TWI617229B - 印刷電路板之製造方法 - Google Patents

印刷電路板之製造方法 Download PDF

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Publication number
TWI617229B
TWI617229B TW104140558A TW104140558A TWI617229B TW I617229 B TWI617229 B TW I617229B TW 104140558 A TW104140558 A TW 104140558A TW 104140558 A TW104140558 A TW 104140558A TW I617229 B TWI617229 B TW I617229B
Authority
TW
Taiwan
Prior art keywords
copper foil
layer
wiring
aforementioned
printed circuit
Prior art date
Application number
TW104140558A
Other languages
English (en)
Chinese (zh)
Other versions
TW201633873A (zh
Inventor
Kazuhiro Yoshikawa
吉川和広
Hiroto Iida
飯田浩人
Ayumu Tateoka
立岡歩
Daisuke Nakajima
中島大輔
Original Assignee
Mitsui Mining & Smelting Co., Ltd.
三井金屬鑛業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co., Ltd., 三井金屬鑛業股份有限公司 filed Critical Mitsui Mining & Smelting Co., Ltd.
Publication of TW201633873A publication Critical patent/TW201633873A/zh
Application granted granted Critical
Publication of TWI617229B publication Critical patent/TWI617229B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Biochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electroplating Methods And Accessories (AREA)
TW104140558A 2014-12-08 2015-12-03 印刷電路板之製造方法 TWI617229B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014248426 2014-12-08

Publications (2)

Publication Number Publication Date
TW201633873A TW201633873A (zh) 2016-09-16
TWI617229B true TWI617229B (zh) 2018-03-01

Family

ID=56107298

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104140558A TWI617229B (zh) 2014-12-08 2015-12-03 印刷電路板之製造方法

Country Status (5)

Country Link
JP (1) JP6734785B2 (ja)
KR (1) KR102402300B1 (ja)
CN (1) CN107003257B (ja)
TW (1) TWI617229B (ja)
WO (1) WO2016093109A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI699148B (zh) * 2018-09-28 2020-07-11 日商三井金屬鑛業股份有限公司 多層配線板的製造方法

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WO2016174998A1 (ja) * 2015-04-28 2016-11-03 三井金属鉱業株式会社 粗化処理銅箔及びプリント配線板
US9955588B1 (en) * 2016-11-28 2018-04-24 Chang Chun Petrochemical Co., Ltd. Multilayer carrier foil
JP6816551B2 (ja) * 2017-02-17 2021-01-20 昭和電工マテリアルズ株式会社 コアレス基板用熱硬化性樹脂組成物、コアレス基板用プリプレグ、コアレス基板、コアレス基板の製造方法及び半導体パッケージ
CN107454762A (zh) * 2017-09-14 2017-12-08 桐城市闲产网络服务有限公司 一种计算机电路板的制作方法
JP6634184B1 (ja) * 2019-09-30 2020-01-22 株式会社フジクラ フレキシブルプリント配線板及びその製造方法
KR102349377B1 (ko) * 2019-12-19 2022-01-12 일진머티리얼즈 주식회사 표면처리 동박, 이의 제조방법, 이를 포함한 동박적층판, 및 이를 포함한 프린트 배선판
JP7492090B1 (ja) 2022-11-28 2024-05-28 福田金属箔粉工業株式会社 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板
WO2024116475A1 (ja) * 2022-11-28 2024-06-06 福田金属箔粉工業株式会社 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW208110B (ja) * 1990-06-08 1993-06-21 Furukawa Circuit Foil Kk
TW201131161A (en) * 2009-09-25 2011-09-16 Ube Industries Method for inspecting surface of and method of making resin substrate formed with metal pattern
TWI425899B (zh) * 2007-02-23 2014-02-01 Infermata Systems Ltd 功能性印刷電路板快速製造方法及裝置

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JPH04284690A (ja) * 1991-03-13 1992-10-09 Furukawa Saakitsuto Foil Kk 多層プリント配線板内層回路用銅箔及びその製造方法
JP3267604B2 (ja) * 1990-06-08 2002-03-18 住友ベークライト株式会社 多層プリント配線板
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JP2002164390A (ja) * 2000-11-28 2002-06-07 Hitachi Cable Ltd テープキャリア及びその製造方法
JP2003060356A (ja) * 2001-08-09 2003-02-28 Ngk Spark Plug Co Ltd 多層プリント配線基板の製造方法
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KR101042102B1 (ko) * 2009-06-17 2011-06-16 주식회사 코리아써키트 캐리어 기판의 제조방법 및 이 캐리어기판을 이용한 베리드 인쇄회로기판의 제조방법
CN201707302U (zh) * 2010-04-12 2011-01-12 深南电路有限公司 Aoi缺陷检测系统
EP2615196A1 (en) * 2010-10-06 2013-07-17 Furukawa Electric Co., Ltd. Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board
CN101977480B (zh) * 2010-10-14 2013-06-05 惠州中京电子科技股份有限公司 印刷线路板精细线路制作工艺
CN102495071B (zh) * 2011-12-19 2014-04-16 深圳市景旺电子股份有限公司 一种aoi检测系统及其检测方法
JP6089662B2 (ja) 2012-12-12 2017-03-08 凸版印刷株式会社 コアレス配線基板の製造方法および製造装置
MY181562A (en) * 2013-02-28 2020-12-29 Mitsui Mining & Smelting Co Ltd Black color surface-treated copper foil, method of manufacturing black color surface-treated copper foil, copper-clad laminate and flexible printed wiring board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW208110B (ja) * 1990-06-08 1993-06-21 Furukawa Circuit Foil Kk
TWI425899B (zh) * 2007-02-23 2014-02-01 Infermata Systems Ltd 功能性印刷電路板快速製造方法及裝置
TW201131161A (en) * 2009-09-25 2011-09-16 Ube Industries Method for inspecting surface of and method of making resin substrate formed with metal pattern

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI699148B (zh) * 2018-09-28 2020-07-11 日商三井金屬鑛業股份有限公司 多層配線板的製造方法

Also Published As

Publication number Publication date
WO2016093109A1 (ja) 2016-06-16
KR20170092519A (ko) 2017-08-11
KR102402300B1 (ko) 2022-05-27
JPWO2016093109A1 (ja) 2017-09-14
TW201633873A (zh) 2016-09-16
CN107003257A (zh) 2017-08-01
CN107003257B (zh) 2020-07-03
JP6734785B2 (ja) 2020-08-05

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