CN102834910B - 元件移送装置及方法 - Google Patents
元件移送装置及方法 Download PDFInfo
- Publication number
- CN102834910B CN102834910B CN201080066125.4A CN201080066125A CN102834910B CN 102834910 B CN102834910 B CN 102834910B CN 201080066125 A CN201080066125 A CN 201080066125A CN 102834910 B CN102834910 B CN 102834910B
- Authority
- CN
- China
- Prior art keywords
- chip
- positional information
- location
- suction nozzle
- take
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 32
- 238000003825 pressing Methods 0.000 claims description 56
- 230000008859 change Effects 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 17
- 238000003860 storage Methods 0.000 claims description 4
- 230000009471 action Effects 0.000 description 72
- 239000000853 adhesive Substances 0.000 description 47
- 230000001070 adhesive effect Effects 0.000 description 47
- 238000010521 absorption reaction Methods 0.000 description 21
- 238000004904 shortening Methods 0.000 description 12
- 238000007689 inspection Methods 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000000994 depressogenic effect Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 208000034530 PLAA-associated neurodevelopmental disease Diseases 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
Description
Claims (7)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2010/056615 WO2011128981A1 (ja) | 2010-04-13 | 2010-04-13 | 部品移送装置及び方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102834910A CN102834910A (zh) | 2012-12-19 |
CN102834910B true CN102834910B (zh) | 2015-07-22 |
Family
ID=44798374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080066125.4A Expired - Fee Related CN102834910B (zh) | 2010-04-13 | 2010-04-13 | 元件移送装置及方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4919240B2 (zh) |
CN (1) | CN102834910B (zh) |
WO (1) | WO2011128981A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104205317B (zh) * | 2012-03-27 | 2017-02-22 | 富士机械制造株式会社 | 裸片供给装置 |
TWI570823B (zh) * | 2013-08-14 | 2017-02-11 | 新川股份有限公司 | 半導體製造裝置以及半導體裝置的製造方法 |
CN104576477A (zh) * | 2014-12-10 | 2015-04-29 | 南通富士通微电子股份有限公司 | 晶圆结构及其捡片方法 |
JP6584234B2 (ja) | 2015-08-31 | 2019-10-02 | ファスフォードテクノロジ株式会社 | ダイボンダ、ボンディング方法および半導体装置の製造方法 |
KR101872764B1 (ko) * | 2017-03-02 | 2018-06-29 | 주식회사 코엠에스 | 디스플레이용 엘이디칩 픽킹 배열 장치 |
JP6785735B2 (ja) * | 2017-09-07 | 2020-11-18 | Towa株式会社 | 切断装置及び半導体パッケージの搬送方法 |
JP7285162B2 (ja) * | 2019-08-05 | 2023-06-01 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
CN112908899A (zh) * | 2021-01-27 | 2021-06-04 | 深圳市卓兴半导体科技有限公司 | 一种芯片转移方法、系统及设备 |
DE102021105594B3 (de) * | 2021-03-09 | 2022-06-09 | Asm Assembly Systems Gmbh & Co. Kg | Verfahren zur Positionskorrektur von Bauteilen mit einer Aufnahmevorrichtung, Aufnahmevorrichtung, Computerprogrammprodukt und computerlesbares Medium |
CN115732378B (zh) * | 2021-08-30 | 2023-09-26 | 深圳市智立方自动化设备股份有限公司 | 一种吸嘴自动标定系统与方法 |
CN117457536B (zh) * | 2023-11-01 | 2024-03-26 | 江苏新智达新能源设备有限公司 | 一种基于图像处理的芯片智能拾取方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS632344A (ja) * | 1986-06-23 | 1988-01-07 | Matsushita Electric Works Ltd | ウエハチツプの検出方法 |
JP3719182B2 (ja) * | 2001-09-28 | 2005-11-24 | 松下電器産業株式会社 | 電子部品実装装置および電子部品実装方法 |
JP3861710B2 (ja) * | 2002-02-15 | 2006-12-20 | 松下電器産業株式会社 | 電子部品供給装置および電子部品実装装置 |
DE102005036821A1 (de) * | 2005-08-04 | 2007-03-15 | Siemens Ag | Verfahren zum Transferieren und Vorrichtung zum Handhaben von elektronischen Bauelementen |
JP4946668B2 (ja) * | 2007-07-02 | 2012-06-06 | 日本電気株式会社 | 基板位置検出装置及び基板位置検出方法 |
-
2010
- 2010-04-13 WO PCT/JP2010/056615 patent/WO2011128981A1/ja active Application Filing
- 2010-04-13 JP JP2011527085A patent/JP4919240B2/ja not_active Expired - Fee Related
- 2010-04-13 CN CN201080066125.4A patent/CN102834910B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2011128981A1 (ja) | 2011-10-20 |
CN102834910A (zh) | 2012-12-19 |
JP4919240B2 (ja) | 2012-04-18 |
JPWO2011128981A1 (ja) | 2013-07-11 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP02 | Change in the address of a patent holder |
Address after: Tokyo, Japan Co-patentee after: PIONEER FA Corp. Patentee after: PIONEER Corp. Address before: Kanagawa Co-patentee before: Pioneer Fa Corp. Patentee before: PIONEER Corp. |
|
CP02 | Change in the address of a patent holder | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Co-patentee after: PFA Co. Patentee after: PIONEER Corp. Address before: Tokyo, Japan Co-patentee before: Pioneer Fa Corp. Patentee before: PIONEER Corp. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180829 Address after: Saitama Prefecture, Japan Co-patentee after: SHINKAWA Ltd. Patentee after: PFA Co. Address before: Tokyo, Japan Co-patentee before: PFA Co. Patentee before: PIONEER Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150722 Termination date: 20190413 |