TWI625803B - 使用位元故障及虛擬檢測產生一種晶圓檢測程序 - Google Patents

使用位元故障及虛擬檢測產生一種晶圓檢測程序 Download PDF

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Publication number
TWI625803B
TWI625803B TW102102110A TW102102110A TWI625803B TW I625803 B TWI625803 B TW I625803B TW 102102110 A TW102102110 A TW 102102110A TW 102102110 A TW102102110 A TW 102102110A TW I625803 B TWI625803 B TW I625803B
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TW
Taiwan
Prior art keywords
wafer
defects
detected
defect detection
physical locations
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TW102102110A
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English (en)
Chinese (zh)
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TW201344822A (zh
Inventor
楊寶文
喬治 西蒙
杜岳宗
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克萊譚克公司
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Publication of TW201344822A publication Critical patent/TW201344822A/zh
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Publication of TWI625803B publication Critical patent/TWI625803B/zh

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    • H10P74/23—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H10P74/203—
    • H10P74/207—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
TW102102110A 2012-01-18 2013-01-18 使用位元故障及虛擬檢測產生一種晶圓檢測程序 TWI625803B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201261587911P 2012-01-18 2012-01-18
US61/587,911 2012-01-18
US13/743,074 2013-01-16
US13/743,074 US9277186B2 (en) 2012-01-18 2013-01-16 Generating a wafer inspection process using bit failures and virtual inspection

Publications (2)

Publication Number Publication Date
TW201344822A TW201344822A (zh) 2013-11-01
TWI625803B true TWI625803B (zh) 2018-06-01

Family

ID=48779693

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102102110A TWI625803B (zh) 2012-01-18 2013-01-18 使用位元故障及虛擬檢測產生一種晶圓檢測程序

Country Status (6)

Country Link
US (2) US9277186B2 (enExample)
JP (2) JP6180435B2 (enExample)
KR (2) KR101886853B1 (enExample)
CN (2) CN108062558B (enExample)
TW (1) TWI625803B (enExample)
WO (1) WO2013109714A1 (enExample)

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Also Published As

Publication number Publication date
CN104137120A (zh) 2014-11-05
KR101886853B1 (ko) 2018-08-09
CN108062558B (zh) 2022-10-11
US20160163606A1 (en) 2016-06-09
CN108062558A (zh) 2018-05-22
TW201344822A (zh) 2013-11-01
JP2017216466A (ja) 2017-12-07
KR102001356B1 (ko) 2019-07-17
CN104137120B (zh) 2018-01-02
JP2015509196A (ja) 2015-03-26
US20130182101A1 (en) 2013-07-18
WO2013109714A1 (en) 2013-07-25
JP6180435B2 (ja) 2017-08-16
US10014229B2 (en) 2018-07-03
JP6342046B2 (ja) 2018-06-13
KR20180093090A (ko) 2018-08-20
KR20140124778A (ko) 2014-10-27
US9277186B2 (en) 2016-03-01

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