物及其硬化物、光學構件、以及光學裝置 - Google Patents
硬化性組成物及其硬化物、光學構件、以及光學裝置 Download PDFInfo
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- TWI652302B TWI652302B TW103105292A TW103105292A TWI652302B TW I652302 B TWI652302 B TW I652302B TW 103105292 A TW103105292 A TW 103105292A TW 103105292 A TW103105292 A TW 103105292A TW I652302 B TWI652302 B TW I652302B
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- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- NEPKLUNSRVEBIX-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,4-dicarboxylate Chemical compound C=1C=C(C(=O)OCC2OC2)C=CC=1C(=O)OCC1CO1 NEPKLUNSRVEBIX-UHFFFAOYSA-N 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- OOSPDKSZPPFOBR-UHFFFAOYSA-N butyl dihydrogen phosphite Chemical group CCCCOP(O)O OOSPDKSZPPFOBR-UHFFFAOYSA-N 0.000 description 1
- 235000019282 butylated hydroxyanisole Nutrition 0.000 description 1
- CZBZUDVBLSSABA-UHFFFAOYSA-N butylated hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1.COC1=CC=C(O)C=C1C(C)(C)C CZBZUDVBLSSABA-UHFFFAOYSA-N 0.000 description 1
- 229940043253 butylated hydroxyanisole Drugs 0.000 description 1
- 125000004744 butyloxycarbonyl group Chemical group 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 125000000609 carbazolyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3NC12)* 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical group 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000001047 cyclobutenyl group Chemical group C1(=CCC1)* 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000000298 cyclopropenyl group Chemical group [H]C1=C([H])C1([H])* 0.000 description 1
- GVJHHUAWPYXKBD-UHFFFAOYSA-N d-alpha-tocopherol Natural products OC1=C(C)C(C)=C2OC(CCCC(C)CCCC(C)CCCC(C)C)(C)CCC2=C1C GVJHHUAWPYXKBD-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- WOWBFOBYOAGEEA-UHFFFAOYSA-N diafenthiuron Chemical compound CC(C)C1=C(NC(=S)NC(C)(C)C)C(C(C)C)=CC(OC=2C=CC=CC=2)=C1 WOWBFOBYOAGEEA-UHFFFAOYSA-N 0.000 description 1
- 125000004663 dialkyl amino group Chemical group 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- KMHJKRGRIJONSV-UHFFFAOYSA-N dioxygen(.1+) Chemical compound [O+]=O KMHJKRGRIJONSV-UHFFFAOYSA-N 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 125000000219 ethylidene group Chemical group [H]C(=[*])C([H])([H])[H] 0.000 description 1
- 125000004705 ethylthio group Chemical group C(C)S* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 125000001041 indolyl group Chemical group 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- FZCZZWSFIAHGAD-UHFFFAOYSA-N octadecyl 3-[3-tert-butyl-4-[[2-tert-butyl-6-methyl-4-(3-octadecoxy-3-oxopropyl)phenoxy]-hydroxyphosphanyl]oxy-5-methylphenyl]propanoate Chemical compound CC(C)(C)C1=CC(CCC(=O)OCCCCCCCCCCCCCCCCCC)=CC(C)=C1OP(O)OC1=C(C)C=C(CCC(=O)OCCCCCCCCCCCCCCCCCC)C=C1C(C)(C)C FZCZZWSFIAHGAD-UHFFFAOYSA-N 0.000 description 1
- CSWFWSPPZMEYAY-UHFFFAOYSA-N octadecyl dihydrogen phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(O)O CSWFWSPPZMEYAY-UHFFFAOYSA-N 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 125000005740 oxycarbonyl group Chemical group [*:1]OC([*:2])=O 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 150000002927 oxygen compounds Chemical class 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000006678 phenoxycarbonyl group Chemical group 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 150000004032 porphyrins Chemical group 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000004742 propyloxycarbonyl group Chemical group 0.000 description 1
- 125000005581 pyrene group Chemical group 0.000 description 1
- 125000000168 pyrrolyl group Chemical group 0.000 description 1
- 125000002943 quinolinyl group Chemical group N1=C(C=CC2=CC=CC=C12)* 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000004149 thio group Chemical group *S* 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 235000010384 tocopherol Nutrition 0.000 description 1
- 229960001295 tocopherol Drugs 0.000 description 1
- 229930003799 tocopherol Natural products 0.000 description 1
- 239000011732 tocopherol Substances 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- NLSXASIDNWDYMI-UHFFFAOYSA-N triphenylsilanol Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(O)C1=CC=CC=C1 NLSXASIDNWDYMI-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- GVJHHUAWPYXKBD-IEOSBIPESA-N α-tocopherol Chemical compound OC1=C(C)C(C)=C2O[C@@](CCC[C@H](C)CCC[C@H](C)CCCC(C)C)(C)CCC2=C1C GVJHHUAWPYXKBD-IEOSBIPESA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Physics & Mathematics (AREA)
- Optical Filters (AREA)
- Polarising Elements (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
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| JP2013-029688 | 2013-02-19 | ||
| JP2013029688 | 2013-02-19 |
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| TW201439191A TW201439191A (zh) | 2014-10-16 |
| TWI652302B true TWI652302B (zh) | 2019-03-01 |
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| TW103105292A TWI652302B (zh) | 2013-02-19 | 2014-02-18 | 硬化性組成物及其硬化物、光學構件、以及光學裝置 |
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| JP (2) | JP6474719B2 (enExample) |
| KR (1) | KR101839196B1 (enExample) |
| CN (1) | CN104981496B (enExample) |
| TW (1) | TWI652302B (enExample) |
| WO (1) | WO2014129343A1 (enExample) |
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| KR102131193B1 (ko) * | 2013-02-19 | 2020-07-07 | 주식회사 다이셀 | 웨이퍼 레벨 렌즈용 경화성 조성물, 웨이퍼 레벨 렌즈의 제조 방법 및 웨이퍼 레벨 렌즈, 및 광학 장치 |
| JP6653990B2 (ja) * | 2014-10-27 | 2020-02-26 | 三星エスディアイ株式会社ＳＡＭＳＵＮＧ ＳＤＩ Ｃｏ．， ＬＴＤ． | 偏光板及びこれを備える画像表示装置 |
| CN107949594B (zh) * | 2015-08-27 | 2020-03-24 | 东丽株式会社 | 环氧树脂组合物及由其制造的纤维增强复合材料 |
| JP6935260B2 (ja) * | 2017-07-31 | 2021-09-15 | 東京応化工業株式会社 | 硬化性組成物、硬化膜、表示パネル又はｏｌｅｄ照明、並びに硬化物の製造方法 |
| KR102293898B1 (ko) | 2019-09-16 | 2021-08-26 | 주식회사 트리엘 | 신규한 트리아진 유도체 및 이를 포함하는 열경화성 또는 감광성 조성물 |
| CN110927201B (zh) * | 2019-12-11 | 2020-10-16 | 北京理工大学 | 一种基于dic的热膨胀相变测量方法 |
| JP2021167396A (ja) * | 2020-04-10 | 2021-10-21 | 東京応化工業株式会社 | 積層体の製造方法、マイクロレンズの製造方法、ｃｍｏｓイメージセンサーの製造方法、及び硬化性組成物 |
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| JPH0657103A (ja) * | 1992-08-11 | 1994-03-01 | Yokohama Rubber Co Ltd:The | 光硬化性樹脂組成物 |
| JP2004163491A (ja) * | 2002-11-11 | 2004-06-10 | Nippon Sheet Glass Co Ltd | 光学素子及びその製造方法 |
| JP2004163490A (ja) * | 2002-11-11 | 2004-06-10 | Nippon Sheet Glass Co Ltd | 光学素子及びその製造方法 |
| JP2004204228A (ja) * | 2002-12-13 | 2004-07-22 | Daicel Chem Ind Ltd | 硬化性エポキシ樹脂組成物および硬化物 |
| JP3973611B2 (ja) * | 2003-08-25 | 2007-09-12 | ダイセル化学工業株式会社 | 熱硬化型エポキシ樹脂組成物および透明材料 |
| JP4723272B2 (ja) * | 2004-04-02 | 2011-07-13 | 大阪瓦斯株式会社 | 光重合性樹脂組成物およびその硬化物 |
| JP5354868B2 (ja) * | 2006-07-06 | 2013-11-27 | 株式会社ダイセル | 脂環式ジエポキシ化合物の製造方法、エポキシ樹脂組成物の製造方法、及び硬化物の製造方法 |
| JP5078289B2 (ja) * | 2006-06-23 | 2012-11-21 | 株式会社日本触媒 | 樹脂組成物及びその製造方法 |
| JP5226223B2 (ja) * | 2007-01-31 | 2013-07-03 | 株式会社ダイセル | 透明封止材料及び透明封止物 |
| JP5289713B2 (ja) * | 2007-02-01 | 2013-09-11 | 株式会社ダイセル | 硬化性樹脂組成物及びその硬化物 |
| JP5248790B2 (ja) * | 2007-03-02 | 2013-07-31 | 株式会社ダイセル | 繊維強化複合材料用エポキシ樹脂組成物及び繊維強化複合材料 |
| WO2008143003A1 (ja) * | 2007-05-24 | 2008-11-27 | Sumitomo Bakelite Co., Ltd. | 透明複合シート |
| CN101809055B (zh) * | 2007-09-27 | 2013-10-23 | 株式会社日本触媒 | 成型体用固化性树脂组合物、成型体及其制造方法 |
| JP2009084310A (ja) * | 2007-09-27 | 2009-04-23 | Nippon Shokubai Co Ltd | 熱・光硬化性樹脂組成物、光学材料及び光学部材 |
| JP5443772B2 (ja) * | 2009-01-21 | 2014-03-19 | パナソニック株式会社 | 複合光学素子用樹脂組成物および複合光学素子 |
| WO2010128568A1 (ja) * | 2009-05-07 | 2010-11-11 | 旭化成株式会社 | 硬化性樹脂及び複合材料 |
| JP5229165B2 (ja) * | 2009-09-02 | 2013-07-03 | 住友ベークライト株式会社 | エポキシ樹脂組成物、透明複合シートおよび表示素子用基板 |
| JP5486891B2 (ja) * | 2009-10-08 | 2014-05-07 | 三菱レイヨン株式会社 | 連鎖硬化性樹脂組成物および繊維強化複合材料 |
| JP2011132416A (ja) * | 2009-12-25 | 2011-07-07 | Nagase Chemtex Corp | 熱硬化性樹脂組成物及び有機無機複合樹脂 |
| JP5812993B2 (ja) * | 2010-08-12 | 2015-11-17 | 株式会社ダイセル | 低透湿性樹脂組成物及びその硬化物 |
| JP5665445B2 (ja) * | 2010-09-13 | 2015-02-04 | キヤノン株式会社 | 有機無機複合組成物および光学素子 |
| JP2012209453A (ja) * | 2011-03-30 | 2012-10-25 | Sumitomo Bakelite Co Ltd | 液状樹脂組成物、半導体パッケージ、および半導体パッケージの製造方法 |
| JP2013091710A (ja) * | 2011-10-25 | 2013-05-16 | Sumitomo Bakelite Co Ltd | 透明樹脂複合体、透明複合シートおよび表示素子用透明基板 |
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2018
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6700369B2 (ja) | 2020-05-27 |
| CN104981496B (zh) | 2019-06-14 |
| JPWO2014129343A1 (ja) | 2017-02-02 |
| KR101839196B1 (ko) | 2018-03-15 |
| WO2014129343A1 (ja) | 2014-08-28 |
| JP2019052315A (ja) | 2019-04-04 |
| TW201439191A (zh) | 2014-10-16 |
| KR20150118162A (ko) | 2015-10-21 |
| CN104981496A (zh) | 2015-10-14 |
| JP6474719B2 (ja) | 2019-02-27 |
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