TWI636150B - 基板保持機構、成膜裝置、及基板的保持方法 - Google Patents

基板保持機構、成膜裝置、及基板的保持方法 Download PDF

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Publication number
TWI636150B
TWI636150B TW105111468A TW105111468A TWI636150B TW I636150 B TWI636150 B TW I636150B TW 105111468 A TW105111468 A TW 105111468A TW 105111468 A TW105111468 A TW 105111468A TW I636150 B TWI636150 B TW I636150B
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TW
Taiwan
Prior art keywords
substrate
mounting surface
adsorption
places
holding mechanism
Prior art date
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TW105111468A
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English (en)
Chinese (zh)
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TW201708586A (zh
Inventor
江上明史
金子俊則
大野哲宏
Original Assignee
愛發科股份有限公司
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Application filed by 愛發科股份有限公司 filed Critical 愛發科股份有限公司
Publication of TW201708586A publication Critical patent/TW201708586A/zh
Application granted granted Critical
Publication of TWI636150B publication Critical patent/TWI636150B/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
TW105111468A 2015-04-15 2016-04-13 基板保持機構、成膜裝置、及基板的保持方法 TWI636150B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-083331 2015-04-15
JP2015083331 2015-04-15

Publications (2)

Publication Number Publication Date
TW201708586A TW201708586A (zh) 2017-03-01
TWI636150B true TWI636150B (zh) 2018-09-21

Family

ID=57126572

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105111468A TWI636150B (zh) 2015-04-15 2016-04-13 基板保持機構、成膜裝置、及基板的保持方法

Country Status (5)

Country Link
JP (1) JP6526795B2 (ja)
KR (1) KR102083443B1 (ja)
CN (1) CN107429386B (ja)
TW (1) TWI636150B (ja)
WO (1) WO2016167233A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6851202B2 (ja) * 2017-01-12 2021-03-31 株式会社アルバック 基板ホルダ、縦型基板搬送装置及び基板処理装置
JP6448067B2 (ja) * 2017-05-22 2019-01-09 キヤノントッキ株式会社 基板載置方法、基板載置機構、成膜方法、成膜装置及び電子デバイスの製造方法
KR102182582B1 (ko) * 2017-06-28 2020-11-24 가부시키가이샤 아루박 스퍼터 장치
KR102248322B1 (ko) 2017-11-10 2021-05-04 가부시키가이샤 알박 진공 장치, 흡착 장치, 도전성 박막 제조 방법
CN108048818A (zh) * 2017-12-18 2018-05-18 德淮半导体有限公司 化学气相沉积装置及其使用方法
KR102427823B1 (ko) * 2018-06-11 2022-07-29 캐논 톡키 가부시키가이샤 정전척 시스템, 성막장치, 흡착방법, 성막방법 및 전자 디바이스의 제조방법
KR102419064B1 (ko) * 2018-07-31 2022-07-07 캐논 톡키 가부시키가이샤 정전척 시스템, 성막장치, 흡착방법, 성막방법 및 전자 디바이스의 제조방법
KR102430370B1 (ko) * 2018-07-31 2022-08-05 캐논 톡키 가부시키가이샤 정전척 시스템, 성막장치, 흡착방법, 성막방법 및 전자 디바이스의 제조방법
JP7288832B2 (ja) * 2019-10-01 2023-06-08 キヤノントッキ株式会社 回転駆動装置
JP7449806B2 (ja) 2020-07-28 2024-03-14 株式会社アルバック 吸着装置及び真空処理装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10183345A (ja) * 1996-12-18 1998-07-14 Nissin Electric Co Ltd 基板保持装置
JP2002009064A (ja) * 2000-06-21 2002-01-11 Hitachi Ltd 試料の処理装置及び試料の処理方法
JP2003347393A (ja) * 2002-05-29 2003-12-05 Ulvac Japan Ltd 基板保持装置、及びその基板保持装置を用いた真空処理装置
JP2007162063A (ja) * 2005-12-13 2007-06-28 Dainippon Printing Co Ltd スパッタ装置および基板搬送用キャリア
JP2009249662A (ja) * 2008-04-03 2009-10-29 Ulvac Japan Ltd 真空処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07258839A (ja) * 1994-03-18 1995-10-09 Hitachi Ltd スパッタリング装置
JP3264440B2 (ja) * 2000-09-11 2002-03-11 株式会社日立製作所 真空処理装置の基板保持装置
JP4091288B2 (ja) * 2001-10-31 2008-05-28 株式会社アルバック 処理対象物の処理方法
JP4098283B2 (ja) 2004-07-30 2008-06-11 株式会社アルバック スパッタリング装置
JP2009146932A (ja) * 2007-12-11 2009-07-02 Ulvac Japan Ltd 基板搬送装置、基板搬送方法及び真空処理装置
JP2014078602A (ja) * 2012-10-10 2014-05-01 Sumitomo Heavy Ind Ltd 基板搬送トレイ起伏装置
JP2014078600A (ja) * 2012-10-10 2014-05-01 Sumitomo Heavy Ind Ltd 成膜装置
JP6064684B2 (ja) * 2013-03-05 2017-01-25 三星ダイヤモンド工業株式会社 基板処理システムおよび基板反転装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10183345A (ja) * 1996-12-18 1998-07-14 Nissin Electric Co Ltd 基板保持装置
JP2002009064A (ja) * 2000-06-21 2002-01-11 Hitachi Ltd 試料の処理装置及び試料の処理方法
JP2003347393A (ja) * 2002-05-29 2003-12-05 Ulvac Japan Ltd 基板保持装置、及びその基板保持装置を用いた真空処理装置
JP2007162063A (ja) * 2005-12-13 2007-06-28 Dainippon Printing Co Ltd スパッタ装置および基板搬送用キャリア
JP2009249662A (ja) * 2008-04-03 2009-10-29 Ulvac Japan Ltd 真空処理装置

Also Published As

Publication number Publication date
TW201708586A (zh) 2017-03-01
JPWO2016167233A1 (ja) 2018-01-11
CN107429386A (zh) 2017-12-01
CN107429386B (zh) 2019-09-27
WO2016167233A1 (ja) 2016-10-20
JP6526795B2 (ja) 2019-06-05
KR102083443B1 (ko) 2020-03-02
KR20170134743A (ko) 2017-12-06

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