TWI622667B - 電化學沉積及補充設備 - Google Patents
電化學沉積及補充設備 Download PDFInfo
- Publication number
- TWI622667B TWI622667B TW105101717A TW105101717A TWI622667B TW I622667 B TWI622667 B TW I622667B TW 105101717 A TW105101717 A TW 105101717A TW 105101717 A TW105101717 A TW 105101717A TW I622667 B TWI622667 B TW I622667B
- Authority
- TW
- Taiwan
- Prior art keywords
- anode
- electrolyte
- module
- substrate
- soluble
- Prior art date
Links
- 238000004070 electrodeposition Methods 0.000 title claims abstract description 234
- 239000003792 electrolyte Substances 0.000 claims abstract description 327
- 239000000758 substrate Substances 0.000 claims abstract description 168
- 239000003014 ion exchange membrane Substances 0.000 claims abstract description 154
- 239000012528 membrane Substances 0.000 claims abstract description 145
- 238000012545 processing Methods 0.000 claims abstract description 129
- 238000000151 deposition Methods 0.000 claims abstract description 119
- 230000008021 deposition Effects 0.000 claims abstract description 111
- 150000002500 ions Chemical class 0.000 claims abstract description 111
- 238000000034 method Methods 0.000 claims abstract description 101
- 238000011282 treatment Methods 0.000 claims abstract description 99
- 230000008569 process Effects 0.000 claims abstract description 87
- 238000000926 separation method Methods 0.000 claims abstract description 31
- 125000002091 cationic group Chemical group 0.000 claims abstract description 21
- 238000005234 chemical deposition Methods 0.000 claims abstract description 7
- 230000000153 supplemental effect Effects 0.000 claims description 144
- 239000012530 fluid Substances 0.000 claims description 121
- 229910007637 SnAg Inorganic materials 0.000 claims description 52
- 229910052751 metal Inorganic materials 0.000 claims description 41
- 239000002184 metal Substances 0.000 claims description 41
- 239000000872 buffer Substances 0.000 claims description 33
- 239000007853 buffer solution Substances 0.000 claims description 32
- 238000011109 contamination Methods 0.000 claims description 13
- 239000008188 pellet Substances 0.000 claims description 13
- 230000000295 complement effect Effects 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 9
- 238000005868 electrolysis reaction Methods 0.000 claims description 5
- 238000005342 ion exchange Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 229910001423 beryllium ion Inorganic materials 0.000 claims 1
- 239000008151 electrolyte solution Substances 0.000 claims 1
- 239000011135 tin Substances 0.000 description 120
- 238000007747 plating Methods 0.000 description 85
- 239000000243 solution Substances 0.000 description 52
- 238000013019 agitation Methods 0.000 description 37
- 230000010355 oscillation Effects 0.000 description 29
- 235000012431 wafers Nutrition 0.000 description 27
- 239000010949 copper Substances 0.000 description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- 229910001868 water Inorganic materials 0.000 description 23
- 239000000126 substance Substances 0.000 description 22
- 239000013589 supplement Substances 0.000 description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- 229910052718 tin Inorganic materials 0.000 description 18
- 239000000463 material Substances 0.000 description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 16
- 238000009826 distribution Methods 0.000 description 16
- 230000010360 secondary oscillation Effects 0.000 description 16
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 15
- 239000003963 antioxidant agent Substances 0.000 description 15
- 229910021645 metal ion Inorganic materials 0.000 description 15
- 230000009471 action Effects 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 14
- 238000009713 electroplating Methods 0.000 description 14
- 230000002829 reductive effect Effects 0.000 description 14
- 230000003078 antioxidant effect Effects 0.000 description 13
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- 238000003809 water extraction Methods 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 230000003647 oxidation Effects 0.000 description 10
- 238000007254 oxidation reaction Methods 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- 239000000654 additive Substances 0.000 description 9
- 230000008901 benefit Effects 0.000 description 9
- 238000005370 electroosmosis Methods 0.000 description 9
- 239000007787 solid Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 238000012824 chemical production Methods 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 230000008859 change Effects 0.000 description 7
- 238000011068 loading method Methods 0.000 description 7
- 229940098779 methanesulfonic acid Drugs 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 238000000605 extraction Methods 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 230000002441 reversible effect Effects 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 238000009825 accumulation Methods 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000009472 formulation Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000013011 mating Effects 0.000 description 5
- 230000003534 oscillatory effect Effects 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 238000007792 addition Methods 0.000 description 4
- 239000006227 byproduct Substances 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000000717 retained effect Effects 0.000 description 4
- 230000001502 supplementing effect Effects 0.000 description 4
- 238000000108 ultra-filtration Methods 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N 1,4-Benzenediol Natural products OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 3
- -1 SnAg Chemical class 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 230000008030 elimination Effects 0.000 description 3
- 238000003379 elimination reaction Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007726 management method Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 230000009469 supplementation Effects 0.000 description 3
- 229910001432 tin ion Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004801 Chlorinated PVC Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000010405 anode material Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000010668 complexation reaction Methods 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000007717 exclusion Effects 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000005194 fractionation Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000006259 organic additive Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 230000037361 pathway Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000557 Nafion® Polymers 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000010349 cathodic reaction Methods 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000000779 depleting effect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 238000004520 electroporation Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000011067 equilibration Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012527 feed solution Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 125000000687 hydroquinonyl group Chemical group C1(O)=C(C=C(O)C=C1)* 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000011221 initial treatment Methods 0.000 description 1
- 239000006193 liquid solution Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003204 osmotic effect Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/22—Regeneration of process solutions by ion-exchange
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161475417P | 2011-04-14 | 2011-04-14 | |
| US61/475,417 | 2011-04-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201615901A TW201615901A (zh) | 2016-05-01 |
| TWI622667B true TWI622667B (zh) | 2018-05-01 |
Family
ID=47009702
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105101717A TWI622667B (zh) | 2011-04-14 | 2012-04-13 | 電化學沉積及補充設備 |
| TW101113198A TWI537428B (zh) | 2011-04-14 | 2012-04-13 | 電化學沉積及補充設備 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101113198A TWI537428B (zh) | 2011-04-14 | 2012-04-13 | 電化學沉積及補充設備 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9017528B2 (enExample) |
| JP (1) | JP2014510842A (enExample) |
| KR (1) | KR101959095B1 (enExample) |
| CN (1) | CN103608490B (enExample) |
| TW (2) | TWI622667B (enExample) |
| WO (1) | WO2012142352A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI743872B (zh) * | 2019-07-19 | 2021-10-21 | 美商先進尼克斯有限公司 | 電化學沉積系統 |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130095649A1 (en) * | 2011-10-17 | 2013-04-18 | International Business Machines Corporation | Chemical Bath Replenishment |
| US9637836B2 (en) | 2013-07-03 | 2017-05-02 | Tel Nexx, Inc. | Electrochemical deposition apparatus and methods for controlling the chemistry therein |
| US9303329B2 (en) * | 2013-11-11 | 2016-04-05 | Tel Nexx, Inc. | Electrochemical deposition apparatus with remote catholyte fluid management |
| US9481940B2 (en) | 2014-06-26 | 2016-11-01 | International Business Machines Corporation | Electrodeposition system and method incorporating an anode having a back side capacitive element |
| MX2017009630A (es) * | 2015-02-05 | 2018-03-28 | A King Forrest | Metodo y sistema mejorado de electrolisis de derivacion. |
| JP6408936B2 (ja) * | 2015-03-05 | 2018-10-17 | 株式会社荏原製作所 | めっき装置 |
| US10011919B2 (en) * | 2015-05-29 | 2018-07-03 | Lam Research Corporation | Electrolyte delivery and generation equipment |
| US10227707B2 (en) * | 2015-07-17 | 2019-03-12 | Applied Materials, Inc. | Inert anode electroplating processor and replenisher |
| US9765443B2 (en) * | 2015-09-02 | 2017-09-19 | Applied Materials, Inc. | Electroplating processor with current thief electrode |
| US9920448B2 (en) * | 2015-11-18 | 2018-03-20 | Applied Materials, Inc. | Inert anode electroplating processor and replenisher with anionic membranes |
| JP6577404B2 (ja) * | 2016-04-05 | 2019-09-18 | ファナック株式会社 | 絞りユニット及びこれを備えた静圧軸受装置並びに溝付きブロックの製造方法 |
| US20170370017A1 (en) * | 2016-06-27 | 2017-12-28 | Tel Nexx, Inc. | Wet processing system and method of operating |
| GB201701166D0 (en) * | 2017-01-24 | 2017-03-08 | Picofluidics Ltd | An apparatus for electrochemically processing semiconductor substrates |
| WO2018162682A1 (de) * | 2017-03-08 | 2018-09-13 | Technische Universität Darmstadt | Anordnung und verfahren zum bereitstellen einer vielzahl von nanodrähten sowie galvanikkapsel |
| JP2022532943A (ja) * | 2019-05-24 | 2022-07-20 | ラム リサーチ コーポレーション | 光学プローブを含む電気化学的堆積システム |
| JP7316908B2 (ja) * | 2019-10-30 | 2023-07-28 | 株式会社荏原製作所 | アノード組立体 |
| US11697887B2 (en) * | 2020-10-23 | 2023-07-11 | Applied Materials, Inc. | Multi-compartment electrochemical replenishment cell |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002506488A (ja) * | 1998-04-21 | 2002-02-26 | アプライド マテリアルズ インコーポレイテッド | 電気化学堆積システム及び基体の電気めっき方法 |
| CN1623012A (zh) * | 2000-10-03 | 2005-06-01 | 应用材料有限公司 | 一旦进入金属沉积用来倾斜基片的方法和相关设备 |
Family Cites Families (112)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB293648A (en) | 1928-01-12 | 1928-07-12 | Henry Edward Smith | Improved wallet for containing papers and documents |
| US3072545A (en) | 1961-11-20 | 1963-01-08 | Ionics | Electroplating of metals |
| US3658470A (en) | 1969-06-16 | 1972-04-25 | Industrial Filter Pump Mfg Co | Metal ion recovery system |
| JPS5144527B2 (enExample) | 1973-04-19 | 1976-11-29 | ||
| US4118295A (en) * | 1976-04-20 | 1978-10-03 | Dart Industries Inc. | Regeneration of plastic etchants |
| US4469564A (en) | 1982-08-11 | 1984-09-04 | At&T Bell Laboratories | Copper electroplating process |
| US4565609A (en) | 1983-12-22 | 1986-01-21 | Learonal, Inc. | Bath and process for plating tin, lead and tin-lead alloys |
| JPH0339500Y2 (enExample) | 1986-01-10 | 1991-08-20 | ||
| JPS62188791A (ja) | 1986-02-15 | 1987-08-18 | Nishimura Watanabe Chiyuushiyutsu Kenkyusho:Kk | Ｎｉ，Ｃｏ，Ｚｎ，Ｃｕ，Ｍｎ及びＣｒの電解採取方法 |
| EP0242111B1 (en) | 1986-04-07 | 1992-07-01 | Tosoh Corporation | Method for producing a metal salt by electrolysis |
| NL8602730A (nl) | 1986-10-30 | 1988-05-16 | Hoogovens Groep Bv | Werkwijze voor het electrolytisch vertinnen van blik met behulp van een onoplosbare anode. |
| EP0283681B1 (de) | 1987-02-23 | 1992-05-06 | Siemens Aktiengesellschaft | Galvanisiereinrichtung zur Erzeugung von Höckern auf Chip-Bauelementen |
| US4832812A (en) | 1987-09-08 | 1989-05-23 | Eco-Tec Limited | Apparatus for electroplating metals |
| US4778572A (en) | 1987-09-08 | 1988-10-18 | Eco-Tec Limited | Process for electroplating metals |
| US5039576A (en) | 1989-05-22 | 1991-08-13 | Atochem North America, Inc. | Electrodeposited eutectic tin-bismuth alloy on a conductive substrate |
| US4906340A (en) | 1989-05-31 | 1990-03-06 | Eco-Tec Limited | Process for electroplating metals |
| USRE34191E (en) | 1989-05-31 | 1993-03-09 | Eco-Tec Limited | Process for electroplating metals |
| JPH086198B2 (ja) | 1990-08-15 | 1996-01-24 | 株式会社アルメックス | 水平搬送型メッキ装置 |
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Also Published As
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| CN103608490A (zh) | 2014-02-26 |
| TW201305393A (zh) | 2013-02-01 |
| TWI537428B (zh) | 2016-06-11 |
| US20120298502A1 (en) | 2012-11-29 |
| KR101959095B1 (ko) | 2019-03-15 |
| JP2014510842A (ja) | 2014-05-01 |
| KR20140027247A (ko) | 2014-03-06 |
| WO2012142352A1 (en) | 2012-10-18 |
| US9017528B2 (en) | 2015-04-28 |
| CN103608490B (zh) | 2016-08-10 |
| TW201615901A (zh) | 2016-05-01 |
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