TWI623982B - 晶粒接合器、接合方法及半導體裝置之製造方法 - Google Patents

晶粒接合器、接合方法及半導體裝置之製造方法 Download PDF

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Publication number
TWI623982B
TWI623982B TW105123445A TW105123445A TWI623982B TW I623982 B TWI623982 B TW I623982B TW 105123445 A TW105123445 A TW 105123445A TW 105123445 A TW105123445 A TW 105123445A TW I623982 B TWI623982 B TW I623982B
Authority
TW
Taiwan
Prior art keywords
wafer
die
bonding
pickup
platforms
Prior art date
Application number
TW105123445A
Other languages
English (en)
Chinese (zh)
Other versions
TW201719773A (zh
Inventor
牧浩
Hiroshi Maki
灘本啓祐
Keisuke Nadamoto
岡本直樹
Naoki Okamoto
Original Assignee
捷進科技有限公司
Fasford Technology Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 捷進科技有限公司, Fasford Technology Co., Ltd. filed Critical 捷進科技有限公司
Publication of TW201719773A publication Critical patent/TW201719773A/zh
Application granted granted Critical
Publication of TWI623982B publication Critical patent/TWI623982B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
TW105123445A 2015-08-31 2016-07-25 晶粒接合器、接合方法及半導體裝置之製造方法 TWI623982B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-170628 2015-08-31
JP2015170628A JP6584234B2 (ja) 2015-08-31 2015-08-31 ダイボンダ、ボンディング方法および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW201719773A TW201719773A (zh) 2017-06-01
TWI623982B true TWI623982B (zh) 2018-05-11

Family

ID=58273932

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105123445A TWI623982B (zh) 2015-08-31 2016-07-25 晶粒接合器、接合方法及半導體裝置之製造方法

Country Status (4)

Country Link
JP (1) JP6584234B2 (https=)
KR (2) KR101807419B1 (https=)
CN (1) CN106486398B (https=)
TW (1) TWI623982B (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101802080B1 (ko) 2016-05-31 2017-11-27 세메스 주식회사 웨이퍼로부터 다이들을 픽업하는 방법
JP6846958B2 (ja) * 2017-03-09 2021-03-24 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP6694404B2 (ja) * 2017-03-17 2020-05-13 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP6818608B2 (ja) * 2017-03-28 2021-01-20 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP6975551B2 (ja) * 2017-05-18 2021-12-01 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6868471B2 (ja) * 2017-05-31 2021-05-12 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP7102113B2 (ja) * 2017-09-11 2022-07-19 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
WO2019065394A1 (ja) * 2017-09-29 2019-04-04 株式会社新川 実装装置
CN108155125B (zh) * 2017-12-25 2020-07-21 北京中电科电子装备有限公司 一种半导体芯片贴片装置
JP7018338B2 (ja) * 2018-03-19 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
KR102568388B1 (ko) * 2018-06-04 2023-08-18 한화정밀기계 주식회사 본딩 장치
CN110364446B (zh) * 2019-07-22 2021-04-09 深圳市得润光学有限公司 一种塑封光电耦合器的制造装置
JP7285162B2 (ja) * 2019-08-05 2023-06-01 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN110690152A (zh) * 2019-08-28 2020-01-14 苏州均华精密机械有限公司 大尺寸晶片接合装置
TWI739438B (zh) * 2020-05-21 2021-09-11 鴻騏新技股份有限公司 具有雙作業線的基板貼合機台以及具有雙作業線的基板處理系統
JP7498630B2 (ja) * 2020-09-11 2024-06-12 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP7704534B2 (ja) * 2021-01-18 2025-07-08 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP7570258B2 (ja) 2021-03-08 2024-10-21 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP7714414B2 (ja) * 2021-09-13 2025-07-29 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP7757097B2 (ja) * 2021-09-15 2025-10-21 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN115375612A (zh) * 2021-12-11 2022-11-22 微见智能封装技术(深圳)有限公司 一种提高芯片识别效率的方法
WO2025028255A1 (ja) * 2023-07-28 2025-02-06 東京エレクトロン株式会社 接合装置、接合システム、及び接合方法

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TW200612502A (en) * 2004-07-02 2006-04-16 Unaxis Int Trading Ltd Method and apparatus for mounting semiconductor chips
TW200824059A (en) * 2006-10-19 2008-06-01 Asm Technology Singapore Ptd Ltd Electronic device handler for a bonding apparatus
TW200929425A (en) * 2007-10-09 2009-07-01 Oerlikon Assembly Equipment Ag Steinhausen Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate
TW201120978A (en) * 2009-12-04 2011-06-16 Top Eng Co Ltd LED chip bonding apparatus
TW201324665A (zh) * 2011-09-16 2013-06-16 日立先端科技儀器股份有限公司 晶粒接合器及接合方法
TW201415562A (zh) * 2012-10-12 2014-04-16 財團法人工業技術研究院 黏晶方法及其裝置

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JPH05190904A (ja) * 1992-01-08 1993-07-30 Riyoukoushiya:Kk 微小チップの取り出し方法
JP3822923B2 (ja) * 1995-06-27 2006-09-20 キヤノンマシナリー株式会社 ピックアップ装置及びチップ位置決め方法
JP2010040738A (ja) * 2008-08-05 2010-02-18 Toshiba Corp 半導体装置の製造装置及び製造方法
CN102834910B (zh) 2010-04-13 2015-07-22 日本先锋公司 元件移送装置及方法
WO2013145114A1 (ja) * 2012-03-27 2013-10-03 富士機械製造株式会社 ダイ供給装置
JP2014017313A (ja) * 2012-07-06 2014-01-30 Panasonic Corp 部品実装装置
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Publication number Priority date Publication date Assignee Title
TW200612502A (en) * 2004-07-02 2006-04-16 Unaxis Int Trading Ltd Method and apparatus for mounting semiconductor chips
TW200824059A (en) * 2006-10-19 2008-06-01 Asm Technology Singapore Ptd Ltd Electronic device handler for a bonding apparatus
TW200929425A (en) * 2007-10-09 2009-07-01 Oerlikon Assembly Equipment Ag Steinhausen Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate
TW201120978A (en) * 2009-12-04 2011-06-16 Top Eng Co Ltd LED chip bonding apparatus
TW201324665A (zh) * 2011-09-16 2013-06-16 日立先端科技儀器股份有限公司 晶粒接合器及接合方法
TW201415562A (zh) * 2012-10-12 2014-04-16 財團法人工業技術研究院 黏晶方法及其裝置

Also Published As

Publication number Publication date
KR20170136483A (ko) 2017-12-11
JP6584234B2 (ja) 2019-10-02
KR20170026281A (ko) 2017-03-08
KR101838456B1 (ko) 2018-03-13
TW201719773A (zh) 2017-06-01
CN106486398A (zh) 2017-03-08
CN106486398B (zh) 2019-07-09
JP2017050327A (ja) 2017-03-09
KR101807419B1 (ko) 2017-12-08

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