TWI650230B - 反射電極及鋁合金濺鍍靶 - Google Patents
反射電極及鋁合金濺鍍靶 Download PDFInfo
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- TWI650230B TWI650230B TW106128892A TW106128892A TWI650230B TW I650230 B TWI650230 B TW I650230B TW 106128892 A TW106128892 A TW 106128892A TW 106128892 A TW106128892 A TW 106128892A TW I650230 B TWI650230 B TW I650230B
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- aluminum alloy
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- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 30
- 238000005477 sputtering target Methods 0.000 title claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 18
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 6
- 239000000956 alloy Substances 0.000 claims abstract description 6
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 25
- 239000010949 copper Substances 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 229910052684 Cerium Inorganic materials 0.000 claims description 5
- 229910052746 lanthanum Inorganic materials 0.000 claims description 5
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 4
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 239000010955 niobium Substances 0.000 claims description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 2
- 238000005401 electroluminescence Methods 0.000 abstract description 38
- 238000005286 illumination Methods 0.000 abstract description 13
- 239000010408 film Substances 0.000 description 95
- 229910052725 zinc Inorganic materials 0.000 description 15
- 239000011701 zinc Substances 0.000 description 15
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 238000004544 sputter deposition Methods 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 206010021143 Hypoxia Diseases 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 150000002910 rare earth metals Chemical group 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000009718 spray deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80518—Reflective anodes, e.g. ITO combined with thick metallic layers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C14/14—Metallic material, boron or silicon
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C14/34—Sputtering
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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Abstract
本發明之目的係提供在有機電致發光(EL)顯示裝置或有機電致發光照明等的元件,可充分減低其驅動電壓、具有高反射率之反射電極。本發明係一種由鋁(Al)合金構成的反射膜與透明導電膜所構成之反射電極,其特徵係前述反射膜的主面與前述透明導電膜的主面為相接觸,並且,前述鋁合金係比例含有鋅(Zn)3~12原子%及稀土族元素0.01~0.5原子%。
Description
[0001] 本發明係有關用於有機電致發光(EL)顯示裝置或有機電致發光照明等元件之反射電極及供在該反射電極形成反射膜用之鋁(Al)合金濺鍍靶。
[0002] 有機電致發光(EL)顯示裝置或有機電致發光照明,係利用有機材料的電場發光現象之裝置,對該等謀求以提升元件的光取出效率來減低消耗電力。 [0003] 在從與基板相反方向取出光之頂放射型有機電致發光顯示裝置等之元件,係在反射電極上層積有機材料。為了使以有機材料發生的光於基板側反射,提高取出效率,而在反射電極適於使用光反射率高的材料,作為構成該反射電極之反射膜,可以使用於可見光波長領域反射率高的銀(Ag)或鋁(Al)。此外,反射膜,由於有作為電極之角色、或兼任一部分配線之場合,所以也同時謀求低的電性電阻率。 [0004] 銀係金屬之中具有最高反射率者,但為貴金屬即材料價格高。於是,鋁係次於銀的反射率高的金屬,適合作為反射膜材料。但是,利用鋁作為反射膜之場合,該反射膜會因為該透明導電膜中的氧而被氧化,在反射膜的表面不可避免地形成鋁氧化膜。由於鋁氧化膜的存在,在上述頂放射型有機電致發光顯示裝置等的元件,相較於把銀用在反射膜之元件,前者的驅動電壓較高。 [0005] 於是,在專利文獻1,提出在鋁反射膜與透明導電膜之間,介在由鎢或鉬所構成的金屬膜,利用該金屬膜來防止因透明導電膜中的氧造成的鋁反射膜氧化。 [先前技術文獻] [專利文獻] [0006] [專利文獻1] 日本特開2012-110904號公報
[發明所欲解決之課題] [0007] 然而,在專利文獻1記載之方法,在鋁(Al)反射膜與透明導電膜之間,由於介在電阻率高的鎢膜或鉬膜,並無法充分減低元件全體的驅動電壓。 本發明之目的係提供在有機電致發光(EL)顯示裝置或有機電致發光照明等的元件,可充分減低其驅動電壓、具有高反射率之反射電極。 [供解決課題之手段] [0008] 本案發明人等為解決上述課題進行了銳意檢討。結果發現,藉由將反射膜作成在鋁(Al)添加鋅(Zn)及稀土族元素之鋁合金,可以一面維持作為反射電極・配線所謀求的高反射率及低電性電阻率,一面減低有機電致發光(EL)發光元件的驅動電壓。 [0009] 亦即,本發明係有關一種由鋁合金構成的反射膜與透明導電膜所構成之反射電極,其特徵係前述反射膜的主面與前述透明導電膜的主面為相接觸,並且,前述鋁合金係比例含有鋅(Zn)3~12原子%及稀土族元素0.01~0.5原子%。 [0010] 根據本發明,構成反射電極的反射膜之鋁合金是依指定的比例包含鋅。該鋅,係偏在反射膜的表面,使在反射膜的表面被形成的鋁氧化膜的緻密性降低而劣化其絕緣性。從而,在將該反射電極用於有機電致發光顯示裝置或有機電致發光照明等的元件之場合,可以減低該元件的驅動電壓。 [0011] 此外,從前的鋁反射膜,其表面平滑性低,因而降低該反射膜的反射率。此外,在以上述方式包含鋅時可以減低驅動電壓,另一方面,因表面平滑性降低而使反射率下降。再者,在使用包含鋁反射膜的反射電極來形成元件之場合,則有有機層的膜厚不均一、導致具有包含鋁反射膜的反射電極之元件短路之疑慮。 [0012] 然而,在本發明,由於構成反射膜的鋁合金是依指定的比例包含稀土族元素,即使含有鋅,也能提升該反射膜的表面平滑性。從而,可以抑制上述之類的、反射膜反射率的降低。此外,有機層的平滑化,進而基於此可以抑制元件的短路。 又,在本發明之一態樣,鋁合金所包含之稀土族元素,可以是從釹(Nd)、鑭(La)、鈰(Ce)、及釔(Y)構成的群所選出的至少1種元素。 [0013] 在本發明之一態樣,鋁合金,係含有鎳(Ni)及銅(Cu)之至少1種合計0.05~5.0原子%。鎳及銅,係在提升反射電極的反射率時的熱處理,可以抑制或結晶粒增大、或生成副生成物之化合物。從而,可以抑制鋁合金,亦即該鋁合金構成的反射膜,進而反射電極之、在熱處理後的電阻率降低,可以抑制具有該反射電極之有機電致發光顯示裝置或有機電致發光照明等的元件之驅動電壓升高。 [0014] 本發明之構成反射電極之反射膜,係能以任意方法來形成,例如可以使用同組成的鋁合金濺鍍靶,並利用濺鍍法來形成。 [0015] 又,顯示數值範圍之「~」,係於包含以在其前後所記載之數值作為下限值及上限值之意味下使用,並不以特定段規定為限,在本案說明書,「~」的使用具有同樣的意味。 [發明之效果] [0016] 上述,根據本發明,可以提供在有機電致發光(EL)顯示裝置或有機電致發光照明等的元件,可充分減低其驅動電壓、具有高反射率之反射電極。
[0017] 以下,詳細說明本發明之實施型態。又,於下述,「原子%」與「at原子%」為同義。 [0018] <反射膜> (鋅(Zn)量) 構成反射電極的反射膜之鋁合金,係於3原子%以上12原子%以下之範圍包含鋅。在未滿3原子%,與氧化銦錫(ITO)等透明導電膜之電性接續的改善效果並不充分,具有該反射電極之有機電致發光顯示裝置或有機電致發光照明等之元件的驅動電壓沒有改善效果。在超過12原子%,會造成反射率降低,再者鋁合金的電阻率增大,結果,導致反射膜、亦即反射電極的電阻率增大,使具有該反射電極之有機電致發光顯示裝置或有機電致發光照明等的元件的驅動電壓升高。 [0019] 又,鋅量於超過12原子%之範圍會使元件的驅動電壓升高之原因並不明確,認為是鋅的濃化太大,會增加氧化膜的膜厚等而增加障壁之緣故。鋅量,最好為4原子%以上、且最好是11原子%以下。 [0020] 此外,如上述,構成反射電極的反射膜之鋁合金藉由依上述比例包含鋅來減低元件的驅動電壓,係由於鋅偏在反射膜的表面,使形成在反射膜表面的鋁氧化膜的緻密性降低、劣化其絕緣性,而改善與透明導電膜的電性接續之緣故。 [0021] (稀土族元素) 構成反射電極的反射膜之鋁合金,係於合計0.01原子%以上0.5原子%以下之範圍含有稀土族元素。利用鋅的添加,例如在100nm以上的高膜厚成膜之場合有表面龜裂變大之傾向,而藉由利用稀土族元素的添加來抑制成膜中的結晶粒增加、微細化薄膜的組織,而改善膜表面的平滑性。此外,抑制因熱處理造成的結晶成長,即使在熱處理後也有維持高平滑性之效果。從而,藉由於上述範圍含有稀土族元素,可以充分高地保持反射膜、亦即反射電極的反射率,而且,在使用反射膜來形成元件等之場合,可以迴避元件的短路。 [0022] 稀土族元素的含有量合計,最好為0.05原子%以上、且最好是0.3原子%以下。此外,添加元素之稀土族元素之中,從釹(Nd)、鑭(La)、鈰(Ce)、及釔(Y)構成的群所選出的至少1種元素特佳。 [0023] 又,在稀土族元素的含有量合計為未滿0.01原子%,微細化的效果少;在超過0.5原子%,則反射率降低的程度增加。 [0024] (鎳及銅) 構成反射電極的反射膜之鋁合金,最好是含有鎳(Ni)及銅(Cu)之至少1種合計0.05原子%以上5.0原子%以下。反射電極,為了提高其反射率,例如在250℃左右進行熱處理。然而,藉由反射膜依上述的含有比例包含鎳及銅之至少一方,可以抑制在反射膜表面形成氧化層而擔保導電性,抑制結晶粒增大而使之微細化,再者分散副生成物之化合物。從而,可以抑制鋁合金,亦即該鋁合金構成的反射膜,進而反射電極之、在熱處理後的電阻率降低,可以抑制具有該反射電極之有機電致發光顯示裝置或有機電致發光照明等的元件之驅動電壓升高。 [0025] 藉由鎳及銅之添加量合計設為0.05原子%以上,可以充分地發揮上述之作用效果因而較佳。此外,藉由設為5.0原子%以下,可以維持反射率高度因而較佳。更好是0.1原子%以上、且更好是3.0原子%以下。 [0026] (反射電極的特性) 反射電極的電性電阻率為10μΩ・cm以下佳,9μΩ・cm以下較佳,8μΩ・cm以下更佳。藉此,可以抑制有機電致發光顯示裝置或有機電致發光照明等的元件之驅動電壓升高。 [0027] 此外,使用作為反射電極之場合,於膜厚100nm以上的薄膜於測定之波長550nm下代表的反射率為85%以上佳,88%以上更佳。藉此,可以提升有機電致發光顯示裝置或有機電致發光照明等的元件之、以有機材料所發生的光的取出效率。 此外,作成有機電致發光元件之場合之驅動電壓,在50mA/cm2
之面積電流密度,以9V以下為佳。 [0028] <透明導電膜> 透明導電膜,其主面與反射膜的主面相接觸,一般上,在有機電致發光顯示裝置或有機電致發光照明等的元件,係在反射膜上層積透明導電膜。 [0029] 透明導電膜,可以使用泛用之材料,例如ITO(Sn摻入In2
O3
)、Ga摻入ZnO、Sb摻入SnO等之材料。 [0030] <反射電極之製造> 構成反射電極之反射膜及透明導電膜,可以採用濺鍍法或離子鍍(ion plating)法等之物理蒸鍍法、CVD法等之化學蒸鍍法等泛用方法進行成膜,因而可以形成反射電極。該等之中則以控制容易、也可簡單地控制膜厚或組成之濺鍍法為佳。 [0031] 採用濺鍍法形成反射電極之場合,在例如形成由上述的成分組成的鋁合金所構成的反射膜時,藉由準備與構成該反射膜的鋁合金相同成分組成的濺鍍靶,將該濺鍍靶於指定的條件下進行濺鍍,可以得到目的之反射膜。 具體而言,準備於3原子%以上12原子%以下之範圍包含鋅、並且於0.01原子%以上0.5原子%以下之範圍包含稀土族元素,進而因應必要,於合計含有量之0.05原子%以上5.0原子%以下之範圍包含鎳及銅之至少任何一方之鋁合金濺鍍靶,將該濺鍍靶於指定條件下進行濺鍍而得到目的之反射膜。此外,因應必要,準備在上述加上包含從稀土族元素之釹、鑭、鈰、及釔構成的群所選出的至少1種元素之鋁合金濺鍍靶,將該濺鍍靶於指定條件下進行濺鍍得到目的之反射膜。 [0032] 採用濺鍍法形成透明導電膜之場合,也是準備與該透明導電膜相同成分組成的濺鍍靶,將該濺鍍靶於指定的條件下進行濺鍍,可以得到目的之透明導電膜。 [0033] 又,在將透明導電膜等的氧化物膜以濺鍍進行成膜之場合,由於有產生膜中氧缺損等之場合,而適宜在成膜中供給氧氣等反應性氣體。 [0034] 上述之鋁合金濺鍍靶等,在上述的成分組成之外,包含於製造過程等不可避免地混入之元素,例如鐵、矽等。又,此類之不可避免不純物的比例,一般上為0.03重量%以下,最好是0.01重量%以下。 [0035] 上述靶的形狀,對應於濺鍍裝置的形狀或構造可以包含加工成任意形狀(例如,方板狀、圓板狀及環型板狀等)之靶。 [0036] 作為上述靶之製造方法,例如,可舉出以溶解鑄造法、粉末燒結法、噴覆成型(spray forming)法來製造由鋁基合金所構成的鑄錠而得到之方法,及在製造出由鋁基合金所構成的預成形(得到最終的緻密體之前的中間體)之後利用緻密化手段將該預成形緻密化而得到之方法。 [實施例] [0037] (1)有機電致發光(EL)元件之製造 在玻璃基板(康寧公司製造的EagleXG)上,在將表1及表2所示之成分組成之由鋁合金所構成之反射膜(陽極電極)形成厚度200nm之後,接著形成透明導電膜之氧化銦錫(ITO)10nm。之後,進行圖案化形成2mm幅寬的配線。接著,使用紅外線燈熱處理爐,於氮氣體氛圍中、250℃進行1小時熱處理。之後,進行利用UV燈照射之表面清潔。 [0038] 其次,在透明導電膜上,在利用真空蒸鍍法形成60nm膜厚之正電孔輸送層之α-NPD(α-naphtyl phenil diamine)後,形成50nm厚度之發光層之Alq3(8-hydroxy quinorine alminum),形成0.6nm厚度之電子注入層之LiF,最後,形成100nm厚度之陰極電極之鋁。該等的蒸鍍層係使用2mm幅寬的遮罩形成,製作出具有2mm ×2mm的發光面積之有機電致發光元件。 [0039] 又,反射膜,係使用直徑4吋的鋁合金靶,於3~6W/cm2
的投入電力進行濺鍍而成膜。同樣地,透明導電膜,係使用直徑4吋的氧化銦錫靶,於3~6W/cm2
的投入電力進行濺鍍而成膜。 [0040] (2)測定及評價 上述作法得到的有機電致發光元件之驅動電壓及反射膜(反射電極)之反射率、電阻率,係如下述作法測定。 反射率:利用日本分光(股)(JASCO Corporation)製V-570分光光度計測定絕對反射率,表的數值為波長450nm之數值(代表值) 電阻率:4探針法 驅動電壓:使用HP(股)製造半導體參數分析儀(HP4156A),設定電壓掃掠(sweep)範圍為0V-14V來測定元件的電流電壓,得到各元件之電壓―電流特性。 [0041] 根據諸如上述的測定,設定反射率85%以上、電性電阻率9μΩ・cm以下者為合格。此外,驅動電壓,在50mA/cm2
之面積電流密度,以9V以下者為合格。測定結果顯示於表1及表2。 [0042][0043][0044] 由表1可知,在構成反射電極的反射膜之鋁合金中的鋅量、稀土族元素量及鎳、銅量滿足本發明之要件之實施例1~7,即使在熱處理後,也顯示良好的反射率、電性電阻率及驅動電壓。 [0045] 另一方面,由表2可知,在由純鋁構成反射膜而成的比較例1及比較例4,由於反射膜、亦即反射電極不含鋅元素,顯示出元素的驅動電壓為超過14V或者為10.2V之較高數值。 [0046] 此外,在不含稀土族元素的比較例2、3、5、6及7,由於反射膜的表面平滑性不足,而降低反射率。 [0047] 再者,在不含鋅、而含有較多鎳的比較例8,反射膜、亦即反射電極之反射率低。在鋅量超過本發明的範圍之比較例9,反射膜、亦即反射電極之反射率也是低,再者驅動電壓高。 [0048] 以上,根據上述具體例詳細說明本發明,但本發明並不以上述具體例為限,在不逸脫本發明之範疇下,可以進行種種變形或變更。本申請案係根據2016年8月26日申請之日本專利申請案(特願2016-166148),其內容作為參照而在本說明書中援用。
Claims (5)
- 一種反射電極,由以鋁(Al)合金構成的反射膜與透明導電膜所構成之反射電極,其特徵係前述反射膜的主面與前述透明導電膜的主面為相接觸,並且,前述鋁合金係比例含有鋅(Zn)3~12原子%及稀土族元素0.01~0.5原子%;前述鋁合金,係含有鎳(Ni)及銅(Cu)之至少1種合計0.05~5.0原子%。
- 如申請專利範圍第1項記載之反射電極,其中前述稀土族元素,係從釹(Nd)、鑭(La)、鈰(Ce)、及釔(Y)構成的群所選出的至少1種元素。
- 如申請專利範圍第1項記載之反射電極,其中前述稀土族元素至少含有釹(Nd)。
- 如申請專利範圍第2項記載之反射電極,其中前述鋁合金,係含有鎳及銅之至少1種合計0.05~5.0原子%。
- 一種鋁合金濺鍍靶,其特徵係形成如申請專利範圍第1~4項任1項記載之反射電極之前述反射膜。
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