JP2014510842A - 電気化学堆積装置及び補充装置 - Google Patents

電気化学堆積装置及び補充装置 Download PDF

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Publication number
JP2014510842A
JP2014510842A JP2014505317A JP2014505317A JP2014510842A JP 2014510842 A JP2014510842 A JP 2014510842A JP 2014505317 A JP2014505317 A JP 2014505317A JP 2014505317 A JP2014505317 A JP 2014505317A JP 2014510842 A JP2014510842 A JP 2014510842A
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anode
process electrolyte
module
electrochemical deposition
deposition apparatus
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JP2014505317A
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JP2014510842A5 (enExample
Inventor
パパパナイオトウ，デメトリウス
キーグラー，アーサー
グアルナッチャ，デイヴィッド
ハンダー，ジョナサン
チウ，ヨハネス
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ティーイーエル ネックス，インコーポレイテッド
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Publication of JP2014510842A publication Critical patent/JP2014510842A/ja
Publication of JP2014510842A5 publication Critical patent/JP2014510842A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/22—Regeneration of process solutions by ion-exchange
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2014505317A 2011-04-14 2012-04-13 電気化学堆積装置及び補充装置 Pending JP2014510842A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161475417P 2011-04-14 2011-04-14
US61/475,417 2011-04-14
PCT/US2012/033422 WO2012142352A1 (en) 2011-04-14 2012-04-13 Electro chemical deposition and replenishment apparatus

Publications (2)

Publication Number Publication Date
JP2014510842A true JP2014510842A (ja) 2014-05-01
JP2014510842A5 JP2014510842A5 (enExample) 2015-05-28

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JP2014505317A Pending JP2014510842A (ja) 2011-04-14 2012-04-13 電気化学堆積装置及び補充装置

Country Status (6)

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US (1) US9017528B2 (enExample)
JP (1) JP2014510842A (enExample)
KR (1) KR101959095B1 (enExample)
CN (1) CN103608490B (enExample)
TW (2) TWI537428B (enExample)
WO (1) WO2012142352A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021070844A (ja) * 2019-10-30 2021-05-06 株式会社荏原製作所 アノード組立体

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130095649A1 (en) * 2011-10-17 2013-04-18 International Business Machines Corporation Chemical Bath Replenishment
US9637836B2 (en) 2013-07-03 2017-05-02 Tel Nexx, Inc. Electrochemical deposition apparatus and methods for controlling the chemistry therein
US9303329B2 (en) * 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management
US9481940B2 (en) 2014-06-26 2016-11-01 International Business Machines Corporation Electrodeposition system and method incorporating an anode having a back side capacitive element
CA2974403A1 (en) * 2015-02-05 2016-08-11 Forrest A. King Improved bypass electrolysis system and method
JP6408936B2 (ja) * 2015-03-05 2018-10-17 株式会社荏原製作所 めっき装置
US10011919B2 (en) * 2015-05-29 2018-07-03 Lam Research Corporation Electrolyte delivery and generation equipment
US10227707B2 (en) 2015-07-17 2019-03-12 Applied Materials, Inc. Inert anode electroplating processor and replenisher
US9765443B2 (en) * 2015-09-02 2017-09-19 Applied Materials, Inc. Electroplating processor with current thief electrode
US9920448B2 (en) * 2015-11-18 2018-03-20 Applied Materials, Inc. Inert anode electroplating processor and replenisher with anionic membranes
JP6577404B2 (ja) 2016-04-05 2019-09-18 ファナック株式会社 絞りユニット及びこれを備えた静圧軸受装置並びに溝付きブロックの製造方法
US20170370017A1 (en) * 2016-06-27 2017-12-28 Tel Nexx, Inc. Wet processing system and method of operating
GB201701166D0 (en) * 2017-01-24 2017-03-08 Picofluidics Ltd An apparatus for electrochemically processing semiconductor substrates
WO2018162682A1 (de) * 2017-03-08 2018-09-13 Technische Universität Darmstadt Anordnung und verfahren zum bereitstellen einer vielzahl von nanodrähten sowie galvanikkapsel
WO2020242838A1 (en) * 2019-05-24 2020-12-03 Lam Research Corporation Electrochemical deposition system including optical probes
US11608563B2 (en) * 2019-07-19 2023-03-21 Asmpt Nexx, Inc. Electrochemical deposition systems
US11697887B2 (en) * 2020-10-23 2023-07-11 Applied Materials, Inc. Multi-compartment electrochemical replenishment cell

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001131796A (ja) * 1999-11-08 2001-05-15 Osaka Prefecture 電気銅めっき装置ならびに前記装置を使用した銅めっき方法
JP2004269977A (ja) * 2003-03-10 2004-09-30 Osaka Prefecture めっき用不溶性陽極

Family Cites Families (112)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB293648A (en) 1928-01-12 1928-07-12 Henry Edward Smith Improved wallet for containing papers and documents
US3072545A (en) 1961-11-20 1963-01-08 Ionics Electroplating of metals
US3658470A (en) 1969-06-16 1972-04-25 Industrial Filter Pump Mfg Co Metal ion recovery system
JPS5144527B2 (enExample) 1973-04-19 1976-11-29
US4118295A (en) * 1976-04-20 1978-10-03 Dart Industries Inc. Regeneration of plastic etchants
US4469564A (en) 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
US4565609A (en) 1983-12-22 1986-01-21 Learonal, Inc. Bath and process for plating tin, lead and tin-lead alloys
JPH0339500Y2 (enExample) 1986-01-10 1991-08-20
JPS62188791A (ja) 1986-02-15 1987-08-18 Nishimura Watanabe Chiyuushiyutsu Kenkyusho:Kk Ｎｉ，Ｃｏ，Ｚｎ，Ｃｕ，Ｍｎ及びＣｒの電解採取方法
EP0242111B1 (en) 1986-04-07 1992-07-01 Tosoh Corporation Method for producing a metal salt by electrolysis
NL8602730A (nl) 1986-10-30 1988-05-16 Hoogovens Groep Bv Werkwijze voor het electrolytisch vertinnen van blik met behulp van een onoplosbare anode.
EP0283681B1 (de) 1987-02-23 1992-05-06 Siemens Aktiengesellschaft Galvanisiereinrichtung zur Erzeugung von Höckern auf Chip-Bauelementen
US4832812A (en) 1987-09-08 1989-05-23 Eco-Tec Limited Apparatus for electroplating metals
US4778572A (en) 1987-09-08 1988-10-18 Eco-Tec Limited Process for electroplating metals
US5039576A (en) 1989-05-22 1991-08-13 Atochem North America, Inc. Electrodeposited eutectic tin-bismuth alloy on a conductive substrate
USRE34191E (en) 1989-05-31 1993-03-09 Eco-Tec Limited Process for electroplating metals
US4906340A (en) 1989-05-31 1990-03-06 Eco-Tec Limited Process for electroplating metals
JPH086198B2 (ja) 1990-08-15 1996-01-24 株式会社アルメックス 水平搬送型メッキ装置
US5162079A (en) 1991-01-28 1992-11-10 Eco-Tec Limited Process and apparatus for control of electroplating bath composition
JPH04320088A (ja) 1991-04-18 1992-11-10 Cmk Corp プリント配線板の製造方法
US5173170A (en) 1991-06-03 1992-12-22 Eco-Tec Limited Process for electroplating metals
US5112447A (en) 1991-08-19 1992-05-12 Eltech Systems Corporation Process for electroplating
GB9122169D0 (en) 1991-10-18 1991-11-27 Bp Solar Ltd Electrochemical process
FR2688235B1 (fr) 1992-03-05 1995-06-23 Sorapec Procede d'obtention d'hydroxydes metalliques.
DE4319951A1 (de) 1993-06-16 1994-12-22 Basf Ag Elektrode, bestehend aus einem Eisen-haltigen Kern und einem Blei-haltigen Überzug
DE4344387C2 (de) 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
US5804053A (en) 1995-12-07 1998-09-08 Eltech Systems Corporation Continuously electroplated foam of improved weight distribution
WO2000061498A2 (en) 1999-04-13 2000-10-19 Semitool, Inc. System for electrochemically processing a workpiece
JPH10116758A (ja) 1996-10-08 1998-05-06 Hitachi Ltd 半導体製造工場
JPH10121297A (ja) 1996-10-16 1998-05-12 Nippon Riironaale Kk 不溶性陽極を用いた電気銅めっき装置及びそれを使用する銅めっき方法
US6099713A (en) 1996-11-25 2000-08-08 C. Uyemura & Co., Ltd. Tin-silver alloy electroplating bath and tin-silver alloy electroplating process
JP3640118B2 (ja) 1997-01-08 2005-04-20 ソニー株式会社 半導体気相成長装置
JPH10204695A (ja) 1997-01-23 1998-08-04 Nippon Steel Corp 電気めっき方法およびその設備
US5883762A (en) 1997-03-13 1999-03-16 Calhoun; Robert B. Electroplating apparatus and process for reducing oxidation of oxidizable plating anions and cations
US6126798A (en) 1997-11-13 2000-10-03 Novellus Systems, Inc. Electroplating anode including membrane partition system and method of preventing passivation of same
JP3039500B2 (ja) 1998-01-13 2000-05-08 日本電気株式会社 プラズマディスプレイパネルの駆動方法
US6210556B1 (en) 1998-02-12 2001-04-03 Learonal, Inc. Electrolyte and tin-silver electroplating process
TW593731B (en) 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
US5997712A (en) * 1998-03-30 1999-12-07 Cutek Research, Inc. Copper replenishment technique for precision copper plating system
WO1999054527A2 (en) 1998-04-21 1999-10-28 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
WO2000014308A1 (en) 1998-09-08 2000-03-16 Ebara Corporation Substrate plating device
JP2000160390A (ja) 1998-11-30 2000-06-13 Ebara Corp めっき装置
TW473811B (en) 1998-11-30 2002-01-21 Ebara Corp Plating apparatus
JP3967479B2 (ja) 1998-12-02 2007-08-29 株式会社荏原製作所 めっき装置
US6251255B1 (en) 1998-12-22 2001-06-26 Precision Process Equipment, Inc. Apparatus and method for electroplating tin with insoluble anodes
JP3368860B2 (ja) 1999-02-01 2003-01-20 上村工業株式会社 電気錫合金めっき方法及び電気錫合金めっき装置
US6585876B2 (en) 1999-04-08 2003-07-01 Applied Materials Inc. Flow diffuser to be used in electro-chemical plating system and method
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US8236159B2 (en) 1999-04-13 2012-08-07 Applied Materials Inc. Electrolytic process using cation permeable barrier
US6368475B1 (en) 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US20060157355A1 (en) 2000-03-21 2006-07-20 Semitool, Inc. Electrolytic process using anion permeable barrier
US6299753B1 (en) 1999-09-01 2001-10-09 Applied Materials, Inc. Double pressure vessel chemical dispenser unit
JP3433291B2 (ja) 1999-09-27 2003-08-04 石原薬品株式会社 スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品
US6632335B2 (en) 1999-12-24 2003-10-14 Ebara Corporation Plating apparatus
US6503375B1 (en) 2000-02-11 2003-01-07 Applied Materials, Inc Electroplating apparatus using a perforated phosphorus doped consumable anode
WO2001068952A1 (en) * 2000-03-17 2001-09-20 Ebara Corporation Method and apparatus for electroplating
US6793794B2 (en) 2000-05-05 2004-09-21 Ebara Corporation Substrate plating apparatus and method
US6527920B1 (en) 2000-05-10 2003-03-04 Novellus Systems, Inc. Copper electroplating apparatus
US7273535B2 (en) 2003-09-17 2007-09-25 Applied Materials, Inc. Insoluble anode with an auxiliary electrode
US6576110B2 (en) 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
WO2002029137A2 (en) * 2000-10-03 2002-04-11 Applied Materials,Inc. Method and associated apparatus for tilting a substrate upon entry for metal deposition
US6531039B2 (en) 2001-02-21 2003-03-11 Nikko Materials Usa, Inc. Anode for plating a semiconductor wafer
US7628898B2 (en) 2001-03-12 2009-12-08 Semitool, Inc. Method and system for idle state operation
US6878368B2 (en) 2001-03-29 2005-04-12 San-Ei Kagaku Co., Ltd. Composition for blending to hair treating agents and a hair treating agent
ITMI20011374A1 (it) 2001-06-29 2002-12-29 De Nora Elettrodi Spa Cella di elettrolisi per il ripristino della concentrazione di ioni metallici in processi di elettrodeposizione
US20030119692A1 (en) 2001-12-07 2003-06-26 So Joseph K. Copper polishing cleaning solution
US6878258B2 (en) 2002-02-11 2005-04-12 Applied Materials, Inc. Apparatus and method for removing contaminants from semiconductor copper electroplating baths
EP1342817A3 (en) 2002-03-05 2006-05-24 Shipley Co. L.L.C. Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions
US20030201170A1 (en) 2002-04-24 2003-10-30 Applied Materials, Inc. Apparatus and method for electropolishing a substrate in an electroplating cell
TWI316097B (en) 2002-06-21 2009-10-21 Ebara Corp Substrate holder and plating apparatus
US20040000491A1 (en) 2002-06-28 2004-01-01 Applied Materials, Inc. Electroplating cell with copper acid correction module for substrate interconnect formation
US6875331B2 (en) 2002-07-11 2005-04-05 Applied Materials, Inc. Anode isolation by diffusion differentials
US7128823B2 (en) 2002-07-24 2006-10-31 Applied Materials, Inc. Anolyte for copper plating
US7247222B2 (en) 2002-07-24 2007-07-24 Applied Materials, Inc. Electrochemical processing cell
US20040134775A1 (en) 2002-07-24 2004-07-15 Applied Materials, Inc. Electrochemical processing cell
US20040026255A1 (en) 2002-08-06 2004-02-12 Applied Materials, Inc Insoluble anode loop in copper electrodeposition cell for interconnect formation
US6852209B2 (en) 2002-10-02 2005-02-08 Applied Materials, Inc. Insoluble electrode for electrochemical operations on substrates
US7012333B2 (en) 2002-12-26 2006-03-14 Ebara Corporation Lead free bump and method of forming the same
JP4441726B2 (ja) 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
JP2004310803A (ja) 2003-04-01 2004-11-04 Samsung Electronics Co Ltd 超解像近接場構造の記録媒体、その再生方法及び再生装置
JP4758614B2 (ja) 2003-04-07 2011-08-31 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気めっき組成物および方法
US20070037005A1 (en) 2003-04-11 2007-02-15 Rohm And Haas Electronic Materials Llc Tin-silver electrolyte
US7393439B2 (en) 2003-06-06 2008-07-01 Semitool, Inc. Integrated microfeature workpiece processing tools with registration systems for paddle reactors
US7195702B2 (en) 2003-06-06 2007-03-27 Taskem, Inc. Tin alloy electroplating system
US20050016857A1 (en) 2003-07-24 2005-01-27 Applied Materials, Inc. Stabilization of additives concentration in electroplating baths for interconnect formation
US20050167275A1 (en) * 2003-10-22 2005-08-04 Arthur Keigler Method and apparatus for fluid processing a workpiece
US20050092601A1 (en) 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a diffusion member
US20050092602A1 (en) 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a membrane stack
KR200341665Y1 (ko) * 2003-11-13 2004-02-14 주식회사 티케이씨 도금 처리장치
US7794573B2 (en) 2003-12-05 2010-09-14 Semitool, Inc. Systems and methods for electrochemically processing microfeature workpieces
US7217472B2 (en) * 2003-12-18 2007-05-15 Hamilton Sundstrand Corporation Electrolyte support member for high differential pressure electrochemical cell
US20050173253A1 (en) 2004-02-05 2005-08-11 Applied Materials, Inc. Method and apparatus for infilm defect reduction for electrochemical copper deposition
US20060102467A1 (en) 2004-11-15 2006-05-18 Harald Herchen Current collimation for thin seed and direct plating
JP2006193822A (ja) 2004-12-16 2006-07-27 Sharp Corp めっき装置、めっき方法、半導体装置、及び半導体装置の製造方法
TW200641189A (en) 2005-02-25 2006-12-01 Applied Materials Inc Counter electrode encased in cation exchange membrane tube for electroplating cell
JP4822268B2 (ja) 2005-04-19 2011-11-24 ユケン工業株式会社 回収型電気亜鉛めっき方法および装置
US7837851B2 (en) 2005-05-25 2010-11-23 Applied Materials, Inc. In-situ profile measurement in an electroplating process
US7713859B2 (en) 2005-08-15 2010-05-11 Enthone Inc. Tin-silver solder bumping in electronics manufacture
US8029653B2 (en) 2006-02-21 2011-10-04 Ebara Corporation Electroplating apparatus and electroplating method
JP2007291419A (ja) 2006-04-21 2007-11-08 Nec Electronics Corp メッキ処理装置
US7292485B1 (en) 2006-07-31 2007-11-06 Freescale Semiconductor, Inc. SRAM having variable power supply and method therefor
JP4819612B2 (ja) * 2006-08-07 2011-11-24 ルネサスエレクトロニクス株式会社 めっき処理装置および半導体装置の製造方法
JP5302199B2 (ja) 2006-10-20 2013-10-02 ノバルティス アーゲー ３−（１ｈ−インドル−３−イル）−４−［２−（４−メチル−ピペラジン−１−イル）−キナゾリン−４−イル］−ピロール−２，５−ジオンの結晶形態
WO2008082192A1 (en) 2006-12-29 2008-07-10 Iljin Copper Foil Co., Ltd. Sn-b plating solution and plating method using it
US20080217182A1 (en) 2007-03-08 2008-09-11 E. I. Dupont De Nemours And Company Electroplating process
EP2009147A1 (en) 2007-06-20 2008-12-31 METAKEM Gesellschaft für Schichtchemie der Metalle GmbH Anode assembly for electroplating
US20110226613A1 (en) 2010-03-19 2011-09-22 Robert Rash Electrolyte loop with pressure regulation for separated anode chamber of electroplating system
US9249521B2 (en) 2011-11-04 2016-02-02 Integran Technologies Inc. Flow-through consumable anodes

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001131796A (ja) * 1999-11-08 2001-05-15 Osaka Prefecture 電気銅めっき装置ならびに前記装置を使用した銅めっき方法
JP2004269977A (ja) * 2003-03-10 2004-09-30 Osaka Prefecture めっき用不溶性陽極

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021070844A (ja) * 2019-10-30 2021-05-06 株式会社荏原製作所 アノード組立体
JP7316908B2 (ja) 2019-10-30 2023-07-28 株式会社荏原製作所 アノード組立体

Also Published As

Publication number Publication date
US9017528B2 (en) 2015-04-28
TW201615901A (zh) 2016-05-01
CN103608490A (zh) 2014-02-26
KR20140027247A (ko) 2014-03-06
TW201305393A (zh) 2013-02-01
TWI537428B (zh) 2016-06-11
US20120298502A1 (en) 2012-11-29
WO2012142352A1 (en) 2012-10-18
TWI622667B (zh) 2018-05-01
CN103608490B (zh) 2016-08-10
KR101959095B1 (ko) 2019-03-15

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