KR102001356B1 - 비트 불량 및 가상 검사를 이용한 웨이퍼 검사 공정의 생성 - Google Patents

비트 불량 및 가상 검사를 이용한 웨이퍼 검사 공정의 생성 Download PDF

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KR102001356B1
KR102001356B1 KR1020187022407A KR20187022407A KR102001356B1 KR 102001356 B1 KR102001356 B1 KR 102001356B1 KR 1020187022407 A KR1020187022407 A KR 1020187022407A KR 20187022407 A KR20187022407 A KR 20187022407A KR 102001356 B1 KR102001356 B1 KR 102001356B1
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wafer
defects
physical locations
inspection
defect detection
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KR20180093090A (ko
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포 분 용
조지 시몬
위에종 두
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케이엘에이-텐코 코포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
KR1020187022407A 2012-01-18 2013-01-17 비트 불량 및 가상 검사를 이용한 웨이퍼 검사 공정의 생성 Active KR102001356B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261587911P 2012-01-18 2012-01-18
US61/587,911 2012-01-18
US13/743,074 2013-01-16
US13/743,074 US9277186B2 (en) 2012-01-18 2013-01-16 Generating a wafer inspection process using bit failures and virtual inspection
PCT/US2013/021880 WO2013109714A1 (en) 2012-01-18 2013-01-17 Generating a wafer inspection process using bit failures and virtual inspection

Related Parent Applications (1)

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KR1020147022835A Division KR101886853B1 (ko) 2012-01-18 2013-01-17 비트 불량 및 가상 검사를 이용한 웨이퍼 검사 공정의 생성

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KR20180093090A KR20180093090A (ko) 2018-08-20
KR102001356B1 true KR102001356B1 (ko) 2019-07-17

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KR1020147022835A Active KR101886853B1 (ko) 2012-01-18 2013-01-17 비트 불량 및 가상 검사를 이용한 웨이퍼 검사 공정의 생성
KR1020187022407A Active KR102001356B1 (ko) 2012-01-18 2013-01-17 비트 불량 및 가상 검사를 이용한 웨이퍼 검사 공정의 생성

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US (2) US9277186B2 (enExample)
JP (2) JP6180435B2 (enExample)
KR (2) KR101886853B1 (enExample)
CN (2) CN108062558B (enExample)
TW (1) TWI625803B (enExample)
WO (1) WO2013109714A1 (enExample)

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US9470743B2 (en) * 2014-03-04 2016-10-18 Nvidia Corporation Dynamic yield prediction
US10127653B2 (en) * 2014-07-22 2018-11-13 Kla-Tencor Corp. Determining coordinates for an area of interest on a specimen
US9816939B2 (en) 2014-07-22 2017-11-14 Kla-Tencor Corp. Virtual inspection systems with multiple modes
US10133263B1 (en) 2014-08-18 2018-11-20 Kla-Tencor Corporation Process condition based dynamic defect inspection
US10267746B2 (en) 2014-10-22 2019-04-23 Kla-Tencor Corp. Automated pattern fidelity measurement plan generation
US9830421B2 (en) * 2014-12-31 2017-11-28 Kla-Tencor Corp. Alignment of inspection to design using built in targets
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KR102459337B1 (ko) * 2020-12-21 2022-10-28 주식회사 에타맥스 실리콘 카바이드 웨이퍼의 결함을 회피하는 다이 구획방법 및 검사장치

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Also Published As

Publication number Publication date
TW201344822A (zh) 2013-11-01
US20160163606A1 (en) 2016-06-09
CN104137120B (zh) 2018-01-02
KR101886853B1 (ko) 2018-08-09
JP2017216466A (ja) 2017-12-07
WO2013109714A1 (en) 2013-07-25
TWI625803B (zh) 2018-06-01
US20130182101A1 (en) 2013-07-18
CN108062558B (zh) 2022-10-11
CN108062558A (zh) 2018-05-22
CN104137120A (zh) 2014-11-05
US9277186B2 (en) 2016-03-01
JP6342046B2 (ja) 2018-06-13
JP2015509196A (ja) 2015-03-26
US10014229B2 (en) 2018-07-03
JP6180435B2 (ja) 2017-08-16
KR20140124778A (ko) 2014-10-27
KR20180093090A (ko) 2018-08-20

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