TWI618170B - 基板處理裝置，基板處理裝置之控制方法及記錄媒體 - Google Patents

基板處理裝置，基板處理裝置之控制方法及記錄媒體 Download PDF

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Publication number
TWI618170B
TWI618170B TW103141761A TW103141761A TWI618170B TW I618170 B TWI618170 B TW I618170B TW 103141761 A TW103141761 A TW 103141761A TW 103141761 A TW103141761 A TW 103141761A TW I618170 B TWI618170 B TW I618170B
Authority
TW
Taiwan
Prior art keywords
exhaust
substrate
processing
schedule
individual
Prior art date
Application number
TW103141761A
Other languages
English (en)
Chinese (zh)
Other versions
TW201528412A (zh
Inventor
Nobuhiro Chikanari
Hiroyuki Araki
Hitoshi Ogata
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Publication of TW201528412A publication Critical patent/TW201528412A/zh
Application granted granted Critical
Publication of TWI618170B publication Critical patent/TWI618170B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW103141761A 2013-12-18 2014-12-02 基板處理裝置，基板處理裝置之控制方法及記錄媒體 TWI618170B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013261468A JP6268469B2 (ja) 2013-12-18 2013-12-18 基板処理装置、基板処理装置の制御方法、および記録媒体

Publications (2)

Publication Number Publication Date
TW201528412A TW201528412A (zh) 2015-07-16
TWI618170B true TWI618170B (zh) 2018-03-11

Family

ID=53402581

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103141761A TWI618170B (zh) 2013-12-18 2014-12-02 基板處理裝置，基板處理裝置之控制方法及記錄媒體

Country Status (3)

Country Link
JP (1) JP6268469B2 (ja)
TW (1) TWI618170B (ja)
WO (1) WO2015093226A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI751432B (zh) * 2018-09-07 2022-01-01 日商芝浦機械電子裝置股份有限公司 基板處理裝置及基板處理方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6489524B2 (ja) * 2015-08-18 2019-03-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6499563B2 (ja) * 2015-11-06 2019-04-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置のスケジュール作成方法及びそのプログラム
US10453721B2 (en) 2016-03-15 2019-10-22 Applied Materials, Inc. Methods and assemblies for gas flow ratio control
JP6712482B2 (ja) * 2016-03-31 2020-06-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6890992B2 (ja) * 2017-02-10 2021-06-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理方法
JP7040870B2 (ja) * 2017-07-28 2022-03-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、及び基板処理装置の部品検査方法
JP6985964B2 (ja) * 2018-03-23 2021-12-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置用のピトー管式流量計、基板処理装置、および基板処理方法
CN112992741A (zh) * 2021-03-04 2021-06-18 长江存储科技有限责任公司 半导体处理装置及排气方法
KR102594076B1 (ko) * 2021-07-08 2023-10-25 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201001593A (en) * 2008-06-27 2010-01-01 Dainippon Screen Mfg Substrate treatment apparatus
WO2013133101A1 (ja) * 2012-03-07 2013-09-12 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び基板処理方法
US20130295768A1 (en) * 2010-12-22 2013-11-07 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method of manufacturing semiconductor device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03224213A (ja) * 1989-12-26 1991-10-03 Nec Corp 低圧ｃｖｄ装置
JPH09148231A (ja) * 1995-11-16 1997-06-06 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
JP2003213422A (ja) * 2002-01-24 2003-07-30 Nec Corp 薄膜の形成装置及びその形成方法
JP2009246007A (ja) * 2008-03-28 2009-10-22 Epson Toyocom Corp プラズマ処理方法およびプラズマ処理装置
JP2009277789A (ja) * 2008-05-13 2009-11-26 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2011044446A (ja) * 2009-08-19 2011-03-03 Tokyo Electron Ltd 圧力制御機器、圧力制御方法および基板処理装置
JP5257328B2 (ja) * 2009-11-04 2013-08-07 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201001593A (en) * 2008-06-27 2010-01-01 Dainippon Screen Mfg Substrate treatment apparatus
US20130295768A1 (en) * 2010-12-22 2013-11-07 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method of manufacturing semiconductor device
WO2013133101A1 (ja) * 2012-03-07 2013-09-12 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び基板処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI751432B (zh) * 2018-09-07 2022-01-01 日商芝浦機械電子裝置股份有限公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
JP6268469B2 (ja) 2018-01-31
WO2015093226A1 (ja) 2015-06-25
TW201528412A (zh) 2015-07-16
JP2015119042A (ja) 2015-06-25

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