TWI627413B - 探針卡及接觸檢查裝置 - Google Patents

探針卡及接觸檢查裝置 Download PDF

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Publication number
TWI627413B
TWI627413B TW105133572A TW105133572A TWI627413B TW I627413 B TWI627413 B TW I627413B TW 105133572 A TW105133572 A TW 105133572A TW 105133572 A TW105133572 A TW 105133572A TW I627413 B TWI627413 B TW I627413B
Authority
TW
Taiwan
Prior art keywords
probe
guide
guide portion
probe card
elasticity
Prior art date
Application number
TW105133572A
Other languages
English (en)
Chinese (zh)
Other versions
TW201728908A (zh
Inventor
Tetsuya Yoshioka
吉岡哲也
Takashi Kawano
河野貴志
Shigeki MAKISE
牧瀬茂喜
Mika Nasu
那須美佳
Original Assignee
Kabushiki Kaisha Nihon Micronics
日本麥克隆尼股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Nihon Micronics, 日本麥克隆尼股份有限公司 filed Critical Kabushiki Kaisha Nihon Micronics
Publication of TW201728908A publication Critical patent/TW201728908A/zh
Application granted granted Critical
Publication of TWI627413B publication Critical patent/TWI627413B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06777—High voltage probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW105133572A 2015-10-21 2016-10-18 探針卡及接觸檢查裝置 TWI627413B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015207263A JP6890921B2 (ja) 2015-10-21 2015-10-21 プローブカード及び接触検査装置
JP2015-207263 2015-10-21

Publications (2)

Publication Number Publication Date
TW201728908A TW201728908A (zh) 2017-08-16
TWI627413B true TWI627413B (zh) 2018-06-21

Family

ID=58557432

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105133572A TWI627413B (zh) 2015-10-21 2016-10-18 探針卡及接觸檢查裝置

Country Status (7)

Country Link
US (1) US10775411B2 (cg-RX-API-DMAC7.html)
EP (1) EP3367108B1 (cg-RX-API-DMAC7.html)
JP (1) JP6890921B2 (cg-RX-API-DMAC7.html)
KR (1) KR102015741B1 (cg-RX-API-DMAC7.html)
CN (1) CN108351371B (cg-RX-API-DMAC7.html)
TW (1) TWI627413B (cg-RX-API-DMAC7.html)
WO (1) WO2017069028A1 (cg-RX-API-DMAC7.html)

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JP6892277B2 (ja) * 2017-02-10 2021-06-23 株式会社日本マイクロニクス プローブ及び電気的接続装置
JP6980410B2 (ja) * 2017-05-23 2021-12-15 株式会社日本マイクロニクス プローブ
JP7075725B2 (ja) 2017-05-30 2022-05-26 株式会社日本マイクロニクス 電気的接続装置
US10566256B2 (en) * 2018-01-04 2020-02-18 Winway Technology Co., Ltd. Testing method for testing wafer level chip scale packages
WO2020039969A1 (ja) * 2018-08-23 2020-02-27 日本電産リード株式会社 検査治具、検査装置、及び接触端子
KR102037657B1 (ko) 2018-09-05 2019-10-29 주식회사 아이에스시 전기적 검사용 프로브 카드 및 프로브 카드의 프로브 헤드
TWI857011B (zh) * 2019-02-22 2024-10-01 日商日本電產理德股份有限公司 檢查治具
KR102037198B1 (ko) 2019-06-16 2019-10-28 심민섭 프로브 카드 검사 장치
CN112240945A (zh) * 2019-07-17 2021-01-19 中华精测科技股份有限公司 晶圆探针卡改良结构
JP7148472B2 (ja) * 2019-09-27 2022-10-05 株式会社フェローテックマテリアルテクノロジーズ セラミックス部品およびセラミックス部品の製造方法
KR102865650B1 (ko) 2020-01-31 2025-09-29 (주)포인트엔지니어링 프로브 헤드 및 이를 포함하는 프로브 카드
EP4113127A4 (en) * 2020-02-26 2024-03-27 Nidec Read Corporation Cylindrical body, contact terminal, inspection jig, and inspection device
JP7175518B2 (ja) * 2020-06-02 2022-11-21 東理システム株式会社 電力変換回路装置の電気特性検査ユニット装置
JP2022116470A (ja) * 2021-01-29 2022-08-10 株式会社村田製作所 プローブ装置
KR102892995B1 (ko) 2021-03-24 2025-12-05 삼성전자주식회사 반도체 소자 검사용 프로브 및 이를 포함하는 프로브 카드
KR102673349B1 (ko) * 2022-02-25 2024-06-07 (주)티에스이 저마찰형 프로브 헤드
TWI831293B (zh) * 2022-07-14 2024-02-01 中華精測科技股份有限公司 晶片測試插座
JP2024011702A (ja) * 2022-07-15 2024-01-25 日本発條株式会社 プローブホルダおよびプローブユニット
IT202200026178A1 (it) * 2022-12-21 2024-06-21 Technoprobe Spa Testa di misura per un’apparecchiatura di test di dispositivi elettronici
US20240125815A1 (en) * 2023-07-19 2024-04-18 Translarity, Inc. Socketed Probes

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JP2007012475A (ja) * 2005-06-30 2007-01-18 Fujitsu Ltd ソケット及び電子機器
JP2009230897A (ja) * 2008-03-19 2009-10-08 Fujitsu Ltd 電子部品接合装置、電子ユニット、および電子装置
WO2011115082A1 (ja) * 2010-03-15 2011-09-22 日本電産リード株式会社 接続端子及び接続治具
TW201331587A (zh) * 2011-10-07 2013-08-01 Nhk Spring Co Ltd 探針單元
TW201411133A (zh) * 2012-08-01 2014-03-16 Japan Electronic Materials 探針卡用引導板及具有其之探針卡

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JP4455940B2 (ja) 2004-06-17 2010-04-21 株式会社日本マイクロニクス 電気的接続装置
JP2007057444A (ja) * 2005-08-25 2007-03-08 Nidec-Read Corp 基板検査装置、及び基板検査装置の温度維持機構
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JP2008243861A (ja) 2007-03-23 2008-10-09 Tokyo Electron Ltd 検査装置及び検査方法
JP2009162483A (ja) 2007-12-28 2009-07-23 Micronics Japan Co Ltd 電気的接続装置
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JP6017228B2 (ja) 2012-08-27 2016-10-26 株式会社日本マイクロニクス 電気的接続装置
JP2014048266A (ja) * 2012-09-04 2014-03-17 Toshiba Corp プローブカード、これを用いた撮像素子の試験方法および試験装置
JP6235785B2 (ja) * 2013-03-18 2017-11-22 日本電子材料株式会社 プローブカード用ガイド板およびプローブカード用ガイド板の製造方法
TWI548879B (zh) * 2014-01-28 2016-09-11 Spring sleeve probe
JP6546719B2 (ja) 2014-02-07 2019-07-17 株式会社日本マイクロニクス 接触検査装置
TW201533449A (zh) 2014-02-24 2015-09-01 Mpi Corp 具有彈簧套筒式探針之探針裝置
TWI570415B (zh) * 2015-10-02 2017-02-11 A spring probe having an outer sleeve and a probe device having the spring probe

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007012475A (ja) * 2005-06-30 2007-01-18 Fujitsu Ltd ソケット及び電子機器
JP2009230897A (ja) * 2008-03-19 2009-10-08 Fujitsu Ltd 電子部品接合装置、電子ユニット、および電子装置
WO2011115082A1 (ja) * 2010-03-15 2011-09-22 日本電産リード株式会社 接続端子及び接続治具
TW201331587A (zh) * 2011-10-07 2013-08-01 Nhk Spring Co Ltd 探針單元
TW201411133A (zh) * 2012-08-01 2014-03-16 Japan Electronic Materials 探針卡用引導板及具有其之探針卡

Also Published As

Publication number Publication date
EP3367108A1 (en) 2018-08-29
WO2017069028A1 (ja) 2017-04-27
CN108351371B (zh) 2021-04-27
CN108351371A (zh) 2018-07-31
EP3367108B1 (en) 2025-12-24
JP6890921B2 (ja) 2021-06-18
KR102015741B1 (ko) 2019-08-28
TW201728908A (zh) 2017-08-16
JP2017078660A (ja) 2017-04-27
EP3367108A4 (en) 2019-06-19
US10775411B2 (en) 2020-09-15
KR20180059867A (ko) 2018-06-05
US20180299489A1 (en) 2018-10-18

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