TWI601793B - Conductive paste composition - Google Patents

Conductive paste composition Download PDF

Info

Publication number
TWI601793B
TWI601793B TW102140120A TW102140120A TWI601793B TW I601793 B TWI601793 B TW I601793B TW 102140120 A TW102140120 A TW 102140120A TW 102140120 A TW102140120 A TW 102140120A TW I601793 B TWI601793 B TW I601793B
Authority
TW
Taiwan
Prior art keywords
conductive paste
paste composition
solvent
conductive
mass
Prior art date
Application number
TW102140120A
Other languages
English (en)
Chinese (zh)
Other versions
TW201431982A (zh
Inventor
Kazuhisa Hirao
Koji Inaoka
Juji Takada
Hiroyuki Naito
Original Assignee
Noritake Co Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noritake Co Limited filed Critical Noritake Co Limited
Publication of TW201431982A publication Critical patent/TW201431982A/zh
Application granted granted Critical
Publication of TWI601793B publication Critical patent/TWI601793B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20Diluents or solvents
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW102140120A 2012-11-06 2013-11-05 Conductive paste composition TWI601793B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012244846 2012-11-06

Publications (2)

Publication Number Publication Date
TW201431982A TW201431982A (zh) 2014-08-16
TWI601793B true TWI601793B (zh) 2017-10-11

Family

ID=50684633

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102140120A TWI601793B (zh) 2012-11-06 2013-11-05 Conductive paste composition

Country Status (5)

Country Link
JP (1) JP5890036B2 (ja)
KR (1) KR102092990B1 (ja)
CN (1) CN104769044B (ja)
TW (1) TWI601793B (ja)
WO (1) WO2014073530A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102410080B1 (ko) * 2014-07-31 2022-06-16 스미토모 긴조쿠 고잔 가부시키가이샤 도전성 페이스트
JP6967845B2 (ja) * 2016-09-27 2021-11-17 株式会社ノリタケカンパニーリミテド 銀ペーストおよび電子素子
JP6939015B2 (ja) * 2017-03-29 2021-09-22 住友金属鉱山株式会社 積層セラミックコンデンサ内部電極用のグラビア印刷用導電性ペースト
JP6853606B2 (ja) * 2017-08-10 2021-03-31 株式会社ノリタケカンパニーリミテド 導電性ペースト
JP6521138B1 (ja) * 2018-04-19 2019-05-29 東洋インキScホールディングス株式会社 成形フィルム用導電性組成物、成形フィルム、成形体およびその製造方法
JP7498896B2 (ja) * 2018-12-25 2024-06-13 住友金属鉱山株式会社 導電性ペースト、電子部品、及び積層セラミックコンデンサ
JP7053527B2 (ja) * 2019-03-29 2022-04-12 株式会社ノリタケカンパニーリミテド 導電性ペースト
JPWO2021106470A1 (ja) * 2019-11-29 2021-06-03
JPWO2022255467A1 (ja) * 2021-06-02 2022-12-08

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1926641B (zh) * 2004-02-27 2010-05-05 Tdk株式会社 多层陶瓷电子元件的导电糊以及制造多层陶瓷电子元件的多层单元的方法
JP2011159393A (ja) * 2010-01-29 2011-08-18 Sumitomo Metal Mining Co Ltd 導電性ペースト

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270456A (ja) * 2001-03-07 2002-09-20 Murata Mfg Co Ltd 導電性ペーストおよび積層セラミック電子部品
JP4487595B2 (ja) * 2004-02-27 2010-06-23 Tdk株式会社 積層セラミック電子部品用の積層体ユニットの製造方法
JP4299765B2 (ja) 2004-11-05 2009-07-22 株式会社ノリタケカンパニーリミテド 導電性ペースト
JP4953626B2 (ja) 2004-12-24 2012-06-13 京セラ株式会社 セラミック電子部品の製造方法
JP4462493B2 (ja) 2005-01-18 2010-05-12 ヤスハラケミカル株式会社 導電性ペースト
JP2007084690A (ja) 2005-09-22 2007-04-05 Toppan Printing Co Ltd 凸版反転オフセット法用インキ及び印刷体
JP4471924B2 (ja) 2005-11-28 2010-06-02 京セラ株式会社 電子部品の製造方法
JP2007214452A (ja) * 2006-02-10 2007-08-23 Tdk Corp 剥離層用ペースト及び積層型電子部品の製造方法
JP4340674B2 (ja) * 2006-09-29 2009-10-07 Tdk株式会社 導電性ペースト、積層セラミック電子部品及びその製造方法
JP5328500B2 (ja) * 2009-06-12 2013-10-30 積水化学工業株式会社 積層セラミックコンデンサの製造方法
CN102169755B (zh) * 2010-02-26 2015-07-15 住友金属矿山株式会社 层叠陶瓷电容器内部电极用导电性糊剂
JP2012226865A (ja) * 2011-04-15 2012-11-15 Sumitomo Metal Mining Co Ltd 導電性ペースト組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1926641B (zh) * 2004-02-27 2010-05-05 Tdk株式会社 多层陶瓷电子元件的导电糊以及制造多层陶瓷电子元件的多层单元的方法
JP2011159393A (ja) * 2010-01-29 2011-08-18 Sumitomo Metal Mining Co Ltd 導電性ペースト

Also Published As

Publication number Publication date
CN104769044B (zh) 2017-03-08
KR102092990B1 (ko) 2020-03-24
CN104769044A (zh) 2015-07-08
WO2014073530A1 (ja) 2014-05-15
JPWO2014073530A1 (ja) 2016-09-08
JP5890036B2 (ja) 2016-03-22
TW201431982A (zh) 2014-08-16
KR20150083097A (ko) 2015-07-16

Similar Documents

Publication Publication Date Title
TWI601793B (zh) Conductive paste composition
TWI479510B (zh) 利用高速燒成之膜狀導體之製造方法
JP4355010B2 (ja) 積層電子部品用導体ペースト
US7651764B2 (en) Release layer paste and method of production of a multilayer type electronic device
KR101598945B1 (ko) 도전성 페이스트, 적층 세라믹 전자부품, 및 상기 적층 세라믹 전자부품의 제조방법
JP6613551B2 (ja) 積層セラミックコンデンサ内部電極用ペースト、及び積層セラミックコンデンサ
JP2007194122A (ja) 導電性ペーストおよびそれを用いた配線基板
WO2020137290A1 (ja) 導電性ペースト、電子部品、及び積層セラミックコンデンサ
US20200234843A1 (en) Electrically conductive paste
TW202025178A (zh) 導電性漿料、電子零件、及積層陶瓷電容器
TWI754671B (zh) 導電性糊
JP2006077233A (ja) 剥離層用ペースト及び積層型電子部品の製造方法
WO2021059925A1 (ja) 導電性ペーストとこれを用いた電子部品の製造方法
TWI819103B (zh) 導電性膠
TWI805721B (zh) 導電性糊
JP2012221640A (ja) 導電性ペーストおよびその製造方法
JP7336650B2 (ja) ペースト用樹脂組成物および無機粒子分散ペースト
JPWO2015040916A1 (ja) 導電性ペーストおよびセラミック電子部品
TWI466968B (zh) 積層陶瓷電容器內部電極用導電性糊
JP7400256B2 (ja) 機能材料インク
TWI838578B (zh) 導電性糊及使用其的電子零件的製造方法
TWI846672B (zh) 導電性糊劑
JP2021180079A (ja) 薄膜用導電性ペーストおよびその利用
JP2004303583A (ja) 添加物ペースト、添加物ペーストの製造方法、グリーンシートの製造方法および電子部品の製造方法