201120978 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種發光二極體晶片接合裝置，特別關 於一種能夠減少持取發光二極體晶片並將其接合於導線 架上之時程，進而增加生產力。 【先前技術】 一般而言，發光二極體元件之製程方法包含一晶圓接 合步驟、一切割步驟、一晶粒分離步驟、一晶粒接合步驟、 一打線接合步驟以及一封裝步驟。其中，晶圓接合步驟係 將一具有複數發光二極體晶片之晶圓設置於一結合片 上，再藉由切割步驟將設置於結合片上之晶圓依據各別的 晶片切開，然後晶粒分離步驟係將各別的晶片從結合片上 分離，接者晶粒接合步驟係將已分離的晶片接合於導線 架，再藉由打線接合步驟使晶片與導線架之連接墊電性連 接，最後在封裝步驟中，藉由一環氧樹脂將設置於導線架 上之晶片封裝。 上述晶片接合步驟可藉由一發光二極體晶片接合裝 置來執行。該接合裝置亦可在經過切割步驟之晶圓上持取 各別的晶片，並藉由一黏膠或熱壓合步驟將晶片設置於導 線架上。 以下將舉例說明習知之發光二極體晶片接合裝置。 圖1係顯示一種習知之發光二極體晶片接合裝置。 如圖1所示，習知之發光二極體晶片接合裝置10係 201120978 用以將一晶片C貼合於一導線架LF之一上表面，並包含 一饋送單元20、一晶圓平台30、一晶片轉移單元40、一 第一取像單元50及一第二取像單元60。其中，饋送單元 20具有一導執21，導線架LF設置於導執21上並可由導 執21導引移動。晶圓平台30上係設置一具有複數發光二 極體晶片C之晶圓W。晶片轉移早元40係具有一吸附頭 41，以將已分離之晶片C轉移至導線架LF。第一及第二 取像單元50、60係用以分別監測晶片C之配置及導線架 LF之位置資訊。 其中，吸附頭41係可沿如圖1所示之Y軸（左右移 動）及Z軸方向（上下移動）移動，晶圓平台30係可沿X 軸（前後移動）及Y軸方向（左右移動）移動。 據此，吸附頭41可將晶片C從晶圓平台30上轉移至 位於導執21上之導線架LF。並且晶圓平台30之作動可調 整晶片C之位置，再依據第一取像單元50對晶圓W攝像 的結果，以便吸附頭41可精確地持取晶片C。 另外，第二取像單元60係用以擷取導線架LF之位置 資訊。 然而，在習知發光二極體晶片接合裝置10將晶片C 接合於導線架LF的過程中，吸附頭41需來來回回地在晶 圓平台30與導軌21之間移動，因而浪費不少時間，並延 長生產時程及降低產能。 此外，習知發光二極體晶片接合裝置亦無法檢測發光 二極體晶片之底部（面對晶圓平台）是否有缺陷。 201120978 【發明内容】 鑒於上述習知缺點，本發明之一目的係提供一種發光 二極體晶片接合裝置，其係能夠同時地持取一發光二極體 晶片並將另一發光二極體晶片設置於導線架，進而縮短生 產時程並提高生產力。 本發明之另一目的係提供一種發光二極體晶片接合 裝置，其係能夠檢測發光二極體晶片之一底部表面是否有 缺陷。 為達上述目的，本發明提供一種發光二極體晶片接合 裝置包含一晶圓平台、一導線架平台、一發光二極體晶片 轉移單元、一第一取像單元，一第二取像單元以及一控制 單元。晶圓平台係用以承載具有一發光二極體晶片之一晶 圓，且晶圓平台係可沿一平面上相互垂直的兩軸移動。導 線架平台係用以設置一導線架，且導線架平台係可沿一平 面上相互垂直的兩軸運動。發光二極體晶片轉移單元係可 沿一轉軸旋轉，該轉軸係垂直於晶圓平台運動之平面，發 光二極體晶片轉移單元係將發光二極體晶片從晶圓平台 轉移至導線架平台。第一取像單元係擷取導線架之一位置 資訊。第二取像單元係擷取發光二極體晶片與晶圓平台分 離之一位置資訊、或發光二極體晶片位在晶圓中之一配置 狀態。控制單元係依據第一及第二取像單元所提供之資訊 來調整晶圓平台與導線架平台，俾使發光二極體晶片與導 線架之最終接合位置互相重疊，其中發光二極體晶片轉移 201120978 單元係同時執行取出發光二極體晶片並接合另一發光二 極體晶片於導線架的動作。 在本發明之一實施例中，發光二極體晶片轉移單元可 包含一可旋轉之本體、複數轉移頭以及一致動元件，該等 轉移頭係等間隔設置於本體之一周緣並可沿著與晶圓平 台移動之平面垂直之轉軸移動，致動元件係致動該等轉移 頭。 在本發明之一實施例中，致動元件係具有一攝像凹 槽。 在本發明之一實施例中，本體係可透光。 在本發明之一實施例中，本體係具有複數缺口部，該 等缺口部係位於該等轉移頭之間。 在本發明之一實施例中，發光二極體晶片轉移單元具 有一本體及複數轉移頭，本體可沿著與晶圓平台移動之平 面垂直之轉軸移動並沿著轉軸旋轉，該等轉移頭係等間隔 設置於該本體之一周緣。 在本發明之一實施例中，發光二極體晶片接合裝置可 更包含一第三取像單元，當發光二極體晶片由晶圓平台移 動至導線架時，第三取像單元可監測發光二極體晶片之一 底部。 若發光二極體晶片之底部具有一裂縫，控制單元係依 據第三取像單元監測所得之資訊判斷發光二極體晶片具 有一缺陷。 當控制單元依據第三取像單元監測所得之資訊判斷 201120978 發光二極體晶片偏斜時，轉移頭係可旋轉以修正發光二極 體晶片之偏斜。 【實施方式】 以下將參照相關圖式，說明依據本發明較佳實施例之 發光二極體晶片接合裝置，其中相同的元件將以相同的參 照符號加以說明。 第一實施例 圖2係本發明第一實施例之一種發光二極體晶片接合 裝置（以下簡稱為接合裝置）的示意圖，圖3係圖2所示 之接合裝置之另一示意圖，圖4係顯示圖2所示之一本體 的另一態樣。 如圖2及圖3所示，依本發明第一較佳實施例之接合 裝置A係包含一晶圓平台100、一導線架平台200、一發 光二極體晶片轉移單元300、一第一取像單元400、一第 二取像單元500以及一控制單元600。其中，晶圓平台100 上設置有一具有一發光二極體晶片C之晶圓W，且晶圓平 台100可在一平面上沿相互垂直的兩軸（以X軸及Y軸為 例）移動。導線架平台200上設置有一導線架LF，且導線 架平台200亦可沿一平面上相互垂直的兩軸運動，其中， 導線架平台200移動之平面係平行於晶圓平台100移動之 平面。發光二極體晶片轉移單元300係可依據一轉轴方向 (以Z軸方向為例）轉動，該轉轴方向係垂直於晶圓平台 100所移動之平面。發光二極體晶片轉移單元300係將發 201120978 光二極體晶片C由晶圓平台100轉移至導線架平台200 上。第一取像單元400用以擷取導線架LF之位置資訊。 第二取像單元500用以擷取發光二極體晶片C之位置資訊 或配置狀態。控制單元600係依據取像單元400、500所 取得之資訊來}調整晶圓平台100與導線架平台200，使發 光二極體晶片C及導線架LF之接合位置能夠互相重疊。 發光二極體晶片轉移單元300包含一本體310、複數 轉移頭320以及一致動元件330。本體310係可以Z軸方 向為軸心旋轉，該等轉移頭3 2 0係以等間距設置於本體310 之周緣並可沿Z軸方向移動，致動元件330係用以致動轉 移頭320。 由於本體310係不斷旋轉，且每隔一預定旋轉角度便 會停頓一下，故本體310較佳者係可利用步進馬達（圖未 顯示）實現。當然，步進馬達亦可使用其他常見之機械結 構來取代，同樣使得本體310可不斷旋轉，且每隔一預定 旋轉角度停頓一下。 另外，致動元件330可例如藉由一氣壓缸或一液壓缸 來驅動。 致動元件330具有一攝像凹槽331，且本體310較佳 者係可透光。 據此，當第一及第二取像單元400、500分別與一致 動元件330形成一直線時，取像單元400、500可由攝像 凹槽331對導線架LF及發光二極體晶片C進行攝像。 在此種情況下，由於導線架LF及晶片C可能會被轉 201120978 移頭320遮住，故較佳者係當取像單元400、500位於兩 兩轉移頭320之間時，即對導線架LF與晶片C進行攝像。 另外，如圖4所示之另一態樣之本體310係可具有複 數缺口部340，缺口部340係位於兩兩轉移頭320之間並 等間隔設置。 由於缺口部340之作用可視為與圖2所示之本體310 具有透光性之作用相同，故於此不再贅述。 請參照圖2所示，導線架平台200可與饋送單元210 分離以傳送導線架LF，並將已接合後之導線架LF傳送至 饋送單元210之導執211。另外，導線架平台200亦可與 饋送單元210 —體成型。 藉由本實施例之接合裝置A之該等轉移頭320可沿Z 軸方向移動以及本體310之旋轉作動，一發光二極體晶片 C可被持取且同時另一發光二極體晶片C可被接合於導線 架LF，因而大幅縮短生產時程並顯著提升生產力。 換言之，藉由同時持取發光二極體晶片C與將發光二 極體晶片C接合於導線架LF之操作，可大幅減少閒置時 間。 此外，藉由第一及第二取像單元400、500、可沿平面 之垂直軸向移動之導線架平台200及晶圓平台100，使得 發光二極體晶片C與導線架LF能夠精確地對準並接合。 另外，接合裝置A可更包含一第三取像單元700，其 係用以監測由晶圓平台100轉移至導線架平台200之發光 二極體晶片C之一底部。 201120978 在本實施例中’控制單元600依據第三取像單元700 所取得之資訊來判斷發光二極體晶片c是否有缺陷，其中 若檢測到晶片C的底部（面對晶圓平台ι〇〇)具有一裂縫 即判定發光二極體晶片C為有缺陷。 此外’控制單元600亦可依據第三取像單元7〇〇所取 得之資訊來判定發光二極體晶片C是否偏斜，若有偏斜的 情況，轉移頭320可相對本體310作旋轉以修正發光二極 體晶片C之偏斜。 因此，藉由轉移頭320持取發光二極體晶片C，並藉 由第三取像單元700對發光二極體晶片C的底部進行攝像 就可檢測出發光二極體晶片C是否有缺陷。此外，發光二 極體晶片C的偏斜亦可藉由轉移頭320之旋轉而得到精蜂 的修正。 另外，當本體310進行旋轉時’可依據第三取像單元 700所取得之資訊來調整本體310之狀態。 以下將舉例說明本發明第一實施例之接合裝置A的操 作。 首先’位於晶圓平台1〇0之發光二極體晶片C可藉由 第二取像單元500而察知。 然後，控制單元600係依據第二取像單元500所取得 之資訊來控制晶圓平台1〇〇沿X軸及Y軸移動以配置晶圓 平台100上之發光二極體晶片C到達正確位置。另外，藉 由第一取像單元400可得到位於導線架平台200上之導線 架LF之位置資訊，使得控制單元600可依據第一取像單 201120978 元400所取得之資訊而修正導線架平台200之位置。 因此，發光二極體晶片C與導線架LF的接合位置便 能藉由第一與第二取像單元400、500而精確地配合。 首先，一轉移頭320係持取一已配置之發光二極體晶 片C，然後本體310係以Z軸方向為軸心旋轉一預定角度。 接著’當轉移頭320沿Z軸方向向下移動時，可以將 發光二極體晶片C接合至導線架LF。 藉由如此重覆的作動，該等發光二極體晶片C就不斷 地被持取並接合，且發光二極體晶片匚與導線架LF的接 合位置能夠精確地配合。 以下係關於本發明另一實施例之一種接合裝置A，，在 下面敘述中，與第一實施例相同或相似之元件係具有相同 或相似之結構及功能’且使用相同或相似之& "5虎來表示， 故相同或相似的細節不再贅述。 第二實施例 圖5係本發明第二實施例之一種發光二極體晶片接合 裝置的示意圖。 如圖5所示，本實施例之接合裝置A’係包含一晶圓平 台100、一導線架平台200、一發光二極體晶片轉移單元 300,、一第一取像單元400、一第二取像單元5〇〇以及— 控制單元600。其中，發光二極體晶片轉移單元3〇〇,係用 以將發光二極體晶片C從晶圓平台100轉移至導線架平台 200，取像單元400、500係用以擷取導線架LF之位置資 訊以及發光二極體晶片C之位置資訊或一配置狀態。 12 201120978 & &〆極體晶片轉移單元300*係具有一本體310’及複 9X 7〇 數轉移頭32〇，。本體310,可沿Z軸方向移動並以z軸為軸 心旋轉，轉移頭320,係等間隔設置於本體310’之周緣。 其中，本體310’可藉由一致動元件而沿Z軸方向移 動，致動元件可例如包含氣壓缸或液壓缸。 綜上所述，依據本發明之發光二極體晶片接合裝置， 藉由發光>棰體晶片轉移單元之旋轉、上升及下降之作 動，發光>極體晶片可同時被持取及接合於導線架’使得 製造時程大帳縮短因而提升生產力。 換言之，本發明之發光二極體晶片可不斷地被持取並 接合至導線架’因而減少了間置時間。 此外，本發明係藉由第三取像單元對被持取之發光二 極體晶片之底部進行攝像，而能夠檢測發光二極體晶片之 底部是否有缺陷。 此外，發光二極體晶片與導線架之接合位置能夠藉由 第一及第二取像單元、以及能夠沿X軸與γ軸方向移動之 導線架平台與晶圓平台’而能精確地配合。 此外，藉由第三取像單元、以及轉移頭相對本體之旋 轉而能夠精確地修正發光二極體晶片之偏斜。 以上所述僅為舉例性，而非為限制性者。任何未脫離 本發明之精神與範嘴，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。201120978 VI. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode wafer bonding apparatus, and more particularly to a time-course capable of reducing the holding of a light-emitting diode wafer and bonding it to a lead frame, In turn, increase productivity. [Prior Art] In general, a method of fabricating a light emitting diode device includes a wafer bonding step, a dicing step, a die separation step, a die bonding step, a wire bonding step, and a packaging step. The wafer bonding step is to dispose a wafer having a plurality of LED chips on a bonding chip, and then cutting the wafers disposed on the bonding wafer according to the respective wafers by a cutting step, and then performing a die separation step. Separating the individual wafers from the bonding pads, the die bonding step is to bond the separated wafers to the leadframes, and then electrically connecting the wafers to the bonding pads of the leadframes by a wire bonding step, and finally in the packaging step. The chip disposed on the lead frame is packaged by an epoxy resin. The wafer bonding step described above can be performed by a light emitting diode wafer bonding apparatus. The bonding device can also hold individual wafers on the wafer through the dicing step and place the wafer on the wire frame by a glue or thermal compression step. A conventional light-emitting diode wafer bonding apparatus will be exemplified below. Figure 1 shows a conventional light emitting diode wafer bonding apparatus. As shown in FIG. 1 , a conventional LED wafer bonding apparatus 10 is used to bond a wafer C to an upper surface of a lead frame LF and includes a feeding unit 20, a wafer platform 30, and a wafer. The wafer transfer unit 40, a first image capturing unit 50, and a second image capturing unit 60. Among them, the feeding unit 20 has a guide 21, and the lead frame LF is disposed on the guide 21 and can be guided to move by the guide 21. A wafer W having a plurality of light-emitting diode chips C is disposed on the wafer platform 30. The wafer transfer early 40 has a suction head 41 to transfer the separated wafer C to the lead frame LF. The first and second image capturing units 50, 60 are used to monitor the configuration of the wafer C and the position information of the lead frame LF, respectively. The adsorption head 41 is movable along the Y axis (left and right movement) and the Z axis direction (up and down movement) as shown in FIG. 1 , and the wafer platform 30 is movable along the X axis (forward and backward movement) and the Y axis direction (for moving left and right). )mobile. Accordingly, the adsorption head 41 can transfer the wafer C from the wafer platform 30 to the lead frame LF located on the guide 21. And the operation of the wafer platform 30 adjusts the position of the wafer C, and then according to the result of imaging the wafer W by the first image capturing unit 50, so that the adsorption head 41 can accurately hold the wafer C. In addition, the second image capturing unit 60 is configured to capture the position information of the lead frame LF. However, in the process in which the conventional light-emitting diode wafer bonding apparatus 10 bonds the wafer C to the lead frame LF, the adsorption head 41 needs to move back and forth between the wafer platform 30 and the guide rail 21, thereby wasting a lot of time. And extend production time and reduce production capacity. In addition, the conventional light-emitting diode wafer bonding apparatus cannot detect whether the bottom of the light-emitting diode wafer (facing the wafer platform) is defective. SUMMARY OF THE INVENTION In view of the above-mentioned disadvantages, it is an object of the present invention to provide a light-emitting diode wafer bonding apparatus capable of simultaneously holding one light-emitting diode wafer and setting another light-emitting diode wafer. In the lead frame, which shortens production time and increases productivity. Another object of the present invention is to provide a light-emitting diode wafer bonding apparatus capable of detecting whether or not a bottom surface of a light-emitting diode wafer is defective. To achieve the above objective, the present invention provides a light emitting diode wafer bonding apparatus including a wafer platform, a lead frame platform, a light emitting diode wafer transfer unit, a first image capturing unit, and a second image capturing unit. A control unit. The wafer platform is used to carry a crystal having one of the light emitting diode chips, and the wafer platform is movable along two axes perpendicular to each other on a plane. The lead frame platform is used to provide a lead frame, and the lead frame platform is movable along two axes perpendicular to each other on a plane. The light-emitting diode wafer transfer unit is rotatable along a rotation axis perpendicular to the plane of movement of the wafer platform, and the light-emitting diode wafer transfer unit transfers the light-emitting diode wafer from the wafer platform to the lead frame platform. The first image capturing unit captures the position information of one of the lead frames. The second image capturing unit captures one position information of the light emitting diode chip and the wafer platform, or one of the light emitting diode chip positions in the wafer. The control unit adjusts the wafer platform and the lead frame platform according to the information provided by the first and second image capturing units, so that the final bonding positions of the LED wafer and the lead frame overlap each other, wherein the light emitting diode wafer transfer In 201120978, the unit performs the action of taking out the light-emitting diode chip and bonding another light-emitting diode chip to the lead frame. In an embodiment of the present invention, the LED dipole transfer unit may include a rotatable body, a plurality of transfer heads, and an actuating element, and the transfer heads are equally spaced on one of the circumferences of the body and may be along The plane of the wafer platform moves perpendicularly to the axis of rotation, and the actuating element actuates the transfer heads. In an embodiment of the invention, the actuating element has an imaging recess. In an embodiment of the invention, the system is light transmissive. In one embodiment of the invention, the system has a plurality of notches that are located between the transfer heads. In an embodiment of the invention, the LED dipole transfer unit has a body and a plurality of transfer heads, and the body is movable along a rotation axis perpendicular to a plane on which the wafer platform moves and rotates along the rotation axis. They are equally spaced around one of the circumferences of the body. In an embodiment of the invention, the LED device can further include a third image capturing unit, and the third image capturing unit can monitor the light when the LED chip is moved from the wafer platform to the lead frame. One of the bottoms of the diode chip. If the bottom of the LED chip has a crack, the control unit determines that the LED chip has a defect according to the information monitored by the third image capturing unit. When the control unit judges that the 201120978 LED chip is deflected according to the information monitored by the third image capturing unit, the transfer head can be rotated to correct the deflection of the LED chip. [Embodiment] Hereinafter, a light-emitting diode wafer bonding apparatus according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals. 1 is a schematic view of a light-emitting diode wafer bonding apparatus (hereinafter simply referred to as a bonding apparatus) according to a first embodiment of the present invention, and FIG. 3 is another schematic diagram of the bonding apparatus shown in FIG. Another aspect of one of the bodies shown in FIG. 2 is shown. As shown in FIG. 2 and FIG. 3, the bonding apparatus A according to the first preferred embodiment of the present invention includes a wafer platform 100, a lead frame platform 200, a light-emitting diode wafer transfer unit 300, and a first take-up. The image unit 400, a second image capturing unit 500, and a control unit 600. The wafer platform 100 is provided with a wafer W having a light-emitting diode wafer C, and the wafer platform 100 can be moved along two mutually perpendicular axes (for example, the X-axis and the Y-axis) on a plane. A lead frame LF is disposed on the lead frame platform 200, and the lead frame platform 200 is also movable along two axes perpendicular to each other in a plane, wherein the plane in which the lead frame platform 200 moves is parallel to the plane in which the wafer platform 100 moves. The light-emitting diode wafer transfer unit 300 is rotatable according to a rotation axis direction (exemplified by the Z-axis direction) which is perpendicular to a plane on which the wafer platform 100 moves. The light-emitting diode wafer transfer unit 300 transfers the 201120978 photodiode wafer C from the wafer platform 100 to the lead frame platform 200. The first image capturing unit 400 is configured to capture position information of the lead frame LF. The second image capturing unit 500 is configured to capture the position information or the configuration state of the LED chip C. The control unit 600 adjusts the wafer platform 100 and the lead frame platform 200 based on the information obtained by the image capturing units 400 and 500 so that the bonding positions of the light-emitting diode wafer C and the lead frame LF can overlap each other. The light-emitting diode wafer transfer unit 300 includes a body 310, a plurality of transfer heads 320, and an actuating element 330. The body 310 is axially rotatable in the Z-axis direction. The transfer heads 320 are disposed at equal intervals on the circumference of the body 310 and are movable in the Z-axis direction. The actuating member 330 is used to actuate the transfer head 320. Since the body 310 is continuously rotated and pauses every predetermined rotation angle, the body 310 is preferably implemented by a stepping motor (not shown). Of course, the stepper motor can also be replaced with other common mechanical structures, again allowing the body 310 to be rotated continuously and paused every predetermined rotation angle. Additionally, the actuating member 330 can be driven, for example, by a pneumatic cylinder or a hydraulic cylinder. The actuating element 330 has an imaging recess 331 and the body 310 is preferably light transmissive. Accordingly, when the first and second image capturing units 400 and 500 respectively form a line with the matching element 330, the image capturing units 400 and 500 can image the lead frame LF and the light emitting diode wafer C by the imaging groove 331. In this case, since the lead frame LF and the wafer C may be blocked by the 201120978 transfer head 320, it is preferable that when the image taking units 400, 500 are located between the two transfer heads 320, that is, the lead frame The LF and the wafer C are imaged. Further, another aspect of the body 310 as shown in Fig. 4 may have a plurality of notch portions 340 which are located between the two transfer heads 320 and are equally spaced. Since the function of the notch portion 340 can be regarded as having the same function as that of the body 310 shown in FIG. 2, it will not be described herein. Referring to FIG. 2, the lead frame platform 200 can be separated from the feeding unit 210 to transport the lead frame LF, and the engaged lead frame LF is transferred to the guide 211 of the feeding unit 210. Additionally, the leadframe platform 200 can also be integrally formed with the feed unit 210. The transfer heads 320 of the bonding apparatus A of the present embodiment are movable in the Z-axis direction and the rotation of the body 310, and one LED wafer C can be held while another LED substrate C can be Bonding to the lead frame LF greatly reduces production time and significantly increases productivity. In other words, by simultaneously holding the light-emitting diode wafer C and bonding the light-emitting diode wafer C to the lead frame LF, the idle time can be greatly reduced. In addition, the first and second image capturing units 400, 500, the lead frame platform 200 and the wafer platform 100 that can move along the vertical axis of the plane enable the LED array C and the lead frame LF to be accurately aligned. Quasi-joined. In addition, the bonding device A may further include a third image capturing unit 700 for monitoring the bottom of one of the light emitting diode chips C transferred from the wafer platform 100 to the lead frame platform 200. In the present embodiment, the control unit 600 determines whether the LED chip c is defective according to the information obtained by the third image capturing unit 700. If the bottom of the wafer C is detected (facing the wafer platform) It is determined that the light-emitting diode wafer C is defective by having a crack. In addition, the control unit 600 can also determine whether the LED chip C is skewed according to the information obtained by the third image capturing unit 7 ,. If there is a skew, the transfer head 320 can be rotated relative to the body 310 to correct The deflection of the light-emitting diode wafer C. Therefore, the light-emitting diode wafer C is held by the transfer head 320, and the bottom portion of the light-emitting diode wafer C is imaged by the third image capturing unit 700 to detect whether or not the light-emitting diode wafer C is defective. Further, the deflection of the light-emitting diode wafer C can also be corrected by the rotation of the transfer head 320. In addition, when the body 310 is rotated, the state of the body 310 can be adjusted according to the information obtained by the third image capturing unit 700. The operation of the joining device A of the first embodiment of the present invention will be exemplified below. First, the light-emitting diode wafer C located on the wafer platform 1〇0 can be ascertained by the second image capturing unit 500. Then, the control unit 600 controls the wafer platform 1 to move along the X-axis and the Y-axis according to the information acquired by the second image capturing unit 500 to configure the light-emitting diode wafer C on the wafer platform 100 to reach the correct position. In addition, the position information of the lead frame LF located on the lead frame platform 200 can be obtained by the first image capturing unit 400, so that the control unit 600 can correct the lead frame platform 200 according to the information obtained by the first image book 201120978 400. The location. Therefore, the bonding position of the LED wafer C and the lead frame LF can be precisely matched by the first and second image taking units 400, 500. First, a transfer head 320 holds a configured light-emitting diode wafer C, and then the body 310 is rotated by a predetermined angle in the Z-axis direction. Then, when the transfer head 320 is moved downward in the Z-axis direction, the light-emitting diode wafer C can be bonded to the lead frame LF. By such repeated operations, the light-emitting diode wafers C are continuously held and joined, and the positions at which the light-emitting diode wafers are bonded to the lead frame LF can be accurately matched. The following is a joining device A according to another embodiment of the present invention. In the following description, the same or similar elements as the first embodiment have the same or similar structure and function 'and use the same or similar &" 5 tigers indicate that the same or similar details are not repeated here. SECOND EMBODIMENT Fig. 5 is a schematic view showing a light emitting diode wafer bonding apparatus according to a second embodiment of the present invention. As shown in FIG. 5, the bonding device A' of the embodiment includes a wafer platform 100, a lead frame platform 200, a light emitting diode wafer transfer unit 300, a first image capturing unit 400, and a second The image capturing unit 5A and the control unit 600. The light-emitting diode wafer transfer unit 3 is configured to transfer the light-emitting diode wafer C from the wafer platform 100 to the lead frame platform 200, and the image capturing units 400 and 500 are used to capture the lead frame LF. The position information and the position information or a configuration state of the LED chip C. 12 201120978 && gate wafer transfer unit 300* has a body 310' and a complex 9X 7 number transfer head 32〇. The body 310 is movable in the Z-axis direction and rotated about the z-axis, and the transfer heads 320 are disposed at equal intervals on the periphery of the body 310'. Wherein, the body 310' can be moved in the Z-axis direction by an actuating element, which can comprise, for example, a pneumatic cylinder or a hydraulic cylinder. In summary, according to the light-emitting diode wafer bonding apparatus of the present invention, the light-emitting > polar body wafer can be simultaneously held and bonded by the rotation, the rising and falling of the light-emitting body wafer transfer unit. The lead frame's shorten the manufacturing timeline and increase productivity. In other words, the light-emitting diode wafer of the present invention can be continuously held and bonded to the lead frame' thus reducing the interleaving time. Further, in the present invention, by imaging the bottom of the held light-emitting diode wafer by the third image capturing unit, it is possible to detect whether or not the bottom of the light-emitting diode wafer is defective. Further, the bonding position of the light-emitting diode wafer and the lead frame can be accurately matched by the first and second image taking units, and the lead frame platform and the wafer stage ' which are movable in the X-axis and γ-axis directions. Further, the deflection of the light-emitting diode wafer can be accurately corrected by the rotation of the third image taking unit and the transfer head with respect to the body. The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations of the present invention are intended to be included in the scope of the appended claims.
S 13 201120978 【圖式簡單說明】 圖1係一種習知發光二極體晶片接合裝置的示意圖； 圖2係本發明第一實施例之一種發光二極體晶片接合 裝置之一示意圖； 圖3係圖2所示之發光二極體晶片接合裝置之另一示 意圖； 圖4係顯示本發明第一實施例之本體之另一變化態樣 的不意圖，以及 圖5係本發明第二實施例之一種發光二極體晶片接合 裝置之一示意圖。 【主要元件符號說明】 10 :發光二極體晶片接合裝置 20 :饋送單元 21 :導軌 30 :晶圓平台 40 :晶片轉移單元 41 :吸附頭 50 :第一取像單元 60 :第二取像單元 100 :晶圓平台 200 :導線架平台 210 :饋送單元 211 :導軌 201120978 300、300':發光二極體晶片轉移單元 310、310':本體 320、320':轉移頭 330 :致動元件 331 :攝像凹槽 340 :缺口部 400 :第一取像單元 500 :第二取像單元 600 :控制單元 700 :第三取像單元 A、A,:接合裝置 C :晶片 LF :導線架 W :晶圓 15BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a conventional light-emitting diode wafer bonding apparatus; FIG. 2 is a schematic diagram of a light-emitting diode wafer bonding apparatus according to a first embodiment of the present invention; 2 is a schematic view showing another embodiment of the light-emitting diode wafer bonding apparatus shown in FIG. 2; FIG. 4 is a schematic view showing another variation of the body of the first embodiment of the present invention, and FIG. 5 is a second embodiment of the present invention. A schematic diagram of a light emitting diode wafer bonding apparatus. [Main component symbol description] 10: Light-emitting diode wafer bonding apparatus 20: Feed unit 21: Rail 30: Wafer stage 40: Wafer transfer unit 41: Adsorption head 50: First image capturing unit 60: Second image capturing unit 100: Wafer platform 200: lead frame platform 210: feeding unit 211: guide rail 201120978 300, 300': light emitting diode wafer transfer unit 310, 310': body 320, 320': transfer head 330: actuating element 331: Imaging groove 340: notch portion 400: first image capturing unit 500: second image capturing unit 600: control unit 700: third image capturing unit A, A,: bonding device C: wafer LF: lead frame W: wafer 15